WO1993026049A1 - High responsivity ultraviolet gallium nitride detector - Google Patents

High responsivity ultraviolet gallium nitride detector Download PDF

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Publication number
WO1993026049A1
WO1993026049A1 PCT/US1993/005448 US9305448W WO9326049A1 WO 1993026049 A1 WO1993026049 A1 WO 1993026049A1 US 9305448 W US9305448 W US 9305448W WO 9326049 A1 WO9326049 A1 WO 9326049A1
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Prior art keywords
detector
layer
gallium nitride
single crystal
ultraviolet
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PCT/US1993/005448
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French (fr)
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WO1993026049A9 (en
Inventor
James M. Van Hove
Jon N. Kuznia
Donald T. Olson
Muhammad Asif Khan
Margaret C. Blasingame
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Apa Optics, Inc.
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Priority to AU45999/93A priority Critical patent/AU4599993A/en
Publication of WO1993026049A1 publication Critical patent/WO1993026049A1/en
Publication of WO1993026049A9 publication Critical patent/WO1993026049A9/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264—Inorganic materials
    • H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L31/03046—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds including ternary or quaternary compounds, e.g. GaAlAs, InGaAs, InGaAsP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • H01L31/1852—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising a growth substrate not being an AIIIBV compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/544—Solar cells from Group III-V materials

Definitions

  • the invention generally relates to aluminum gallium nitride ultraviolet detectors. More specifically, the invention relates to ultraviolet aluminum gallium nitride detectors formed through a switched atomic layer epitaxy process.
  • gallium nitride devices disclose gallium nitride devices.
  • One device is an ultraviolet detector comprising a sapphire base, an aluminum nitride matrix matching layer, and an aluminum gallium nitride active layer.
  • MOCVD metal organic chemical vapor deposition
  • the disclosed device has a peak sensor responsivity at 365 nanometers. The device generally does not provide a broad response across the expanse of the ultraviolet range.
  • gallium nitride ultraviolet device has provided a detector having the level or range of responsivity necessary to provide sensitivity over the broad ultraviolet range while still avoiding interferences created by visible and infrared wavelengths.
  • the invention also comprises a metallizing layer which serves as an electrode deposited over the single crystal AlGaN layer.
  • a metallizing layer which serves as an electrode deposited over the single crystal AlGaN layer.
  • the sensor responsivity at 365 nanometers of the claimed detector may be 0.2 x 10 6 A/ with a bias of 5 volts when the molar concentration of Al is 0 mol-%.
  • the claimed detector has a responsivity which is nearly constant for wavelengths from 200 to 365 nanometers and it drops by three orders of magnitude by 375 nanometers (within 10 nanometers of the band edge) .
  • FIGURES 1A and IB are a schematic depiction of two embodiments of the ultraviolet detector of the invention.
  • FIGURES 2A and 2B are graphical depictions of the optical transmission and photoluminescence of the detector of the invention compared to prior art detectors.
  • FIGURE 3 is a top plan view of the detector shown in Figs. 1A and IB.
  • FIGURE 4A is a graphical depiction of the spectral responsivity of the ultraviolet detector of the invention.
  • FIGURE 4B is a graphical depiction of the variance in band edge with variation in Al content in the Al-.GAi_.-N active layer.
  • FIGURE 4C is a graphical depiction of the optical transmission versus wavelength for several detectors each having a different Al molar concentration.
  • FIGURE 5 is a graphical depiction of the detector of the invention compared to conventional silicon detectors.
  • FIGURE 6 is a graphical depiction of the photoresponse time of the ultraviolet detector in accordance with the invention.
  • FIGURE 7 is a top plan view of a device comprising the detector of the invention.
  • FIGURE 8 is a perspective view of the device shown in Fig. 7.
  • the invention comprises an ultraviolet aluminum gai-feirum nitride detector.
  • the detector generally has two--layers including a substrate layer and an aluminum gallium nitride layer.
  • the detector may also comprise a crystal match or matrix layer between the substrate and the active aluminum gallium nitride layer.
  • the AlGaN Ultraviolet Detector Referring to the drawings wherein like numerals represent like parts throughout several views, there is generally shown a AlGaN ultraviolet (UV) detector in
  • the UV detector of the invention can be seen in Fig. 1A.
  • the detector comprises a single crystal substrate 1, a matrix layer 3, the single crystal AlGaN active layer 5, and a metallization layer 7 which serves as an electrode for the device.
  • the device comprises a preliminary layer of AlGaN 4 deposited over the matrix layer 3 to function as a seed for the AlGaN active layer 5.
  • the first layer of the ultraviolet detector is a substrate 1. The substrate functions as a seed for the growth of further layers of the detector as well as a physical support for the detector.
  • compositions including gallium arsenide, silicon, silicon carbide, zinc oxide, magnesium oxide, germanium, and spinnel quartz among others.
  • sapphire and most specifically, single crystal basal plane sapphire is used as the substrate. Basal plane sapphire is commercially available in single crystal form and..serves well as a template for the growth of further layers of the detector. Further, basal plane sapjphire is generally transparent to ultraviolet energy. Basal plane sapphire is commercially available through any -number of channels. zz l ⁇ i order to ease the lattice mismatch between single crystal aluminum gallium nitride and the substrate and increase device quality, the ultraviolet detector of the invention may also comprise an intermediate matrix layer 3. Generally, any number of chemical compositions may be used for such a layer consistent with the function of this layer such as gallium nitride, boron nitride, zinc oxide, magnesium oxide and aluminum nitride, or mixtures thereof among others.
  • a preliminary layer of aluminum gallium nitride may then be deposited over the substrate 1 and, if present, matrix layer 3.
  • This aluminum gallium nitride layer 4 (Fig. IB) serves as a substrate for the active single crystal aluminum gallium nitride layer 5 which is later deposited by atomic layer epitaxy.
  • the aluminum gallium nitride 4 layer may range in thickness generally from about 100 A to 1000 A, preferably from about 400 A to about 600 A, and most preferably is about 500 A thick.
  • the ultraviolet detector of the invention also comprises an aluminum gallium nitride active layer 5.
  • the function of this aluminum gallium nitride active layer is to absorb and collect ultraviolet signals at a high responsivity rate.
  • the aluminum gallium nitride layer is single crystal and from about 4000 A to about 20,000 A, preferably from about 4000 A to 10,000 A, and most preferably about 5000 A. If the single crystal active aluminum gallium nitride layer is too thin, it will not absorb all the ultraviolet signals incident on the detector. Further, if the aluminum gallium nitride single crystal active layer is too thick, the detector will be unable to collect enough ultraviolet energy to drive or create a response.
  • the invention comprises a 0.8 micron thick active layer of GaN deposited over a 0.1 micron thick AlN matrix layer 3.
  • the epilayer structure Prior to detector fabrication, the epilayer structure was characterized for it's optical transmission and photoluminescence.
  • the UV detector of the invention may also comprise an electrode system 7 (Figs. 1A, IB and 3).
  • the electrode system serves to sense changes in the AlGaN active layer 5 created by the UV energy, incident to the detector, and transmit these changes to a sensing circuit.
  • any number of materials may be used consistent with these functions.
  • One means of defining an electrode system is through conventional metallization and photolithography processes. Metals used for the electrode include aluminum, tungsten, silver, copper, gold, titanium and any number of other conductive metals.
  • One preferred combination comprises an initial layer of titanium followed by gold patterned as interdigitated fingers (Fig. 3) .
  • the interdigitated electrodes may be formed on the epilayers, Fig. 3.
  • a liftoff process may be used to form 5000 A thick gold electrodes.
  • the fabricated detector structure may occupy an area of 0.75 mm 2 and the interdigitated electrodes may be formed 3 microns wide, 1 mm long and with 10 micron spacing.
  • spectral responsivity data for a single (GaN) detector element may be seen in Fig. 4.
  • the spectral responsivity is beyond the signal detection limit for wavelengths in excess of 375 nanometers. It reaches its peak value at 360 nanometers (band gap energy as seen in Fig. 2A) and then remains nearly constant down to 200 nanometers.
  • the band edge may be varied across the UV range. As seen in Fig. 4B, an aluminum concentration of 0 mole-% provides a band edge of about 365 nm. Meanwhile, an aluminum concentration of 1.0 mole-% provides a band edge of 200 nm.
  • Figure 4C illustrates the ability of AlGaN active layer 5 devices to provide varying band edge positioning across the UV spectrum.
  • a sapphire substrate 1 may be placed on a SiC coated graphite susceptor and heated with rf induction.
  • the matrix layer 3 may then be grown by MOCVD or ALE.
  • the matrix layer 3 assists in providing the sharp band gap cutoff by reducing the crystal mismatch with the active layer 5. It is believed that mismatch leads to crystal structure defects. These crystal structure defects may be visualized or perceived as holes, voids, or openings between the various crystals. The creation of openings between the matrix layer 3 and the active layer 5 results in a flow of electrons to the active layer 5 making this layer conductive. Conductivity in the active layer 5 leads to a greater volume of interference and noise and a rougher band gap cutoff.
  • the matrix layer comprises aluminum nitride grown in two stages. The first stage is the growth of an amorphous layer and the second stage is the growth of a single crystal layer. Deposition of the subsequent active layer 5 results in a crystallization of the matrix layer 3, transforming the matrix layer to single crystal. Generally, this matrix layer may be grown to a thickness ranging from about 800 A to 1700 A .
  • the matrix layer 3 is deposited in a two part deposition process.
  • an aluminum nitride layer 3A (See Fig. 1A) ranging in thickness from 300 A to 700 A, and preferably 500 A is deposited at 600°C in amorphous form by MOCVD .
  • the second phase of the matrix layer, 3B (See also Fig. 1A) is generally deposited in single crystal form a thickness ranging from 500 A to about 1000 A, and preferably about 700 A. This deposition is completed at temperatures ranging from 950°C to about 1080°C and preferably about 1040°C. by MOCVD.
  • a further seed layer 4 of aluminum gallium nitride may be grown.
  • this gallium nitride layer may be deposited through standard MOCVD processes at 76 torr pressure and at temperatures ranging from about 950°C to 1080°C and preferably about 1040°C.
  • the active aluminum gallium nitride layer 5 is grown in single crystal through atomic layer epitaxy.
  • the growth temperature generally ranges from about 800°C and 1000°C and preferably from about 850 to 950°C with a growth time which may span up to or over two hours.
  • the growth temperature may be monitored by a thermocouple inserted in the susceptor.
  • Source gases for gallium include any number of common gallium sources such as trimethyl or triethylgallium. Other source gases include triethylaluminum and for nitrogen, any number of nitrogenous sources including ammonia.
  • Carrier gases may comprise any number of inert gases such as argon and hydrogen. Hydrogen is preferred as it is readily commercially available and generally clean. Growth pressures may range from about 50 torr to 200 torr, and preferably 100 torr.
  • the deposition system is capable of switched operation under computer control.
  • the precursors may be introduced in the growth chamber in a cyclic fashion with an adjustable sweepout time between the precursor pulses.
  • the system preferably also allows for a simultaneous introduction of the precursors.
  • One means of using atomic layer epitaxy is to grow the aluminum gallium nitride through a series of pulses or using a switched deposition process. In each of the pulses, lasting approximately one second, a different gas is flowed into the chamber. For example, in the first pulse, triethylgallium may be flowed into the chamber. In the second pulse, only the carrier gas, for example hydrogen, is flowed into the chamber.
  • the nitrogenous source for example ammonia
  • the nitrogenous source may be flowed into the chamber.
  • an aluminum species may be flowed into the chamber.
  • the carrier gas is then used to evacuate the chamber.
  • the nitrogenous source is then introduced into the chamber.
  • the chamber is then evacuated once again.
  • Films of varying aluminum concentration may be deposited by varying the order and number of pulses for each respective gas species.
  • the sequence of steps may be continued over several thousand times resulting in a atomic layer epitaxy process which takes over two hours. As one of skill in the art would expect, variance or extension of this growth period may increase the chemical nature and thickness of the active aluminum gallium nitride single crystal layer.
  • the temperature within the reaction chamber is lowered to range from about 300°C to 400°C and held at that temperature for five minutes in a nitrogen flow.
  • Detector fabrication is completed by covering the active aluminum gallium nitride layer with a photolithographic layer and developing that layer to a pattern such as that shown in Fig. 3.
  • the photolithographic coated upper surface of the active single crystal aluminum gallium nitride layer is then metallized and then the developed photoresist is stripped from the upper surface of the aluminum gallium nitride layer 5, also stripping certain aspects of metallization over the photoresist.
  • the resulting pattern (Fig. 3) acts as a receptor 7 for the ultraviolet detector.
  • One metallization system Applicants have found preferable includes 500 A of titanium followed by the deposition of 1500 A of gold. The detector may then be tested by means known to those of skill in the art.
  • Working Example 2 A UV detector comprising an ALE GaN layer was grown at 150 torr. The films morphology was very grainy.
  • the sample may well be made up of small crystallites of high quality GaN.
  • a diamond saw was used to cleave the wafer into individual dies.
  • the detectivity (amps/watt) was measured for the detector as a function of field strength over the spectral range of 320-400 nm using a D.C. power supply of 0-200 volts, an ammeter, and a UV radiation source incident to the detector.
  • Example 3 The detectors 10 of Example 1 were repackaged and detectivity was remeasured.
  • a 4 pin canister 20 (Figs. 7 and 8) was used to mount the detector 10. The canister top was filed out to allow light input.
  • the dual detector was cut from the die of Working Example 1 by scribing the back with a carbide steel scribe and placing the cut between two protector slides and lightly tapping. The metal fingers were protected during scribing by a coating of photoresist baked on for 45 minutes at 95°C.
  • the canister 20 was metallic, a piece of glass was bonded onto the pedestal with UV epoxy. The detector was then bonded to the glass with UV epoxy. Wires were attached to the connector wires by attachment to intermediate pads positioned on the glass. A wire was bonded to the pad and ultimately connected to the bonding post. Finally the cap was sealed on with epoxy.
  • the time response of the UV detector of Example 1 was then measured by pulsing the detector with a nitrogen laser and triggering the scope with the silicon photodiode. The photo-time response appeared to comprise two time constants, one at 1.0 ms and the other on the order of seconds. The laser was adjusted such that at 10 Hz a 10V DC bias existed on the 1 Mega ohm resistor. The rest of the voltage was an AC signal with about a 10 ms time constant.
  • the UV response of the detectors was then measured using a black light excitation source.
  • Working Example 5 Using the detector of Working Example 4, detector response was measured using a silicon diode and a spectrometer.
  • the detector of Working Example 4 has a photoresponse similar to that of the detector of Working Example 1.
  • the response dropped 4 orders of magnitude between 365 nm and 370 nm.
  • Working Example 6 The peak responsivity of the invention was compared to that from a calibrated silicon detector at a wavelength of 360 nanometers.
  • the silicon detector had an area of 0.95 cm 2 as compared to 0.37 mm 2 as the exposed area for the GaN detector.
  • Fig. 5 shows the plot of the photosignal measured on the two detectors for the same incident power.
  • the GaN detector had a bias of 5 Volts and a 10 Hz signal was used for each case. As seen the responsivity of the GaN detector is fairly linear over a large dynamic range. Scaling the photocurrent to account for the detector areas, we estimate the peak responsivity of the GaN detector to be around 0.2 x 10 6 A/watt. Assuming a quantum efficiency of 0.8 (same as the Si detector) this translates to a gain of around 2 x
  • Fig. 6 is a plot of the signal which shows the response time to be 1 ms.

Abstract

The invention is an Alx?Ga1-x?N ultraviolet detector with extremely high responsivity at over 200 to 365 nanometers and a very sharp long wavelength cutoff. The active layer for the sensors is a single crystal Alx?Ga1-x?N preferably deposited over a basal plane sapphire substrate using a switched atomic layer epitaxy process.

Description

HIGH RESPONSIVITY ULTRAVIOLET GALLIUM NITRIDE DETECTOR
Field of the Invention
The invention generally relates to aluminum gallium nitride ultraviolet detectors. More specifically, the invention relates to ultraviolet aluminum gallium nitride detectors formed through a switched atomic layer epitaxy process.
Background of the Invention AlxGa1_-.N is a compound semiconductor that is ideally suited for devices in the visible and the ultraviolet parts of the spectrum. It's band gap is tunable from 365 nanometers (at x = 0) to 200 nanometers (at x = 1) and is direct over the entire alloy composition. This makes the material ideally suited for intrinsic ultraviolet sensors with responsivities sharply peaked at a wavelength corresponding to the band edge. Such sensors have potential commercial applications in the areas of flame safeguard and fire control. Ultraviolet detectors and, specifically, detectors of gallium nitride are well known in the art. For example. Khan et al, U.S. Patent Nos. 4,614,961 and 4,616,248, disclose gallium nitride devices. One device is an ultraviolet detector comprising a sapphire base, an aluminum nitride matrix matching layer, and an aluminum gallium nitride active layer. However, made by conventional metal organic chemical vapor deposition (MOCVD), the disclosed device has a peak sensor responsivity at 365 nanometers. The device generally does not provide a broad response across the expanse of the ultraviolet range.
Others have deposited gallium nitride layers over basal plane sapphire substrates using metal organic chemical vapor deposition; see Khan et al, Applied Physics Letters, 58, 526 (1991); Amano et al, Japanese Journal of Applied Physics, 29, L205 (1990); and Nakamura et al, Applied Physics Letters, 58, 2021 (1991).
The deposition of various aluminum gallium nitride layers in various temperature environments has also been well documented, see Khan et al, Applied Physics Letters, 58, 1515 (1991); Khan et al Applied Physics Letters, 58, 2408 (1991); Khan et al, Applied Physics Letters, 60 (11), 1366 (1992); and Khan et al, Applied Physics Letters, 56, 1257 (1990).
However, no prior art gallium nitride ultraviolet device has provided a detector having the level or range of responsivity necessary to provide sensitivity over the broad ultraviolet range while still avoiding interferences created by visible and infrared wavelengths.
Summary of the Invention In accordance with a first aspect of the invention, there is provided an ultraviolet detector having a single crystal substrate and a single crystal active layer of aluminum gallium nitride (Al-.Gai_.- wherein x = 0 to 1) wherein the ultraviolet detector has a peak sensor responsivity at 365 nanometers which is 0.2 x 106 amps per watt (when x = 0) and a substantially constant responsivity for ultraviolet wavelengths ranging from about 200 to 365 nanometers.
In accordance with a second aspect of the invention, there is provided an ultraviolet detector having a single crystal substrate, a matrix layer deposited over the single crystal substrate, and an active layer deposited over the matrix layer, said active layer comprising single crystal aluminum gallium nitride (Al.-Gai_.-N wherein x = 0 to 1) wherein the single crystal aluminum gallium nitride active layer is deposited through atomic layer epitaxy.
Preferably, the invention also comprises a metallizing layer which serves as an electrode deposited over the single crystal AlGaN layer. Using an interdigitated electrode pattern with a 10 micron spacing deposited over the AlGaN, the sensor responsivity at 365 nanometers of the claimed detector may be 0.2 x 106 A/ with a bias of 5 volts when the molar concentration of Al is 0 mol-%. The claimed detector has a responsivity which is nearly constant for wavelengths from 200 to 365 nanometers and it drops by three orders of magnitude by 375 nanometers (within 10 nanometers of the band edge) .
Brief Description of the Drawings FIGURES 1A and IB are a schematic depiction of two embodiments of the ultraviolet detector of the invention.
FIGURES 2A and 2B are graphical depictions of the optical transmission and photoluminescence of the detector of the invention compared to prior art detectors. FIGURE 3 is a top plan view of the detector shown in Figs. 1A and IB.
FIGURE 4A is a graphical depiction of the spectral responsivity of the ultraviolet detector of the invention. FIGURE 4B is a graphical depiction of the variance in band edge with variation in Al content in the Al-.GAi_.-N active layer.
FIGURE 4C is a graphical depiction of the optical transmission versus wavelength for several detectors each having a different Al molar concentration.
FIGURE 5 is a graphical depiction of the detector of the invention compared to conventional silicon detectors.
FIGURE 6 is a graphical depiction of the photoresponse time of the ultraviolet detector in accordance with the invention.
FIGURE 7 is a top plan view of a device comprising the detector of the invention.
FIGURE 8 is a perspective view of the device shown in Fig. 7.
Detailed Description of the Invention The invention comprises an ultraviolet aluminum gai-feirum nitride detector. The detector generally has two--layers including a substrate layer and an aluminum gallium nitride layer. Preferably, the detector may also comprise a crystal match or matrix layer between the substrate and the active aluminum gallium nitride layer.
The AlGaN Ultraviolet Detector Referring to the drawings wherein like numerals represent like parts throughout several views, there is generally shown a AlGaN ultraviolet (UV) detector in
Figs. 1A and IB. In its broadest scope the UV detector of the invention can be seen in Fig. 1A. In this instance the detector comprises a single crystal substrate 1, a matrix layer 3, the single crystal AlGaN active layer 5, and a metallization layer 7 which serves as an electrode for the device. In a more preferred aspect (Fig. IB), the device comprises a preliminary layer of AlGaN 4 deposited over the matrix layer 3 to function as a seed for the AlGaN active layer 5. Generally, the first layer of the ultraviolet detector is a substrate 1. The substrate functions as a seed for the growth of further layers of the detector as well as a physical support for the detector. Any number of compositions may be used including gallium arsenide, silicon, silicon carbide, zinc oxide, magnesium oxide, germanium, and spinnel quartz among others. Preferably, sapphire, and most specifically, single crystal basal plane sapphire is used as the substrate. Basal plane sapphire is commercially available in single crystal form and..serves well as a template for the growth of further layers of the detector. Further, basal plane sapjphire is generally transparent to ultraviolet energy. Basal plane sapphire is commercially available through any -number of channels. zz lτi order to ease the lattice mismatch between single crystal aluminum gallium nitride and the substrate and increase device quality, the ultraviolet detector of the invention may also comprise an intermediate matrix layer 3. Generally, any number of chemical compositions may be used for such a layer consistent with the function of this layer such as gallium nitride, boron nitride, zinc oxide, magnesium oxide and aluminum nitride, or mixtures thereof among others.
A preliminary layer of aluminum gallium nitride may then be deposited over the substrate 1 and, if present, matrix layer 3. This aluminum gallium nitride layer 4 (Fig. IB) serves as a substrate for the active single crystal aluminum gallium nitride layer 5 which is later deposited by atomic layer epitaxy. Generally, the aluminum gallium nitride 4 layer may range in thickness generally from about 100 A to 1000 A, preferably from about 400 A to about 600 A, and most preferably is about 500 A thick.
The ultraviolet detector of the invention also comprises an aluminum gallium nitride active layer 5. The function of this aluminum gallium nitride active layer is to absorb and collect ultraviolet signals at a high responsivity rate. Preferably, the aluminum gallium nitride layer is single crystal and from about 4000 A to about 20,000 A, preferably from about 4000 A to 10,000 A, and most preferably about 5000 A. If the single crystal active aluminum gallium nitride layer is too thin, it will not absorb all the ultraviolet signals incident on the detector. Further, if the aluminum gallium nitride single crystal active layer is too thick, the detector will be unable to collect enough ultraviolet energy to drive or create a response.
In one preferred aspect, the invention comprises a 0.8 micron thick active layer of GaN deposited over a 0.1 micron thick AlN matrix layer 3. Prior to detector fabrication, the epilayer structure was characterized for it's optical transmission and photoluminescence.
In Fig. 2A, the optical transmissivity of the atomic layer epitaxy (ALE) material is comparable to MOCVD material. In Fig. 2B, the photoluminescence versus wavelength spectrum from atomic layer epitaxy GaN layer shows excellent responsivity by the peak with narrow peak half-width. The UV detector of the invention may also comprise an electrode system 7 (Figs. 1A, IB and 3). The electrode system serves to sense changes in the AlGaN active layer 5 created by the UV energy, incident to the detector, and transmit these changes to a sensing circuit. Generally, any number of materials may be used consistent with these functions. One means of defining an electrode system is through conventional metallization and photolithography processes. Metals used for the electrode include aluminum, tungsten, silver, copper, gold, titanium and any number of other conductive metals. One preferred combination comprises an initial layer of titanium followed by gold patterned as interdigitated fingers (Fig. 3) .
Using photolithography procedures, the interdigitated electrodes may be formed on the epilayers, Fig. 3. Generally, a liftoff process may be used to form 5000 A thick gold electrodes. Preferably, the fabricated detector structure may occupy an area of 0.75 mm2 and the interdigitated electrodes may be formed 3 microns wide, 1 mm long and with 10 micron spacing. By measurement of the current voltage characteristics of the device with the intensity of the source normalized to allow for the varying emission intensity at different wavelengths, spectral responsivity data for a single (GaN) detector element may be seen in Fig. 4. As seen, the spectral responsivity is beyond the signal detection limit for wavelengths in excess of 375 nanometers. It reaches its peak value at 360 nanometers (band gap energy as seen in Fig. 2A) and then remains nearly constant down to 200 nanometers.
By varying aluminum concentration in the active layer 5 (x can range from 0 to 1), the band edge may be varied across the UV range. As seen in Fig. 4B, an aluminum concentration of 0 mole-% provides a band edge of about 365 nm. Meanwhile, an aluminum concentration of 1.0 mole-% provides a band edge of 200 nm.
Figure 4C illustrates the ability of AlGaN active layer 5 devices to provide varying band edge positioning across the UV spectrum.
Detector Fabrication Process In fabricating the detector of the invention, a sapphire substrate 1 may be placed on a SiC coated graphite susceptor and heated with rf induction. The matrix layer 3 may then be grown by MOCVD or ALE.
The matrix layer 3 assists in providing the sharp band gap cutoff by reducing the crystal mismatch with the active layer 5. It is believed that mismatch leads to crystal structure defects. These crystal structure defects may be visualized or perceived as holes, voids, or openings between the various crystals. The creation of openings between the matrix layer 3 and the active layer 5 results in a flow of electrons to the active layer 5 making this layer conductive. Conductivity in the active layer 5 leads to a greater volume of interference and noise and a rougher band gap cutoff. Preferably, the matrix layer comprises aluminum nitride grown in two stages. The first stage is the growth of an amorphous layer and the second stage is the growth of a single crystal layer. Deposition of the subsequent active layer 5 results in a crystallization of the matrix layer 3, transforming the matrix layer to single crystal. Generally, this matrix layer may be grown to a thickness ranging from about 800 A to 1700 A .
Preferably, the matrix layer 3 is deposited in a two part deposition process. In the first step of the deposition process an aluminum nitride layer 3A (See Fig. 1A) ranging in thickness from 300 A to 700 A, and preferably 500 A is deposited at 600°C in amorphous form by MOCVD .
The second phase of the matrix layer, 3B (See also Fig. 1A) is generally deposited in single crystal form a thickness ranging from 500 A to about 1000 A, and preferably about 700 A. This deposition is completed at temperatures ranging from 950°C to about 1080°C and preferably about 1040°C. by MOCVD.
Once the AlN layer is grown, a further seed layer 4 of aluminum gallium nitride may be grown. In practice, this gallium nitride layer may be deposited through standard MOCVD processes at 76 torr pressure and at temperatures ranging from about 950°C to 1080°C and preferably about 1040°C.
Generally, the active aluminum gallium nitride layer 5 is grown in single crystal through atomic layer epitaxy. The growth temperature generally ranges from about 800°C and 1000°C and preferably from about 850 to 950°C with a growth time which may span up to or over two hours. The growth temperature may be monitored by a thermocouple inserted in the susceptor.
Source gases for gallium include any number of common gallium sources such as trimethyl or triethylgallium. Other source gases include triethylaluminum and for nitrogen, any number of nitrogenous sources including ammonia. Carrier gases may comprise any number of inert gases such as argon and hydrogen. Hydrogen is preferred as it is readily commercially available and generally clean. Growth pressures may range from about 50 torr to 200 torr, and preferably 100 torr.
Preferably, the deposition system is capable of switched operation under computer control. In this mode, the precursors may be introduced in the growth chamber in a cyclic fashion with an adjustable sweepout time between the precursor pulses. The system preferably also allows for a simultaneous introduction of the precursors. One means of using atomic layer epitaxy is to grow the aluminum gallium nitride through a series of pulses or using a switched deposition process. In each of the pulses, lasting approximately one second, a different gas is flowed into the chamber. For example, in the first pulse, triethylgallium may be flowed into the chamber. In the second pulse, only the carrier gas, for example hydrogen, is flowed into the chamber. In the third pulse, the nitrogenous source, for example ammonia, may be flowed into the chamber. In the fourth pulse, again only an evacuating flow of hydrogen is flowed into the chamber. In the fifth pulse, an aluminum species may be flowed into the chamber. In the sixth pulse, the carrier gas is then used to evacuate the chamber. In the seventh pulse, the nitrogenous source is then introduced into the chamber. In the eighth pulse, the chamber is then evacuated once again. Films of varying aluminum concentration may be deposited by varying the order and number of pulses for each respective gas species. Preferably, the sequence of steps may be continued over several thousand times resulting in a atomic layer epitaxy process which takes over two hours. As one of skill in the art would expect, variance or extension of this growth period may increase the chemical nature and thickness of the active aluminum gallium nitride single crystal layer.
In completion of the atomic layer epitaxy process, the temperature within the reaction chamber is lowered to range from about 300°C to 400°C and held at that temperature for five minutes in a nitrogen flow.
Detector fabrication is completed by covering the active aluminum gallium nitride layer with a photolithographic layer and developing that layer to a pattern such as that shown in Fig. 3. The photolithographic coated upper surface of the active single crystal aluminum gallium nitride layer is then metallized and then the developed photoresist is stripped from the upper surface of the aluminum gallium nitride layer 5, also stripping certain aspects of metallization over the photoresist. The resulting pattern (Fig. 3) acts as a receptor 7 for the ultraviolet detector. One metallization system Applicants have found preferable includes 500 A of titanium followed by the deposition of 1500 A of gold. The detector may then be tested by means known to those of skill in the art. Working Examples
Applicants now provide working examples which although useful in understanding and demonstrating the device of the invention, should not be construed as limiting of the invention. Working Example 1
An investigation of photoresponse was undertaken for GaN detectors having the 10μm wide x 20 μm spaced interdigitated finger mask. Interdigitated fingers with 500 A of titanium and a 2000 A of gold were deposited on the GaN. The detectors produced excellent results. The fingers were brought to 200 V DC with little leakage current. The detector had an extremely sharp response starting near the band edge of 365 nm. Dies located in the center of the detector are more conductive. However they still have excellent photoresponse. The sample was all sensitive to a cigarette lighter and propane torch at 3 ft. The bias conditions were 200 V DC.
Working Example 2 A UV detector comprising an ALE GaN layer was grown at 150 torr. The films morphology was very grainy.
However the film had excellent optical properties. The sample may well be made up of small crystallites of high quality GaN.
As a means of cutting the wafer, a diamond saw was used to cleave the wafer into individual dies.
The detectivity (amps/watt) was measured for the detector as a function of field strength over the spectral range of 320-400 nm using a D.C. power supply of 0-200 volts, an ammeter, and a UV radiation source incident to the detector.
An ammeter was used to measure the detector current at a given wavelength over the range of 320-400 nm. The detectivity of the detector was then determined by dividing the measured current by the total wattage. A small correction was performed since all measured light did not hit the detector. The area of the detector was known and the area of the input light was known and ratioed out. Analysis showed that there was no difference between peak dropoff as a function of voltage.
Four trials were run in each instance detectivity dropped two to three orders of magnitude around 370 nm.
Working Example 3 The detectors 10 of Example 1 were repackaged and detectivity was remeasured. A 4 pin canister 20 (Figs. 7 and 8) was used to mount the detector 10. The canister top was filed out to allow light input. The dual detector was cut from the die of Working Example 1 by scribing the back with a carbide steel scribe and placing the cut between two protector slides and lightly tapping. The metal fingers were protected during scribing by a coating of photoresist baked on for 45 minutes at 95°C.
Since the canister 20 was metallic, a piece of glass was bonded onto the pedestal with UV epoxy. The detector was then bonded to the glass with UV epoxy. Wires were attached to the connector wires by attachment to intermediate pads positioned on the glass. A wire was bonded to the pad and ultimately connected to the bonding post. Finally the cap was sealed on with epoxy. The time response of the UV detector of Example 1 was then measured by pulsing the detector with a nitrogen laser and triggering the scope with the silicon photodiode. The photo-time response appeared to comprise two time constants, one at 1.0 ms and the other on the order of seconds. The laser was adjusted such that at 10 Hz a 10V DC bias existed on the 1 Mega ohm resistor. The rest of the voltage was an AC signal with about a 10 ms time constant.
Working Example 4
Another wafer of AlGaN detectors was grown using the method of Example 1. Four samples were cleaved with a
5:5:5:1 minute hot rinse with trichloroethane, acetone, methanol, and propanol. The samples were air dried following the propanol rinse. Approximately 500 A of titanium was then deposited followed by a 2000 A of Au.
The UV response of the detectors was then measured using a black light excitation source.
SAMPLE DIE V(Bias) I(Dark) I(Photo) Response Am s Am s eco ds
Figure imgf000014_0001
*Less than < 1 second.
Working Example 5 Using the detector of Working Example 4, detector response was measured using a silicon diode and a spectrometer. The detector of Working Example 4 has a photoresponse similar to that of the detector of Working Example 1. The response dropped 4 orders of magnitude between 365 nm and 370 nm. Working Example 6 The peak responsivity of the invention was compared to that from a calibrated silicon detector at a wavelength of 360 nanometers. The silicon detector had an area of 0.95 cm2 as compared to 0.37 mm2 as the exposed area for the GaN detector. Fig. 5 shows the plot of the photosignal measured on the two detectors for the same incident power. Note, for these measurements the GaN detector had a bias of 5 Volts and a 10 Hz signal was used for each case. As seen the responsivity of the GaN detector is fairly linear over a large dynamic range. Scaling the photocurrent to account for the detector areas, we estimate the peak responsivity of the GaN detector to be around 0.2 x 106 A/watt. Assuming a quantum efficiency of 0.8 (same as the Si detector) this translates to a gain of around 2 x
Figure imgf000015_0001
We also measured the response time of our detectors by using a pulsed UV source, Fig. 6. The time resolved photosignal was measured using an oscilloscope. Fig. 6 is a plot of the signal which shows the response time to be 1 ms.
The above discussion, examples and embodiments illustrate our current understanding of the invention. However, since many variations of the invention can be made without departing from the spirit and scope of the invention, the invention resides wholly in the claims hereafter appended.

Claims

WE CLAIM AS OUR INVENTION:
1. An ultraviolet detector comprising:
(a) a single crystal substrate; and
(b) a single crystal active layer deposited 5 over said substrate, said single crystal active
, layer comprising aluminum gallium nitride wherein said ultraviolet detector has a peak sensor responsivity at 365 nanometers which is 0.2 x 106 amps per watt and a substantially constant 0 responsivity for ultraviolet wavelengths ranging from about 200 to 365 nanometers.
2. The detector of claim 1 wherein said active layer has a thickness ranging from about 4000 A to 20,000 A. 5
3. The detector of claim 1 wherein said substrate comprises basal plane sapphire.
4. The detector of claim 1 comprising an aluminum nitride layer deposited between said substrate and said active layer. 0 5. The detector of claim 4 comprising an aluminum gallium nitride layer deposited between said aluminum nitride layer and said active layer, said aluminum gallium nitride layer deposited by metal organic chemical vapor deposition.
5
6. An ultraviolet detector comprising:
(a) a single crystal substrate;
(b) a matrix layer deposited over said single crystal substrate; and
(c) an active layer deposited over said matrix 0 layer, said active layer comprising single crystal aluminum gallium nitride wherein said single crystal aluminum gallium nitride active layer is deposited through atomic layer epitaxy.
7. The detector of claim 6 wherein said active 5 layer has a thickness ranging from about 4000 A to 20,000 A.
8. The detector of claim 6 wherein said substrate comprises basal plane sapphire.
9. The detector of claim 6 wherein said matrix layer comprises aluminum nitride deposited between said substrate and said active layer.
10. The detector of claim 6 comprising an aluminum gallium nitride layer deposited between said aluminum nitride layer and said active layer, said aluminum gallium nitride layer deposited by metal organic chemical vapor deposition.
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