WO1992004620A3 - Method and apparatus for high resolution inspection of electronic items - Google Patents

Method and apparatus for high resolution inspection of electronic items Download PDF

Info

Publication number
WO1992004620A3
WO1992004620A3 PCT/US1991/006166 US9106166W WO9204620A3 WO 1992004620 A3 WO1992004620 A3 WO 1992004620A3 US 9106166 W US9106166 W US 9106166W WO 9204620 A3 WO9204620 A3 WO 9204620A3
Authority
WO
WIPO (PCT)
Prior art keywords
target
image
rays
vacuum chamber
computer
Prior art date
Application number
PCT/US1991/006166
Other languages
French (fr)
Other versions
WO1992004620A2 (en
Inventor
John A Adams
Bruce D Baker
Kerry L Brown
Robert L Corey
Brian L Ganz
David C Reynolds
Edward W Ross
Gerald S Russell
Christoper S Sexton
Original Assignee
Four Pi Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Four Pi Systems Corp filed Critical Four Pi Systems Corp
Publication of WO1992004620A2 publication Critical patent/WO1992004620A2/en
Publication of WO1992004620A3 publication Critical patent/WO1992004620A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05G—X-RAY TECHNIQUE
    • H05G1/00—X-ray apparatus involving X-ray tubes; Circuits therefor
    • H05G1/08—Electrical details
    • H05G1/26—Measuring, controlling or protecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/043—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing

Abstract

A high resolution laminography system (200) for the inspection of integrated circuits wherein a beam of highly focused electrons is traced in a circular pattern on a flat target (272) within a vacuum chamber (275). The target (272) converts the electron beam into X-rays, so that a point source of X-rays is produced which rotates in synchronization with a rotating detector assembly. An object (210) is placed within the vacuum chamber (274), between the X-rays source and the detector so that an X-ray shadowgraph of the object is converted into an optical image by a phosphor screen (285) deposited on the inside of a window that seals the vacuum chamber. The rotating detector assembly derotates the image so as to be viewed and integrated in a stationary video camera (300) as a laminograph. A computer (350) and feedback system (320) controls an automated positioning system which deflects the electron beam so as to image selected regions of the object under inspection. In order to maintain high image quality and resolution, the computer (350) and feedback system (320) also controls the synchronization of the electron beam deflection and the rotating detector system, making adjustments for inaccuracies of the mechanics of the system. The computer system (350) can also operate under program control to automatically analyze data, measure characteristics of the object under inspection, and make decisions regarding the acceptability of the object's quality. The invention also employs scanning electron microscope techniques to directly image the target so that the condition of the target may be monitored, and electron drift within the system can be compensated. The invention is particularly well suited for failure analysis of integrated circuit chips and the like.
PCT/US1991/006166 1990-08-30 1991-08-28 Method and apparatus for high resolution inspection of electronic items WO1992004620A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US575,550 1990-08-30
US07/575,550 US5199054A (en) 1990-08-30 1990-08-30 Method and apparatus for high resolution inspection of electronic items

Publications (2)

Publication Number Publication Date
WO1992004620A2 WO1992004620A2 (en) 1992-03-19
WO1992004620A3 true WO1992004620A3 (en) 1992-05-29

Family

ID=24300754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1991/006166 WO1992004620A2 (en) 1990-08-30 1991-08-28 Method and apparatus for high resolution inspection of electronic items

Country Status (2)

Country Link
US (1) US5199054A (en)
WO (1) WO1992004620A2 (en)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600734A (en) * 1991-10-04 1997-02-04 Fujitsu Limited Electron beam tester
US5561696A (en) * 1987-10-30 1996-10-01 Hewlett-Packard Company Method and apparatus for inspecting electrical connections
US5621811A (en) * 1987-10-30 1997-04-15 Hewlett-Packard Co. Learning method and apparatus for detecting and controlling solder defects
US5463459A (en) * 1991-04-02 1995-10-31 Hitachi, Ltd. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
US5289520A (en) * 1991-11-27 1994-02-22 Lorad Corporation Stereotactic mammography imaging system with prone position examination table and CCD camera
GB9214114D0 (en) * 1992-07-03 1992-08-12 Ibm X-ray inspection apparatus for electronic circuits
US5594768A (en) * 1994-05-12 1997-01-14 Kabushiki Kaisha Toshiba Laminograph and inspection and repair device using the same
US5594770A (en) * 1994-11-18 1997-01-14 Thermospectra Corporation Method and apparatus for imaging obscured areas of a test object
US6091796A (en) * 1994-11-23 2000-07-18 Thermotrex Corporation Scintillator based microscope
US5687209A (en) * 1995-04-11 1997-11-11 Hewlett-Packard Co. Automatic warp compensation for laminographic circuit board inspection
US5583904A (en) * 1995-04-11 1996-12-10 Hewlett-Packard Co. Continuous linear scan laminography system and method
US5930330A (en) * 1995-09-29 1999-07-27 New Mexico Biophysics Method and apparatus for multitaxis scanning system
AU1545997A (en) * 1996-03-08 1997-09-22 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Process and device for radioscopically inspecting soldered points in electronic units
US5784430A (en) * 1996-04-16 1998-07-21 Northrop Grumman Corporation Multiple station gamma ray absorption contraband detection system
US5751784A (en) * 1996-09-27 1998-05-12 Kevex X-Ray X-ray tube
US6243095B1 (en) * 1996-12-05 2001-06-05 Peter E. Shile Navigation and display system for digital radiographs
US6067342A (en) * 1997-10-30 2000-05-23 Analogic Corporation Digital filmless X-ray projection imaging system and method
US6370487B1 (en) * 1998-04-23 2002-04-09 Micron Technology, Inc. Remote semiconductor microscopy
US6463124B1 (en) * 1998-06-04 2002-10-08 X-Technologies, Ltd. Miniature energy transducer for emitting x-ray radiation including schottky cathode
TW402769B (en) * 1998-06-13 2000-08-21 Samsung Electronics Co Ltd Apparatus and method for contact failure inspection in semiconductor devices
US7295314B1 (en) 1998-07-10 2007-11-13 Nanometrics Incorporated Metrology/inspection positioning system
US6320609B1 (en) 1998-07-10 2001-11-20 Nanometrics Incorporated System using a polar coordinate stage and continuous image rotation to compensate for stage rotation
US6215851B1 (en) 1998-07-22 2001-04-10 Northrop Grumman Corporation High current proton beam target
US6314201B1 (en) 1998-10-16 2001-11-06 Agilent Technologies, Inc. Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography
US6303931B1 (en) * 1998-11-17 2001-10-16 Applied Materials, Inc. Method for determining a profile quality grade of an inspected feature
US6201850B1 (en) * 1999-01-26 2001-03-13 Agilent Technologies, Inc. Enhanced thickness calibration and shading correction for automatic X-ray inspection
SE516914C2 (en) * 1999-09-09 2002-03-19 Micronic Laser Systems Ab Methods and grid for high performance pattern generation
US6590216B1 (en) * 2000-01-27 2003-07-08 Nikon Corporation Servo control for high emittance electron source
KR100435108B1 (en) * 2000-02-16 2004-06-09 삼성전자주식회사 Radiation inspection system and method thereof
JP4505664B2 (en) * 2000-03-24 2010-07-21 株式会社ニコン X-ray generator
US6628745B1 (en) * 2000-07-01 2003-09-30 Martin Annis Imaging with digital tomography and a rapidly moving x-ray source
US6825856B1 (en) 2000-07-26 2004-11-30 Agilent Technologies, Inc. Method and apparatus for extracting measurement information and setting specifications using three dimensional visualization
US6373917B1 (en) 2000-08-30 2002-04-16 Agilent Technologies, Inc. Z-axis elimination in an X-ray laminography system using image magnification for Z plane adjustment
US7173245B2 (en) * 2001-01-04 2007-02-06 The Regents Of The University Of California Submicron thermal imaging method and enhanced resolution (super-resolved) AC-coupled imaging for thermal inspection of integrated circuits
US20020107659A1 (en) * 2001-02-05 2002-08-08 Vann Charles S. Orientation and position sensor
US6324249B1 (en) 2001-03-21 2001-11-27 Agilent Technologies, Inc. Electronic planar laminography system and method
US6980229B1 (en) * 2001-10-16 2005-12-27 Ebersole Jr John F System for precise rotational and positional tracking
US6853744B2 (en) * 2001-12-14 2005-02-08 Agilent Technologies, Inc. System and method for confirming electrical connection defects
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
DE10224292A1 (en) * 2002-05-31 2003-12-11 Philips Intellectual Property X-ray tube
US6823736B1 (en) 2002-11-20 2004-11-30 The United States Of America As Represented By The Secretary Of The Navy Nondestructive acoustic emission testing system using electromagnetic excitation and method for using same
US6738450B1 (en) 2002-12-10 2004-05-18 Agilent Technologies, Inc. System and method for cost-effective classification of an object under inspection
DE10352334B4 (en) * 2003-11-06 2010-07-29 Comet Gmbh Method for controlling a microfocus X-ray device
WO2006113839A2 (en) * 2005-04-20 2006-10-26 Richard Albert Laminography apparatus
DE102005020149A1 (en) * 2005-04-29 2006-11-09 Yxlon International X-Ray Gmbh Method for automatic error detection in test parts by means of an X-ray inspection system
DE102006042157B4 (en) 2006-09-06 2013-03-21 Leica Microsystems Cms Gmbh Method and microscope system for scanning a sample
JP4504344B2 (en) * 2006-12-04 2010-07-14 国立大学法人 東京大学 X-ray source
WO2008088097A1 (en) * 2007-01-19 2008-07-24 Postech Foundation Fabrication of freestanding micro hollow tubes by template-free localized electrochemical deposition
US20080173546A1 (en) * 2007-01-22 2008-07-24 Seung Kwon Seol Fabrication of freestanding micro hollow tubes by template-free localized electrochemical deposition
US7529336B2 (en) 2007-05-31 2009-05-05 Test Research, Inc. System and method for laminography inspection
CN101842188B (en) * 2007-09-17 2013-12-11 科诺普提卡股份有限公司 Rotating part position and change finding method and apparatus
DE102007046927A1 (en) * 2007-09-28 2009-04-02 Carl Zeiss Smt Ag Calibration of a position measuring device of an optical device
US8331525B2 (en) 2007-10-01 2012-12-11 Pratt & Whitney Rocketdyne, Inc. Characteristic X-ray computed laminography system for home made explosives (HME) detection
US8080791B2 (en) * 2008-12-12 2011-12-20 Fei Company X-ray detector for electron microscope
US8401151B2 (en) * 2009-12-16 2013-03-19 General Electric Company X-ray tube for microsecond X-ray intensity switching
US8831179B2 (en) 2011-04-21 2014-09-09 Carl Zeiss X-ray Microscopy, Inc. X-ray source with selective beam repositioning
JP2015526838A (en) 2012-06-14 2015-09-10 シーメンス アクティエンゲゼルシャフト Spark gap
US9484179B2 (en) 2012-12-18 2016-11-01 General Electric Company X-ray tube with adjustable intensity profile
US9224572B2 (en) 2012-12-18 2015-12-29 General Electric Company X-ray tube with adjustable electron beam
CN103278515A (en) * 2013-05-16 2013-09-04 华南理工大学 Rotary X-ray layered photographic detection system and method
US9443691B2 (en) 2013-12-30 2016-09-13 General Electric Company Electron emission surface for X-ray generation
GB201715902D0 (en) * 2017-09-29 2017-11-15 Oxford Instr Plc Improved system for electron diffraction analysis
JP6930932B2 (en) * 2018-01-26 2021-09-01 東芝Ｉｔコントロールシステム株式会社 Inclined CT imaging device
CN112424590A (en) * 2018-05-15 2021-02-26 克塞诺奇股份公司 Method and apparatus for X-ray scattering material analysis

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB868830A (en) * 1958-01-22 1961-05-25 Foerderung Forschung Gmbh Improvements in and relating to x-ray tubes and apparatus including such tubes
EP0225969A1 (en) * 1985-08-19 1987-06-24 Kabushiki Kaisha Toshiba Apparatus and method for controlling irradiation of electron beam at fixed position in electron beam tester system
WO1989004477A1 (en) * 1987-10-30 1989-05-18 Four Pi Systems Corporation Automated laminography system for inspection of electronics

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR812792A (en) * 1935-11-01 1937-05-18 Philips Nv Radiographic method and device for representing cross-sectional objects using chi-rays
US2677585A (en) * 1951-03-09 1954-05-04 Voy Donald G La Garment bag
BE533316A (en) * 1953-11-14
NL207028A (en) * 1956-05-09
DE1138617B (en) * 1960-01-22 1962-10-25 Zuder Di G Zurli & Dr A De Reg Device for performing X-ray recordings, in particular layer recordings
US3812288A (en) * 1972-11-21 1974-05-21 Edax Int Inc Television display system
GB1581526A (en) * 1976-08-12 1980-12-17 Emi Ltd X-ray tube arrangements
DE2647167A1 (en) * 1976-10-19 1978-04-20 Siemens Ag PROCESS FOR THE PRODUCTION OF LAYERS WITH X-RAYS OR SIMILAR PENETRATING RAYS
US4075489A (en) * 1977-01-21 1978-02-21 Simulation Physics Method and apparatus involving the generation of x-rays
US4139776A (en) * 1977-09-22 1979-02-13 Cgr Medical Corporation System for circular and complex tomography
DE2946443A1 (en) * 1979-11-17 1981-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Radiographic sectional imaging system - has X=ray source triggered at points along coplanar path to obtain perspective images
US4352021A (en) * 1980-01-07 1982-09-28 The Regents Of The University Of California X-Ray transmission scanning system and method and electron beam X-ray scan tube for use therewith
DE3134076A1 (en) * 1981-08-28 1983-03-10 Philips Patentverwaltung Gmbh, 2000 Hamburg "DEVICE FOR SHOWING A BODY"
US4521902A (en) * 1983-07-05 1985-06-04 Ridge, Inc. Microfocus X-ray system
US5020086A (en) * 1983-07-05 1991-05-28 Ridge, Inc. Microfocus X-ray system
US4688241A (en) * 1984-03-26 1987-08-18 Ridge, Inc. Microfocus X-ray system
FR2565451B1 (en) * 1984-05-30 1986-08-22 Thomson Cgr METHOD FOR MONITORING THE POSITION OF THE FIREPLACE OF A RADIOGENIC TUBE AND MONITORING DEVICE USING THE SAME
JPH0676975B2 (en) * 1984-09-26 1994-09-28 新技術事業団 Observation method of surface atomic arrangement structure
US4720633A (en) * 1986-01-17 1988-01-19 Electro-Scan Corporation Scanning electron microscope for visualization of wet samples
US4809308A (en) * 1986-02-20 1989-02-28 Irt Corporation Method and apparatus for performing automated circuit board solder quality inspections
US4730350A (en) * 1986-04-21 1988-03-08 Albert Richard D Method and apparatus for scanning X-ray tomography
US4852131A (en) * 1988-05-13 1989-07-25 Advanced Research & Applications Corporation Computed tomography inspection of electronic devices
JPH0258221A (en) * 1988-08-23 1990-02-27 Semiconductor Energy Lab Co Ltd Etching method using carbon or mask mainly comprising carbon
US4977328A (en) * 1989-03-02 1990-12-11 U.S. Philips Corporation Method of detecting a marker provided on a specimen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB868830A (en) * 1958-01-22 1961-05-25 Foerderung Forschung Gmbh Improvements in and relating to x-ray tubes and apparatus including such tubes
EP0225969A1 (en) * 1985-08-19 1987-06-24 Kabushiki Kaisha Toshiba Apparatus and method for controlling irradiation of electron beam at fixed position in electron beam tester system
WO1989004477A1 (en) * 1987-10-30 1989-05-18 Four Pi Systems Corporation Automated laminography system for inspection of electronics

Also Published As

Publication number Publication date
US5199054A (en) 1993-03-30
WO1992004620A2 (en) 1992-03-19

Similar Documents

Publication Publication Date Title
WO1992004620A3 (en) Method and apparatus for high resolution inspection of electronic items
CA1323453C (en) Automated laminography system for inspection of electronics
US5097492A (en) Automated laminography system for inspection of electronics
US5081656A (en) Automated laminography system for inspection of electronics
US4447731A (en) Exterior view examination apparatus
US7518383B2 (en) Inspection apparatus and inspection method using electron beam
CN105628724A (en) X-ray fluorescence analyzer and X-ray fluorescence analyzing method
US4656663A (en) Method of film inspection with a microscopical image analyzer
JP3836735B2 (en) Circuit pattern inspection device
US3795808A (en) Electron microscopes
JP3751841B2 (en) Inspection apparatus using electron beam and inspection method using electron beam
Suzuki et al. X-ray sensing pickup tube
JP2775928B2 (en) Surface analyzer
EP0737858A1 (en) Method and apparatus for adjusting electron-beam device
US20240027377A1 (en) Method of examining a sample using a charged particle microscope
JPH1167138A (en) Micro-area observation device
Davies et al. End‐point detection using absorbed current, secondary electron, and secondary ion signals during milling of multilayer structures by focused ion beam
JP2023054559A (en) Image display method, analysis system and program
Waldrop et al. Auger Electron Spectroscopy in the Scanning Electron Microscope
JP2006170770A (en) Sample analyzer
KR830002115B1 (en) Sample analysis device using particle beam
JPS59153154A (en) Electron beam analytical method and apparatus
JPS627974B2 (en)
JPH1092366A (en) Scanning electron microscope
JP2002202272A (en) X-ray radioscopic inspection device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CA JP

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE

AK Designated states

Kind code of ref document: A3

Designated state(s): CA JP

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE

NENP Non-entry into the national phase

Ref country code: CA