Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD664511 S1
Publication typeGrant
Application numberUS 29/389,790
Publication dateJul 31, 2012
Filing dateApr 15, 2011
Priority dateOct 15, 2010
Also published asUSD689831
Publication number29389790, 389790, US D664511 S1, US D664511S1, US-S1-D664511, USD664511 S1, USD664511S1
InventorsKouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
Original AssigneeHitachi Chemical Company, Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Adhesive tape for semiconductor manufacturing
US D664511 S1
Abstract  available in
Previous page
Next page
  1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

FIG. 1 is a top plan view of our new design;

FIG. 2 is a bottom plan view;

FIG. 3 is a left side view;

FIG. 4 is a right side view;

FIG. 5 is a rear side view;

FIG. 6 is a front side view;

FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view; and,

FIG. 9 is a close-up view of region 9 in FIG. 1.

Non-Patent Citations
1Taniguchi et al., U.S. Appl. No. 29/389,788, filed Apr. 15, 2011.
2Taniguchi et al., U.S. Appl. No. 29/389,794, filed Apr. 15, 2011.
3Taniguchi et al., U.S. Appl. No. 29/389,797, filed Apr. 15, 2011.
U.S. ClassificationD13/182