WO1987005547A3 - Solder delivery systems - Google Patents

Solder delivery systems Download PDF

Info

Publication number
WO1987005547A3
WO1987005547A3 PCT/US1987/000530 US8700530W WO8705547A3 WO 1987005547 A3 WO1987005547 A3 WO 1987005547A3 US 8700530 W US8700530 W US 8700530W WO 8705547 A3 WO8705547 A3 WO 8705547A3
Authority
WO
WIPO (PCT)
Prior art keywords
delivery systems
solder preforms
solder delivery
delivery
solder
Prior art date
Application number
PCT/US1987/000530
Other languages
French (fr)
Other versions
WO1987005547A2 (en
Inventor
Raymond Noel
William M Robinson
Gabe Cherlan
Thomas H Clifford
William D Carlomagno
William M Deasy
Willie K Grassauer
David K Haygood
H Paul Sherlock
Harry E White
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Priority to DE8787902244T priority Critical patent/DE3763557D1/en
Publication of WO1987005547A2 publication Critical patent/WO1987005547A2/en
Publication of WO1987005547A3 publication Critical patent/WO1987005547A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Abstract

Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.
PCT/US1987/000530 1986-03-17 1987-03-11 Solder delivery systems WO1987005547A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8787902244T DE3763557D1 (en) 1986-03-17 1987-03-11 SOLVENT ADMINISTRATION SYSTEM.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/840,624 US4712721A (en) 1986-03-17 1986-03-17 Solder delivery systems
US840,624 1986-03-17

Publications (2)

Publication Number Publication Date
WO1987005547A2 WO1987005547A2 (en) 1987-09-24
WO1987005547A3 true WO1987005547A3 (en) 1988-04-07

Family

ID=25282831

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1987/000530 WO1987005547A2 (en) 1986-03-17 1987-03-11 Solder delivery systems

Country Status (3)

Country Link
US (1) US4712721A (en)
EP (1) EP0260316B1 (en)
WO (1) WO1987005547A2 (en)

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US4962878A (en) * 1987-02-18 1990-10-16 Plato Products, Inc. Desoldering aid
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US4872846A (en) * 1988-07-21 1989-10-10 Clark Thomas C Solder containing electrical connector and method for making same
US4903889A (en) * 1988-11-14 1990-02-27 Raychem Corporation Connection to a component for use in an electronics assembly
US5468681A (en) * 1989-08-28 1995-11-21 Lsi Logic Corporation Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
US5341980A (en) * 1990-02-19 1994-08-30 Hitachi, Ltd. Method of fabricating electronic circuit device and apparatus for performing the same method
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
JPH0754868B2 (en) * 1991-09-30 1995-06-07 松下電器産業株式会社 High frequency module board
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5626278A (en) * 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5373984A (en) * 1993-09-27 1994-12-20 Sundstrand Corporation Reflow process for mixed technology on a printed wiring board
EP0647091A1 (en) * 1993-10-05 1995-04-05 AT&T Corp. Passive alignment of components with micromachined tool
JPH07221104A (en) * 1994-01-28 1995-08-18 Fujitsu Ltd Semiconductor device manufacture thereof and mask for forming electrode pin and testing wherein the mask for forming electrode pin is used
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5791552A (en) * 1995-05-24 1998-08-11 Methode Electronics Inc Assembly including fine-pitch solder bumping and method of forming
US5673846A (en) * 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6809421B1 (en) * 1996-12-02 2004-10-26 Kabushiki Kaisha Toshiba Multichip semiconductor device, chip therefor and method of formation thereof
US6230963B1 (en) 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
MXPA01007647A (en) * 1999-01-29 2002-07-02 Norsk Hydro As Manifold for heat exchanger.
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
JP3973340B2 (en) 1999-10-05 2007-09-12 Ｎｅｃエレクトロニクス株式会社 Semiconductor device, wiring board, and manufacturing method thereof
US6710454B1 (en) 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
DE10392500B4 (en) * 2002-04-01 2010-02-25 Nas Interplex, Inc. Solder-carrying component and method for holding a solder mass thereon
DE112004002603B4 (en) * 2004-01-07 2010-06-17 Infineon Technologies Ag Method and device for soldering components on printed circuit boards by means of solder preforms
DE102004013688A1 (en) * 2004-03-18 2005-10-06 Behr Gmbh & Co. Kg Lotfolien for soldering components, in particular plates of heat exchangers
CN100596260C (en) * 2004-09-15 2010-03-24 莫列斯公司 Method of attaching a solder element to a contact and the contact assembly formed thereby
US7543376B2 (en) * 2004-10-20 2009-06-09 Panasonic Corporation Manufacturing method of flexible printed wiring board
DE102004058285A1 (en) * 2004-12-02 2006-06-08 Emitec Gesellschaft Für Emissionstechnologie Mbh Connecting material for positioning of solder material, method for producing a honeycomb body and corresponding honeycomb body
CN101495266B (en) * 2006-05-31 2011-09-28 东恺互联系统公司 Solder-bearing articles and method of retaining a solder mass along a side edge thereof
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
KR101164396B1 (en) * 2011-09-30 2012-07-09 센주긴조쿠고교 가부시키가이샤 Small piece of solder, chip solder, and manufacturing method for small piece of solder
US9108262B1 (en) * 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
WO2016015188A1 (en) * 2014-07-28 2016-02-04 GM Global Technology Operations LLC Systems and methods for reinforced adhesive bonding
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JP6042956B1 (en) * 2015-09-30 2016-12-14 オリジン電気株式会社 Method for manufacturing soldered products
CN205944139U (en) 2016-03-30 2017-02-08 首尔伟傲世有限公司 Ultraviolet ray light -emitting diode spare and contain this emitting diode module
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD874413S1 (en) * 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates

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EP0041857A1 (en) * 1980-06-09 1981-12-16 RAYCHEM CORPORATION (a California corporation) Solder delivery device
EP0079135A2 (en) * 1981-11-06 1983-05-18 Multicore Solders Limited Method of producing preformed solder material for use in soldering electronic components
EP0133752A2 (en) * 1983-06-30 1985-03-06 RAYCHEM CORPORATION (a Delaware corporation) Elements and devices for assembly of electronic components

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EP0041857A1 (en) * 1980-06-09 1981-12-16 RAYCHEM CORPORATION (a California corporation) Solder delivery device
EP0079135A2 (en) * 1981-11-06 1983-05-18 Multicore Solders Limited Method of producing preformed solder material for use in soldering electronic components
EP0133752A2 (en) * 1983-06-30 1985-03-06 RAYCHEM CORPORATION (a Delaware corporation) Elements and devices for assembly of electronic components

Also Published As

Publication number Publication date
WO1987005547A2 (en) 1987-09-24
US4712721A (en) 1987-12-15
EP0260316A1 (en) 1988-03-23
EP0260316B1 (en) 1990-07-04

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