Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSRE35578 E
Publication typeGrant
Application numberUS 08/198,208
Publication dateAug 12, 1997
Filing dateFeb 28, 1994
Priority dateDec 12, 1988
Fee statusPaid
Publication number08198208, 198208, US RE35578 E, US RE35578E, US-E-RE35578, USRE35578 E, USRE35578E
InventorsJean-Pierre Gloton, Gerard Coiton
Original AssigneeSgs-Thomson Microelectronics, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Cutting metallized layer into electrically insulated zones, covering with polyimide layer, connecting terminals, encapsulating entire component in resin which is hardened by heating, fastening into housing cavity
US RE35578 E
Abstract
Disclosed is a method for installing an electronic component and its electrical connections on a support provided with a cavity to house said component. A metallic layer is cut out into zones on which there is deposited a layer of polyimide which mechanically holds the said zones during the operations for the electrical connection of the electronic component and for encapsulation and installation on the support. This method avoids the use of a supporting film and of a bonder to fix the metallic joints to the film, namely elements that do not withstand high temperatures during encapsulation.
Images(2)
Previous page
Next page
Claims(15)
What is claimed is:
1. A method for installing an electronic component and its, electrical connections in a support having a cavity to house said component, said method comprising the following operations:
(a) depositing of a metallic layer;
(b) cutting up of this metallic layer into zones that are electrically insulated from one another,
(c) depositing of a polyimide layer on one side of these metallic zones,
(d) laying, on one side of these metallic zones, the electronic component having output terminals,
(e) electrically connecting the output terminals of the electronic component to the metallic zones,
(f) coating of the electrical component by a resin,
(g) heating of the entire unit at a high temperature so as to quickly obtain the hardening of the resin,
(h) positioning of the unit on the support, so that the encapsulated electronic component is housed in the cavity.
2. A method according to claim 1 wherein the electronic component is laid on that side of the metallic layer which is opposite the polyimide layer and wherein it comprises the following additional operation:
the removal of the polyimide layer so as to clear the metallic zones without damaging the polyimide joints between the metallic zones.
3. A method according to claim 2, wherein the operation for the removal of the polyimide is designed also to remove the polyimide joints between the metallic zones.
4. A method according to claim 1, wherein the electronic component is laid on the side of the polyimide layer and wherein the operation for the electrical connection of the output terminals of the electronic component is preceded by an operation to remove the layer of polyimide at least at the positions of the metallic zones designed to set up the electrical connections.
5. A method according to claim 4, wherein the operation to remove the polyimide layer also concerns the position where the electronic component has to be laid.
6. A method according to claim 4 or 5, wherein the operation to install the unit on the support is preceded by an operation to remove the polyimide layer without damaging the polyimide joints between the metallic zones.
7. A method for installing an electronic component and its electrical connections in a support having a cavity to house said component, said method comprising the following operations:
(a) depositing of a metallic layer;
(b) cutting up of this metallic layer into zones that are electrically insulated from one another,
(c) depositing of a silicone and/or epoxy resin layer on one side of these metallic zones,
(d) laying, on one side of these metallic zones, the electronic component having output terminals,
(e) the electrically connecting the output terminals of the electric component to the metallic zones,
(f) coating of the electrical component by a resin,
(g) heating of the entire unit at a high temperature so as to quickly obtain the hardening of the resin,
(h) positioning of the unit on the support, so that the encapsulated electronic component is housed in the cavity. .Iadd.
8. A method for installing an electronic component in a housing, comprising the steps of:
forming a conducting layer having a plurality of zones electrically insulated from each other;
forming an insulating layer on a first side of the conducting layer, wherein the insulating layer is resistant to relatively high temperature processing;
placing the electronic component on a second side of the conducting layer opposite the first side;
electrically connecting output terminals of the electronic component to the zones of the conducting layer;
covering the electronic component with a resin; and
heating the resin to a relatively high temperature to quickly harden it..Iaddend..Iadd.
9. The method of claim 8, wherein the conducting layer is formed from metal..Iaddend..Iadd.
10. The method of claim 9, wherein the metal comprises copper..Iaddend..Iadd.11. The method of claim 9, wherein the metal comprises nickel..Iaddend..Iadd.12. The method of claim 8, wherein the
insulating layer comprises polyimide..Iaddend..Iadd.13. The method of claim 8, wherein the insulating layer comprises silicone..Iaddend..Iadd.14. The method of claim 8, wherein the insulating
layer comprises epoxy resin..Iaddend..Iadd.15. The method of claim 8, further comprising the step of:
placing the covered electronic component into a support structure having a cavity therein for receiving the covered electronic
component..Iaddend..Iadd.16. The method of claim 15, wherein portions of the conducting layer zones contact electrically conductive structures in
the support structure..Iaddend..Iadd.17. A method for installing an electronic component in a housing, comprising the steps of:
forming a conducting layer having a plurality of zones electrically insulated from each other;
forming an insulating layer on a first side of the conducting layer, wherein the insulating layer is resistant to relatively high temperature processing;
placing the electronic component on the first side of the conducting layer and separated therefrom by the insulating layer;
electrically conducting output terminals of the electronic component to the zones of the conducting layer;
covering the electronic component with a resin; and
heating the resin to a relatively high temperature to quickly harden it..Iaddend..Iadd.18. The method of claim 13, further comprising the step of:
before said placing step, forming openings in the insulating layer to expose portions of the conducting layer zones therein suitable for making
electrical connection therewith..Iaddend..Iadd.19. The method of claim 18, wherein said step of forming openings includes forming an opening in a central region suitable for placement of the electrical component, and wherein said placing step includes placing the electrical component into the central region opening..Iaddend.
Description

.Iadd.This is a continuation of application Ser. No. 07/855,086, filed Mar. 20, 1992 now abandoned. .Iaddend.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention concerns a method to install an electrical component and its contacts on a support, such as an identification or bank card; it also concerns the product obtained by the implementation of this method.

2. Description of the Prior Art

Identification or identity cards are used in many fields, especially in the field of bank cards or credit cards. However, for a long time, apart from an identification number and the bearer's number, these cards have had only a magnetic recording enabling identification by magnetic reading. For many years now, these cards have been used for other functions than for identifying the bearer and, especially, for prepayment and protection against fraudulent activities. To this end, the card has an active electronic component which may consist of an electronic memory which may or may not be associated with a microprocessor, thus enabling its use especially for banking type applications.

Prior art cards, which have an electronic component are manufactured in various ways. According to a first method, a cavity is made in the thickness of the card to accommodate the electronic component. According to another method, known as "co-lamination", thin layers of plastic material as an epoxy material, polyethylene, polyvinylchloride etc. are laminated around the component. During the implementation of these methods, various other operations are further performed to connect the terminals of the electronic component electrically with metallizations placed on the surface of the card.

One method used to install the electronic component in the cavity made in the card and to place metallizations on the card as well as to make the connections between the terminals of the card and the metallizations consists, as shown in FIG. 1, in the use of a non-conductive film 1, made of an epoxy material, for example. This film has, on one side, the electronic component in the form of a chip (reference 2) and, on the other side, metallized surfaces such as those marked 3, 4 and 5 separated from one another by spaces 6 and 7 without metallization. These metallized surfaces 3, 4 and 5 communicate with the other side of the film 1 by means of holes 8, 9 and 10 through which the ends of the conducting wires 11, 12 and 13 are connected with the corresponding metallized surfaces by any known means such as a conductive bonder. The other end of each conducting wire is connected to an output terminal 14, 15 or 16 of the chip 2.

These operations are then followed by the coating of the chip 2 with resin and curing of the resin, by heat, to encapsulate the chip. The chip can then be installed in the cavity of the card and metallizations can be placed at the edge of the cavity by simply fitting in the chip and bonding the support film 1 to the card after it has been cut out to the requisite dimensions.

The method which has just been briefly described above has the following drawback: the film 1 and the bonder used to hold the metallizations 3, 4 and 5 cannot withstand temperatures of more than than 150° C. The result thereof is a considerable increase in the time needed to cure the resin used to encapsulate the chip 2. This is costly, especially in an automatic manufacturing line.

An object of the present invention, therefore, is to overcome the above-mentioned drawbacks by the application of a method for installing an electronic component and its electrical connections on a support enabling higher curing temperature for the coating resin, thus giving a shorter curing time and, therefore, lower costs.

SUMMARY OF THE INVENTION

The invention relates to a method for installing an electronic component and its electrical connections in a support having a cavity to house said component, said method comprising the following operations:

(a) the depositing of a metallic layer on a working support such as a wafer;

(b) the cutting up of this metallic layer into zones that are electrically insulated from one another,

(c) the depositing of a polyimide layer on one side of these metallic zones,

(d) the laying, on one side of these metallic zones, of the electronic component having output terminals,

(e) the electrical connection of the output terminals of the electronic component to the metallic zones,

(f) the coating of the electrical component by a resin,

(g) the heating of the entire unit at a high temperature so as to quickly obtain the hardening of the resin,

(h) the positioning of the set on the support, so that the encapsulated electronic component is housed in the cavity.

The invention also relates to a product, obtained by implementing said method, which comprises a supporting card provided with a cavity and an electronic component placed in said cavity, wherein said electronic component is placed directly on a metallic layer which is bonded to the card and wherein this metallic layer is divided into zones, each corresponding to a contact.

In an alternative embodiment of the method, the product obtained has an electronic component which is fixed to the metallic layer by means of a polyimide layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will appear from the following description of a particular embodiment, made with reference to the appended drawings, of which:

FIG. 1 is a perspective view of a supporting film for an electronic component and its electrical connections, implementing a method according to the invention,

FIG. 2 is a perspective view of a memory card designed to receive an electronic component,

FIG. 3 is a perspective view of an electronic component placed on a metallic layer of the support, implementing the method according to the invention,

FIG. 4 is a perspective view of another embodiment of the invention.

DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 1 corresponds to the prior art and has been described in the preamble. FIG. 2 shows a memory card 20 which has, in its middle, a cavity 21 in which an electronic component, for example the chip 2 of FIG. 1, has to be housed. In the prior art method, to install the chip in its housing, it is of course necessary to present the film 1 upside down with respect to the card 20, so that the chip 2 gets fitted into the cavity 21.

According to the invention, the supporting film 1 is replaced by a layer 22 of a metal such as, for example, copper or nickel. This layer will be a few tens of microns thick, for example eighty microns thick. This metallic layer 22, deposited on a working support (not shown) is cut out long the line shown by the segments 23 to 30 connected to the center by a circular cut 31. This circular cut can be made by any known means and, notably, by a chemical attacking process such as etching or a mechanical process in using a laser device.

These various segments 23 to 31 delineate metallic zones such as those marked 32 and 33, which are electrically separated so as to act as contacts. To ensure that these different zones do not get separated from one another, a layer 34 of polyimide or silicone is deposited on their entire surface. This deposit is made in liquid phase on the metal and naturally adheres to the latter without modifying the structure of the metal and of the metallic zones. Instead of polyimide or silicone, it is possible to use epoxy resin deposited at very high temperature. This polyimide layer is about a few microns thick; for example it is three microns thick. In FIG. 3, this polyimide layer is assumed to be transparent.

In the next operation, an electronic component 35 is laid down and bonded to the metallic layer 22. For this purpose, two methods are possible: one method is to turn over the unit of FIG. 3 so that the polyimide layer 34 is in contact with the working support (FIG. 4). The other method is to remove the polyimide layer at the position where the component 35 has to be bonded by any known method, for example by chemical etching with masking. In this second method, the mask is designed to remove the polyimide layer, not only at the position of the component 35 but also at the places 36 where the electrical connections between the component and the metallic zones have to be made. When the zone of the component has been cleared in the polyimide layer, the component 35 is bonded to said zone by means of a bonder which withstands high temperatures.

This operation for bonding the component 35 is followed by an operation for the electrical connection of each of the output terminals 35 of the chip 3S to a metallic zone 32 by means of a conductive wire 38. The ends of each conducting wire can be connected by any known means, for example by bonding, using a conductive bonder.

At this stage in the method, the set comprising the polyimide layer 34 and the metallic layer 22, carrying the electrical component 35 and the electrical connections 38 is ready for the encapsulation of the electrical component 35 ad the electrical connections by any known method, particularly molding in resin followed by the heating of the set to harden the resin and obtain a compact block (not shown). Owing the absence of a supporting film for the metallic layer and of a holding bonder between this metallic layer and the supporting film, namely elements that do not withstand temperatures of over 150° C., the set shown in each of the FIGS. 3 and 4 can be heated to temperatures up to 300° C., thus considerably accelerating the process by which the encapsulating resin is hardened. The result of this is a simpler type of automatic manufacturing line and saving of time and money.

When the encapsulating operation is over, the component/metallic layer set is installed on the card 20 (FIG. 2) so that the compact block containing the component 35 and its electrical connections fit into the cavity 21 and so that the metallic zones lie on the edges of the cavity where they are fixed by any known methods, notably by boding. It will be noted that these metallic zones lie directly on the edges of the cavity 21 in the case of FIG. 4, but do so through the polyimide layer 34 in the case of FIG. 3.

In the case of FIG. 4, since the polyimide layer 34 meets the outer side of the metallic zones after being installed on the card, this layer must be removed to clear the metallic zones so that they fulfil their role of electrical contacts. This removing process can be performed by any known method, for example by chemical etching without masks or, again, by a mechanical method such as polishing.

In the example of FIG. 2, there is also provision to remove the polyimide burn which may be formed n the side of the metallic zones opposite that of the polyimide layer. This cleaning operation can be performed before or after the component/metallic layer set is installed on the card. In this cleaning operation, it should be seen to it that the underlying polyimide layer 44 is not damaged.

During this operation to remove the polyimide layer or its burrs on the opposite side, the polyimide in the spaces between the metallic zones is also removed, so that said zones appear in relief on the center of the support 20 and in such a way that there may be communication holes between the cavity 21 and the environment outside the card. To prevent these holes, it is provided that the encapsulation process will give a capsule with dimensions as close as possible to those of the cavity. It may also be provided to let the polyimide remain between the metallic zones: this means that no chemical etching process should be used to remove the polyimide but that, rather mechanical polishing should be used.

In the case of the method corresponding to FIG. 3, the polyimide layer 34 remains in position in the final device. According to an alternative method, the polyimide layer may be removed after the set is installed in the card but, in this case, it must be noted that the mechanical strength of the metallic zones is lower. To overcome this problem, it is proposed to leave the polyimide joints in their position between said zones and to replace the polyimide layer by a layer of bonder which is used to fix the set to the card.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US3325882 *Jun 23, 1965Jun 20, 1967IbmMethod for forming electrical connections to a solid state device including electrical packaging arrangement therefor
US3387365 *Sep 28, 1965Jun 11, 1968John P. StelmakMethod of making electrical connections to a miniature electronic component
US3614832 *Mar 9, 1966Oct 26, 1971IbmDecal connectors and methods of forming decal connections to solid state devices
US3838984 *Apr 16, 1973Oct 1, 1974Sperry Rand CorpFlexible carrier and interconnect for uncased ic chips
US3859723 *Nov 5, 1973Jan 14, 1975Microsystems Int LtdBonding method for multiple chip arrays
US3998377 *Mar 29, 1976Dec 21, 1976Teletype CorporationMethod of and apparatus for bonding workpieces
US4132856 *Nov 28, 1977Jan 2, 1979Burroughs CorporationProcess of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
US4460825 *Dec 7, 1981Jul 17, 1984Gao Gesellschaft Fur Automation Und Organisation MbhCarrier element for an IC module
US4474292 *May 7, 1981Oct 2, 1984Gao Gesellschaft Fur Automation Und Organisation MbhCarrier element for an IC-chip
US4567643 *Oct 24, 1983Feb 4, 1986Sintra-AlcatelMethod of replacing an electronic component connected to conducting tracks on a support substrate
US4661653 *Dec 27, 1984Apr 28, 1987Seiichiro AigoPackage assembly for semiconductor device
US4667402 *Aug 31, 1984May 26, 1987Siemens AktiengesellschaftMethod for micro-pack production
US4674175 *Apr 1, 1986Jun 23, 1987Eta Sa Fabrique D'ebauchesPolymer pellets joining metal grid contactor and integrated c ircuit chips
US4733061 *Jan 6, 1986Mar 22, 1988Lupa Finances S.A.Card provided with a microprocessor and/or at least one electronic memory
US4746392 *Sep 22, 1986May 24, 1988Gao Gesellschaft Fur Automation Und Organisation MbhLamination, multilayer, silicone rubber
US4763409 *Aug 25, 1986Aug 16, 1988Nec CorporationMethod of manufacturing semiconductor device
US4801765 *Jan 6, 1986Jan 31, 1989American Telephone And Telegraph Company, At&T Bell LaboratoriesElectronic component package using multi-level lead frames
US4829666 *Jul 20, 1984May 16, 1989Gao Gesellschaft Fur Automation Und Organisation MbhMethod for producing a carrier element for an IC-chip
US4835846 *Sep 13, 1988Jun 6, 1989Em Microelectronic Marin SaMethod of manufacture of electronic modules for cards with microcircuits
US4843225 *May 22, 1987Jun 27, 1989G A O Gesellschaft Fur Automation Und Organisation MbhIdentification card with an integrated circuit
US4897534 *Nov 6, 1987Jan 30, 1990Gao Gesellschaft Fur Automation Und Organisation MbhData carrier having an integrated circuit and a method for producing the same
US4941257 *Dec 12, 1988Jul 17, 1990Sgs-Thomson Microelectronics SaMethod for fixing an electronic component and its contacts to a support
US4943464 *Dec 1, 1988Jul 24, 1990Sgs-Thomson Microelectronics SaElectronic component support for memory card and product obtained thereby
US5055913 *Oct 26, 1989Oct 8, 1991Gao Gesellschaft Fur Automation Und Organisation MbhTerminal arrangement for integrated circuit device
EP0019280A1 *May 14, 1980Nov 26, 1980GAO Gesellschaft für Automation und Organisation mbHIdentity card with an integrated circuit component
EP0029785A1 *Nov 21, 1980Jun 3, 1981Societe FlonicElectrical connection system
EP0128822A1 *Jun 6, 1984Dec 19, 1984Flonic S.A.Method of producing memory cards, and cards obtained thereby
EP0132183A1 *Jun 27, 1984Jan 23, 1985SligosMethod for producing memory cards
EP0189039A2 *Jan 4, 1986Jul 30, 1986Lupa Finances S.A.Card with a microprocessor and/or at least an electronic memory
EP0197438A1 *Mar 26, 1986Oct 15, 1986Eta SA Fabriques d'EbauchesMethod of manufacturing electronic modules for microcircuit boards and modules obtained by this method
EP0207853A1 *Jun 26, 1986Jan 7, 1987Bull S.A.Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card
EP0211360A2 *Jul 25, 1986Feb 25, 1987Dai Nippon Insatsu Kabushiki KaishaIC card
EP0213764A2 *Aug 1, 1986Mar 11, 1987THE GENERAL ELECTRIC COMPANY, p.l.c.Preparation of fragile sheet-like devices, such as lead frames
EP0231937A2 *Feb 4, 1987Aug 12, 1987Hitachi Maxell Ltd.An arrangement of a semiconductor device for use in a card
EP0246744A2 *Mar 31, 1987Nov 25, 1987Kabushiki Kaisha ToshibaIC card and method of manufacturing the same
EP0246973A1 *May 20, 1987Nov 25, 1987Gérard Jacques Guy MichotObject associated with an electronic element and manufacturing method
FR2483128A1 * Title not available
FR2547457A1 * Title not available
FR2583574A1 * Title not available
FR2624999A1 * Title not available
GB2081974A * Title not available
GB2088630A * Title not available
JPS5990183A * Title not available
JPS6095941A * Title not available
JPS6115289A * Title not available
Non-Patent Citations
Reference
1 *IBM Technical Disclosure Bulletin, vol. 11, No. 3 Aug. 3, 1968, F. J. Kurtz, Joining Semiconductor CIPS to A Decal Interconnection Overlay, p. 309.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6606789 *Apr 18, 2001Aug 19, 2003Telefonaktiebolaget Lm Ericsson (Publ)Method and apparatus in a production line
US6655021 *Apr 5, 2001Dec 2, 2003Telefonaktiebolaget Lm Ericsson (Publ)Method and apparatus for improving mounting
US7328504 *Jun 15, 2006Feb 12, 2008Samsung Electro-Mechanics Co., LtdMethod for manufacturing circuit board with built-in electronic components
Classifications
U.S. Classification29/840, 156/293, 438/126, 438/118, 156/295, 156/244.12
International ClassificationH01L23/498, G06K19/077
Cooperative ClassificationH01L24/48, H01L2224/48228, H01L23/49855, G06K19/07743, H01L2224/48227
European ClassificationG06K19/077K, H01L23/498K
Legal Events
DateCodeEventDescription
Aug 30, 2001FPAYFee payment
Year of fee payment: 12
Sep 8, 1997FPAYFee payment
Year of fee payment: 8