WO1991015032A1 - Loading mechanisms - Google Patents

Loading mechanisms Download PDF

Info

Publication number
WO1991015032A1
WO1991015032A1 PCT/GB1991/000221 GB9100221W WO9115032A1 WO 1991015032 A1 WO1991015032 A1 WO 1991015032A1 GB 9100221 W GB9100221 W GB 9100221W WO 9115032 A1 WO9115032 A1 WO 9115032A1
Authority
WO
WIPO (PCT)
Prior art keywords
pallet
elements
work station
lines
workpieces
Prior art date
Application number
PCT/GB1991/000221
Other languages
French (fr)
Inventor
Carl David Monnington Brancher
Original Assignee
Surface Technology Systems Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surface Technology Systems Limited filed Critical Surface Technology Systems Limited
Priority to EP91903229A priority Critical patent/EP0520996B1/en
Priority to US07/924,022 priority patent/US5330301A/en
Priority to DE69128194T priority patent/DE69128194T2/en
Publication of WO1991015032A1 publication Critical patent/WO1991015032A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Definitions

  • This invention relates to batch loading mechanisms and in particular, but not exclusively, to loading mechanisms for use with semi-conductor processing apparatus.
  • the heat required to achieve a good process is sufficiently high as to cause undesirable side effects and damage if continued for too long. It is therefore important to achieve such a temperature but to minimise the length of time the wafers are at such temperatures. If the batch loading time is significant then either the first to load will have been subjected to excessive time-at-temperature or the last to load have had insufficient time to reach the correct temperature.
  • the present invention consists in a wor piece loading mechanism, comprising a work station having a plurality of lifting elements arranged in lines and means for moving the elements between the workpiece lift position and a rest position; a pallet for supporting workpieces and means for moving the pallet into and out of the work station, the pallet having a plurality of slots corresponding to the lines of the elements such that the elements can pass through the slots when the pallet is at the work station, to lift the workpieces off the pallet and such that the pallet can be withdrawn from the work station with the elements in the workpiece lift position.
  • the lines are substantially straight and substantially parallel.
  • single elements may consitute a line for these purposes but at least some of the lines will include a plurality of elements.
  • the elements may be in the form of pins.
  • the elements are mounted on a common base for simultaneous movement for example by means of a hydraulic ram.
  • the invention also consists in a gas reactor having a work station including a vacuum chamber and a mechanism as defined above for loading workpieces through a side wall thereon.
  • the workpieces may be semi-conductor wafers.
  • Figure 1 is a plan view of a dual chamber processing apparatus with one form of loading mechanism
  • Figure 2 is a cross-sectional view of a single chamber apparatus with a different form of loading mechanism.
  • a processing apparatus 10 has chambers 11 and 12 and a loading mechanism generally indicated at 13.
  • the loading mechanism 13 includes a carrier 14 and an actuating mechanism 15 which can move the carrier 14 in a straight line into or out of the chambers 11 and 12 using a "frog legs" mechanism.
  • a "frog legs" mechanism One example is manufactured by Brooks Automation.
  • a pallet 16 can be placed into the carrier 14.
  • the pallet 16 which has a number of recessed semi-conductor wafer locations 17 and eight slots 18 of different lengths, extending into, and in some cases through, the locations 17 from the leading edge of the pallet 16.
  • a work station 19 in chamber 12 has a base 20 on which is positioned an array 21 of pins 22 which are, when viewed in one direction, aligned in a series of parallel lines which are indicated at A-H.
  • a similar array exists in chamber 11 except the lines A-H are orthogonal to those in chamber 12.
  • the wafers are loaded on the pallet 16 and the pallet 16 is placed on the carrier 14 when it is outside a chamber.
  • the loaded carrier is then fed into the chamber 11 or 12.
  • the base 20 is then lifted so that the pins 22 move up through their respective slots 18 to lift the wafers 23 from the pallet 16 and to support them in that lifted position. Because the slots 18 are aligned with the lines A-H the pallet 16 can then be withdrawn from the chamber and the pins can then be lowered placing the wafers 23 onto a workpiece support table 20a. In some circumstances it may not be necessary to lower the pins.
  • the base 20 may be mounted on a hydraulic ram 24 to provide the lift for the pins.
  • Other suitable mechanisms may be used and the pins may be arranged to drop back through the workpiece support table 20a within the chamber.
  • FIG. 2 An alternative loading mechanism 25 is illustrated in Figure 2 and in this case the table 16 is mounted for linear movement on a guide from a load chamber 26 into a processing chamber 27.
  • the loading chamber is accessible through a lid 28 and the mechanism is driven by a motor 29.

Abstract

A processing apparatus (10) has chambers (11 and 12) and a loading mechanism (13) for transferring workpieces into and out of the chambers. The workpieces are carried on a pallet (16) which is slotted so that, when it is inserted into the chambers (11 or 12) the slots are aligned with lines A-H on lifting pins. This arrangement enables the mechanism (13) to withdraw the pallet, whilst the pins (22) are in their erect position.

Description

LOADING MECHANISMS
This invention relates to batch loading mechanisms and in particular, but not exclusively, to loading mechanisms for use with semi-conductor processing apparatus.
Currently semi-conductor wafers are processed either as single wafers or in batches. Batches can be loaded one at a time, or as a batch on a pallet. Loading a batch one at a time is time consuming and subjects the individual wafers in the batch to varying conditions. Those loaded earliest will have spent longer in the chamber than those loaded last. This will adversely affect the process uniformity across the batch. In extreme cases the first loaded wafers will be spoilt by the wait for the last to load, or the last to load will hot be processed properly because they have not achieved the same state as those that have been loaded earlier. This is particularly the case where the process involves heating. In many processes the heat required to achieve a good process is sufficiently high as to cause undesirable side effects and damage if continued for too long. It is therefore important to achieve such a temperature but to minimise the length of time the wafers are at such temperatures. If the batch loading time is significant then either the first to load will have been subjected to excessive time-at-temperature or the last to load have had insufficient time to reach the correct temperature.
The present invention consists in a wor piece loading mechanism, comprising a work station having a plurality of lifting elements arranged in lines and means for moving the elements between the workpiece lift position and a rest position; a pallet for supporting workpieces and means for moving the pallet into and out of the work station, the pallet having a plurality of slots corresponding to the lines of the elements such that the elements can pass through the slots when the pallet is at the work station, to lift the workpieces off the pallet and such that the pallet can be withdrawn from the work station with the elements in the workpiece lift position.
Preferably the lines are substantially straight and substantially parallel. In some instances single elements may consitute a line for these purposes but at least some of the lines will include a plurality of elements. The elements may be in the form of pins. Conveniently the elements are mounted on a common base for simultaneous movement for example by means of a hydraulic ram.
The invention also consists in a gas reactor having a work station including a vacuum chamber and a mechanism as defined above for loading workpieces through a side wall thereon.
The workpieces may be semi-conductor wafers.
Although the invention has been defined above it is to be understood that it includes any inventive combination of the features set out above or in the following description.
The invention may be performed in various ways and specific embodiments will now be described, by way of example, with reference to the accompanying drawings, in which:
Figure 1 is a plan view of a dual chamber processing apparatus with one form of loading mechanism, and
Figure 2 is a cross-sectional view of a single chamber apparatus with a different form of loading mechanism.
Referring first to Figure 1 a processing apparatus 10 has chambers 11 and 12 and a loading mechanism generally indicated at 13. The loading mechanism 13 includes a carrier 14 and an actuating mechanism 15 which can move the carrier 14 in a straight line into or out of the chambers 11 and 12 using a "frog legs" mechanism. One example is manufactured by Brooks Automation.
As will be seen a pallet 16 can be placed into the carrier 14. The pallet 16 which has a number of recessed semi-conductor wafer locations 17 and eight slots 18 of different lengths, extending into, and in some cases through, the locations 17 from the leading edge of the pallet 16.
As can best be seen in Figure 2 a work station 19, in chamber 12, has a base 20 on which is positioned an array 21 of pins 22 which are, when viewed in one direction, aligned in a series of parallel lines which are indicated at A-H. A similar array exists in chamber 11 except the lines A-H are orthogonal to those in chamber 12.
In operation the wafers are loaded on the pallet 16 and the pallet 16 is placed on the carrier 14 when it is outside a chamber. The loaded carrier is then fed into the chamber 11 or 12. The base 20 is then lifted so that the pins 22 move up through their respective slots 18 to lift the wafers 23 from the pallet 16 and to support them in that lifted position. Because the slots 18 are aligned with the lines A-H the pallet 16 can then be withdrawn from the chamber and the pins can then be lowered placing the wafers 23 onto a workpiece support table 20a. In some circumstances it may not be necessary to lower the pins.
Unloading is exactly the reverse procedure and again the slots 18 allow the pallet 16 to pass the pins 22.
As can be seen in Figure 2 the base 20 may be mounted on a hydraulic ram 24 to provide the lift for the pins. Other suitable mechanisms may be used and the pins may be arranged to drop back through the workpiece support table 20a within the chamber.
An alternative loading mechanism 25 is illustrated in Figure 2 and in this case the table 16 is mounted for linear movement on a guide from a load chamber 26 into a processing chamber 27. The loading chamber is accessible through a lid 28 and the mechanism is driven by a motor 29.

Claims

Claims
1. A workpiece loading mechanism, comprising a work station having a plurality of lifting elements arranged in lines and means for moving the elements between a workpiece lift position and work position; a pallet for supporting workpieces and means for moving the pallet into and out of the work station, the pallet having a plurality of slots corresponding to the lines of the elements such that the elements can pass through the slot when the pallet is at the work station, to lift workpieces off the pallet, and such that the pallet can be withdrawn from the work station with the elements in the workpiece lift position.
2. A mechanism as claimed in Claim 1, wherein the lines are substantially straight and substantially parallel.
3. A mechanism as claimed in Claim 1 or Claim 2, wherein the elements are in the form of pins.
4. A mechanism as claimed in any one of the preceding Claims, wherein the elements are mounted on a common base for simultaneous movement.
5. A workpiece loading mechanism substantially as hereinbefore described, with reference to the accompanying drawings.
6. A gas reactor having a work station including a vacuum chamber and a mechanism as claimed in any one of the preceding Claims for loading workpieces through a side wall thereof.
PCT/GB1991/000221 1990-03-22 1991-02-14 Loading mechanisms WO1991015032A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP91903229A EP0520996B1 (en) 1990-03-22 1991-02-14 Loading mechanisms
US07/924,022 US5330301A (en) 1990-03-22 1991-02-14 Loading mechanisms
DE69128194T DE69128194T2 (en) 1990-03-22 1991-02-14 LOADING DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB909006471A GB9006471D0 (en) 1990-03-22 1990-03-22 Loading mechanisms
GB9006471.8 1990-03-22

Publications (1)

Publication Number Publication Date
WO1991015032A1 true WO1991015032A1 (en) 1991-10-03

Family

ID=10673087

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1991/000221 WO1991015032A1 (en) 1990-03-22 1991-02-14 Loading mechanisms

Country Status (5)

Country Link
US (1) US5330301A (en)
EP (1) EP0520996B1 (en)
DE (1) DE69128194T2 (en)
GB (1) GB9006471D0 (en)
WO (1) WO1991015032A1 (en)

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US5961897A (en) * 1995-12-01 1999-10-05 Rockwool International A/S Manufacture of man-made vitreous fiber products
WO2012153232A3 (en) * 2011-05-12 2013-01-03 Roth & Rau Ag Substrate‑transporting module, loading and unloading system, and method for transporting substrates in a substrate‑processing installation

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US6849471B2 (en) * 2003-03-28 2005-02-01 Reflectivity, Inc. Barrier layers for microelectromechanical systems
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US6949202B1 (en) 1999-10-26 2005-09-27 Reflectivity, Inc Apparatus and method for flow of process gas in an ultra-clean environment
US6290864B1 (en) 1999-10-26 2001-09-18 Reflectivity, Inc. Fluoride gas etching of silicon with improved selectivity
US6682288B2 (en) * 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US7189332B2 (en) 2001-09-17 2007-03-13 Texas Instruments Incorporated Apparatus and method for detecting an endpoint in a vapor phase etch
US20030073302A1 (en) * 2001-10-12 2003-04-17 Reflectivity, Inc., A California Corporation Methods for formation of air gap interconnects
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6965468B2 (en) * 2003-07-03 2005-11-15 Reflectivity, Inc Micromirror array having reduced gap between adjacent micromirrors of the micromirror array
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US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
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US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
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Publication number Priority date Publication date Assignee Title
US5961897A (en) * 1995-12-01 1999-10-05 Rockwool International A/S Manufacture of man-made vitreous fiber products
WO2012153232A3 (en) * 2011-05-12 2013-01-03 Roth & Rau Ag Substrate‑transporting module, loading and unloading system, and method for transporting substrates in a substrate‑processing installation

Also Published As

Publication number Publication date
DE69128194T2 (en) 1998-03-26
EP0520996A1 (en) 1993-01-07
US5330301A (en) 1994-07-19
EP0520996B1 (en) 1997-11-12
GB9006471D0 (en) 1990-05-23
DE69128194D1 (en) 1997-12-18

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