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Publication numberUSD659110 S1
Publication typeGrant
Application numberUS 29/358,133
Publication dateMay 8, 2012
Filing dateMar 23, 2010
Priority dateMar 23, 2010
Publication number29358133, 358133, US D659110 S1, US D659110S1, US-S1-D659110, USD659110 S1, USD659110S1
InventorsWei-Hau Chen, Cheng-Hsien Kuo
Original AssigneeComTake Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat-dissipating device for memory
US D659110 S1
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for an heat-dissipating device for memory, as shown and described.
Description

FIG. 1 is a perspective view of a heat-dissipating device for memory showing my new design wherein a portion of the device is shown separately for ease of illustration;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an exploded perspective view of the heat dissipating device thereof; and,

FIG. 9 is a perspective view of the heat dissipating, device thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Classifications
U.S. ClassificationD13/179