|Publication number||USRE42773 E1|
|Application number||US 10/729,584|
|Publication date||Oct 4, 2011|
|Priority date||Jun 17, 1992|
|Publication number||10729584, 729584, US RE42773 E1, US RE42773E1, US-E1-RE42773, USRE42773 E1, USRE42773E1|
|Inventors||Mark E. Tuttle, John R. Tuttle, Rickie C. Lake|
|Original Assignee||Round Rock Research, Llc|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (130), Non-Patent Citations (20), Referenced by (1), Classifications (57), Legal Events (5)|
|External Links: USPTO, USPTO Assignment, Espacenet|
More than one reissue application has been filed for the reissue of U.S. Pat. No. 6,325,294. The reissue applications are the initial reissue application Ser. No. 10/729,584 filed Dec. 4, 2003, a divisional reissue application Ser. No. 11/849,941, filed Sep. 4, 2007, a continuation reissue application Ser. No. 11/849,868, filed Sep. 4, 2007, and another continuation reissue application Ser. No. 11/849,899, filed Sep. 4, 2007, the teachings of all of which are incorporated by reference herein.
This is a Continuation Application of U.S. patent application Ser. No. 09/008,215, filed Jan. 16, 1998, now U.S. Pat. No. 6,220,516, and titled “Method of Manufacturing an Enclosed Transceiver”, which is a divisional of U.S. patent application Ser. No. 08/781,107, filed Jan. 9, 1997, now U.S. Pat. No. 5,776,278, which in turn is a continuation of U.S. patent application Ser. No. 08/602,686, filed on Feb. 16, 1996, now abandoned, which is a file wrapper continuation of U.S. patent application Ser. No. 08/137,677, filed Oct. 14, 1993, now abandoned, which is a continuation-in-part of U.S. patent application Ser. No. 07/899,777, filed Jun. 17, 1992, now abandoned.
This is a continuation-in-part of and claims priority from, U.S. patent application Ser. No. 899,777 filed an Jun. 17, 1992.
The present invention relates generally to a process for manufacturing an enclosed transceiver, such as a radio frequency identification (“RFID”) tag.
In the field of radio frequency identification (“RFID”), communication systems have been developed utilizing relatively large packages whose size is on the order of that of a cigarette package or a substantial fraction thereof, and generally speaking, have been fabricated using hybrid circuit fabrication techniques. These relatively large electronic packages have been affixed, for example, to railroad cars to reflect RF signals in order to monitor the location and movement of such cars.
With respect to an enclosed electronic apparatus, a system for handling baggage in an airport terminal is a typical application. Such a system incorporates radio frequency identification (RFID) between interrogators and transceivers. Further, each baggage tag is an enclosed, battery operated transceiver.
Other smaller passive RFID packages have been developer for applications in the field of transportation, including the tracking of automobiles. These packages include reflective systems of the type produced by Amtech Inc. of Dallas, Tx. However, these reflective passive RFID packages which operate by modulating the impedance of an antenna are inefficient in operation, require large amounts of power to operate, and have a limited data handling capability.
In still other applications of article location and tracking such as in the postal service or in the field of airline baggage handling and transport, it has not been practical or feasible to use the above relatively large and expensive RFID hybrid packages on smaller articles of transport such as letters, boxed mail shipments or airline luggage. Accordingly, in these latter areas of transport monitoring, as well as many other areas such as inventory control of stored articles, article location and tracking methods have traditionally employed bar code identification and optical character recognition (OCR) techniques which are well known in the art.
Bar code identification and OCR techniques are labor intensive and may, for example, require several airline employees or postal workers to physically manipulate the article and/or the bar code readers to read these bar codes before the transported article reaches its final destination. In addition, the cost of bar code readers and optical character readers is high, limiting the number of locations at which these readers can be used. Furthermore, both bar code readers and optical character readers tend to be highly unreliable.
In yet further and somewhat unrelated fields of: (1) animal tracking and (2) plant tracking, other types of passive RFID tags have been developed by Hughes/IDI/Destron of Irvine, California. These tags utilize a coil wrapped around a ferrite core. Such passive RFID tags have a very limited range, on the order of nine (9) inches, have a very limited data handling capability, and are not field programmable. In addition, these tags are limited in data storage capacity and are slow in operation.
In view of the problems described above and related problems that consequently become apparent to those skilled in the applicable arts, the need remains for enclosed electronic apparatus including transceivers wherein the enclosure is inexpensive, readily manufactured in high volume, appropriate in size for use as a stamp, label, or tag, and, in the case of transceivers, operable over distances of several hundred feet without regard for the spacial orientation of the enclosure.
The general purpose and principal object of the present invention is to provide a novel alternative approach to all of the above prior art RFID, OCR, and bar code type location tracking and data storage systems. This new approach as described and claimed herein represents a fundamental breakthrough in the field of article transport control in a wide variety of fields, of which the fields of airline baggage transport, delivery of parcels and mail, and inventory control are only three examples.
To accomplish this purpose and object, we have invented and developed a new and improved radio frequency identification device, an associated electrical system, and a method for communicating with a remote RFID device from a local interrogator and controller. The size of this new device will typically be on the order of one inch square and 0.03 inches thick, or only slightly larger and slightly thicker than a postage stamp. This device includes, in combination, an integrated circuit (IC) which is mounted in an approximately one inch square package and is encapsulated, for example laminated, in a flexible or rigid thin film material. This material may also include a suitable adhesive backing for reliably securing the package to an outer surface or printed label of an article of interest. The IC includes therein a receiver section for driving suitable control logic and memory for decoding and storing input information such as an identification number, the baggage owner's name, point of origin, weight, size, route, destination, and the like. This memory includes, but is not limited to, PROMS, EPROMS, EEPROMS, SRAMs, DRAMs, and ferroelectric memory devices. The IC also includes a transmitter section therein operative for transmitting this information to an interrogator upon subsequent IC interrogation. An RF antenna is placed in a desired geometrical configuration (for example, monopole, dipole, loop, bow-tie, or dual-dipole) and incorporated within or on the thin film material and adjacent to the IC in an essentially two dimensional structure, neglecting the approximately 30 mil thickness dimension of the completed structure.
Advantageously, a thin battery is connected to the IC for providing power to the IC. The IC also incorporates circuitry to allow for operation in a sleep mode during transit and in storage in order to conserve power. Thus, at shipment points of origin, destination, and locations in transit, an operator may encode data into the IC or interrogate the IC by signaling the IC from a remote location to thereby “wake up” the IC without engaging in any hands-on operation.
In a preferred embodiment of the invention, the integrated circuit receiver and transmitter are operated in a spread spectrum mode and in the frequency range of 200 Mhz MHZ to 10 GHz, with the range of 800 MHz to 8 GHz being the range of most importance. This operation has the effect of avoiding errors or improper operation due to extraneous signal sources and other sources of interference, multipathing, and reflected radiation from the surrounding environment.
Accordingly, it is a further object of this invention to provide an RFID electronic device of the type described and method of fabricating such device.
Another object of this invention is to provide an RFID system and method of operation of the type described which utilizes RF transmitting and receiving sections on a single IC. Such a system has applications for tracking people or articles in both storage and transit.
Another object of this invention is to provide an electronic device of the type described which does not include bulky hybrid circuits, use modulation techniques described above for passive RFID tags, nor require scanning of bar codes, bar code readers, optical character readers, or especially clean operating environments.
Another object of this invention is to provide an electronic device of the type described which may be manufactured using integrated circuit fabrication and packaging processes.
Another object of this invention is to provide an electronic device of the type described which may be reliably and economically manufactured at high yields and at a high performance to price figure of merit.
Another object of this invention is to provide an RFID device of the type described which is field writable and has a transmission range greater than five (5) feet.
Another object of this invention is to provide a novel assembly process for manufacturing the RFID electronic device described herein.
Another object is to provide a manufacturing process of the type described which is conducive to high speed automation.
Another object is to provide an enclosed electronic device of the type described which is further conducive to high speed product usage, since these RFID devices may be supplied to the customer in a tape and reel format, a fan fold format, or a sheet format.
Another object of this invention is to provide an RFID device of the type described which may be powered with the use of an RF coil and capacitor and without the use of a battery. Such device is also referred to herein as the “passive” device embodiment. However, the term “passive” refers only to the fact that no battery is used, whereas the electrical circuitry on the IC is indeed active while being powered by the RF coil and capacitor combination.
Another object of this invention is to provide a non-contact method of object and person detection and location which can serve as a replacement for metal-to-metal contact in smart card applications and as a replacement for magneticstrip, bar code, and other types of contact-powered electronics. This novel method of object detection and location represents a significant saving of time and manual effort. For example, consider the time and effort involved when a person must first remove a smart card from a pocket or billfold and then insert the card in a card reader device before being allowed entry into a secured area within a building.
Another object of this invention is to provide an electronic device, system, and communication method of the type described which represents, in novel combination, a fundamental breakthrough in many diverse fields of article shipment, including the parcel post and postal fields, the airline industry, inventory control for many manufacturing industries, security, waste management, personnel, and the like.
Accordingly, an enclosed electrical assembly of the present invention includes: a rigid or flexible thin film support member having an integrated circuit (IC) disposed thereon and an antenna incorporated within the IC or positioned adjacent to the IC within a predetermined area of the thin support member; means on the IC for receiving and encoding data relating to the article being stored or shipped; and means on the IC for reading the stored data and transmitting this data to an operator at a remote location.
According to a first aspect of such an assembly, a base member and a cover member each having conductive patterns developed thereon connect the IC in series with two thin film batteries. By arranging two batteries with the IC, no substantial current flows through a laminated or folded portion of the assembly. Smaller signal levels, lower power operation, and longer useful life of the assembly results.
According to another aspect, antenna coupling is also provided to the IC without current flow through a laminated or folded portion of the assembly. Greater sensitivity in receiving and lower losses in transmitting result.
According to another aspect of the present invention, an RFID device has two modes of operation are provided with a wake-up circuit. The wake-up circuit senses in-band energy and switches from a sleep mode to an operating (waked) mode. The sleep mode being useful during transit and storage of the RFID device to conserve battery power.
According to another aspect of such an RFID device, the IC includes receiver and transmitter sections characterized by spread spectrum modulation. Use of spread spectrum modulation reduces data transmission and reception errors, reduces the possibility of improper-operation in response to extraneous signal sources, reflected radiation from a surrounding noisy environment, and other interference. Battery power is thereby conserved.
According to another aspect of the present invention, the enclosure includes an adhesive on an outer surface thereof. The adhesive permits reliable and convenient securing of a device of the present invention to an article being transported or stored.
According to yet another aspect of the present invention, by enclosing a transceiver in film, an extremely light weight, durable, and thin package results. Such a package is appropriate for use in replacement of or in conjunction with the conventional handwritten label, conventional handcancelled or postage-metered stamp, and the conventional baggage tag.
According to another aspect of the present invention, the frequencies of radio communication, modulation scheme, geometry of the antenna, capacity of the battery, and electrical properties of the enclosure cooperate for omnidirectional communication between an enclosed transceiver of the present invention and a distant interrogator. No manual manipulation of the interrogator or transceiver is required for area-wide communication such as confirming the contents of a delivery vehicle or verifying inventory in place, to name a few examples.
According to an aspect of another embodiment of the present invention, a plurality of transceivers are enclosed and laminated between a pair of films. One side of one of the films has adhesive capability. The transceivers are separated and arranged on a backing. A roll or tape of the backing having transceivers removably attached thereto is enclosed in an RF tight dispenser. The dispenser provides convenient access to unprogrammed transceivers for use on articles to be shipped. When removed from the dispenser, a transceiver communicates with an interrogator in the area for establishing transceiver identity, shipping authorization, destination or storage criteria, date of issue, and similar information. By shielding transceivers within the dispenser from wake-up signals, battery power is conserved.
These and other embodiments, aspects, advantages, and features of the present invention will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art by reference to the following description of the invention and referenced drawings or by practice of the invention. The aspects, advantages, and features of the invention are realized and attained by means of the instrumentalities, procedures, and combinations particularly pointed out in the appended claims
FIG 1A and
In each functional block diagram, a single line between functional blocks represents one or more signals. A person of ordinary skill in the art will recognize that portions of the perspective views and cross-sectional views are enlarged for clarity.
Integrated circuit 11 is a transceiver including wake-up circuit 12, receiver 13, transmitter 14, control logic 15, and memory 16. Each of these functional circuits receives power signals VCC and GND on lines 8 and 9. When a received signal has substantial in-band energy as detected by wake-up circuit 12, control logic 15 enables receiver 13 for receiving and decoding a radio signal on antenna 4 and 5. Received data is provided by receiver 13 to control logic 15. Control logic 15 writes received data into memory 16. Control logic 15 also processes (i.e. decodes, tests, or edits) the received data with data stored in memory 16 and determines whether a response transmission is appropriate and the content of such a response. If a response is appropriate, control logic 15 reads transmit data from memory 16 and enables transmitter 14 for sending the transmit data as a second radio signal on antenna 4 and 5. Control logic 15 operates as a controller for reading data from and writing data to memory 16. Antenna 4 and 5 matches the medium to the receiver and to the transmitter for improved receiver sensitivity, and reduced transmission losses. Dipole antenna 4 and 5 has a toroidal antenna pattern with a null along the axis of the toroid.
Battery 20 is connected to antenna line 22 to reduce the number of terminals required to connect integrated circuit 21 into enclosed transceiver 18 and to improve the omnidirectional nature of the antenna pattern. A novel enclosure implements this connection to be discussed below. Integrated circuit 21 is a three terminal device providing the same functions as integrated circuit 11 already described with reference to
As an example of a data call-up operation, consider the events surrounding checking baggage or mailing a package. When an enclosed transceiver of the present invention is placed on the outside surface of a piece of luggage by the airlines or on a package for shipment by the postal service, an airline agent or postal worker operates an interrogator. The interrogator transmits information to receiver 13 via an RF communication link concerning data such as the owner's name, an ID number, point of origin, weight, size, route, destination, amount of postage prepaid, billing information for debit, postage, handling, or storage costs due, time stamp, and the like. This received data is coupled to control logic 15 for processing, encoding, and storage in memory 16. Stored data is made available for call up by an interrogator at one or more points along the shipment route.
For example, upon reaching a point of shipment destination, an interrogator calls up stored data and uses it at the point of destination for insuring that the item of luggage or shipment is most assuredly and efficiently put in the hands of the desired receiver at the earliest possible time. Specifically, an interrogator at the destination point sends interrogation signals to the enclosed transceiver 1 where they are received by antenna 4 and 5 and first processed by sleep/wake up circuit 12. Wake-up circuit 12 operates to bring integrated circuit 11 out of a “sleep” mode into a “waked” mode wherein receiver 13 receives and decodes signals to provide received data to control logic 15.
With integrated circuit 11 now in “waked” mode, memory 16 is read by control logic 15 to call-up transmit data, i.e. the above six pieces of information relating to the shipped article. Control logic 15 then couples the transmit data to transmitter 14 and enables transmitter 14 for sending transmit data to the interrogator.
Receiver 13 and transmitter 14 preferably employ one of the well known spread spectrum modulation techniques including for example: (1) direct sequencing, (2) frequency hopping, (3) pulsed FM or chirped modulation, (4) time hopping, or (5) time-frequency hopping used with pulse amplitude modulation, simple amplitude modulation or binary phase shift keying.
The communication circuitry of an interrogator (not shown) is designed to conform to the modulation technique, message encoding, and modes of operation described for the enclosed transceivers of the present invention. Interrogator design is understood by those skilled in the art and, therefore, is not described herein.
A pair of rectangularly shaped batteries 38 and 40 are positioned as shown adjacent to IC 32 and are also disposed on the upper surface of base support member 30. Rectangular batteries 38 and 40 are electrically connected in series to power IC 32 in a manner more particularly described below. Assembly of enclosed transceiver 1 is completed by the folding over of an outer or upper cover member 42 which is sealed to the exposed edge surface portions of the base member 30 to thereby provide an hermetically sealed and completed package. When cover member 42 is folded over onto base member 30, conductive strip 50 is attached to batteries 38 and 40 using conductive epoxy. Conductive strip 50 provides means for coupling a pole of battery 38 to a pole of battery 40; thus accomplishing the series electrical connection of batteries 38 and 40. Integrated circuit 32 has transmitter, memory, control logic, and receiver stages therein and is powered by batteries 38 and 40 during the transmission and reception of data to and from an interrogator to provide the interrogator with the various above information and identification parameters concerning the article, animal or person to which the enclosed transceiver is attached.
Referring now to
Referring now to
Referring now to
Referring now to
In the embodiment of the invention shown in
The enclosed transceiver shown in
After manufacturing has been completed, a large number of finished devices, or webs are stored on a take-up reel (not shown) supporting a corresponding large plurality of the devices. Advantageously, storage on a take-up reel not only makes the present process conducive to high speed automated manufacturing, but in addition makes the process compatible to high speed manual or automated product dispensing and use. Large numbers of enclosed transceivers may be supplied easily to a user in a conventional tape and reel format. The user can readily detach one device at a time for immediate attaching to an article. Alternatively, enclosed transceivers are manufactured and shipped in sheets and later sectioned by the customer.
In yet another embodiment, devices are cut from the tape or sheet from which they were manufactured and then removably mounted on a backing. The backing in one embodiment is in tape format and in another equivalent embodiment is in sheet format. When mounted to a backing, enclosed transceivers are more effectively stored in a cache for dispensing individually. The cache, not shown, includes means for dispensing (i.e. separately providing a transceiver on demand) and shielding means for preventing signal reception by enclosed transceivers within the cache. If shielding were not included, a supply of transceivers located within communicating range of an interrogator would soon expend battery capacity by processing signals including, for example, wake-up signals. Means for dispensing includes, for example, mechanical devices for feeding a tape or sheet through an opening and mechanical devices for separating shielding materials from a tape or sheet. The former dispensing means, in one embodiment of the cache, cooperates with shielding across the opening including conductive rollers, separating brushes, separating fingers, and the like. The latter dispensing means, in another embodiment of the cache, cooperates with conductive backing material, or conductive foam as a backing or cover layer arranged to shield the exposed edges of a roll containing transceivers.
Contact 246 is intentionally misaligned with respect to area 222 to prevent shorting battery 20. However, strips 218 and 234 are aligned to coincide, as are contact areas 226 and 254, respectively. These strips and contact areas when joined by lamination cooperate as means for coupling power from battery 20 to IC 21 and, simultaneously, for electrically matching IC 21 to the communications medium by forming loop antenna 19. Thus, contacts 242, 246, and 250 correspond respectively to lines 24, 23, and 22 shown in
Unlike the antenna pattern of the dipole antenna shown in
In the first step 410, barrier material, such as a silicon nitride deposit, is formed on the outer surface by sputtering, or by chemical vapor deposition (CVD), preferably plasma enhanced CVD. The deposit provides a hermetic barrier to prevent water vapor and other contaminants from affecting (e.g. oxidizing) battery and transceiver components. In a first embodiment the resulting thickness of the deposit is from 400 to 10,000 angstroms. In another embodiment, where thin deposits are desirable, coating on both sides of the film prevents pin holes in each deposit from aligning in a way that defeats hermeticity. The thickness of the deposit and the manner of formation are design choices based on the selection of materials for the film and the deposit, as well as the system requirements for hermeticity over time. For example an alternate and equivalent embodiment uses other barrier materials including silicon oxide and silicon nitride deposited at a thickness of 100 to 400 angstroms. The barrier material is formed in such an embodiment using one of the processes including evaporation, deposition, chemical vapor deposition, and-plasma enhanced chemical vapor deposition.
In another embodiment of the present invention, a nitride film is sputtered on the outside portion of a top and bottom base support layer. Each base support layer preferably comprises a polymer material such as a polyester film that is laminated with a barrier layer material such as polyethylene and/or polyvinylidenechloride (PVDC). Formation of the barrier material deposit can be deferred until the enclosed transceiver is encapsulated, provided that environmental concerns such as contamination, over heating, and changes in pressure are addressed.
In step 420, a laminate adhesive is applied to the inner surfaces of the top and bottom films. The laminate adhesive is activated in a later manufacturing step to cause the top and bottom layers to adhere. Preferably, the adhesive is tack free at room temperature and selected to match laminating equipment heat and pressure capabilities. In a preferred embodiment, butyl acrylate is extruded onto the films to cover the entire inside surface of each film. In another embodiment, the adhesive is screen printed for economy.
In step 430, conductors are screen printed onto the films. In a preferred embodiment, the conductors are formed on top of laminate adhesive. Areas such as grid conductors 222 and 238 shown in
Printed circuits on the top layer are arranged to perform multiple functions when the top and bottom layers are joined.
First, a conductor on the top layer completes series or parallel circuits for devices having contacts in two planes. Conductor 50 in
Third, a single conductor in the top layer accomplishes both the first and second functions. See, for example, the conductor in
In an alternate embodiment, conductors are formed in a subtractive process, for example, chemical etching. By using a positive screen print process, energy and material are conserved. Printed circuit technology is applied in another embodiment wherein the step of attaching the integrated circuit and the battery to a base material includes soldering and brazing. The base material in such an embodiment is one of a wide variety of printed circuit materials including polyimide and glass-epoxy materials.
In step 440, the top and bottom base support layers are cut from the roll or web to form sheets as illustrated in
In step 470, those portions of conductors that are to make electrical contact with the integrated circuit are prepared with a coating or puddle of conductive epoxy. In a preferred embodiment, silver filled epoxy is employed that remains wet at room temperature until thermally cured. Application of the epoxy is by screen printing in an alternate embodiment, epoxy is applied by dispensing.
In step 480, integrated circuit die are placed so that epoxy bumps previously formed on the integrated circuit enter the puddles formed in step 470. The arrangement of the integrated circuit face down on the bottom film is commonly referred to as “flip-chip” orientation. In an alternate and equivalent embodiment, integrated circuits are also placed in contact puddles formed on the top, i.e. cover layer. All die on the sheet are placed and aligned in this step 480 prior to proceeding with subsequent cure.
In step 490, a batch of panels is heated to set the epoxy applied in step 470. In an alternate embodiment, a conveyor based oven supports continuous curing. Curing temperature and duration are design choices that match the epoxy curing requirements. In a preferred embodiment, curing is performed at 150 degrees Celsius for 3 to 5 minutes. The cure is selected so as not to interfere with the characteristics of the laminate adhesive applied in step 420.
In step 500, an encapsulation material, commonly called “glob top epoxy” is applied over the integrated circuit. Suitable nonconductive materials include those providing a stiffening property to protect the integrated circuit and the electrical connections thereto from mechanical damage.
In step 510, the encapsulating material is cured. In a preferred embodiment, the encapsulating material is cured with ultraviolet radiation. An alternate and equivalent embodiment, employs a thermal curing process. The ultraviolet cure is preferred for rapid manufacturing. However, use of a thermal cure in step 510 may permit use of a partial thermal cure in step 490, later perfected by additional thermal cure duration provided in step 510.
In step 520, the battery or batteries are aligned and placed on the base support film. In an embodiment including stacked battery calls, connection is made using conductive tape having adhesive on both sides of the tape. Such tape commonly includes conductive particles in the adhesive.
In step 530, the top or cover film is aligned over the bottom or base film. In an embodiment including a folded film, the top film is folded over the base film. In an alternate embodiment employing-continuous manufacturing from roll stock, the base film and top film are aligned for continuous lamination.
In step 540, the top cover film is pressed onto the bottom base film and heat is applied to activate the adhesive applied in step 420. For butyl acrylate adhesive a temperature of from 95 to 110 degrees Celsius is preferred.
In applications where the transceiver is to be used in harsh environments, the seal provided by automated lamination equipment may be incomplete or have weaknesses caused, for example, by insufficient heat or pressure at a point in an area to be sealed. Enclosing components of varying thicknesses can result in air pockets surrounding such components that, if too near the periphery, can also lead to weaknesses and voids. In such applications, the preferred process includes step 550 wherein the periphery of each transceiver on a sheet is subject to a second application of heat and pressure for activating laminate adhesive applied in step 420. The additional heat and pressure in such a localized periphery can deform the films to form minute bosses. Thus, the step is called embossing. The aspect of the effective application of heat and pressure is more important than the extent of consequential deformation.
In an alternate embodiment, each enclosure is evacuated. Lamination for such an embodiment is conducted in an evacuated environment. Embossing in yet another embodiment is also conducted in an evacuated environment
After step 540, the circuitry of the battery powered transceiver is active by virtue of the completed circuits formed when the top cover layer is aligned and butt contacts are formed with components and the base layer. Functional tests of multiple or individual transceivers are now feasible.
In step 560, transceivers are functionally tested. To prevent interference between tests of individual transceivers, a pair of grounded plates with surface features are placed on both sides of a sheet of enclosed transceivers so that each transceiver operates inside a shielded cavity. The wavelength used for testing is selected such that leakage through the thickness of the embossed seal is negligible. Plates similar to the embossing die used in step 550 are used in one embodiment. Each cavity includes an antenna for transmitting stimulus signals and for receiving response signals for measuring the quality of each transceiver. Measurements include, for example, receiver sensitivity, transmitted spectrum, message handling capability, self-testing, and response timing.
In step 570, the sheet of tested transceivers is sheered in two dimensions to singulate or separate the transceivers from one another. In an alternate and equivalent embodiment, a backing material is applied to one side of the sheet prior to singulation. Singulation for this embodiment is accomplished by kiss cutting through the top and base films leaving the transceivers attached to the backing material. Transceivers, whether attached to the backing or loose are then sorted based on the results of functional testing performed in step 560 and additional testing as needed.
In one embodiment the nine steps are performed sequentially as follows. In step 610, a circuit pattern is initially formed on a base layer material. This base layer material is preferably a polymer such as a polyester film that is laminated with a barrier layer material such as polyethylene and/or polyvinylidenechloride (PVDC). In step 612, the circuit pattern is cured and a conductive epoxy material is applied. In step 614 an integrated circuit chip is aligned onto the base layer. In step 616, two (2) batteries are aligned onto the base layer. In an alternate enclosed transceiver, the batteries are stacked vertically in either a series or parallel electrical connection. In step 618, the epoxy applied in step 612 is cured. In step 620, a stiffener material is applied. In step 622 epoxy is applied to the top surface of the battery and then the top half of the base layer is folded over the bottom half so that the top half forms the top cover. In step 624, the epoxy material applied in step 622 is cured. Finally, in step 626, the package is sealed to complete manufacturing of the package.
Various modifications may be made in and to the above described embodiments without departing from the spirit and scope of this invention. For example, various modifications and changes may be made in the antenna configurations, battery arrangements (such as battery stacking), device materials, device fabrication steps, and the functional block diagrams without departing from the scope of this invention. The various off-chip components such as the antenna, battery, and capacitor are manufactured on-chip in alternate and equivalent embodiments. As a second example, the antenna in another alternate and equivalent embodiment is formed on the outer surface or within the outer film. In such an arrangement, coupling to the antenna is through the capacitance of the outer film as a dielectric. When formed on the exterior, the material comprising the antenna also provides hermeticity to the film for protecting the enclosed transceiver. Accordingly, these and equivalent structural modifications are within the scope of the following appended claims.
As previously suggested, an enclosed transceiver used as an RFID device has utility directed to a wide variety of applications including, but not limited to, airline baggage (luggage, freight, and mail); parcel post (Federal Express and United Parcel Service); U.S. Mail; manufacturing; inventory; personnel security.
While the particular invention has been described with reference to illustrative embodiments, this description is not meant to be construed in a limiting sense. It is understood that although the present invention has been described in a preferred embodiment, various modifications of the illustrative embodiments, as well as additional embodiments of the invention, will be apparent to persons skilled in the art, upon reference to this description without departing from the spirit of the invention, as recited in the claims appended hereto. It is therefore contemplated that the appended claims will cover any such modifications or embodiments as fall within the true scope of the invention.
The words and phrases used in the claims are intended to be broadly construed. A “sticker” refers generally to a label, tag, marker, stamp, identifier, packing slip, invoice, package seal, tape, band, clasp, medallion, emblem, shield, and escutcheon regardless of printed or handwritten material thereon. Mechanical coupling of a “sticker” so defined to an article, person, plant, or animal is not restricted to adhesive but is intended to broadly include all forms of fastening, tieing, and securing.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3660916 *||Nov 10, 1969||May 9, 1972||Bio Logics Inc||Identification system|
|US3702464 *||May 4, 1971||Nov 7, 1972||Ibm||Information card|
|US3706094||Feb 26, 1970||Dec 12, 1972||Peter Harold Cole||Electronic surveillance system|
|US3750167||Jul 22, 1971||Jul 31, 1973||Gen Dynamics Corp||Postal tracking system|
|US3780368||Feb 19, 1971||Dec 18, 1973||Svejsecentralen||Method of marking and subsequently localizing, identifying and recording physical objects|
|US3832530||Jul 19, 1973||Aug 27, 1974||Westinghouse Electric Corp||Object identifying apparatus|
|US3849633||Jul 17, 1973||Nov 19, 1974||Westinghouse Electric Corp||Object identifying apparatus|
|US3858031 *||Feb 16, 1973||Dec 31, 1974||Bliss & Laughlin Ind||Credit card having clear middle layer encoded by discrete opaque areas and system for decoding same by laser beam|
|US3947930||Apr 14, 1975||Apr 6, 1976||I. D. Engineering, Inc.||Anti-theft fastening device and tool for releasing same|
|US4049969||Mar 19, 1970||Sep 20, 1977||The United States Of America As Represented By The Secretary Of The Air Force||Passive optical transponder|
|US4065343||Dec 13, 1976||Dec 27, 1977||Rexnord Inc.||Label system for package and baggage handling|
|US4067011||Oct 22, 1976||Jan 3, 1978||Motorola, Inc.||Digital transponder universal pulse assembly|
|US4068232||Feb 12, 1976||Jan 10, 1978||Fairchild Industries, Inc.||Passive encoding microwave transponder|
|US4075632||May 24, 1976||Feb 21, 1978||The United States Of America As Represented By The United States Department Of Energy||Interrogation, and detection system|
|US4129855||Jul 15, 1977||Dec 12, 1978||Rodrian J||Animal identification system|
|US4177466||Nov 16, 1977||Dec 4, 1979||Lo-Jack Corporation||Auto theft detection system|
|US4188629||Jul 19, 1976||Feb 12, 1980||Motorola, Inc.||Passive navigation system with frequency coding|
|US4226361||Oct 27, 1978||Oct 7, 1980||Taylor Leonard H||Positive identification system for authenticating the identity of a card user|
|US4242663||Feb 1, 1979||Dec 30, 1980||Lockheed Electronics Corporation||Electronic identification system|
|US4262631||Oct 1, 1979||Apr 21, 1981||Kubacki Ronald M||Thin film deposition apparatus using an RF glow discharge|
|US4331957||Apr 18, 1980||May 25, 1982||Bengt Enander||Transponder for use in locating avalanche victims|
|US4399441||Jan 19, 1981||Aug 16, 1983||Unisearch Limited||Apparatus for remote temperature reading|
|US4418411||Mar 10, 1981||Nov 29, 1983||Brown, Boveri & Cif Ag||Method and apparatus for generating an equipment reply signal for the automatic identification of objects and/or living beings|
|US4442430||May 11, 1981||Apr 10, 1984||Schneider Bernard A||Identification technique for air traffic|
|US4453074||Oct 19, 1981||Jun 5, 1984||American Express Company||Protection system for intelligent cards|
|US4471344||Apr 29, 1982||Sep 11, 1984||Ici Americas Inc.||Dual frequency anti-theft system|
|US4484355||Apr 11, 1983||Nov 20, 1984||Ritron, Inc.||Handheld transceiver with frequency synthesizer and sub-audible tone squelch system|
|US4587038||Jun 9, 1981||May 6, 1986||Canon Kabushiki Kaisha||Electro-optic display device and a method of producing the same|
|US4603326||Sep 14, 1984||Jul 29, 1986||Ici Americas Inc.||Anti-theft detector responsive to a chemical agent|
|US4621190 *||Jun 7, 1984||Nov 4, 1986||Kabushiki Kaisha Toshiba||Card with an IC module|
|US4634849||Apr 2, 1985||Jan 6, 1987||Klingen Leonard G||Uniquely numbered baggage split tag and system for handling baggage|
|US4649233||Apr 11, 1985||Mar 10, 1987||International Business Machines Corporation||Method for establishing user authenication with composite session keys among cryptographically communicating nodes|
|US4656478||Jul 23, 1985||Apr 7, 1987||Asulab S.A.||Passive transponder for locating avalanche victims|
|US4680724||Feb 4, 1986||Jul 14, 1987||Casio Computer Co., Ltd.||Sheet-like miniaturized electronic device|
|US4686358 *||Mar 15, 1985||Aug 11, 1987||Bauer Kaba Ag||Programmable electronic-mechanical reversing flat key interactively communicatable with data processing means|
|US4724427||Jul 18, 1986||Feb 9, 1988||B. I. Incorporated||Transponder device|
|US4727560||Apr 25, 1986||Feb 23, 1988||U.S. Philips Corporation||Charge-coupled device with reduced signal distortion|
|US4737789||Dec 2, 1986||Apr 12, 1988||X Cyte, Inc.||Inductive antenna coupling for a surface acoustic wave transponder|
|US4745401||Sep 9, 1985||May 17, 1988||Minnesota Mining And Manufacturing Company||RF reactivatable marker for electronic article surveillance system|
|US4746618||Aug 31, 1987||May 24, 1988||Energy Conversion Devices, Inc.||Method of continuously forming an array of photovoltaic cells electrically connected in series|
|US4746830||Mar 14, 1986||May 24, 1988||Holland William R||Electronic surveillance and identification|
|US4756717||Feb 9, 1987||Jul 12, 1988||Polaroid Corporation||Laminar batteries and methods of making the same|
|US4777563||Apr 28, 1987||Oct 11, 1988||Toshiba Battery Co., Ltd.||Thin type electronic instrument|
|US4780791 *||Apr 2, 1987||Oct 25, 1988||Fujisoku Electric Co., Ltd.||Card-shaped memory having an IC module|
|US4783646||Mar 4, 1987||Nov 8, 1988||Kabushiki Kaisha Toshiba||Stolen article detection tag sheet, and method for manufacturing the same|
|US4814943||Jun 2, 1987||Mar 21, 1989||Oki Electric Industry Co., Ltd.||Printed circuit devices using thermoplastic resin cover plate|
|US4827110||Jun 11, 1987||May 2, 1989||Fluoroware, Inc.||Method and apparatus for monitoring the location of wafer disks|
|US4827395||Apr 6, 1987||May 2, 1989||Intelli-Tech Corporation||Manufacturing monitoring and control systems|
|US4854328||Mar 23, 1987||Aug 8, 1989||Philip Pollack||Animal monitoring telltale and information system|
|US4855583||Aug 17, 1987||Aug 8, 1989||Figgie International, Inc.||Structure and method of making combination proximity/insertion identification cards|
|US4862176||Feb 17, 1978||Aug 29, 1989||Emi Limited||Identification of friend or foe (IFF) systems|
|US4882294||Aug 17, 1988||Nov 21, 1989||Delco Electronics Corporation||Process for forming an epitaxial layer having portions of different thicknesses|
|US4888591||Oct 6, 1988||Dec 19, 1989||Amtech Technology Corporation||Signal discrimination system|
|US4908502||Feb 8, 1988||Mar 13, 1990||Pitney Bowes Inc.||Fault tolerant smart card|
|US4910521||Aug 3, 1981||Mar 20, 1990||Texas Instruments Incorporated||Dual band communication receiver|
|US4911217||Mar 24, 1989||Mar 27, 1990||The Goodyear Tire & Rubber Company||Integrated circuit transponder in a pneumatic tire for tire identification|
|US4918425 *||Jul 25, 1988||Apr 17, 1990||Daniel E. Ely||Monitoring and locating system for an object attached to a transponder monitored by a base station having an associated ID code|
|US4918631||Sep 1, 1987||Apr 17, 1990||Casio Computer Co., Ltd.||Compact type electronic information card|
|US4924237||Sep 13, 1988||May 8, 1990||Matsushita Electric Works, Ltd.||Antenna and its electronic circuit combination|
|US4926182||May 29, 1987||May 15, 1990||Sharp Kabushiki Kaisha||Microwave data transmission apparatus|
|US4942327||May 26, 1989||Jul 17, 1990||Hitachi, Ltd.||Solid state electronic device|
|US4956645||May 15, 1989||Sep 11, 1990||Etat Francais Represente Par Le Ministre Des Postes, Telecommunications Et De L'espace (Centre National D'etudes Des Telecommunications)||Radio system for data transmission with one passive end and station included in such a system|
|US4960983||Jun 23, 1988||Oct 2, 1990||Mitsubishi Denki Kabushiki Kaisha||Noncontact type IC card and system for noncontact transfer of information using the same|
|US4962415||Feb 6, 1990||Oct 9, 1990||Hitachi Maxell, Ltd.||IC card|
|US5008776||Jun 6, 1990||Apr 16, 1991||Sgs-Thomson Microelectronics, Inc.||Zero power IC module|
|US5023573||Sep 21, 1989||Jun 11, 1991||Westinghouse Electric Corp.||Compact frequency selective limiter configuration|
|US5065160||Sep 28, 1989||Nov 12, 1991||Mitsubishi Denki Kabushiki Kaisha||Radar transponder|
|US5068894||Aug 22, 1990||Nov 26, 1991||U.S. Philips Corp.||Method of generating a unique number for a smart card and its use for the cooperation of the card with a host system|
|US5095240||Nov 13, 1989||Mar 10, 1992||X-Cyte, Inc.||Inductively coupled saw device and method for making the same|
|US5124733||Mar 13, 1990||Jun 23, 1992||Saitama University, Department Of Engineering||Stacked microstrip antenna|
|US5144314||Dec 11, 1991||Sep 1, 1992||Allen-Bradley Company, Inc.||Programmable object identification transponder system|
|US5148504||Oct 16, 1991||Sep 15, 1992||At&T Bell Laboratories||Optical integrated circuit designed to operate by use of photons|
|US5153710||Jul 26, 1991||Oct 6, 1992||Sgs-Thomson Microelectronics, Inc.||Integrated circuit package with laminated backup cell|
|US5166502||Mar 12, 1992||Nov 24, 1992||Trend Plastics, Inc.||Gaming chip with implanted programmable identifier means and process for fabricating same|
|US5192947||Feb 2, 1990||Mar 9, 1993||Simon Neustein||Credit card pager apparatus|
|US5200362||Sep 9, 1991||Apr 6, 1993||Motorola, Inc.||Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film|
|US5214410||Jul 9, 1990||May 25, 1993||Csir||Location of objects|
|US5231273||Apr 9, 1991||Jul 27, 1993||Comtec Industries||Inventory management system|
|US5250843||Sep 8, 1992||Oct 5, 1993||Integrated System Assemblies Corp.||Multichip integrated circuit modules|
|US5274221||Feb 16, 1993||Dec 28, 1993||Mitsubishi Denki Kabushiki Kaisha||Non-contact integrated circuit card|
|US5283423||Feb 24, 1992||Feb 1, 1994||U.S. Philips Corporation||Contactless microcircuit card|
|US5302954||Nov 18, 1992||Apr 12, 1994||Magellan Corporation (Australia) Pty. Ltd.||Identification apparatus and methods|
|US5313052||Jun 26, 1992||May 17, 1994||Nippondenso Co., Ltd.||Aircraft baggage managing system utilizing a response circuit provided on a baggage tag|
|US5313211||Aug 7, 1991||May 17, 1994||Sharp Kabushiki Kaisha||Portable data processing device capable of transmitting processed data on a radio by reflection of unmodulated carrier signal externally applied|
|US5326652||Jan 25, 1993||Jul 5, 1994||Micron Semiconductor, Inc.||Battery package and method using flexible polymer films having a deposited layer of an inorganic material|
|US5337063||Apr 13, 1992||Aug 9, 1994||Mitsubishi Denki Kabushiki Kaisha||Antenna circuit for non-contact IC card and method of manufacturing the same|
|US5340968||May 5, 1992||Aug 23, 1994||Nippondenso Company, Ltd.||Information storage medium with electronic and visual areas|
|US5350645||Jun 21, 1993||Sep 27, 1994||Micron Semiconductor, Inc.||Polymer-lithium batteries and improved methods for manufacturing batteries|
|US5414427||Jul 5, 1991||May 9, 1995||Gunnarsson; Staffan||Device for information transmission|
|US5416423||Mar 28, 1994||May 16, 1995||Gpt Limited||Method and apparatus for verifying the integrity of a smart card|
|US5432027||Mar 2, 1994||Jul 11, 1995||Micron Communications, Inc.||Button-type battery having bendable construction, and angled button-type battery|
|US5434397||Jul 26, 1993||Jul 18, 1995||Laboratoire Europeen De Recherches Electroniques Avancees, Societe En Nom Collectif||Protection against the non-authorized inhibition of writing in certain storage areas of a smart card|
|US5448110||Sep 14, 1993||Sep 5, 1995||Micron Communications, Inc.||Enclosed transceiver|
|US5480462||Jul 6, 1994||Jan 2, 1996||Micron Communications, Inc.||Method of forming button-type battery lithium electrodes|
|US5480834||Dec 13, 1993||Jan 2, 1996||Micron Communications, Inc.||Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent|
|US5486431||Mar 2, 1994||Jan 23, 1996||Micron Communications, Inc.||Method of producing button-type batteries and spring-biased concave button-type battery|
|US5491482||Dec 29, 1992||Feb 13, 1996||David Sarnoff Research Center, Inc.||Electronic system and method for remote identification of coded articles and the like|
|US5494495||Oct 11, 1994||Feb 27, 1996||Micron Communications, Inc.||Method of forming button-type batteries|
|US5497140||Dec 17, 1993||Mar 5, 1996||Micron Technology, Inc.||Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication|
|US5510074||Feb 23, 1994||Apr 23, 1996||Schlumberger Industries||Method for manufacturing smart cards|
|US5537105||Jan 3, 1992||Jul 16, 1996||British Technology Group Limited||Electronic identification system|
|US5558679||Aug 21, 1995||Sep 24, 1996||Micron Communications, Inc.||Method for mounting a battery on a substrate|
|US5572226||Apr 11, 1995||Nov 5, 1996||Micron Technology, Inc.||Spherical antenna pattern(s) from antenna(s) arranged in a two-dimensional plane for use in RFID tags and labels|
|US5603157||Mar 2, 1994||Feb 18, 1997||Micron Communications, Inc.||Methods of producing button-type batteries and a plurality of battery terminal housing members|
|US5605467 *||Jan 19, 1995||Feb 25, 1997||Eaton Corporation||Cover for battery compartment and communications port|
|US5605487||May 13, 1994||Feb 25, 1997||Memc Electric Materials, Inc.||Semiconductor wafer polishing appartus and method|
|US5612513||Sep 19, 1995||Mar 18, 1997||Micron Communications, Inc.||Article and method of manufacturing an enclosed electrical circuit using an encapsulant|
|US5619066||Aug 31, 1994||Apr 8, 1997||Dallas Semiconductor Corporation||Memory for an electronic token|
|US5621412||Jun 7, 1995||Apr 15, 1997||Texas Instruments Incorporated||Multi-stage transponder wake-up, method and structure|
|US5624468||Jun 2, 1993||Apr 29, 1997||Micron Technology, Inc.||Method for fabricating a leadless battery employing an alkali metal anode and polymer film inks|
|US5649296||Jun 19, 1995||Jul 15, 1997||Lucent Technologies Inc.||Full duplex modulated backscatter system|
|US5652070||Jan 18, 1996||Jul 29, 1997||Micron Communications, Inc.||Thin profile battery|
|US5719586||Jan 11, 1996||Feb 17, 1998||Micron Communications, Inc.||Spherical antenna pattern(s) from antenna(s) arranged in a two-dimensional plane for use in RFID tags and labels|
|US5725967||Mar 24, 1997||Mar 10, 1998||Micron Communications, Inc.||Battery container and method of manufacture|
|US5817207||Oct 7, 1996||Oct 6, 1998||Leighton; Keith R.||Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards|
|US5820716||Feb 25, 1997||Oct 13, 1998||Micron Technology, Inc.||Method for surface mounting electrical components to a substrate|
|US5937512||Jan 11, 1996||Aug 17, 1999||Micron Communications, Inc.||Method of forming a circuit board|
|US6049461||Jul 25, 1996||Apr 11, 2000||Giesecke & Devrient Gmbh||Circuit unit and a method for producing a circuit unit|
|US6052062||Aug 20, 1997||Apr 18, 2000||Micron Technology, Inc.||Cards, communication devices, and methods of forming and encoding visibly perceptible information on the same|
|US6220516||Jan 16, 1998||Apr 24, 2001||Micron Technology, Inc.||Method of manufacturing an enclosed transceiver|
|US6229441||Feb 25, 2000||May 8, 2001||Micron Technology, Inc.||Communication devices, radio frequency identification devices, methods of forming a communication device, and methods of forming a radio frequency identification device|
|US6956538||Aug 28, 2002||Oct 18, 2005||Micron Technology, Inc.||RFID material tracking method and apparatus|
|US7262609||Jun 3, 2006||Aug 28, 2007||Synaptics Incorporated||Methods and systems for guarding a charge transfer capacitance sensor for proximity detection|
|US7649463||Aug 30, 2007||Jan 19, 2010||Keystone Technology Solutions, Llc||Radio frequency identification device and method|
|US20080291027||Sep 13, 2007||Nov 27, 2008||Lake Rickie C||Thin Profile Battery Bonding Method, Method Of Conductively Interconnecting Electronic Components, Battery Powerable Apparatus, Radio Frequency Communication Device, And Electric Circuit|
|DE4120265C2||Jun 19, 1991||Jul 25, 1996||Mitsubishi Electric Corp||IC-Karte|
|GB1567784A||Title not available|
|JP2257648A||Title not available|
|JP08267974A||Title not available|
|JP2000339437A||Title not available|
|1||"Airco coating technology announces contracts in its toll coating program"; Airco press release; Mar. 26, 1993.|
|2||Ang, P.; Progress of QLF Barrier Coating; Airco Coating Technology; Publication Date Not Shown; (mailed by Airco to Mark Tuttle Sep. 21, 1993.).|
|3||Casson, K. et al.; High Temperature Packaging: Flip Chip on Flexible Laminate; Jan. 1992; Surface Mount Technology.|
|4||Felts, J.F.; Transparent Barrier Coatings Update: Flexible Substrates; Airco Coating Technology; Publication Date Not Shown; (mailed by Airco to Mark Tuttle Sep. 21, 1993.).|
|5||Felts, J.F.; Transparent Gas Barrier Technologies; Airco Coating Technology; Publication Date Not Shown; (mailed by Airco to Mark Tuttle Sep. 21, 1993.).|
|6||Gilleo, K.; "Using SM Devices on Flexible Circuitry"; Mar. 1986 Electri-onics; pp. 20-23.|
|7||Johnson, R.W.; "Polymer Thick Films: Tehcnology and Materials"; Jul. 1982; Circuits Manufacturing (reprint).|
|8||Kanarzibis, M.G.; "Conductive Polymers"; Dec. 3, 1990; Chemical and Engineering News-American Chemical Society; pp. 36-54.|
|9||Kanarzibis, M.G.; "Conductive Polymers"; Dec. 3, 1990; Chemical and Engineering News—American Chemical Society; pp. 36-54.|
|10||Merriam-Webster Collegiate Dictionary; 1993; p. 563.|
|11||Nelson, R.J.; "Plasma Enhanced Chemical vapor Deposition of SiOx Coatings for Gas Diffusion Barrier Enhancement of Flexible Polymerized Compounds"; Jul. 9, 1993; Society for.|
|12||Pierce, C.W.; "Epitaxy"; VLSI Technology; S.M. Sze editor; McGraw-Hill Book Co. 1983, pp. 55.|
|13||Rice, J.; "Silica-coated films go to commerical in '93"; "Food Processing"; Oct. 1993.|
|14||Rizika, A.; "Vapor Coating with SiOx: the Flexible Glass Barrier"; Aug. 11-Nov. 1992; Pack Expo '92 Conference, Chicago, IL.|
|15||The New IEEE Standard Dictionary of Electrical and Electronic Terms; 5th Ed.; 1993; pp. 662.|
|16||U.S. Appl. No. 08/489,185, filed Jun. 9, 1995; "Enclosed Transceiver"; Tuttle, John et al.; now abandoned.|
|17||U.S. Appl. No. 08/538,826, filed Oct. 5, 1995; "Method for Surface Mounting Electrical Components to a Substrate"; Tuttle, Mark et al.; now abandoned.|
|18||U.S. Appl. No. 08/602,686, filed Feb. 16, 1996; "Method of Manufacturing an Enclosed Transceiver"; Tuttle, Mark et al.; now abandoned.|
|19||Untitled page stating moisture barrier performance of QLF barrier coating on 12mupolyester-film. Sample ID# R9-930316; Airco Coating Technology; Publication Date Not Shown; (mailed by Airco to Mark Tuttle Sep. 12, 1993).|
|20||Untitled page stating moisture barrier performance of QLF barrier coating on 12μpolyester-film. Sample ID# R9-930316; Airco Coating Technology; Publication Date Not Shown; (mailed by Airco to Mark Tuttle Sep. 12, 1993).|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US20030016012 *||Apr 2, 2002||Jan 23, 2003||Coates George Richard||NMR logging apparatus and methods for fluid typing|
|U.S. Classification||235/492, 235/487, 235/380|
|International Classification||G06K19/073, H04L29/12, H01Q9/28, G06K19/077, H01Q1/22, G06K5/00, G01S13/76, H01Q1/38, G01S13/75, G06K19/07|
|Cooperative Classification||H04L61/6022, H04L61/2092, H04L61/6004, H01Q9/285, H04L61/2084, G06K19/073, H04L61/35, H01L2924/01082, H04L29/12839, G01S13/758, H01Q1/22, H01L2924/01027, H01L2924/30105, G06K19/0702, G06K19/07749, G06K19/0723, H01L2924/19041, H04L29/12311, H01L2924/01079, H01L2924/3025, H04L61/2046, H04L29/12254, H01L24/24, H01L2924/14, H01L2224/2402, H04L29/1232, H01L2224/16, H01L2224/24226, H01L2924/3011, H01L2924/01029, H01Q1/38, H04L29/12801, G06K19/07786, H01L24/82, H04L61/2038, H04L29/12783, H01Q1/2225, H04L29/12264, G01S13/767, H01Q9/28, H01L2924/01047, H01L2924/01033, H01L2924/014|
|Sep 13, 2007||AS||Assignment|
Owner name: KEYSTONE TECHNOLOGY SOLUTIONS, LLC, IDAHO
Effective date: 20070628
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:019825/0542
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Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:023786/0416
Owner name: ROUND ROCK RESEARCH, LLC, NEW YORK
Effective date: 20091223
|Jan 26, 2010||AS||Assignment|
Effective date: 20091222
Owner name: MICRON TECHNOLOGY, INC., IDAHO
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KEYSTONE TECHNOLOGY SOLUTIONS, LLC;REEL/FRAME:023839/0881
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