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Publication numberUSD659110 S1
Publication typeGrant
Application numberUS 29/358,133
Publication dateMay 8, 2012
Priority dateMar 23, 2010
Publication number29358133, 358133, US D659110 S1, US D659110S1, US-S1-D659110, USD659110 S1, USD659110S1
InventorsWei-Hau Chen, Cheng-Hsien Kuo
Original AssigneeComTake Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat-dissipating device for memory
US D659110 S1
Abstract  available in
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  1. The ornamental design for an heat-dissipating device for memory, as shown and described.

FIG. 1 is a perspective view of a heat-dissipating device for memory showing my new design wherein a portion of the device is shown separately for ease of illustration;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an exploded perspective view of the heat dissipating device thereof; and,

FIG. 9 is a perspective view of the heat dissipating, device thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

U.S. ClassificationD13/179