|Publication number||USRE40100 E1|
|Application number||US 10/979,047|
|Publication date||Feb 26, 2008|
|Filing date||Nov 2, 2004|
|Priority date||Jul 23, 2002|
|Also published as||CN1659306A, CN100351424C, EP1523584A1, US6759005, US7311874, US20040018110, US20040208774, US20070134124, WO2004009865A1|
|Publication number||10979047, 979047, US RE40100 E1, US RE40100E1, US-E1-RE40100, USRE40100 E1, USRE40100E1|
|Original Assignee||Heraeus Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (34), Referenced by (4), Classifications (39), Legal Events (2)|
|External Links: USPTO, USPTO Assignment, Espacenet|
The invention is directed to a method of fabricating sputtering targets doped with non-metal additions including boron, carbon, nitrogen, oxygen and silicon by using atomized or crushed alloy powder or ultra fine boride, carbide, nitride, oxide and silicide powder and hot isostatic pressing.
Cathodic sputtering processes are widely used for the deposition of thin films of material onto desired substrates. A typical sputtering system includes a plasma source for generating an electron or ion beam, a target that comprises a material to be atomized and a substrate onto which the sputtered material is deposited. The process involves bombarding the target material with an electron or ion beam at an angle that causes the target material to be sputtered or eroded. The sputtered target material is deposited as a thin film or layer on the substrate.
The target materials for sputtering process range from pure metals to ever more complicated alloys. The use of complex 3 to 6 element alloys is common in the sputtering industry. Alloying additions such as boron, carbon, nitrogen, oxygen, silicon and so on are frequently added to Cr-, Co-, Fe-based alloys and other intermetallic alloys to modify characteristics such as deposited film grain-size, surface energy and magnetic properties.
The presence of non-metal additions like boron, carbon, nitrogen, oxygen and silicon to target materials is either in the form of pure elements, e.g. boron and carbon, or in the form of compounds like nitride and oxide. The pure element phases such as boron and carbon and the compound phases like boride, carbide, nitride, oxide, and silicide, however cause spitting problems during sputtering. The present invention provides a solution to this problem.
The present invention relates to a novel method of fabricating sputtering targets that are doped with non-metals such as boron, carbon, nitrogen, oxygen and silicon or mixtures thereof or compounds of non-metals. The process comprises preparation of a pre-alloyed powder or selection of ultra fine compound powder of less than 10 microns, preferably less than 5 microns and most preferably less than 2 microns. It has been discovered that spitting will not occur when the above phases are in form of ultra fine particles of less than 10 microns in size. After the ultra fine powders are blended together, the powder blend is canned, followed by a hot isostatic press (HIP) consolidation. Powder processing as above is employed to make the target materials because of unique advantages over the prior art's melting process, both technically and economically. These and other objectives of this invention will become apparent from the following detailed description.
Reference is now made to the accompanying drawing wherein:
The alloy powders of the present invention include alloys and intermetallic alloys composed of 2 to 6 elements, including but not limited to Cr-, Co-, Ru-, Ni-, or Fe-based alloys. The alloy powders contain Cr, Co, Ru, Ni, or Fe, optionally alloyed with each other, or with Cr, Al, Pt, Ta, Zr, Mo, Ti, V or W, and include at least one non-metallic addition selected from B, C, N, O or Si.
Proper canning techniques are needed to avoid segregation during canning. The powders are canned in preparation for consolidation. In canning for example, a container is filled with the powder, evacuated under heat to ensure the removal of any moisture or trapped gasses present, and then sealed. Although the geometry of the container is not limited in any manner, the container can possess a near-net shape geometry with respect to the final material configuration.
The encapsulate material from the canning step is then consolidated via Hot-Isostatic-Pressing (HIP), a procedure known in the art. A HIP unit is typically a cylindrical pressure vessel large enough to house one or more containers. The inner walls of the vessel can be lined with resistance heating elements, and the pressure can be controlled by the introduction of inert gas within the container. HIP parameters including temperature, pressure and hold time will be minimized to prevent the growth of compound phases and grain size, as well as to save energy and to protect the environment. Pressures of about 5 to about 60 ksi (preferably 10-20 ksi) at temperatures between about 500° C. to about 1500° C. (preferably 600-900° C.) are typically employed to achieve appropriate densities. Depending upon the complexity of the cycle, total hold times during isostatic pressing typically vary from about 0.5 to about 12 hours. It is noteworthy that other powder consolidation techniques such as hot pressing and cold pressing can also be employed independently or in conjunction with HIP processing.
After consolidation, the solid material form (billet) is removed from the encapsulation can, and a slice of the billet can then be sent to be tested as to various properties of the billet. If desired, the billet can be subjected to optional thermo-mechanical processing to further manipulate the microstructural and macro-magnetic properties of the target. Also, the final shape and size of the sputter targets can be formed, for example, by processes such as wire EDM, saw, waterjet, lathe, grinder, mill, etc. In these steps, the target can be cleaned and subjected to a final inspection.
alloys manufactured using the method described herein.
Co61 at %-Cr15 at %-Pt12 at %-B12 at %
Co56 at %-Cr18 at %-Pt16 at %-O3.33
at %-Si1.67 at %
Co60 at %-Pt20 at %-B16 at %-C4 at %
Co50 at %-Ta50 at % doped with nitrogen
of 5000 ppm
Co85 at %-Ta5 at %-Zr5 at %-O3.33
at %-Si-1.67 at %
Co62 at %-Ti6 at %-Pt12 at %-B20 at %
Cr97 at %-B3 at %
Cr80 at %-Mo15 at %-B5 at %
Cr80 at %-Mo20 at % doped with oxygen of
Cr doped with oxygen of 5000 ppm
Cr80 at %-Ti16 at %-B4 at %
Cr80 at %-V20 at % doped with oxygen of
Cr79 at %-V20 at %-Zr1 at % doped with
oxygen of 4000 ppm
Cr90 at %-W10 at % doped with oxygen of
Cr99 at %-Zr1 at % doped with oxygen of
Fe56 at %-Co31 at %-B11 at %
Fe73 at %-Si17 at %-Al10 at % (Sendust)
Fe80 at %-Ta8 at %-C12 at %
Ni50 at %-Al50 at % doped with boron of
Ni48 at %-Al48 at % doped with nitrogen
of 4 at %
Ni50 at %-Al50 at % doped with oxygen of
Ru50 at %-Al50 at % doped with oxygen of
Ru50 at %-Al50 at % doped with nitrogen
of 4000 ppm
The following examples demonstrate the present invention further, but should not be construed as a limitation of the present invention. The processes for all materials are similar with each other as shown in
The above alloy is made with the following powder blends, (1) Cr, Mo and ultra fine MoB compound powder, and (2) Cr, Mo and pre-alloyed Cr-3.1wt % B powder that is made with a vacuum induction melter at 1730° C. and mechanically crushing cast ingots into powder at room temperature. Special attention must be paid to mixing all powders together when ultra fine compound powder like MoB is used, otherwise segregation may occur. Herewith an attritor mill or a ball mill must be used for blending from 2 to 24 hours. The HIP parameters for this kind of alloy include the temperature ranging from about 1000-1400° C., at a pressure from about 5-40 ksi and a hold time from about 1-12 hours. The cooling rate must be controlled too, otherwise the HIPed billet may crack during cooling down. A cooling rate of 3° C./min and a hold plateau at 800° C. for 6 hours is introduced to cooling phase.
Two different combinations of starting powders are employed herein. The first is the combination of Co, Cr, Pt and ultra fine SiO2 powder and the second is the combination of Co, Cr, Pt, atomized Co—Si pre-alloy and ultra fine Cr2O3 powder. The suicides are ultra fine and well dispersed in Co matrix of original gas-atomized Co—Si particles. Special mixing methods using an attritor mill or a ball mill for 2 to 24 hours must be employed here to mix all powders together homogeneously when ultra fine compound powders like SiO2 and Cr2O3 are used, otherwise segregation may occur. The HIP parameters for this kind of alloy include the temperature ranging from about 600-1400° C., at a pressure from about 5-40 ksi and a hold time from about 1-12 hours.
Regular Cr, Mo and partly oxidized Cr powder of oxygen level 15000 ppm are used to make the targets. The Cr powder of high oxygen is produced by oxidizing Cr flakes at high temperature and then subjected to mechanical crushing. In this case, only a part of the surface area of Cr powder is covered with oxides. Special attention must be paid to Cr powder of high oxygen level and mixing all powders together in this case, otherwise segregation may occur. Herewith an attritor mill or a ball mill may be used for blending from 2 to 24 hours. The HIP parameters for this kind of alloy include the temperature ranging from about 800-1400° C., at a pressure from about 5-40 ksi and a hold time from about 1-12 hours. The cooling rate must be controlled too, otherwise the HIPed billet may crack during cooling down. A cooling rate of 3° C./min and a hold plateau at 800° C. for 6 hours is introduced to cooling phase.
Gas-atomized NiAl intermetallic powder and ultra fine Al2O3 and AlN powder of less than 5 microns in diameter were taken for making NiAl sputtering targets doped with oxygen or nitrogen. Besides gas-atomized NiAl powder, boron-doped gas-atomized NiAl powder was also taken for making NiAl sputtering targets doped with boron and borides are ultra fine and well dispersed in the matrix. Conventional gas atomization methods are used to manufacture the powders. Special attention must be paid to mixing all powders together when ultra fine compound powders like Al2O3 and AlN are used, otherwise segregation may occur. Herewith an attritor mill or a ball mill may be used for blending from 2 to 24 hours. The HIP parameters for this kind of alloy include the temperature ranging from about 900-1400° C., at a pressure from about 5-40 ksi, and a hold time from about 1-12 hours. The cooling rate must be controlled too, otherwise the HIPed billet may crack during cooling down. A power-off furnace cooling and a hold plateau at 700° C. for 4 hours is introduced to cooling phase.
While this invention has been described with reference to several preferred embodiments, it is contemplated that various alterations and modifications thereof will become apparent to those skilled in the art upon a reading of the detailed description contained herein. It is therefore intended that the following claims are interpreted as including all such alterations and modifications as fall within the true spirit and scope of this invention.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4609528 *||Oct 3, 1985||Sep 2, 1986||General Electric Company||Tri-nickel aluminide compositions ductile at hot-short temperatures|
|US4612165 *||Dec 21, 1983||Jul 23, 1991||Us Energy||Title not available|
|US4613368 *||Oct 3, 1985||Sep 23, 1986||General Electric Company||Tri-nickel aluminide compositions alloyed to overcome hot-short phenomena|
|US4731116||Dec 18, 1986||Mar 15, 1988||Schwarzkopf Development Corporation||Sputter target and process for producing sputter target|
|US4820393 *||May 11, 1987||Apr 11, 1989||Tosoh Smd, Inc.||Titanium nitride sputter targets|
|US4917722 *||May 18, 1989||Apr 17, 1990||Tosoh Corporation||Single crystals of chromium and method for producing the same|
|US5320729||Jul 17, 1992||Jun 14, 1994||Hitachi, Ltd.||Sputtering target|
|US5415829||Dec 22, 1993||May 16, 1995||Nikko Kyodo Co., Ltd.||Sputtering target|
|US5470527||Sep 12, 1994||Nov 28, 1995||Kabushiki Kaisha Toshiba||Ti-W sputtering target and method for manufacturing same|
|US5530467 *||Jan 31, 1991||Jun 25, 1996||Kabushiki Kaisha Toshiba||Sputtering target, film resistor and thermal printer head|
|US5561833 *||Nov 21, 1994||Oct 1, 1996||Japan Metals & Chemicals Co., Ltd.||Method of making high oxygen chromium target|
|US5618397 *||Apr 17, 1995||Apr 8, 1997||Japan Energy Corporation||Silicide targets for sputtering|
|US5652877||Apr 5, 1995||Jul 29, 1997||Centre National De La Recherche||Aluminum alloys, substrates coated with these alloys and their applications|
|US5778302 *||Oct 30, 1995||Jul 7, 1998||Tosoh Smd, Inc.||Methods of making Cr-Me sputter targets and targets produced thereby|
|US5863398||Oct 11, 1996||Jan 26, 1999||Johnson Matthey Electonics, Inc.||Hot pressed and sintered sputtering target assemblies and method for making same|
|US5896553||Apr 10, 1996||Apr 20, 1999||Sony Corporation||Single phase tungsten-titanium sputter targets and method of producing same|
|US5989673||Jun 30, 1997||Nov 23, 1999||Sony Corporation||Caromium-tantalum oxides (Cr-TaOx), sputtering targets and thin film seedlayer/sublayers for thin film magnetic recording media|
|US6261984||Oct 8, 1999||Jul 17, 2001||Tosoh Corporation||Sputtering target and process for the preparation thereof|
|US6264813||Oct 14, 1999||Jul 24, 2001||Aluminum Pechiney||Cathodic sputtering targets made of aluminum alloy|
|US6309593||Jul 27, 1994||Oct 30, 2001||Kabushiki Kaisha Toshiba||Refractory metal silicide target, method of manufacturing the target, refractory metal silicide thin film, and semiconductor device|
|US6328927 *||Dec 24, 1998||Dec 11, 2001||Praxair Technology, Inc.||Method of making high-density, high-purity tungsten sputter targets|
|US6406600||Sep 14, 1999||Jun 18, 2002||Hitachi Metals, Ltd.||CoPt-base sputtering target, method of making same, magnetic recording film and Co-Pt-base magnetic recording medium|
|US6417105 *||May 24, 2000||Jul 9, 2002||Honeywell International Inc.||Sputtering targets comprising aluminides or silicides|
|US6589311 *||Jul 7, 2000||Jul 8, 2003||Hitachi Metals Ltd.||Sputtering target, method of making same, and high-melting metal powder material|
|US6676728 *||Aug 21, 2002||Jan 13, 2004||Hitachi Metals, Ltd.||Sputtering target, method of making same, and high-melting metal powder material|
|US6797137||Apr 11, 2001||Sep 28, 2004||Heraeus, Inc.||Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal|
|CN402642A||Title not available|
|EP1112988A1||Dec 20, 2000||Jul 4, 2001||Furuya Metal Co., Ltd.||ZnS-series sintered material and method for producing the same, target using the ZnS-series sintered material, thin film, and optical recording medium using the thin film|
|EP1118690A2||Jul 27, 1994||Jul 25, 2001||Kabushiki Kaisha Toshiba||Refractory metal silicide target|
|EP1233082A1||Nov 22, 2000||Aug 21, 2002||Idemitsu Kosan Co., Ltd.||Sputtering target, transparent conductive oxide, and method for preparing sputtering target|
|JPH10183341A||Title not available|
|KR0184725B1||Title not available|
|WO1999019102A1||Oct 14, 1998||Apr 22, 1999||Tosoh Smd, Inc.||Sputter targets and methods of making same|
|WO2001038599A1||Nov 22, 2000||May 31, 2001||Idemitsu Kosan Co., Ltd.||Sputtering target, transparent conductive oxide, and method for preparing sputtering target|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US8394243||Sep 30, 2008||Mar 12, 2013||Wd Media, Inc.||Sputtered cobalt oxide for perpendicular magnetic recording medium with low media noise|
|US8488276||Sep 30, 2008||Jul 16, 2013||WD Media, LLC||Perpendicular magnetic recording medium with grain isolation magnetic anistropy layer|
|US8993133||Dec 23, 2010||Mar 31, 2015||WD Media, LLC||Intermediate layer for perpendicular magnetic recording medium with high permeability grain boundaries|
|US20110003177 *||Jan 6, 2011||Solar Applied Materials Technology Corp.||Method for producing sputtering target containing boron, thin film and magnetic recording media|
|U.S. Classification||204/298.13, 419/23, 419/28, 75/246, 419/49|
|International Classification||C22C28/00, C22C19/07, C23C14/14, B22F3/15, B22F3/24, C23C14/34, C22C38/00, C22C27/06, C22C19/03|
|Cooperative Classification||C22C32/0026, C22C27/06, C23C14/3414, B22F2998/10, C22C19/007, C22C38/02, C22C38/10, C22C19/03, C22C38/12, C22C38/06, C22C19/07, C22C5/04, C22C38/002|
|European Classification||C23C14/34B2, C22C38/10, C22C38/02, C22C38/00C, C22C27/06, C22C19/03, C22C38/12, C22C32/00C4, C22C19/07, C22C19/00D, C22C5/04, C22C38/06|
|Jan 5, 2012||FPAY||Fee payment|
Year of fee payment: 8
|Dec 29, 2015||FPAY||Fee payment|
Year of fee payment: 12