WO1990007858A3 - Improved method for making printed circuits - Google Patents

Improved method for making printed circuits Download PDF

Info

Publication number
WO1990007858A3
WO1990007858A3 PCT/GB1989/001536 GB8901536W WO9007858A3 WO 1990007858 A3 WO1990007858 A3 WO 1990007858A3 GB 8901536 W GB8901536 W GB 8901536W WO 9007858 A3 WO9007858 A3 WO 9007858A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
coating
printing
printed
applying
Prior art date
Application number
PCT/GB1989/001536
Other languages
French (fr)
Other versions
WO1990007858A2 (en
Inventor
John Michael Lowe
Joseph Devonport
Original Assignee
Technology Applic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB8830251A external-priority patent/GB2227887A/en
Application filed by Technology Applic Co Ltd filed Critical Technology Applic Co Ltd
Priority to KR1019900701909A priority Critical patent/KR910700599A/en
Priority to BR898907268A priority patent/BR8907268A/en
Publication of WO1990007858A2 publication Critical patent/WO1990007858A2/en
Publication of WO1990007858A3 publication Critical patent/WO1990007858A3/en
Priority to DK201690A priority patent/DK201690A/en
Priority to FI904210A priority patent/FI904210A0/en
Priority to FI904213A priority patent/FI91587C/en
Priority to AU84210/91A priority patent/AU8421091A/en
Priority to EP91914883A priority patent/EP0556185B1/en
Priority to DE69124260T priority patent/DE69124260T2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles

Abstract

Printed circuits are produced by screen printing or the like to deposit conductors, resistors, capacitors and insulators. Crossover connections are made by covering the conducting portions to be crossed with an insulating material that serves as a base for a printed crossing conductor. The equivalent of multilayer boards can be achieved by printing repeated layers of conductors, components and insulators on the same side of the board, or by printing on two sides of a board. Interconnection between adjacent layers can be made as a part of the printing process. A method of making a printed circuit board comprises applying a first and second coating in a desired pattern to a substrate, the substrate (12) being disposed in a different relationship to coating apparatus used in applying a second coating from the relationship in which it is disposed in applying the first coating. Preferably a number of identical boards are printed on a substrate (12) from which they are subsequently separated. The individual boards are positioned such that the same pattern may be applied when the substrate (12) is presented to coating means in any of a number of orientations each separated from the next by a fixed angle of rotation about an axis (A) at right angles to the substrate (12), the first coating being applied in one such orientation and the second after the screen and substrate respectively have been rotated in opposite directions, (S, B) each through 90°.
PCT/GB1989/001536 1988-12-24 1989-12-22 Improved method for making printed circuits WO1990007858A2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1019900701909A KR910700599A (en) 1988-12-24 1989-12-22 Printed Circuit Manufacturing Method
BR898907268A BR8907268A (en) 1988-12-24 1989-12-22 PROCESS TO MAKE AN ELECTRICAL CONNECTION, PRINTED CIRCUIT BOARD, PROCESS TO PRODUCE A CONTACT PAD, PROCESS TO PRODUCE A CAPACITOR, PRINTED CIRCUIT AND PROCESS TO APPLY A LAYER IN A DESIRED PATTERN TO AN UNDERSTRATE
DK201690A DK201690A (en) 1988-12-24 1990-08-22 PROCEDURE FOR THE MANUFACTURING OF PRINTED CIRCUITS
FI904210A FI904210A0 (en) 1988-12-24 1990-08-24 FOERBAETTRAT FOERFARANDE FOER TILLVERKNING AV TRYCKTA KRETSAR.
FI904213A FI91587C (en) 1989-12-18 1990-08-27 System for controlling the pressing elements of a harvester, in particular a grapple harvester
AU84210/91A AU8421091A (en) 1989-12-18 1991-08-27 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester
EP91914883A EP0556185B1 (en) 1989-12-18 1991-08-27 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester
DE69124260T DE69124260T2 (en) 1989-12-18 1991-08-27 SYSTEM FOR CONTROLLING THE CLAMPING DEVICES IN A HARVESTING DEVICE, IN PARTICULAR A DEVICE WITH GRIPPERS

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB8830251A GB2227887A (en) 1988-12-24 1988-12-24 Making printed circuits
GB8830251.8 1988-12-24
GB8928563A GB2228232A (en) 1988-12-24 1989-12-18 Making printed circuits
GB8928563.9 1989-12-18

Publications (2)

Publication Number Publication Date
WO1990007858A2 WO1990007858A2 (en) 1990-07-12
WO1990007858A3 true WO1990007858A3 (en) 1990-08-09

Family

ID=26294784

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1989/001536 WO1990007858A2 (en) 1988-12-24 1989-12-22 Improved method for making printed circuits

Country Status (8)

Country Link
US (1) US5148355A (en)
EP (1) EP0406376A1 (en)
JP (1) JPH03504065A (en)
AU (1) AU631595B2 (en)
BR (1) BR8907268A (en)
DK (1) DK201690A (en)
FI (1) FI904210A0 (en)
WO (1) WO1990007858A2 (en)

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Also Published As

Publication number Publication date
AU631595B2 (en) 1992-12-03
JPH03504065A (en) 1991-09-05
BR8907268A (en) 1991-03-12
DK201690D0 (en) 1990-08-22
WO1990007858A2 (en) 1990-07-12
US5148355A (en) 1992-09-15
EP0406376A1 (en) 1991-01-09
FI904210A0 (en) 1990-08-24
DK201690A (en) 1990-10-19
AU4825090A (en) 1990-08-01

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