|Publication number||USRE40436 E1|
|Application number||US 11/176,878|
|Publication date||Jul 15, 2008|
|Filing date||Jul 7, 2005|
|Priority date||Aug 1, 2001|
|Also published as||US6589625|
|Publication number||11176878, 176878, US RE40436 E1, US RE40436E1, US-E1-RE40436, USRE40436 E1, USRE40436E1|
|Inventors||Manish Kothari, Clarence Chui|
|Original Assignee||Idc, Llc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (151), Non-Patent Citations (22), Referenced by (6), Classifications (10), Legal Events (1) |
|External Links: USPTO, USPTO Assignment, Espacenet|
Hermetic seal and method to create the same
US RE40436 E1
An electronic display screen is created by processing a mirror on a substrate glass. A back plate glass is then placed on top of the substrate glass and sealed to the back plate glass. A hermetic seal that includes an adhesive mixed with zeolites is disclosed. The hermetic seal can seal the back plate glass with the substrate glass. The application of the hermetic seal is not limited to the electronic display screen. Rather, the hermetic seal can be used to seal a variety of surfaces including metals, polymers, plastics, alloys, ceramics and the like.
1. A micro-electromechanical systems based device package comprising:
a back plate glass;
a substrate glass;
at least one mirror located between the substrate glass and the back plate glass; the at lease one mirror being configured to be actuated in an electronic display; and
a bead of an adhesive mixed with a zeolite, the adhesive applied between the back plate glass and the substrate glass; and, wherein the adhesive is applied substantially around the outer perimeter of the at least one mirror.
a mirror processed on the substrate glass.
2. The micro-electromechanical systems based device package of claim 1, including the bead being applied around the perimeter of the mirror.
3. The micro-electromechanical systems based device package of claim 1, wherein the beadadhesive acts as a hermetic seal.
4. The micro-electromechanical systems based device package of claim 1, wherein the beadadhesive traps moisture and other contaminant gases that can be harmful to the mirror.
5. The micro-electromechanical systems based device package of claim 1, wherein the micro-electromechanical systems device includes an electronic display screen.
6. A micro-electromechanical systems based(MEMS
) device package comprising:
a back plate glass;
a substrate glass;
at least one MEMS structure located between the substrate glass and the back plate glass; and
a bead of an adhesive mixed with zeolites of different pore sizes, the adhesive applied between the back plate glass and the substrate glass, wherein the zeolites of different pore sizes are selected to absorb molecules of different diameters, wherein the adhesive is applied substantially around the outer perimeter of the at least one MEMS structure.
7. The micro-electromechanical systems based device package of claim 6, wherein some of the zeolites have a pore size to allow absorption of molecules having a diameter of up to ten angstroms.
8. The micro-electromechanical systems based device package of claim 6, wherein some of the zeolites have a pore size to allow absorption of molecules having a diameter of less than two angstroms.
9. The micro-electromechanical systems based device package of claim 6, wherein the pore sizes of some of the zeolites allow absorption of nitrogen and carbon dioxide molecules.
10. A micro-electromechanical systems based(MEMS
) device package comprising:
a back plate glass;
a substrate glass;
at least one MEMS structure located between the substrate glass and the back plate glass, the at least one MEMS structure being configured to be actuated; and
a bead of an adhesive mixed with a zeolite, the adhesive applied between the back plate glass and the substrate glass, wherein the zeolite is selected to have a pore size which allows the zeolite to absorb a contaminant gas that is outgassed by components of the packagethe at least one MEMS structure, and wherein said pore size is up to about fifty Angstroms, wherein the adhesive is supplied substantially around the outer perimeter of the at least one MEMS structure.
11. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb aromatic branched-chain hydrocarbons.
12. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb hydrogen molecules.
13. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb nitrogen and carbon dioxide molecules.
14. A micro-electromechanical systems
) device, comprising:
a back plate;
at least one reflective MEMS device located between the substrate glass and the back plate glass; and
an adhesive mixed with a zeolite, the adhesive applied between the back plate and the substrate, wherein the zeolite is selected to absorb contaminant molecules outgassed by the at least one MEMS device, said contaminant molecules having a diameter of up to about ten angstroms, and wherein the adhesive is applied substantially around the outer perimeter of the at least one MEMS device.
15. The micro-electromechanical systems device of claim 14 , wherein the zeolite is selected to absorb molecules having a diameter less than about two angstroms.
16. The micro-electromechanical systems device of claim 14 , wherein the zeolite is selected to have a pore size between about two and three angstroms.
17. The micro-electromechanical systems device of claim 14 , wherein the zeolite is selected to absorb aromatic branched-chain hydrocarbons.
18. The micro-electromechanical systems device of claim 14 , wherein the zeolite is selected to absorb hydrogen molecules.
19. The micro-electromechanical systems device of claim 14 , wherein the zeolite is selected to absorb moisture molecules.
20. A micro-electromechanical systems device, comprising:
a back plate;
at least one mirror located between the substrate and the back plate, the at least one mirror being configured to be actuated; and
an adhesive mixed with a zeolite, the adhesive applied between the back plate and the substrate, wherein the zeolite is selected to have a pore size of about fifty angstroms, and wherein the adhesive is applied substantially around the outer perimeter of the at least one mirror.
21. The micro-electromechanical systems device of claim 20 , wherein the zeolite is selected to absorb nitrogen.
22. The micro-electromechanical systems device of claim 20 , wherein the zeolite is selected to absorb carbon dioxide.
23. The micro-electromechanical systems device of claim 1 , wherein the adhesive is applied as a bead between the back plate glass and the substrate glass.
24. The micro-electromechanical systems device of claim 6 , wherein the adhesive is applied as a bead between the back plate glass and the substrate glass.
25. The micro-electromechanical systems device of claim 6 , wherein the adhesive acts as a hermetic seal.
26. The micro-electromechanical systems device of claim 10 , wherein the adhesive is applied as a bead between the back plate glass and the substrate glass.
27. The micro-electromechanical systems device of claim 10 , wherein the adhesive acts as a hermetic seal.
28. The micro-electromechanical systems device of claim 1 , wherein the at least one mirror comprises a plurality of mirrors, and wherein the adhesive is applied substantially around the perimeter of the plurality of mirrors.
FIELD OF THE INVENTION
The present invention relates to a hermetic seal and methods to create the same. Specifically, a functional hermetic seal is disclosed that includes an adhesive mixed with an active component that can act as an absorbing filter on a molecular level.
To create an electronic display screen, a micro-electromechanical systems (MEMS) based device such as a mirror is sandwiched between two glass plates: the back plate glass stand the substrate glass. The mirror is typically processed on the substrate glass. The back plate glass is then placed on top of the substrate glass to form the sandwich. The purpose of the back plate glass is to act as a viewing surface and to provide mechanical and environmental protection to the mirror. The sandwich is also referred to as the package.
The MEMS based device that is packaged in this manner is susceptible to problems associated with moisture and other harmful contaminants. The presence of moisture can cause stiction (static friction). The stiction can result because of the physical hydrogen bonding between the two glass surfaces in contact or because of the surface tension forces that result when the moisture between the two glass surfaces undergoes capillary condensation during the actuation of the MEMS based device. The presence of moisture can also cause electrochemical corrosion; for example, if the mirror includes an aluminum mirror.
The presence of harmful contaminants and moisture can pose a danger to the functioning of MEMS based device. For example, chlorine and moisture can combine to form an acidic environment that can be harmful to the MEMS based device. It is important that the package is moisture and contaminant free for the life of the device.
There are various channels by which water vapor or the contaminant can find its way inside the package. The moisture can enter the package from the environment in which the MEMS device is packaged. The moisture can permeate into the package from outside. The contaminant can be formed as a result of the outgassing of package components such as glass and polymers, especially at elevated temperatures.
In the prior art, to prevent the moisture and the contaminant from entering the package, the back plate glass and the substrate glass of the package are sealed to each other by using techniques such as welding and soldering, and by using o-rings. These prior art techniques are lacking in at least two respects. One, welding and soldering materials and o-rings occupy space. Real estate in MEMS based device packages is tight and there is a growing need for smaller form factors. Two, these prior art techniques do not eliminate the moisture and contaminants that are formed inside the package as a result of, for example, outgassing.
A simple technique to effectively seal two surfaces to each other that does not occupy additional real estate is desirable.
BRIEF DESCRIPTION OF THE DRAWING
The present invention is illustrated by way of example and not limitation in the figure of the accompanying drawing, in which:
FIG. 1 illustrates an exemplary embodiment of package components that can be sealed with the hermetic seal of the present invention.
SUMMARY OF THE INVENTION
The hermetic seal including an adhesive mixed with an active component that can act as an absorbing filter on a molecular level is disclosed. The material can include a zeolite.
Additional features and advantages of the present invention will be apparent from the accompanying drawing and the detailed description that follows.
In the following descriptions for the purposes of explanation, numerous details are set forth such as examples of specific materials and methods in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that these specific details are not required in order to practice the present invention. In other instances, well known materials and methods have not been described in detail in order to avoid unnecessarily obscuring the present invention.
In this description, a hermetic seal and, methods to create the same are disclosed. The hermetic seal includes an adhesive mixed with molecular sieves or zeolites. In one embodiment, the zeolites can include aluminosilicate-structured minerals such as sodium aluminosilicate. In another embodiment, the zeolites can include microporous silicate-structured minerals. It will be appreciated that active components other than zeolites that can act as absorbing filters on a molecular level can also be used. In one embodiment, the adhesive can include an adhesive with low outgassing numbers. In other embodiments, the adhesives can include adhesives with various outgassing numbers.
In one embodiment, the zeolites are mixed with the adhesive in a weight: ratio of 50:50. In other embodiments, the zeolites are mixed with the adhesive in various weight ratios. In one embodiment, the zeolites include zeolites in the powder form. In another embodiment, the zeolites include zeolites pellets. In yet another embodiment, the zeolites include zeolites beads.
The hermetic seal of the present invention can be applied as a bead between two surfaces to seal the two surfaces. The surfaces can include glass, metal, polymer, plastic, alloy or ceramic surfaces, or a combination thereof. The amount of bead that is applied can depend on the estimated amount of moisture or contaminant gases that will have to be removed from the package during the life of the package. This amount can be calculated by considering factors such as the amount of moisture/contamination that is present inside the package when the package is formed, the permeation rate of the adhesive, and the outgassing potential of the package components.
The zeolites can absorb water molecules at high temperatures. Zeolites of different pore sizes can be selected to absorb different contaminants. In one embodiment, the zeolites are selected to absorb contaminant molecules such as aromatic branched-chain hydrocarbons that have critical diameters of up to ten angstroms. In another embodiment, zeolites of pore sizes between two and three angstroms can be selected to absorb molecules of diameters less than two angstroms, namely hydrogen and moisture molecules. In yet another embodiment, zeolites of pore sizes of fifty angstroms are used to absorb nitrogen and carbon dioxide. molecules. In yet another embodiment, the hermetic seal can include a mixture of zeolites of various pore sizes.
The hermetic seal of the present invention can be constructed in a simple manner without using techniques such as welding and soldering, or by using o-rings. The bead can be applied through a simple in-line manufacturing process. The bead occupies a negligible amount of real estate and it does not significantly bulk up the package. The hermetic seal includes active components in the form of zeolites that can trap the moisture and other contaminant gases in their pores. The hermetic seal provides mechanical support to the MEMS based device package.
FIG. 1 illustrates an exemplary embodiment of package components that can be sealed with the hermetic seal of the present invention. The components 100 for the MEMS based device in the form of a flat panel display are shown. The components include the substrate glass 110, the mirror 120, the hermetic seal bead 130 and the back plate glass 140. The mirror 120 is processed on the substrate glass 110. The bead 130 is applied to the substrate glass 110 around the perimeter of the mirror 120. The back plate glass 140 is placed on top of the substrate glass 110. The substrate glass 110 and the back plate glass 140 are sealed together by the bead 130 to form the package 100. In the ensuing description, the terms components 100 and package 100 are used interchangeably. Also, in the ensuing description, the terms bead 130 and hermetic seal 130 are used interchangeably.
The mirror 120 can be referred to as the MEMS based device or the MEMS structure. The package 100 can also be referred to as the glass sandwich. The package 100 formed by the components 100 can be a component of a flat panel display. An array of mirrors such as the mirror 120 can be processed on the substrate glass 110 to form the flat panel display. The back plate glass 140 serves as the viewing surface. The back plate glass 140 also serves a mechanical function because it prevents the user from touching the mirror 110.
The mirror 120 can be processed through conventional semiconductor technology processes. The mirror 120 can include a metallic mirror such as an aluminum mirror. It will be appreciated that in addition to the mirror 120, the package can include other display elements. It will be appreciated that clear plastic surfaces can replace the substrate glass 110 and the back plate glass 140.
The bead 130 can be applied around the perimeter of the mirror 120. For the embodiments in which the substrate glass 110 includes a plurality of mirrors 130 120, the bead 130 can be applied around the perimeter of the plurality of mirrors 120. In one embodiment, the bead 130 thickness is one hundred angstroms. In another embodiment, the bead 130 thickness is two hundred angstroms. In yet another embodiment, the bead 130 thickness is three hundred angstroms. In still other embodiments, beads 130 of various thicknesses that maintain a low form factor for the package 100 can be applied.
It will be appreciated that the application of the hermetic seal 130 of the present invention is not limited to the MEMS based products. The hermetic seal 130 can seal various surfaces of various devices and products. The hermetic seal 130 can seal surfaces including metals, plastics, polymers, ceramics, alloys and the like. The hermetic seal 130 of the present invention is ideal for the space critical environments because it occupies negligible real estate. The prior art seals that are formed by using techniques such as welding and soldering or by using o-rings can substantially bulk up the size of the package 100. The hermetic seal 130 can be applied through simple in-line manufacturing processes. The prior art techniques of welding and soldering require very high temperature processes that are expensive, can damage the package, and occupy valuable real estate.
The hermetic seal 130 acts as an environmental barrier by blocking humidity and chemical contaminants from entering the package 100. The hermetic seal 130 includes an adhesive mixed with an active component such as the zeolites. The adhesive alone, even a low permeation rate adhesive, cannot serve as a perfect environmental barrier because it eventually allows the contaminants and moisture to permeate. The active component can grab the contaminants and moisture that try to permeate into the package 100, instead of merely blocking their entry. The active component can grab the contaminant gases that result from outgassing of the components 100 after the package 100 is formed. The active component can grab the portion of the adhesive that evaporates into the package 100 while the adhesive is curing. The thickness of the bead 130 and the amount of active component that is mixed with the adhesive can depend on the package 100 estimated life time and the estimated amount of contaminants and moisture that can penetrate the package 100 during the expected life time.
In some embodiments, an outer bead 150 of adhesive is applied around the perimeter of the bead 130. The outer bead 150 can include a low permeation rate adhesive. The outer bead 150 can provide additional environmental protection to the package 100. The outer bead can be useful for the aggressive environment in which the bead 130 alone cannot serve as an effective hermetic seal without being loaded with an impractical amount of the active component. If the bead 130 includes a very high portion of zeolites in the zeolites-adhesive mixture, for example more than sixty percent zeolites by weight, the bead 130 can become microscopically porous. The bead 130 can also become highly non-viscous and thus difficult to apply. Also, the bead 130 with a high percentage of zeolite by weight may not provide a robust mechanical support to the package 100. In aggressive environments, the application of the outer bead 150 can slow down the penetration process of contaminants and moisture into the package 100.
In the foregoing specification, the invention has been described with reference to specific exemplary embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention as set forth in the claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US2534846||Sep 8, 1947||Dec 19, 1950||Emi Ltd||Color filter|
|US3439973||Jun 25, 1964||Apr 22, 1969||Siemens Ag||Polarizing reflector for electromagnetic wave radiation in the micron wavelength|
|US3443854||Jun 25, 1964||May 13, 1969||Siemens Ag||Dipole device for electromagnetic wave radiation in micron wavelength ranges|
|US3653741||Feb 16, 1970||Apr 4, 1972||Alvin M Marks||Electro-optical dipolar material|
|US3656836||Jun 26, 1969||Apr 18, 1972||Thomson Csf||Light modulator|
|US3704806 *||Jan 6, 1971||Dec 5, 1972||Le T Im Lensoveta||Dehumidifying composition and a method for preparing the same|
|US3813265||Mar 23, 1972||May 28, 1974||Marks A||Electro-optical dipolar material|
|US3900440 *||Oct 23, 1973||Aug 19, 1975||Kuraray Co||Adhesive composition|
|US3955880||Jul 15, 1974||May 11, 1976||Organisation Europeenne De Recherches Spatiales||Infrared radiation modulator|
|US4036360 *||Nov 12, 1975||Jul 19, 1977||Graham Magnetics Incorporated||Package having dessicant composition|
|US4074480 *||Feb 12, 1976||Feb 21, 1978||Burton Henry W G||Kit for converting single-glazed window to double-glazed window|
|US4099854||Oct 12, 1976||Jul 11, 1978||The Unites States Of America As Represented By The Secretary Of The Navy||Suspension of absorbing particles in a group 1a or 2a halide|
|US4228437||Jun 26, 1979||Oct 14, 1980||The United States Of America As Represented By The Secretary Of The Navy||Wideband polarization-transforming electromagnetic mirror|
|US4377324||Aug 4, 1980||Mar 22, 1983||Honeywell Inc.||Graded index Fabry-Perot optical filter device|
|US4389096||Feb 23, 1981||Jun 21, 1983||Matsushita Electric Industrial Co., Ltd.||Image display apparatus of liquid crystal valve projection type|
|US4403248||Mar 4, 1981||Sep 6, 1983||U.S. Philips Corporation||Display device with deformable reflective medium|
|US4431691 *||Jul 29, 1981||Feb 14, 1984||Tremco, Incorporated||Dimensionally stable sealant and spacer strip and composite structures comprising the same|
|US4441791||Jun 7, 1982||Apr 10, 1984||Texas Instruments Incorporated||Deformable mirror light modulator|
|US4445050||Dec 15, 1981||Apr 24, 1984||Marks Alvin M||Device for conversion of light power to electric power|
|US4482213||Nov 23, 1982||Nov 13, 1984||Texas Instruments Incorporated||Perimeter seal reinforcement holes for plastic LCDs|
|US4500171||Jun 2, 1982||Feb 19, 1985||Texas Instruments Incorporated||Process for plastic LCD fill hole sealing|
|US4519676||Jan 24, 1983||May 28, 1985||U.S. Philips Corporation||Passive display device|
|US4531126||May 17, 1982||Jul 23, 1985||Societe D'etude Du Radant||Method and device for analyzing a very high frequency radiation beam of electromagnetic waves|
|US4552806 *||Jul 12, 1983||Nov 12, 1985||Kabushiki Kaisha Toyota Chuo Kenkyusho||Cellular glass coated with a heat insulator|
|US4566935||Jul 31, 1984||Jan 28, 1986||Texas Instruments Incorporated||Spatial light modulator and method|
|US4571603||Jan 10, 1984||Feb 18, 1986||Texas Instruments Incorporated||Deformable mirror electrostatic printer|
|US4596992||Aug 31, 1984||Jun 24, 1986||Texas Instruments Incorporated||Linear spatial light modulator and printer|
|US4615595||Oct 10, 1984||Oct 7, 1986||Texas Instruments Incorporated||Frame addressed spatial light modulator|
|US4662746||Oct 30, 1985||May 5, 1987||Texas Instruments Incorporated||Spatial light modulator and method|
|US4663083||Apr 3, 1984||May 5, 1987||Marks Alvin M||Electro-optical dipole suspension with reflective-absorptive-transmissive characteristics|
|US4681403||Jun 19, 1986||Jul 21, 1987||U.S. Philips Corporation||Display device with micromechanical leaf spring switches|
|US4710732||Jul 31, 1984||Dec 1, 1987||Texas Instruments Incorporated||Spatial light modulator and method|
|US4748366||Sep 2, 1986||May 31, 1988||Taylor George W||Novel uses of piezoelectric materials for creating optical effects|
|US4786128||Dec 2, 1986||Nov 22, 1988||Quantum Diagnostics, Ltd.||Device for modulating and reflecting electromagnetic radiation employing electro-optic layer having a variable index of refraction|
|US4790635||Apr 24, 1987||Dec 13, 1988||The Secretary Of State For Defence In Her Brittanic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland||Electro-optical device|
|US4856863||Jun 22, 1988||Aug 15, 1989||Texas Instruments Incorporated||Optical fiber interconnection network including spatial light modulator|
|US4950344 *||Dec 5, 1988||Aug 21, 1990||Lauren Manufacturing Company||Using ultraviolet curable adhesive as sealant|
|US4954789||Sep 28, 1989||Sep 4, 1990||Texas Instruments Incorporated||Spatial light modulator|
|US4956619||Oct 28, 1988||Sep 11, 1990||Texas Instruments Incorporated||Spatial light modulator|
|US4977009 *||Mar 6, 1990||Dec 11, 1990||Ford Motor Company||Composite polymer/desiccant coatings for IC encapsulation|
|US4982184||Jan 3, 1989||Jan 1, 1991||General Electric Company||Electrocrystallochromic display and element|
|US5018256||Jun 29, 1990||May 28, 1991||Texas Instruments Incorporated||Architecture and process for integrating DMD with control circuit substrates|
|US5018258||Dec 1, 1989||May 28, 1991||Valmet Paper Machinery Inc.||Support system for a variable-crown roll|
|US5022745||Sep 7, 1989||Jun 11, 1991||Massachusetts Institute Of Technology||Electrostatically deformable single crystal dielectrically coated mirror|
|US5028939||Jun 26, 1989||Jul 2, 1991||Texas Instruments Incorporated||Spatial light modulator system|
|US5037173||Nov 22, 1989||Aug 6, 1991||Texas Instruments Incorporated||Optical interconnection network|
|US5044736||Nov 6, 1990||Sep 3, 1991||Motorola, Inc.||Configurable optical filter or display|
|US5061049||Sep 13, 1990||Oct 29, 1991||Texas Instruments Incorporated||Spatial light modulator and method|
|US5075796||Sep 17, 1990||Dec 24, 1991||Eastman Kodak Company||Optical article for multicolor imaging|
|US5078479||Apr 18, 1991||Jan 7, 1992||Centre Suisse D'electronique Et De Microtechnique Sa||Light modulation device with matrix addressing|
|US5079544||Feb 27, 1989||Jan 7, 1992||Texas Instruments Incorporated||Standard independent digitized video system|
|US5083857||Jun 29, 1990||Jan 28, 1992||Texas Instruments Incorporated||Multi-level deformable mirror device|
|US5095375 *||Mar 29, 1991||Mar 10, 1992||Hughes Aircraft Company||Holographic combiner edge seal design and composition|
|US5096279||Nov 26, 1990||Mar 17, 1992||Texas Instruments Incorporated||Spatial light modulator and method|
|US5099353||Jan 4, 1991||Mar 24, 1992||Texas Instruments Incorporated||Architecture and process for integrating DMD with control circuit substrates|
|US5124834||Nov 16, 1989||Jun 23, 1992||General Electric Company||Transferrable, self-supporting pellicle for elastomer light valve displays and method for making the same|
|US5142405||Jun 29, 1990||Aug 25, 1992||Texas Instruments Incorporated||Bistable dmd addressing circuit and method|
|US5153771||Jul 18, 1990||Oct 6, 1992||Northrop Corporation||Coherent light modulation and detector|
|US5162787||May 30, 1991||Nov 10, 1992||Texas Instruments Incorporated||Apparatus and method for digitized video system utilizing a moving display surface|
|US5168406||Jul 31, 1991||Dec 1, 1992||Texas Instruments Incorporated||Color deformable mirror device and method for manufacture|
|US5170156||May 30, 1991||Dec 8, 1992||Texas Instruments Incorporated||Digitized video system|
|US5172262||Apr 16, 1992||Dec 15, 1992||Texas Instruments Incorporated||Spatial light modulator and method|
|US5179274||Jul 12, 1991||Jan 12, 1993||Texas Instruments Incorporated||Method for controlling operation of optical systems and devices|
|US5192395||Oct 12, 1990||Mar 9, 1993||Texas Instruments Incorporated||Method of making a digital flexure beam accelerometer|
|US5192946||May 30, 1991||Mar 9, 1993||Texas Instruments Incorporated||Digitized color video display system|
|US5206629||Jul 3, 1991||Apr 27, 1993||Texas Instruments Incorporated||Spatial light modulator and memory for digitized video display|
|US5212582||Mar 4, 1992||May 18, 1993||Texas Instruments Incorporated||Electrostatically controlled beam steering device and method|
|US5214419||Jun 26, 1991||May 25, 1993||Texas Instruments Incorporated||Planarized true three dimensional display|
|US5214420||Jun 26, 1991||May 25, 1993||Texas Instruments Incorporated||Spatial light modulator projection system with random polarity light|
|US5216537||Jan 2, 1992||Jun 1, 1993||Texas Instruments Incorporated||Forming a spatial light modulator|
|US5226099||Apr 26, 1991||Jul 6, 1993||Texas Instruments Incorporated||Digital micromirror shutter device|
|US5231532||Feb 5, 1992||Jul 27, 1993||Texas Instruments Incorporated||Switchable resonant filter for optical radiation|
|US5233385||Dec 18, 1991||Aug 3, 1993||Texas Instruments Incorporated||White light enhanced color field sequential projection|
|US5233456||Dec 20, 1991||Aug 3, 1993||Texas Instruments Incorporated||Resonant mirror and method of manufacture|
|US5233459||Mar 6, 1991||Aug 3, 1993||Massachusetts Institute Of Technology||Electric display device|
|US5244707 *||Jan 10, 1992||Sep 14, 1993||Shores A Andrew||Enclosure for electronic devices|
|US5254980||Sep 6, 1991||Oct 19, 1993||Texas Instruments Incorporated||DMD display system controller|
|US5272473||Aug 17, 1992||Dec 21, 1993||Texas Instruments Incorporated||Coherent light projection system|
|US5278652||Mar 23, 1993||Jan 11, 1994||Texas Instruments Incorporated||DMD architecture and timing for use in a pulse width modulated display system|
|US5280277||Nov 17, 1992||Jan 18, 1994||Texas Instruments Incorporated||Field updated deformable mirror device|
|US5287096||Sep 18, 1992||Feb 15, 1994||Texas Instruments Incorporated||Variable luminosity display system|
|US5296950||Jan 31, 1992||Mar 22, 1994||Texas Instruments Incorporated||Optical signal free-space conversion board|
|US5304419 *||Mar 9, 1992||Apr 19, 1994||Alpha Fry Ltd||Electronics; pressure sensitive adhesive and desiccant|
|US5305640||May 1, 1992||Apr 26, 1994||Texas Instruments Incorporated||Digital flexure beam accelerometer|
|US5311360||Apr 28, 1992||May 10, 1994||The Board Of Trustees Of The Leland Stanford, Junior University||Method and apparatus for modulating a light beam|
|US5312513||Apr 3, 1992||May 17, 1994||Texas Instruments Incorporated||Deformable mirror device with patterns, circuits and etching to form patterns|
|US5323002||Jun 8, 1993||Jun 21, 1994||Texas Instruments Incorporated||Spatial light modulator based optical calibration system|
|US5325116||Sep 18, 1992||Jun 28, 1994||Texas Instruments Incorporated||Device for writing to and reading from optical storage media|
|US5327286||Aug 31, 1992||Jul 5, 1994||Texas Instruments Incorporated||Real time optical correlation system|
|US5331454||Jan 16, 1992||Jul 19, 1994||Texas Instruments Incorporated||Low reset voltage process for DMD|
|US5339116||Oct 15, 1993||Aug 16, 1994||Texas Instruments Incorporated||DMD architecture and timing for use in a pulse-width modulated display system|
|US5365283||Jul 19, 1993||Nov 15, 1994||Texas Instruments Incorporated||Color phase control for projection display using spatial light modulator|
|US5381253||Nov 14, 1991||Jan 10, 1995||Board Of Regents Of University Of Colorado||Chiral smectic liquid crystal optical modulators having variable retardation|
|US5401983||Apr 7, 1993||Mar 28, 1995||Georgia Tech Research Corporation||Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices|
|US5411769||Sep 29, 1993||May 2, 1995||Texas Instruments Incorporated||Forming a low surface energy, wear resistant thin film on the surface of a device|
|US5444566||Mar 7, 1994||Aug 22, 1995||Texas Instruments Incorporated||Optimized electronic operation of digital micromirror devices|
|US5446479||Aug 4, 1992||Aug 29, 1995||Texas Instruments Incorporated||Multi-dimensional array video processor system|
|US5448314||Jan 7, 1994||Sep 5, 1995||Texas Instruments||Method and apparatus for sequential color imaging|
|US5452024||Nov 1, 1993||Sep 19, 1995||Texas Instruments Incorporated||DMD display system|
|US5454906||Jun 21, 1994||Oct 3, 1995||Texas Instruments Inc.||Method of providing sacrificial spacer for micro-mechanical devices|
|US5457493||Sep 15, 1993||Oct 10, 1995||Texas Instruments Incorporated||Digital micro-mirror based image simulation system|
|US5457566||Dec 30, 1992||Oct 10, 1995||Texas Instruments Incorporated||For scanning an image|
|US5459602||Oct 29, 1993||Oct 17, 1995||Texas Instruments||Micro-mechanical optical shutter|
|US5459610||May 20, 1993||Oct 17, 1995||The Board Of Trustees Of The Leland Stanford, Junior University||Deformable grating apparatus for modulating a light beam and including means for obviating stiction between grating elements and underlying substrate|
|US5461411||Mar 29, 1993||Oct 24, 1995||Texas Instruments Incorporated||Process and architecture for digital micromirror printer|
|US5489952||Jul 14, 1993||Feb 6, 1996||Texas Instruments Incorporated||Method and device for multi-format television|
|US5497172||Jun 13, 1994||Mar 5, 1996||Texas Instruments Incorporated||Method of loading frames of data to a spatial light modulator|
|US5497197||Nov 4, 1993||Mar 5, 1996||Texas Instruments Incorporated||System and method for packaging data into video processor|
|US5499062||Jun 23, 1994||Mar 12, 1996||Texas Instruments Incorporated||Multiplexed memory timing with block reset and secondary memory|
|US5500635||Nov 10, 1994||Mar 19, 1996||Mott; Jonathan C.||Shoe that lights|
|US5547823 *||Nov 9, 1995||Aug 20, 1996||Ishihara Sangyo Kaisha, Ltd.||Photocatalyst composite and process for producing the same|
|US5553440 *||Oct 20, 1994||Sep 10, 1996||Ppg Industries, Inc.||Multi-sheet glazing unit and method of making same|
|US5591379 *||Aug 2, 1993||Jan 7, 1997||Alpha Fry Limited||Moisture getting composition for hermetic microelectronic devices|
|US5815141 *||Apr 12, 1996||Sep 29, 1998||Elo Touch Systems, Inc.||Resistive touchscreen having multiple selectable regions for pressure discrimination|
|US5835255 *||May 5, 1994||Nov 10, 1998||Etalon, Inc.||Visible spectrum modulator arrays|
|US5853662 *||Apr 17, 1996||Dec 29, 1998||Mitsubishi Gas Chemical Company, Inc.||Method for preserving polished inorganic glass and method for preserving article obtained by using the same|
|US5986796 *||Nov 5, 1996||Nov 16, 1999||Etalon Inc.||Visible spectrum modulator arrays|
|US6040937 *||Jul 31, 1996||Mar 21, 2000||Etalon, Inc.||Interferometric modulation|
|US6055090 *||Jan 27, 1999||Apr 25, 2000||Etalon, Inc.||Interferometric modulation|
|US6238755 *||Nov 13, 1998||May 29, 2001||Dow Corning Corporation||Insulating glass units|
|US6355328 *||Nov 23, 1998||Mar 12, 2002||Truseal Technologies, Inc.||Preformed flexible laminate|
|US6465355 *||Apr 27, 2001||Oct 15, 2002||Hewlett-Packard Company||Method of fabricating suspended microstructures|
|US6466358 *||Dec 28, 2000||Oct 15, 2002||Texas Instruments Incorporated||Analog pulse width modulation cell for digital micromechanical device|
|US6473274 *||Jun 28, 2000||Oct 29, 2002||Texas Instruments Incorporated||Symmetrical microactuator structure for use in mass data storage devices, or the like|
|US6480177 *||Jun 2, 1998||Nov 12, 2002||Texas Instruments Incorporated||Blocked stepped address voltage for micromechanical devices|
|US6496122 *||Jun 26, 1998||Dec 17, 2002||Sharp Laboratories Of America, Inc.||Image display and remote control system capable of displaying two distinct images|
|US6545335 *||Dec 27, 1999||Apr 8, 2003||Xerox Corporation||Structure and method for electrical isolation of optoelectronic integrated circuits|
|US6548908 *||Dec 27, 1999||Apr 15, 2003||Xerox Corporation||Structure and method for planar lateral oxidation in passive devices|
|US6549338 *||Nov 7, 2000||Apr 15, 2003||Texas Instruments Incorporated||Bandpass filter to reduce thermal impact of dichroic light shift|
|US6552840 *||Nov 30, 2000||Apr 22, 2003||Texas Instruments Incorporated||Electrostatic efficiency of micromechanical devices|
|US6582789 *||Sep 28, 2000||Jun 24, 2003||Teijin Limited||Surface protective film and laminate formed therefrom|
|US6600201 *||Aug 3, 2001||Jul 29, 2003||Hewlett-Packard Development Company, L.P.||Systems with high density packing of micromachines|
|US6606175 *||Mar 16, 1999||Aug 12, 2003||Sharp Laboratories Of America, Inc.||Multi-segment light-emitting diode|
|US6625047 *||Dec 31, 2001||Sep 23, 2003||Texas Instruments Incorporated||Micromechanical memory element|
|US6630786 *||Mar 30, 2001||Oct 7, 2003||Candescent Technologies Corporation||Light-emitting device having light-reflective layer formed with, or/and adjacent to, material that enhances device performance|
|US6643069 *||Aug 28, 2001||Nov 4, 2003||Texas Instruments Incorporated||SLM-base color projection display having multiple SLM's and multiple projection lenses|
|US6650455 *||Nov 13, 2001||Nov 18, 2003||Iridigm Display Corporation||Photonic mems and structures|
|US6674090 *||Dec 27, 1999||Jan 6, 2004||Xerox Corporation||Structure and method for planar lateral oxidation in active|
|US6674562 *||Apr 8, 1998||Jan 6, 2004||Iridigm Display Corporation||Interferometric modulation of radiation|
|US6680792 *||Oct 10, 2001||Jan 20, 2004||Iridigm Display Corporation||Interferometric modulation of radiation|
|US6709750 *||May 20, 1999||Mar 23, 2004||Metallgesellschaft Aktiengesellschaft||Hot-melt adhesive for sealing the edge of laminated glass|
|US6710908 *||Feb 13, 2002||Mar 23, 2004||Iridigm Display Corporation||Controlling micro-electro-mechanical cavities|
|US6775174 *||Dec 28, 2001||Aug 10, 2004||Texas Instruments Incorporated||Memory architecture for micromirror cell|
|US6778155 *||Jul 31, 2001||Aug 17, 2004||Texas Instruments Incorporated||Display operation with inserted block clears|
|US6822628 *||Jun 28, 2001||Nov 23, 2004||Candescent Intellectual Property Services, Inc.||Methods and systems for compensating row-to-row brightness variations of a field emission display|
|US6859218 *||Nov 7, 2000||Feb 22, 2005||Hewlett-Packard Development Company, L.P.||Electronic display devices and methods|
|US20030043157 *||Aug 19, 2002||Mar 6, 2003||Iridigm Display Corporation||Photonic MEMS and structures|
|US20030072070 *||Feb 25, 2002||Apr 17, 2003||Etalon, Inc., A Ma Corporation||Visible spectrum modulator arrays|
|US20030202266 *||Mar 12, 2003||Oct 30, 2003||Ring James W.||Micro-mirror device with light angle amplification|
|US20040051929 *||Aug 19, 2003||Mar 18, 2004||Sampsell Jeffrey Brian||Separable modulator|
|US20040240032 *||Jan 5, 2004||Dec 2, 2004||Miles Mark W.||Interferometric modulation of radiation|
|1||"Light over Matter," Circle No. 36 (Jun. 1993).|
|2||Akasaka, "Three-Dimensional IC Trends," Proceedings of IEEE, vol. 74, No. 12, pp. 1703-1714 (Dec. 1986).|
|3||Aratani et al., "Process and Design Considerations for Surface Micromachined Beams for a Tuneable Interferometer Array in Silicon," Proc. IEEE Microelectromechanical Workshop, Fort Lauderdale, FL, pp. 230-235 (Feb. 1993).|
|4||Aratani et al., "Surface Micromachined Tuneable Interferometer Array," Sensors and Actuators, pp. 17-23 (1994).|
|5||Conner, "Hybrid Color Display Using Optical Interference Filter Array," SID Digest, pp. 577-580 (1993).|
|6||Goosen et al., "Silicoon Modulator Based on Mechanically-Active Anti-Reflection Layer with 1Mbit/sec Capability for Fiber-in-the-Loop Applications," IEEE Photonics Technology Letters (Sep. 1994).|
|7||Goossen et al., "Possible Display Applications of the Silicon Mechinical Anti-Reflection Switch, " Society for Information Display (1994).|
|8||Gosch, "West Germany Grabs the Lead in X-Ray Litography," Electronics, pp. 78-80 (Feb. 5, 1987).|
|9||Howard et al., "Nanometer-Scale Fabrication Techniques," VLSI Electronics:Microstructure Science, vol. 5, pp. 145-153 and pp. 166-173 (1982).|
|10||Jackson, "Classical Electrodynamics," John Wiley & Sons Inc., pp. 568-573.|
|11||Jerman et al., "A Miniature Fabry-Perot Interfrometer with a Corrugated Silicon Diaphragm Support," IEEE Electron Devices Society (1988).|
|12||Johnson "Optical Scanners," Microwave Scanning Antennas, vol. 1, pp. 251-261 (1964).|
|13||Miles, "A New Reflective FPD Technology Using Interferometric Modulation," Society for Information Display '97 Digest, Session 7.3.|
|14||Newsbreaks, "Quantum-trench devices might operate at terahertz frequencies," Laser Focus World (May 1993).|
|15||Office Action mailed Sep. 24, 2002 in U.S. App. No. 09/921,196.|
|16||Oliner et al., "Radiating Elements and Mutual Coupling," Microwave Scanning Antennas, vol. 2, pp. 134-194 (1966).|
|17||Raley et al., "A Fabry-Perot Microinterferometer for Visible Wavelenghts," IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC (1992).|
|18||Sperger et al., "High Performance Patterned All-Dielectric Interference Colour Filter for Display Applications," SID Digest, pp. 81-83 (1994).|
|19||Stone, "Radiation and Optics, An Introduction to the Classical Theory," McGraw-Hill, pp. 340-343 (1963).|
|20||Walker, et al., "Electron-beam-tunable Interference Filter Spatial Light Modulator," Optics Letters, vol. 13, No. 5, pp. 345-347 (May 1988).|
|21||Winton, John M., "A novel way to capture solar energy," Chemical Week, pp. 17-18 (May 15, 1985).|
|22||Wu, "Design of a Reflective Color LCD Using Optical Interference Reflectors," ASIA Display '95, pp. 929-931 (Oct. 16, 1995).|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US7561334||Dec 20, 2005||Jul 14, 2009||Qualcomm Mems Technologies, Inc.||Method and apparatus for reducing back-glass deflection in an interferometric modulator display device|
|US7629678||Aug 21, 2007||Dec 8, 2009||Qualcomm Mems Technologies, Inc.||Method and system for sealing a substrate|
|US7642127||Jul 17, 2007||Jan 5, 2010||Qualcomm Mems Technologies, Inc.||Method and system for sealing a substrate|
|US7715080||Apr 13, 2007||May 11, 2010||Qualcomm Mems Technologies, Inc.||Packaging a MEMS device using a frame|
|US7826127||Jun 20, 2007||Nov 2, 2010||Qualcomm Mems Technologies, Inc.||MEMS device having a recessed cavity and methods therefor|
|US7935555||Nov 30, 2009||May 3, 2011||Qualcomm Mems Technologies, Inc.||Method and system for sealing a substrate|
|Oct 30, 2009||AS||Assignment|
Owner name: QUALCOMM MEMS TECHNOLOGIES, INC., CALIFORNIA
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:IDC,LLC;REEL/FRAME:023449/0614
Effective date: 20090925