WO1987007077A3 - Method and apparatus for cleaning semiconductor wafers - Google Patents

Method and apparatus for cleaning semiconductor wafers Download PDF

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Publication number
WO1987007077A3
WO1987007077A3 PCT/US1987/001084 US8701084W WO8707077A3 WO 1987007077 A3 WO1987007077 A3 WO 1987007077A3 US 8701084 W US8701084 W US 8701084W WO 8707077 A3 WO8707077 A3 WO 8707077A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
station
cleaning
drying
transported
Prior art date
Application number
PCT/US1987/001084
Other languages
French (fr)
Other versions
WO1987007077A2 (en
Inventor
Brian Anthony Giles
Frederick John Schwab
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of WO1987007077A2 publication Critical patent/WO1987007077A2/en
Publication of WO1987007077A3 publication Critical patent/WO1987007077A3/en
Priority to KR1019870701247A priority Critical patent/KR880701454A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Abstract

A method and apparatus for cleaning and drying semiconductor wafers wherein the wafers may be stored in a wet environment until the cleaning step and wherein, after drying, the wafers are substantially isolated from the remainder of the apparatus and the workpplace environment to prevent or at least substantially eliminate the recontamination of the wafer surface. The wafers are removed one at a time from an incoming storage bath and are transported to a cleaning station where they are cleaned and are then transported to a drying station. After being dried the wafers are transported to an output station where they are loaded into a portable enclosure member which substantially isolates the wafers in the enclosure from further contamination. Further, means is provided for introducing clean air into the drying station and venting at least a portion of the air through the cleaning station while at the same time substantially precluding the escape of air into the output station enclosure member. The cleaned wafer is substantially isolated during the cleaning and drying steps from the less clean portions of the method and apparatus thereby substantially preventing recontamination of the cleaned and dried wafer.
PCT/US1987/001084 1986-05-16 1987-05-11 Method and apparatus for cleaning semiconductor wafers WO1987007077A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019870701247A KR880701454A (en) 1986-05-16 1987-12-30 Semiconductor wafer cleaning method and apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/864,633 US4924890A (en) 1986-05-16 1986-05-16 Method and apparatus for cleaning semiconductor wafers
US864,633 1986-05-16

Publications (2)

Publication Number Publication Date
WO1987007077A2 WO1987007077A2 (en) 1987-11-19
WO1987007077A3 true WO1987007077A3 (en) 1987-12-17

Family

ID=25343715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1987/001084 WO1987007077A2 (en) 1986-05-16 1987-05-11 Method and apparatus for cleaning semiconductor wafers

Country Status (6)

Country Link
US (1) US4924890A (en)
EP (1) EP0307409A1 (en)
JP (1) JPH01502867A (en)
KR (1) KR880701454A (en)
CN (1) CN87103641A (en)
WO (1) WO1987007077A2 (en)

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JP4219799B2 (en) * 2003-02-26 2009-02-04 大日本スクリーン製造株式会社 Substrate processing equipment
US20070170812A1 (en) * 2006-01-20 2007-07-26 Pejman Fani System apparatus and methods for processing substrates using acoustic energy
CN100385629C (en) * 2006-09-18 2008-04-30 无锡华润华晶微电子有限公司 Method and device for cleaning semiconductor crystal wafer
JP4953892B2 (en) * 2007-04-13 2012-06-13 新科實業有限公司 Ultrasonic cleaning apparatus and method
CN103567175A (en) * 2013-10-30 2014-02-12 广西钦州天山微电子有限公司 Chromium plate cleaning machine
CN108772399A (en) * 2018-06-11 2018-11-09 杭州和源精密工具有限公司 The method of saw blade cleaning workpiece frame and clamping saw blade
JP7234527B2 (en) * 2018-07-30 2023-03-08 Tdk株式会社 Filter structure with built-in sensor and wafer storage container
CN109148339A (en) * 2018-09-26 2019-01-04 广西桂芯半导体科技有限公司 wafer cleaning device and cleaning method
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CN110931406B (en) * 2019-11-18 2022-10-21 北京北方华创微电子装备有限公司 Lifting door and groove type cleaning machine
CN111370298A (en) * 2020-04-16 2020-07-03 上海华虹宏力半导体制造有限公司 Semiconductor substrate cleaning method and adjusting method
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Also Published As

Publication number Publication date
KR880701454A (en) 1988-07-27
US4924890A (en) 1990-05-15
CN87103641A (en) 1987-11-25
EP0307409A1 (en) 1989-03-22
JPH01502867A (en) 1989-09-28
WO1987007077A2 (en) 1987-11-19

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