|Publication number||USRE42785 E1|
|Application number||US 12/790,380|
|Publication date||Oct 4, 2011|
|Priority date||May 3, 2000|
|Also published as||US6833984, US20070222061, US20070223159, US20070230134, US20070230139, USRE42318, USRE42429|
|Publication number||12790380, 790380, US RE42785 E1, US RE42785E1, US-E1-RE42785, USRE42785 E1, USRE42785E1|
|Original Assignee||Rambus Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (98), Non-Patent Citations (9), Classifications (50), Legal Events (1)|
|External Links: USPTO, USPTO Assignment, Espacenet|
This application claims priority to and is a continuation reissue application of U.S. Ser. No. 11/398,458 filed on Apr. 4, 2006 entitled “Semiconductor Module With Serial Bus Connection To Multiple Dies”, which is a reissue of U.S. Pat. No. 6,833,984, which is a continuation-in-part of U.S. Ser. No. 09/564,064 filed on May 3, 2000 entitled “Semiconductor Module with Imbedded Heat Spreader”, now U.S. Pat. No. 6,449,159, all of which are incorporated by reference herein in their entirety; more than one reissue application has been filed for the reissue of U.S. Pat. No. 6,833,984 the reissue applications are application Ser. No. 11/398,458 filed on Apr. 4, 2006, Ser. No. 11/754,199 filed on May 25, 2007, Ser. No. 11/754,206 filed on May 25, 2007, Ser. No. 11/754,211 filed on May 25, 2007, Ser. No. 11/754,212 filed on May 25, 2007, Ser. No. 12/790,393 filed on May 28, 2010, and Ser. No. 12/790,380 (the present application), all of which are reissues of U.S. Pat. No. 6,833,984.
The present invention relates generally to semiconductor modules and in particular to a semiconductor module that allows for more efficient interconnection between the semiconductor module an a computing device's transmission channel.
The semiconductor industry is constantly producing smaller and more complex semiconductors, sometimes called integrated circuits or chips. This trend has brought about the need for smaller chip packages with smaller footprints, higher lead counts, and better electrical and thermal performance, while at the same time meeting accepted reliability standards.
In recent years a number of microelectronic packages have been produced to meet the need for smaller chip packaging. One such package is referred to as a chip scale package (CSP). CSPs are so called because the total package size is similar or not much larger than the size of the chip itself. Typically, the CSP size is between 1 and 1.2 times the perimeter size of the chip, or 1.5 times the area of the die. One example of a CSP is a product developed by TESSER® called “MICRO BGA” or μBGA. In a CSP, the semiconductor has a set of bond pads distributed across its surface. A first surface of an insulating, flexible film is positioned over the semiconductor surface. Interconnect circuitry is positioned within the film. Electrical connections are made between the interconnect circuitry and the semiconductor bond pads. Solder balls are subsequently attached to a second surface of the film in such a manner as to establish selective connections with the interconnect circuitry. The solder balls may then be attached to a printed circuit board.
CSPs may be used in connection with memory chips. Memory chips may be grouped to form in-line memory modules. In-line memory modules are surface mounted memory chips positioned on a circuit board.
As memory demands increase, so does the need for increased memory capacity of in-line memory modules. A need has also arisen for materials and methods that lead to increased performance by more closely matching the coefficient of thermal expansion of the materials used in these memory modules. Examples of such in-line memory modules are single in line memory modules or SIMMs and dual in-line memory modules or DIMMs. DIMMs have begun to replace SIMMs as the compact circuit boards of preference and essentially comprise a SIMM wherein memory chips are surface mounted to opposite sides of the circuit board with connectors on each side.
A problem with in-line memory modules is that adding more chips to the circuit board spreads out the placement of the chips on the circuit card and therefore requires reconfiguration of the circuit card connectors and their associated connections on the motherboard, which means replacing the memory card and in some cases the motherboard.
Another problem with current in-line memory modules is that a separate heat spreader must be positioned across a set of memory chips. The heat spreader adds cost to the assembly process and adds significant weight to the module.
Existing Multi-Chip Modules (MCM's) typically connect the transmission channel to semiconductors via electrical contact points or ball-outs on the MCM. Each electrical contact point then connects to a semiconductor in the MCM via an electrical lead, so that a signal may be transmitted along the transmission channel to each semiconductor via that semiconductor's electrical lead. However, each successive electrical lead slightly degrades the signal, by placing a load on the signal. By the time the signal reaches the last semiconductor connected to a transmission channel, the signal may have degraded so as to be unusable.
Modem MCM's, such as those disclosed in the U.S. patent application Ser. No. 09/564,064, disclose MCMs that include relatively long electrical leads. The longer the electrical lead, the more the signal degradation. This is because the speed of the signal is inversely related to the length of the electrical lead. Therefore, existing MCMs can only handle a maximum of approximately thirty two semiconductors connected to a single transmission channel before the signal has degraded to an unusable form.
In view of the foregoing it would be highly desirable to provide a semiconductor module that overcomes the shortcomings of the abovementioned prior art devices.
A semiconductor module is provided which includes a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors.
A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.
The termination resistor coupled to the semiconductors substantially reduces any degradation of the signal caused by a load placed on the signal from electrical leads, as the signal is not being split as is the case with stubs in existing semiconductor modules. Furthermore, by incorporating the termination resistor into the semiconductor module, the need for a termination resistor on the printed circuit board is eliminated, thereby reducing the need for additional circuit board space, and deceasing circuit board layout complexity and cost.
For a better understanding of the nature and objects of the invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings, in which:
Like reference numerals refer to corresponding parts throughout the several views of the drawings.
As shown in
In a preferred embodiment, two semiconductors 102 are positioned on opposing sides of the heat spreader 106. The leads 108 preferably run the length of each sides of the heat spreader 106, culminating at electrical contact points 110 at the base of the heat spreader 106. Electrical contact points 110 may for example comprise solder balls or bond pads. The semiconductors may further comprise of single dies or multiple stacked dies.
In the embodiments shown in
The semiconductor modules 908 maybe placed directly onto a PCB 910, such as a motherboard, or alternatively onto an in-line memory module circuit card which in turn slots into another PCB, such as a motherboard. In this manner the footprint of an in-line memory module circuit card may remain constant even if additional semiconductor modules 908 are slotted onto the in-line memory module circuit card. As the footprint of the array is always constant, the in-line memory module circuit card does not have to be changed each time additional memory is required, thereby enhancing the upgradability of electronic devices. The invention provides a memory module with a small footprint. Adding further chips to the module does not effect the footprint.
When in an aligned position, each electrical contact point electrically connects with a corresponding electrical contact on the substrate or PCB. Where the electrical contact points are solder bumps, the electrical connection between the semiconductor module and the PCB may be made by heating the solder bumps to cause reflow of the solder and allowing subsequent cooling, thereby fusing the semiconductor module 908 to the PCB 910.
Alternatively, or in addition, fastening mechanisms 904 and 906 may be provided for securely anchoring the semiconductor modules 908 onto the PCB 910. Such fastening mechanisms 904 and 906 may include clamps, slots, or the like.
In an alternative embodiment, a semiconductor package such as a CSP may have its solder balls attached to the flexible circuitry. The combination of the semiconductor package and the flexible circuitry is then bonded to the heat spreader. In this manner existing semiconductor packages may be used to manufacture the semiconductor module according to the invention.
Another alternative embodiment may include shielding 1115 (FIG. 10) to protect the semiconductor from electromagnetic forces. In addition, adhesive may be placed between the tape and the base of the heat spreader to cushion the contact points and ensure contact between the contact points and the PCB.
The semiconductor module of the invention eliminates the need for a separate heat spreader. The invention reduces overall cost and weight through shared common contact points or nodes. The common contact points also allow for a constant footprint to be maintained independent of the size or number of semiconductors used. Furthermore, the module is reliable as the semiconductors are not exposed to as high thermal stresses. The module also substantially improves heat dissipation by exposing greater surface areas to the surrounding air.
As explained above in the background section of this specification, many existing semiconductor modules position their embedded semiconductors relatively far from the circuit board to which they are attached. Each semiconductor in such semiconductor modules connects to a transmission channel via its own electrical lead. A signal passing along the transmission channel from lead to lead is degraded by a load placed on the signal by each successive lead. The longer the stub, the more the signal is degraded. Each successive lead further degrades the signal, until such time as the signal has been degraded so as to be useless. Most semiconductor modules also include a termination resistor at the end of each transmission channel on the printed circuit board. The present invention addresses the problem associated with signal degradation in semiconductor modules having relatively long electrical leads.
Impedance matching of an electrical load to the impedance of a signal source and the characteristic impedance of a transmission channel is often necessary to reduce reflections by the load, back into the transmission channel. As the length of a non-terminated transmission line increases, reflections become more problematic. When high frequency signals are transmitted or passed through even very short transmission lines, such as printed circuit board (PCB) traces, a termination resistor may be inserted at the load to avoid reflections and degradations in performance.
In the multi-chip modules of the present invention, termination resistors are preferably internal to the MCM's. The use of external termination resistors presents a number of drawbacks. The placement of a termination resistor outside an MCM results in an additional stub or short transmission line between the termination resistor and the integrated circuit device. External termination resistors also require significant circuit board space, and increase circuit board layout complexity and cost.
The semiconductors 1204 on the flexible circuit 1210, are preferably bonded directly to a heat spreader 1218. Alternatively, as shown and described in relation to
The heat spreader 1218 is preferably made from a material with good heat dissipation properties, such as a metal. In a preferred embodiment, the semiconductors 1204 are positioned on opposing sides of the heat spreader 1218. The electrical leads 1202 connect the semiconductors 1204 to electrical contact points 1216 at the base of the semiconductor module 1200. In use, electrical contact points 1216 may for example comprise solder balls or bond pads. The electrical contact points 1216 electrically couple the electrical leads 1202 to a transmission channel 1214 on a printed circuit board 1212. Electrical signals are transmitted along the transmission channel 1214 to electrical contact points 1216. The electrical signals are then passed from the electrical contact points 1216 through the electrical leads 1202 to each of the semiconductors 1204.
In this embodiment, the semiconductors 1204, on opposing sides of the heat spreader 1218, are connected to one another in series by the electrical lead 1202. It should be noted that multiple (i.e., more than two) semiconductors 1204 may be connected together in series. The final semiconductor in the series, remote from the transmission channel, electrically couples to a termination resistor 1208. The termination resistor 1208 is preferably thermally coupled to the heat spreader 1218 so that any heat built up in termination resistor 1208 can dissipate through the heat spreader.
The termination resistor 1208 connected in series to the semiconductors 1204 substantially reduces any degradation of the signal caused by a load placed on the signal from the electrical leads 1210, as the signal is not being split as is the case with stubs in existing semiconductor modules. A signal is transmitted from a signal source along the transmission channel 1214, along an electrical lead 1202, to each semiconductor 1204 connected in series, and is terminated at the termination resistor 1208. Furthermore, by incorporating the termination resistor 1208 into the semiconductor module 1200, the need for a termination resistor on the printed circuit board 1214 is eliminated.
This embodiment of the invention is particularly useful now that the memory capacity of individual semiconductors has increased to a point where only a few semiconductors are needed for many applications.
The resistance value of the termination resistor 1208 (
The semiconductors may be electrically coupled in series, where the semiconductors are capable of being electrically coupled to a transmission channel. Moreover, an additional termination resistor may be electrically coupled to the semiconductor not already connected to the termination resistor, where each of the semiconductors is capable of being electrically coupled to a separate transmission channel.
While the foregoing description and drawings represent the preferred embodiments of the present invention, it will be understood that various additions, modifications and substitutions may be made therein without departing from the spirit and scope of the present invention as defined in the accompanying claims. In particular, it will be clear to those skilled in the art that the present invention may be embodied in other specific forms, structures, arrangements, proportions, and with other elements, materials, and components, without departing from the spirit or essential characteristics thereof. The presently disclosed embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims, and not limited to the foregoing description.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US3506877 *||Sep 25, 1968||Apr 14, 1970||Us Navy||Hermetically sealed and shielded circuit module|
|US3654580 *||Mar 14, 1969||Apr 4, 1972||Sanders Associates Inc||Resistor structure|
|US3868724||Nov 21, 1973||Feb 25, 1975||Fairchild Camera Instr Co||Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier|
|US4314270 *||Oct 10, 1980||Feb 2, 1982||Mitsubishi Denki Kabushiki Kaisha||Hybrid thick film integrated circuit heat dissipating and grounding assembly|
|US4377855||Nov 6, 1980||Mar 22, 1983||National Semiconductor Corporation||Content-addressable memory|
|US4737903 *||Oct 14, 1986||Apr 12, 1988||Canon Kabushiki Kaisha||Electronic apparatus|
|US4811165||Dec 7, 1987||Mar 7, 1989||Motorola, Inc.||Assembly for circuit modules|
|US4858073 *||Mar 21, 1988||Aug 15, 1989||Akzo America Inc.||Metal substrated printed circuit|
|US4879588||Jan 19, 1988||Nov 7, 1989||Sumitomo Electric Industries, Ltd.||Integrated circuit package|
|US4914551||Jul 13, 1988||Apr 3, 1990||International Business Machines Corporation||Electronic package with heat spreader member|
|US5045921||Dec 26, 1989||Sep 3, 1991||Motorola, Inc.||Pad array carrier IC device using flexible tape|
|US5066250||Dec 21, 1990||Nov 19, 1991||Itt Corporation||Polarizing key permitting connector displacement|
|US5090920 *||Feb 22, 1991||Feb 25, 1992||Amp Incorporated||Module retention/ejection system|
|US5161986||Oct 15, 1991||Nov 10, 1992||Ceridian Corporation||Low inductance circuit apparatus with controlled impedance cross-unders and connector for connecting to backpanels|
|US5179501||Feb 24, 1992||Jan 12, 1993||Motorola, Inc.||Laminated electronic module assembly|
|US5213868||Aug 13, 1991||May 25, 1993||Chomerics, Inc.||Thermally conductive interface materials and methods of using the same|
|US5214318||Jan 7, 1991||May 25, 1993||Hitachi, Ltd.||Semiconductor integrated circuit device having a signal transmission line pair interconnected by propagation delay time control resistance|
|US5224023||Feb 10, 1992||Jun 29, 1993||Smith Gary W||Foldable electronic assembly module|
|US5229916||Mar 4, 1992||Jul 20, 1993||International Business Machines Corporation||Chip edge interconnect overlay element|
|US5268813||Dec 4, 1991||Dec 7, 1993||International Business Machines Corp.||Flexible printed circuit package and flexible printed circuit for incorporating in such a package|
|US5276418||Mar 25, 1991||Jan 4, 1994||Motorola, Inc.||Flexible substrate electronic assembly|
|US5315153||Jan 12, 1990||May 24, 1994||Toyo Aluminium Kabushiki Kaisha||Packages for semiconductor integrated circuit|
|US5386341||Nov 1, 1993||Jan 31, 1995||Motorola, Inc.||Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape|
|US5468999||May 26, 1994||Nov 21, 1995||Motorola, Inc.||Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding|
|US5477933||Oct 24, 1994||Dec 26, 1995||At&T Corp.||Electronic device interconnection techniques|
|US5485351||Jul 31, 1992||Jan 16, 1996||Labinal Components And Systems, Inc.||Socket assembly for integrated circuit chip package|
|US5518964||Jul 7, 1994||May 21, 1996||Tessera, Inc.||Microelectronic mounting with multiple lead deformation and bonding|
|US5527998 *||Oct 22, 1993||Jun 18, 1996||Sheldahl, Inc.||Flexible multilayer printed circuit boards and methods of manufacture|
|US5550406||Dec 20, 1993||Aug 27, 1996||Lsi Logic Corporation||Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate|
|US5640305||Jun 14, 1996||Jun 17, 1997||Thermalloy, Inc.||Anchor for securing a heat sink to a printed circuit board|
|US5663661||Jul 12, 1996||Sep 2, 1997||Rambus, Inc.||Modular bus with single or double parallel termination|
|US5703436||Mar 6, 1996||Dec 30, 1997||The Trustees Of Princeton University||Transparent contacts for organic devices|
|US5751553||Jun 7, 1995||May 12, 1998||Clayton; James E.||Thin multichip module including a connector frame socket having first and second apertures|
|US5763952||Mar 8, 1996||Jun 9, 1998||Lsi Logic Corporation||Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same|
|US5764489||Jul 18, 1996||Jun 9, 1998||Compaq Computer Corporation||Apparatus for controlling the impedance of high speed signals on a printed circuit board|
|US5777345||Jan 3, 1996||Jul 7, 1998||Intel Corporation||Multi-chip integrated circuit package|
|US5785535||Jan 17, 1996||Jul 28, 1998||International Business Machines Corporation||Computer system with surface mount socket|
|US5804004||May 24, 1996||Sep 8, 1998||Nchip, Inc.||Stacked devices for multichip modules|
|US5808870 *||Oct 2, 1996||Sep 15, 1998||Stmicroelectronics, Inc.||Plastic pin grid array package|
|US5925934||Jan 4, 1996||Jul 20, 1999||Institute Of Microelectronics||Low cost and highly reliable chip-sized package|
|US5926369||Jan 22, 1998||Jul 20, 1999||International Business Machines Corporation||Vertically integrated multi-chip circuit package with heat-sink support|
|US5926951||Oct 21, 1996||Jul 27, 1999||Formfactor, Inc.||Method of stacking electronic components|
|US5936850||Feb 28, 1996||Aug 10, 1999||Canon Kabushiki Kaisha||Circuit board connection structure and method, and liquid crystal device including the connection structure|
|US5940721||Oct 3, 1996||Aug 17, 1999||International Rectifier Corporation||Termination structure for semiconductor devices and process for manufacture thereof|
|US5949657||Aug 25, 1998||Sep 7, 1999||Karabatsos; Chris||Bottom or top jumpered foldable electronic assembly|
|US5954536||Mar 27, 1998||Sep 21, 1999||Molex Incorporated||Connector for flat flexible circuitry|
|US5959839||Jan 2, 1997||Sep 28, 1999||At&T Corp||Apparatus for heat removal using a flexible backplane|
|US5963427||Dec 11, 1997||Oct 5, 1999||Sun Microsystems, Inc.||Multi-chip module with flexible circuit board|
|US5995370||Aug 6, 1998||Nov 30, 1999||Sharp Kabushiki Kaisha||Heat-sinking arrangement for circuit elements|
|US5998864||May 27, 1997||Dec 7, 1999||Formfactor, Inc.||Stacking semiconductor devices, particularly memory chips|
|US6002589||Jul 21, 1997||Dec 14, 1999||Rambus Inc.||Integrated circuit package for coupling to a printed circuit board|
|US6005778||Jul 29, 1996||Dec 21, 1999||Honeywell Inc.||Chip stacking and capacitor mounting arrangement including spacers|
|US6007357||Jul 3, 1997||Dec 28, 1999||Rambus Inc.||Chip socket assembly and chip file assembly for semiconductor chips|
|US6009487||May 31, 1996||Dec 28, 1999||Rambus Inc.||Method and apparatus for setting a current of an output driver for the high speed bus|
|US6023103||Jun 30, 1998||Feb 8, 2000||Formfactor, Inc.||Chip-scale carrier for semiconductor devices including mounted spring contacts|
|US6034878||Dec 16, 1997||Mar 7, 2000||Hitachi, Ltd.||Source-clock-synchronized memory system and memory unit|
|US6040624||Oct 2, 1997||Mar 21, 2000||Motorola, Inc.||Semiconductor device package and method|
|US6049476||Jul 31, 1998||Apr 11, 2000||Silicon Graphics, Inc.||High memory capacity DIMM with data and state memory|
|US6072700||Jun 30, 1998||Jun 6, 2000||Hyundai Electronics Industries Co., Ltd.||Ball grid array package|
|US6093969||May 15, 1999||Jul 25, 2000||Lin; Paul T.||Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules|
|US6094075||Aug 27, 1998||Jul 25, 2000||Rambus Incorporated||Current control technique|
|US6115909||May 26, 1999||Sep 12, 2000||Miller; Dennis K.||ZIF PGA socket tool|
|US6133629||Apr 26, 1999||Oct 17, 2000||United Microelectronics Corp.||Multi-chip module package|
|US6137682||Jan 11, 1999||Oct 24, 2000||Fujitsu Limited||Air-cooled electronic apparatus|
|US6172895||Dec 14, 1999||Jan 9, 2001||High Connector Density, Inc.||High capacity memory module with built-in-high-speed bus terminations|
|US6180881||May 5, 1998||Jan 30, 2001||Harlan Ruben Isaak||Chip stack and method of making same|
|US6181002||Dec 13, 1999||Jan 30, 2001||Sharp Kabushiki Kaisha||Semiconductor device having a plurality of semiconductor chips|
|US6184587||Oct 21, 1996||Feb 6, 2001||Formfactor, Inc.||Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components|
|US6185122||Dec 22, 1999||Feb 6, 2001||Matrix Semiconductor, Inc.||Vertically stacked field programmable nonvolatile memory and method of fabrication|
|US6212073 *||Oct 18, 1999||Apr 3, 2001||Kitagawa Industries Co., Inc.||Heat sink|
|US6215182||Mar 20, 2000||Apr 10, 2001||Fujitsu Limited||Semiconductor device and method for producing the same|
|US6229217||Jun 27, 2000||May 8, 2001||Sharp Kabushiki Kaisha||Semiconductor device and method of manufacturing the same|
|US6234820||Jul 21, 1997||May 22, 2001||Rambus Inc.||Method and apparatus for joining printed circuit boards|
|US6273759||Apr 18, 2000||Aug 14, 2001||Rambus Inc||Multi-slot connector with integrated bus providing contact between adjacent modules|
|US6341971 *||Aug 31, 2000||Jan 29, 2002||Hon Hai Precision Ind. Co., Ltd.||Duplex profile connector assembly|
|US6356106||Sep 12, 2000||Mar 12, 2002||Micron Technology, Inc.||Active termination in a multidrop memory system|
|US6376904||Oct 10, 2000||Apr 23, 2002||Rambus Inc.||Redistributed bond pads in stacked integrated circuit die package|
|US6404660||Dec 23, 1999||Jun 11, 2002||Rambus, Inc.||Semiconductor package with a controlled impedance bus and method of forming same|
|US6449159||May 3, 2000||Sep 10, 2002||Rambus Inc.||Semiconductor module with imbedded heat spreader|
|US6490325||Sep 30, 1998||Dec 3, 2002||Lsi Logic Corporation||Transmission circuit having an inductor-assisted termination|
|US6496889||Sep 17, 1999||Dec 17, 2002||Rambus Inc.||Chip-to-chip communication system using an ac-coupled bus and devices employed in same|
|US6514794||Feb 5, 2002||Feb 4, 2003||Rambus Inc.||Redistributed bond pads in stacked integrated circuit die package|
|US6520789||May 22, 2001||Feb 18, 2003||Delphi Technologies, Inc.||Connecting system for printed circuit boards|
|US6530062||Mar 10, 2000||Mar 4, 2003||Rambus Inc.||Active impedance compensation|
|US6532157||Nov 16, 2000||Mar 11, 2003||Amkor Technology, Inc.||Angulated semiconductor packages|
|US6545875||May 10, 2000||Apr 8, 2003||Rambus, Inc.||Multiple channel modules and bus systems using same|
|US6590781||Mar 26, 2001||Jul 8, 2003||Rambus, Inc.||Clock routing in multiple channel modules and bus systems|
|US6608507||Aug 29, 2002||Aug 19, 2003||Rambus Inc.||Memory system including a memory device having a controlled output driver characteristic|
|US6618938||Oct 9, 2001||Sep 16, 2003||Lsi Logic Corporation||Interposer for semiconductor package assembly|
|US6621373||May 26, 2000||Sep 16, 2003||Rambus Inc.||Apparatus and method for utilizing a lossy dielectric substrate in a high speed digital system|
|US6657871||Jun 20, 2002||Dec 2, 2003||Rambus Inc.||Multiple channel modules and bus systems using same|
|US6705388||Sep 11, 1998||Mar 16, 2004||Parker-Hannifin Corporation||Non-electrically conductive thermal dissipator for electronic components|
|US6721189||Mar 13, 2002||Apr 13, 2004||Rambus, Inc.||Memory module|
|US6751192||Jul 15, 1997||Jun 15, 2004||Canon Kabushiki Kaisha||Network system and communication method|
|US6754129||Jan 24, 2002||Jun 22, 2004||Micron Technology, Inc.||Memory module with integrated bus termination|
|US6765800||Apr 20, 2001||Jul 20, 2004||Rambus Inc.||Multiple channel modules and bus systems using same|
|US6784526 *||Jul 22, 1998||Aug 31, 2004||Fujitsu Limited||Integrated circuit device module|
|US6833984||Feb 7, 2002||Dec 21, 2004||Rambus, Inc.||Semiconductor module with serial bus connection to multiple dies|
|1||IBM Technical Disclosure Bulletin, Concept for Forming Multilayer Structures for Packaging, 5 pages, Aug. 1, 1987.|
|2||IEEE 100 The Authoritative Dictionary of IEEE Standard Terms, 7th edition, 2000, IEEE Press, pp. 144, 704.|
|3||Notice of Allowance for Application No. 11,398,458, dated Jun. 2, 2010, pp. 9.|
|4||Selected Prosecution History U.S. Appl. No. 11/398,458 through May 25, 2010.|
|5||Selected Prosecution History U.S. Appl. No. 11/754,199 through May 25, 2010.|
|6||Selected Prosecution History U.S. Appl. No. 11/754,206 through May 25, 2010.|
|7||Selected Prosecution History U.S. Appl. No. 11/754,211 through May 25, 2010.|
|8||Selected Prosecution History U.S. Appl. No. 11/754,212 through May 25, 2010.|
|9||Selected Prosecution History U.S. Appl. No. 90/007,681 through May 25, 2010.|
|U.S. Classification||361/58, 361/707, 361/709, 361/728, 361/747, 361/748, 361/749, 361/710, 326/30|
|International Classification||H02H9/00, H01L23/538, H01L23/36, H01L25/065|
|Cooperative Classification||H01L2924/12032, H01L23/36, H01L2225/06551, H01L2225/06589, H01L23/647, H05K2201/1056, H05K2201/10674, H01L2225/06579, H01L2225/06517, H01L2924/14, H01L24/86, H05K3/0061, H01L2924/3011, H01L2225/06527, H01L2225/0652, H01L2924/3025, H05K2201/056, H01L23/552, H01L25/0657, H01L23/5387, H01L23/4985, H01L23/367, H05K1/189, H01L2924/19105, H05K2201/09445, H05K2201/10022, H05K1/0246, H01L25/0655, H01L2225/06586|
|European Classification||H01L23/36, H01L25/065S, H01L23/64R, H05K1/18F, H05K1/02C4R, H01L23/367, H01L23/538J, H01L25/065N|