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Publication numberUSD664511 S1
Publication typeGrant
Application numberUS 29/389,790
Publication dateJul 31, 2012
Filing dateApr 15, 2011
Priority dateOct 15, 2010
Also published asUSD689831
Publication number29389790, 389790, US D664511 S1, US D664511S1, US-S1-D664511, USD664511 S1, USD664511S1
InventorsKouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
Original AssigneeHitachi Chemical Company, Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Adhesive tape for semiconductor manufacturing
US D664511 S1
Images(5)
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Claims(1)
  1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
Description

FIG. 1 is a top plan view of our new design;

FIG. 2 is a bottom plan view;

FIG. 3 is a left side view;

FIG. 4 is a right side view;

FIG. 5 is a rear side view;

FIG. 6 is a front side view;

FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view; and,

FIG. 9 is a close-up view of region 9 in FIG. 1.

Non-Patent Citations
Reference
1Taniguchi et al., U.S. Appl. No. 29/389,788, filed Apr. 15, 2011.
2Taniguchi et al., U.S. Appl. No. 29/389,794, filed Apr. 15, 2011.
3Taniguchi et al., U.S. Appl. No. 29/389,797, filed Apr. 15, 2011.
Classifications
U.S. ClassificationD13/182