WO1995023424A1 - Feldemissionskathodeneinrichtung und verfahren zur herstellung - Google Patents
Feldemissionskathodeneinrichtung und verfahren zur herstellung Download PDFInfo
- Publication number
- WO1995023424A1 WO1995023424A1 PCT/DE1995/000221 DE9500221W WO9523424A1 WO 1995023424 A1 WO1995023424 A1 WO 1995023424A1 DE 9500221 W DE9500221 W DE 9500221W WO 9523424 A1 WO9523424 A1 WO 9523424A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- field emission
- carbon nanotubes
- cathode
- field
- emission cathode
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 230000005684 electric field Effects 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 75
- 239000002041 carbon nanotube Substances 0.000 claims description 49
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 28
- 238000005520 cutting process Methods 0.000 claims description 17
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical class C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims description 4
- 239000002585 base Substances 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000002071 nanotube Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000005641 tunneling Effects 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 description 18
- 239000010439 graphite Substances 0.000 description 18
- 238000005516 engineering process Methods 0.000 description 8
- 238000004377 microelectronic Methods 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000003491 array Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000003421 catalytic decomposition reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002591 computed tomography Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000036515 potency Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/304—Field-emissive cathodes
- H01J1/3042—Field-emissive cathodes microengineered, e.g. Spindt-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30403—Field emission cathodes characterised by the emitter shape
- H01J2201/30423—Microengineered edge emitters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30446—Field emission cathodes characterised by the emitter material
- H01J2201/30453—Carbon types
- H01J2201/30469—Carbon nanotubes (CNTs)
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
- Y10S977/86—Scanning probe structure
- Y10S977/875—Scanning probe structure with tip detail
- Y10S977/876—Nanotube tip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/939—Electron emitter, e.g. spindt emitter tip coated with nanoparticles
Definitions
- the invention relates to a field emission cathode device and method for its production.
- Field emission is the term given to the emergence of electrons from the surface of an electrical conductor under the effect of an electrical field of more than 10 ⁇ V / m. In practice, such field strengths are realized on sharp edges or peaks, at which field strength increases occur, high vacuum being necessary to avoid gas discharges.
- field emission cathodes are used, for example in the field electron microscope, in electron accelerators, in high-performance circuit breakers (OS DE 39 24 745 AI) and in field emission diodes and field emitter arrays for vacuum microelectronics (for example Busta, Vacuum microelectronics 1992, Journal of Micromechanics and Microengineering, 2 (1992), pp. 53-60 and Iannazzo, A Survey of the present Status of vacuum icroelectronics, Solid State Electronics,
- a tungsten wire can be used as the field emission cathode, the tip of which becomes so fine by etching that it can no longer be seen in the light microscope. Also by etching, carbon fibers can be made sufficiently fine at the ends (Heinrich, Essig, Geiger, Appl. Phys. (1977) 12 pp. 197 - 202) to serve as a field emission cathode.
- the field emission cathodes are generally processed using the processes of microprocessing technology Etching and vapor deposition using lithographically produced masks (see Busta, Vacuum microelectronics-1992, Journal of Micromechanics and Microengineering, 2 (1992), pp. 53-60). In this way, conical tips with a radius of curvature of a few nm or wedge-shaped cutting edges with a comparable radius of curvature can be produced.
- the material for the cathode is, for example, molybdenum, lanthanum hexaboride, hafnium, diamond-like carbon (BC Djubua, NN Chubun, Emission properties of Spindt-Type Cold Cathodes with Different Emission Cone Material, IEEE Transactions on Electron Devices, 38 (1991 ) No. 10, pp. 2314-2316).
- a disadvantage of the use of tips and edges which are produced by the known methods is that the electron current decreases with the operating time, since the tips or edges are destroyed by positive ions of the inevitable residual gas in the system.
- the geometry and microstructure of the tip and thus the work function of the electrons can vary within such large limits that the electron current of several tips which are produced in one process differs by tens of potencies and this also changes with the operating time.
- Single-shell carbon nanotubes can be produced in the presence of iron or cobalt.
- Theoretical calculations show that, depending on the helicity of the hexagonal ring structure of the walls, the carbon nanotubes are electrically conductive or semiconductive (Saito, Fujita, Dresselhaus, Dresselhaus, Materials Science and Engineering, B19 (1993) 185-191).
- the carbon nanotubes can also be filled with metals, such as lead.
- Carbon nanotubes can be produced by catalytic decomposition of acetylene over iron particles at approximately 700 ° C. (Jose-Yacaman, Miki. -Yoshida, Rendon, Applied Physics Letters 62 (6) 1993, pp 657-659). In the presence of methane, argon and iron vapor, single-shell carbon nanotubes can be found in the soot deposit on the chamber walls of an arc apparatus (Iijima, Nature 363 (1993) pp. 603-605).
- carbon nanotubes By evaporating high-purity graphite with electron beams in a vacuum, carbon nanotubes can be produced on substrates made of different materials, the carbon nanotubes being oriented in the direction of the steam jet (Kosakovskaya et al., JETP Lett., 56 (1992) 26) .
- carbon nanotubes In addition to the carbon nanotubes, generally disordered carbon particles are also deposited on the substrate. These can be done, for example, by treatment in an oxidizing atmosphere at an elevated temperature of up to 500 ° C. preferably 400 ° C, are removed. In the same way, the carbon nanotubes can be opened in the oxidizing atmosphere (air, CO2 or pure oxygen) at the end caps. This offers the possibility of filling the carbon nanotubes with metals, as described by Ajayan et al. Iijima in Nature 361, p. 333 for the filling with lead is described.
- the present invention is based on the object or the technical problem of specifying a method for producing a field emission cathode device of the type mentioned at the outset which ensures technically optimal production and can be used economically.
- the field emission cathode device according to the invention is given by the features of claim 1.
- the inventive method for producing the field emission cathode device is given by the features of claim 9.
- Advantageous refinements and developments are the subject of the subclaims.
- the field emission cathode device according to the invention is accordingly characterized in that the electron-emitting part of the field emission cathode at least partially preferably has tubular cage molecules and / or connections with cage molecules and / or tubular atomic networks, optionally with end caps with diameter dimensions in the nanometer range .
- the tubular atomic networks can be provided with end caps made of carbon and / or boron and / or nitrogen atoms, which have openings.
- a particularly preferred embodiment of the field emission cathode device according to the invention is characterized in that carbon nanotubes are used as field emission cathodes.
- Carbon nanotubes can be made single-shell with a diameter of approx. 1 nanometer and lengths of over 1 micrometer or multi-shell with up to a few nanometers in diameter. Bundles of single-shell carbon nanotubes with diameters of about 5 nanometers can also be produced.
- the walls of the carbon nanotubes consist of carbon atoms in a hexagonal arrangement, while the end caps additionally contain five-ring structures.
- the individual carbon atoms of the carbon nanotubes are chemically strongly bound, as a result of which the carbon nanotubes have an extremely high mechanical strength. This also results in the high sputter resistance in comparison to the randomly grown tips, which are vapor-deposited according to the state of the art.
- the use of the carbon nanotubes known per se as a field emission cathode thus combines the advantage of an optimal geometry with the high strength, which ensures that the emission properties of such field emission cathodes do not change during operation, in contrast to the cathode tips previously used .
- the known methods for the production of such arrangements must be modified according to the invention in such a way that carbon nanotubes grow at suitably prepared locations on a substrate.
- the manufacturing process can be used to manufacture both individual field emission cathodes and field emission cathode arrays.
- FIG. 1 shows a single field emission element of a field emitter array, as can be produced according to the prior art
- Fig. 2 shows the same element after the first invention
- Process step to provide the emission tip with carbon nanotubes 3 shows the same element after the vapor deposition of carbon
- FIG 8 shows a diode for power pulse technology with a field emission cathode prepared according to the invention.
- field emission cathodes can be produced from carbon nanotubes, which serve, for example, as cathodes for diodes or switches.
- a second example explains how field emission cathodes for a field emitter array can be produced using methods of microstructure technology.
- FIG. 6 shows such a graphite plate 100 with a cutting edge 101 that is beveled on one side.
- FIG. 7 shows how ten These graphite flakes 100a to 100j are combined in a clamping device 103 to form a block such that the cutting edges 101a to 100j lie on one side of the block in one plane and an aluminum foil or egg between the graphite flakes as spacers 102a to 102j ne Teflon film.
- the clamping device consists of two brass blocks into which recesses for the ten graphite plates with the spacer foils are milled. The blocks are screwed together using two screws 104.
- the prepared block is installed in a vacuum apparatus in which a target made of high-purity graphite is vaporized with an electron beam.
- the graphite target and the block are arranged so that the carbon vapor strikes the plane with the graphite cutting edges perpendicularly. Under these conditions, carbon nanotubes grow individually and in bundles of several tubes on the cutting edges in the direction of the carbon vapor jet. After a layer thickness of a few tenths of a micrometer has been reached, the evaporation process is ended.
- the cutting edges and the bevelled surfaces of the graphite flakes are now coated with carbon nanotubes, which have an extraordinarily high mechanical strength.
- the microstructure of the surface is characterized by tubular elevations with sharp tips that have a radius of curvature of a few nanometers.
- FIG. 8 shows how a graphite plate prepared in this way can be used in a diode serving as a switching element.
- a large-area anode 112 and a cathode pin 111 are melted into an evacuated glass bulb 110.
- the graphite plate 100 is fastened on the cathode pin with the cutting edge 101 in such a way that it faces the anode at a distance of approximately 1 mm.
- a sufficiently high negative voltage is applied to the cathode, an electrical current can flow through the diode.
- several cutting edges can be used as the cathode instead of a single cutting edge.
- cutting edges are distinguished by the fact that, in contrast to cutting edges without carbon nanotubes, they have a significantly larger elevation of the electric field, which manifests itself in the fact that the field emission current is greater at the same voltage.
- the emission peaks are not destroyed by ions of the residual gas after a short operating time.
- the production process described can be easily transferred to a larger number of graphite flakes with a longer cutting edge.
- the edge angle and the spacing of the cutting edges from one another can also be varied within wide limits.
- a field emission cathode is thus presented, the electron-emitting surface and current density of which can be adapted to many applications, for example in power pulse technology.
- an array of field emitter cathodes and gate electrodes made of molybdenum is produced on a doped silicon substrate using the methods of silicon process technology, as described, for example, in the article Spindt et al. , J. Appl. Physics 47 (1976), p. 5248ff is described (see also Busta loc. Cit. And Iannazzo loc. Cit.). 1 shows a field emitter cathode with a gate electrode.
- 10 denotes the electrically conductive, n-doped silicon substrate
- 11 denotes an approximately 2 ⁇ m thick vapor-deposited insulating layer made of SiO 2
- 12 the approximately 0.5 ⁇ m thick vapor-deposited molybdenum gate electrode
- 13 is the tip-shaped one Molybdenum field emission cathode.
- the gate openings 14 of the molybdenum layer are advantageously chosen to be between 0.4 and 0.8 ⁇ m; this is in the cited manufacturing process Ren achieved that the cathode cone tips are about 0.5 microns below the gate electrodes.
- a sacrificial sizing made of aluminum is applied to the field emitter array, which already corresponds to the state of the art in this form, in that the substrate is rotated perpendicular to the surface and is vaporized with aluminum while grazing.
- This type of vapor deposition prevents the aluminum from being deposited in the cathode openings.
- 2 shows a field emitter element after this process step; the aluminum sacrificial layer is designated 20.
- a graphite target which is arranged above the field emitter array, is evaporated by an electron beam and the carbon is deposited on the field emitter array. A part of the carbon atom beam penetrates through the gate openings and is deposited on the cathode tips.
- tubular parallel graphite fibers form in the direction of the incident atomic beam. An improvement in the growth process is achieved if a voltage U G of the order of 50 V is seen between the cathode and gate layers during this process step.
- the high field strength at the fiber tip obviously causes the fiber ends to remain open and the growth of the fibers to be improved (Smalley, loc. Cit. P. 4).
- 3 shows a field emitter element after this process step, 30 being the deposited carbon layer on the gate electrode and 31 one or more carbon nanotubes on the molybdenum tip.
- the voltage source for generating the field strength at the cathode tip is also shown schematically.
- the growth of the carbon nanotubes can be controlled via the emission current Ic. The longer the grown carbon nanotubes, the stronger the emission current.
- the process must be stopped in good time when the carbon nanotubes have reached a few tenths of a ⁇ m length.
- the gate voltage U G is advantageously modulated slightly.
- the quotient dIc / dU G is called differential slope and can serve as a measure of the quality of the field emitter array.
- the carbon layer with the aluminum sacrificial layer is etched away, so that the field emitter element looks as shown in FIG. 4 after this step.
- the cathodes can also be manufactured in such a way that only one row is electrically coupled to one another.
- the gate electrodes can be manufactured in this way that they are also only electrically coupled in one row, but perpendicular to the direction of the cathodes connected in series. This gives the possibility of individually controlling each cathode.
- This type of circuit is previously known and is used, for example, for the screen with digitally controllable pixels from LETI (described in Busta op. Cit. Pp. 69-70). This circuit for three rows of cathodes and three rows of gates is shown schematically in FIG. 5 in plan view.
- the gate electrodes Gl, G2 and G3 are as well the cathodes are applied in strips, but perpendicular to the direction of the cathode tracks.
- the further process steps correspond to the steps used for producing the field emitter cathodes which cannot be controlled individually.
- the middle electrode of the last column in FIG. 5 can now be controlled, for example, by applying a negative voltage to the cathode strips K2 and a positive voltage to the gate strips G3; a field emission current then flows from this electrode, which can be measured in the cathode or gate circuit or can be detected with a suction anode (not shown here).
- this arrangement of the cathode strips and gate strips can be used to specifically control the production process of each individual cathode. It is then possible to measure the emission current from each field emitter tip during the manufacturing process and not only the total value of the entire field emitter array. By switching off the voltage at a field emission cathode, the formation of an end cap with five-ring structures is promoted, so that no further growth takes place.
- the formation process takes place at elevated temperatures of 100 to 700 ° C (degrees Celsius), preferably 300 - 400 ° C.
- the advantage of the slim, cylindrical shape of the carbon nanotubes can also be dispensed with and only the advantage of the high mechanical stability of cage molecules, ie resistance to the bombardment of the cathode by positive residual gas ions, can be exploited .
- the cathodes produced in a conventional manner - by vacuum deposition using the methods of microstructure technology or by etching - are coated with electrically conductive cage molecules.
- the cage molecules can be fullerenes, heterofullerenes or their derivatives, in particular also endohedral and exohedral compounds, for example of the type M3Cg Q or M3C7 Q , where M is a metal, preferably the alkali metals potassium or sodium.
- the cage molecules may also be in crystalline form, for example, be brought Cgg als ⁇ i n the form of fullerite, on the cathode.
- the field emission cathodes whose resistance and emission properties have been improved by coating with carbon nanotubes or also with fullerenes and their derivatives in molecular or crystalline form, can be used wherever thermal cathodes have previously been used in vacuo , and in all applications of vacuum microelectronics. Typical fields of application are listed below, the list not being exhaustive and the person skilled in the art can easily transfer the field emission cathode according to the invention to similar applications.
- Single emitter tips, emitter edges or emitter arrays can be used as an electron source for X-ray tubes, X-ray tubes with flat, controllable cathodes, for example for computer tomography, electron beam lithography, miniature electron microscope, power switch tubes, diode or triode, logic switching element, screen.
- Field emission cathodes can be used in miniaturized electronic components, such as high-frequency diodes, high-frequency triodes, diodes and triodes in combination with semiconductor components, temperature-resistant diodes and triodes in automotive engines, temperature-resistant logic components, electronic components with diode and triode functions, all of which have particular strength against electromagnetic interference radiation and ionizing radiation, pressure sensors in which the distance between the cathode and gate is influenced by the pressure, microwave generators and amplifiers.
- Field emission cathodes can preferably be used as an array as large-area electron sources of high current density, controllable electron sources for flat screens of high luminance in a single or multi-color design.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95910405A EP0801805B1 (de) | 1994-02-23 | 1995-02-22 | Feldemissionskathodeneinrichtung und verfahren zur herstellung |
US08/702,684 US5773921A (en) | 1994-02-23 | 1995-02-22 | Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge |
US09/504,635 USRE38223E1 (en) | 1994-02-23 | 1995-02-22 | Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge |
US10/408,871 USRE38561E1 (en) | 1995-02-22 | 1995-02-22 | Field emission cathode |
DE59507196T DE59507196D1 (de) | 1994-02-23 | 1995-02-22 | Feldemissionskathodeneinrichtung und verfahren zur herstellung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4405768A DE4405768A1 (de) | 1994-02-23 | 1994-02-23 | Feldemissionskathodeneinrichtung und Verfahren zu ihrer Herstellung |
DEP4405768.7 | 1994-02-23 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/702,684 A-371-Of-International US5773921A (en) | 1994-02-23 | 1995-02-22 | Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge |
US09/504,635 Reissue USRE38223E1 (en) | 1994-02-23 | 1995-02-22 | Field emission cathode having an electrically conducting material shaped of a narrow rod or knife edge |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1995023424A1 true WO1995023424A1 (de) | 1995-08-31 |
Family
ID=6510961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1995/000221 WO1995023424A1 (de) | 1994-02-23 | 1995-02-22 | Feldemissionskathodeneinrichtung und verfahren zur herstellung |
Country Status (5)
Country | Link |
---|---|
US (3) | USRE38223E1 (de) |
EP (1) | EP0801805B1 (de) |
AT (1) | ATE186422T1 (de) |
DE (2) | DE4405768A1 (de) |
WO (1) | WO1995023424A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6097139A (en) * | 1995-08-04 | 2000-08-01 | Printable Field Emitters Limited | Field electron emission materials and devices |
DE102008049654A1 (de) | 2008-09-30 | 2010-04-08 | Carl Zeiss Nts Gmbh | Elektronenstrahlquelle und Verfahren zur Herstellung derselben |
US8536773B2 (en) | 2011-03-30 | 2013-09-17 | Carl Zeiss Microscopy Gmbh | Electron beam source and method of manufacturing the same |
Families Citing this family (147)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996042101A1 (en) * | 1995-06-12 | 1996-12-27 | Ecole Polytechnique Federale De Lausanne | Electron source and applications of the same |
KR100438137B1 (ko) * | 1995-11-15 | 2004-07-16 | 이.아이,듀우판드네모아앤드캄파니 | 어니일링된탄소수트전장방출재및그로부터제조된전장방출캐쏘드 |
US5872422A (en) * | 1995-12-20 | 1999-02-16 | Advanced Technology Materials, Inc. | Carbon fiber-based field emission devices |
US6445006B1 (en) | 1995-12-20 | 2002-09-03 | Advanced Technology Materials, Inc. | Microelectronic and microelectromechanical devices comprising carbon nanotube components, and methods of making same |
KR100365444B1 (ko) * | 1996-09-18 | 2004-01-24 | 가부시끼가이샤 도시바 | 진공마이크로장치와이를이용한화상표시장치 |
DE69834673T2 (de) | 1997-09-30 | 2006-10-26 | Noritake Co., Ltd., Nagoya | Verfahren zur Herstellung einer Elektronenemittierenden Quelle |
US6525461B1 (en) * | 1997-10-30 | 2003-02-25 | Canon Kabushiki Kaisha | Narrow titanium-containing wire, process for producing narrow titanium-containing wire, structure, and electron-emitting device |
JP3740295B2 (ja) * | 1997-10-30 | 2006-02-01 | キヤノン株式会社 | カーボンナノチューブデバイス、その製造方法及び電子放出素子 |
JP3441396B2 (ja) | 1998-12-03 | 2003-09-02 | 喜萬 中山 | 電子装置の表面信号操作用プローブ及びその製造方法 |
JP3441397B2 (ja) | 1998-12-31 | 2003-09-02 | 喜萬 中山 | 電子装置の表面信号操作用融着プローブ及びその製造方法 |
JPH11273551A (ja) * | 1998-03-23 | 1999-10-08 | Nec Corp | 窒化ホウ素を用いた電子放出素子及びその製造方法 |
US6630772B1 (en) | 1998-09-21 | 2003-10-07 | Agere Systems Inc. | Device comprising carbon nanotube field emitter structure and process for forming device |
US6597090B1 (en) | 1998-09-28 | 2003-07-22 | Xidex Corporation | Method for manufacturing carbon nanotubes as functional elements of MEMS devices |
WO2000019494A1 (en) * | 1998-09-28 | 2000-04-06 | Xidex Corporation | Method for manufacturing carbon nanotubes as functional elements of mems devices |
US6146227A (en) * | 1998-09-28 | 2000-11-14 | Xidex Corporation | Method for manufacturing carbon nanotubes as functional elements of MEMS devices |
US6232706B1 (en) * | 1998-11-12 | 2001-05-15 | The Board Of Trustees Of The Leland Stanford Junior University | Self-oriented bundles of carbon nanotubes and method of making same |
US6283812B1 (en) | 1999-01-25 | 2001-09-04 | Agere Systems Guardian Corp. | Process for fabricating article comprising aligned truncated carbon nanotubes |
US6250984B1 (en) * | 1999-01-25 | 2001-06-26 | Agere Systems Guardian Corp. | Article comprising enhanced nanotube emitter structure and process for fabricating article |
KR20000074609A (ko) * | 1999-05-24 | 2000-12-15 | 김순택 | 카본 나노 튜브를 이용한 전계 방출 어레이 및 그 제조방법 |
EP1061554A1 (de) | 1999-06-15 | 2000-12-20 | Iljin Nanotech Co., Ltd. | Weisslichtquelle mit Kohlenstoffnanoröhren und Verfahren zur Herstellung |
US6648711B1 (en) * | 1999-06-16 | 2003-11-18 | Iljin Nanotech Co., Ltd. | Field emitter having carbon nanotube film, method of fabricating the same, and field emission display device using the field emitter |
JP2001052652A (ja) * | 1999-06-18 | 2001-02-23 | Cheol Jin Lee | 白色光源及びその製造方法 |
US6538367B1 (en) | 1999-07-15 | 2003-03-25 | Agere Systems Inc. | Field emitting device comprising field-concentrating nanoconductor assembly and method for making the same |
US6504292B1 (en) | 1999-07-15 | 2003-01-07 | Agere Systems Inc. | Field emitting device comprising metallized nanostructures and method for making the same |
US6312303B1 (en) * | 1999-07-19 | 2001-11-06 | Si Diamond Technology, Inc. | Alignment of carbon nanotubes |
US6277318B1 (en) * | 1999-08-18 | 2001-08-21 | Agere Systems Guardian Corp. | Method for fabrication of patterned carbon nanotube films |
US6741019B1 (en) | 1999-10-18 | 2004-05-25 | Agere Systems, Inc. | Article comprising aligned nanowires |
JP3483526B2 (ja) * | 1999-10-21 | 2004-01-06 | シャープ株式会社 | 画像形成装置 |
US6401526B1 (en) | 1999-12-10 | 2002-06-11 | The Board Of Trustees Of The Leland Stanford Junior University | Carbon nanotubes and methods of fabrication thereof using a liquid phase catalyst precursor |
US6989631B2 (en) * | 2001-06-08 | 2006-01-24 | Sony Corporation | Carbon cathode of a field emission display with in-laid isolation barrier and support |
DE10005057C2 (de) * | 2000-02-04 | 2002-10-31 | Jisoon Ihm | Feldemissionsspitzen |
KR100499120B1 (ko) * | 2000-02-25 | 2005-07-04 | 삼성에스디아이 주식회사 | 카본 나노튜브를 이용한 3전극 전계 방출 표시소자 |
US6456691B2 (en) * | 2000-03-06 | 2002-09-24 | Rigaku Corporation | X-ray generator |
ATE438922T1 (de) * | 2000-03-16 | 2009-08-15 | Hitachi Ltd | Vorrichtung zum erzeugen eines stromes von ladungsträgern |
US6512235B1 (en) * | 2000-05-01 | 2003-01-28 | El-Mul Technologies Ltd. | Nanotube-based electron emission device and systems using the same |
JP3658342B2 (ja) | 2000-05-30 | 2005-06-08 | キヤノン株式会社 | 電子放出素子、電子源及び画像形成装置、並びにテレビジョン放送表示装置 |
US6586889B1 (en) | 2000-06-21 | 2003-07-01 | Si Diamond Technology, Inc. | MEMS field emission device |
US6819034B1 (en) | 2000-08-21 | 2004-11-16 | Si Diamond Technology, Inc. | Carbon flake cold cathode |
US6692324B2 (en) * | 2000-08-29 | 2004-02-17 | Ut-Battelle, Llc | Single self-aligned carbon containing tips |
JP3639809B2 (ja) * | 2000-09-01 | 2005-04-20 | キヤノン株式会社 | 電子放出素子,電子放出装置,発光装置及び画像表示装置 |
JP3658346B2 (ja) * | 2000-09-01 | 2005-06-08 | キヤノン株式会社 | 電子放出素子、電子源および画像形成装置、並びに電子放出素子の製造方法 |
JP3610325B2 (ja) * | 2000-09-01 | 2005-01-12 | キヤノン株式会社 | 電子放出素子、電子源及び画像形成装置の製造方法 |
JP3639808B2 (ja) * | 2000-09-01 | 2005-04-20 | キヤノン株式会社 | 電子放出素子及び電子源及び画像形成装置及び電子放出素子の製造方法 |
US6664728B2 (en) | 2000-09-22 | 2003-12-16 | Nano-Proprietary, Inc. | Carbon nanotubes with nitrogen content |
JP3634781B2 (ja) | 2000-09-22 | 2005-03-30 | キヤノン株式会社 | 電子放出装置、電子源、画像形成装置及びテレビジョン放送表示装置 |
US20030002627A1 (en) * | 2000-09-28 | 2003-01-02 | Oxford Instruments, Inc. | Cold emitter x-ray tube incorporating a nanostructured carbon film electron emitter |
US6876724B2 (en) * | 2000-10-06 | 2005-04-05 | The University Of North Carolina - Chapel Hill | Large-area individually addressable multi-beam x-ray system and method of forming same |
US7082182B2 (en) * | 2000-10-06 | 2006-07-25 | The University Of North Carolina At Chapel Hill | Computed tomography system for imaging of human and small animal |
US7227924B2 (en) | 2000-10-06 | 2007-06-05 | The University Of North Carolina At Chapel Hill | Computed tomography scanning system and method using a field emission x-ray source |
US7085351B2 (en) * | 2000-10-06 | 2006-08-01 | University Of North Carolina At Chapel Hill | Method and apparatus for controlling electron beam current |
US6553096B1 (en) * | 2000-10-06 | 2003-04-22 | The University Of North Carolina Chapel Hill | X-ray generating mechanism using electron field emission cathode |
US20040240616A1 (en) * | 2003-05-30 | 2004-12-02 | Applied Nanotechnologies, Inc. | Devices and methods for producing multiple X-ray beams from multiple locations |
US6980627B2 (en) * | 2000-10-06 | 2005-12-27 | Xintek, Inc. | Devices and methods for producing multiple x-ray beams from multiple locations |
US20050200261A1 (en) * | 2000-12-08 | 2005-09-15 | Nano-Proprietary, Inc. | Low work function cathode |
US6885022B2 (en) * | 2000-12-08 | 2005-04-26 | Si Diamond Technology, Inc. | Low work function material |
JP2002179418A (ja) * | 2000-12-13 | 2002-06-26 | Tohoku Techno Arch Co Ltd | カーボン・ナノチューブ作成方法 |
US7273598B2 (en) * | 2001-01-19 | 2007-09-25 | Chevron U.S.A. Inc. | Diamondoid-containing materials for passivating layers in integrated circuit devices |
US7306674B2 (en) * | 2001-01-19 | 2007-12-11 | Chevron U.S.A. Inc. | Nucleation of diamond films using higher diamondoids |
US6783589B2 (en) * | 2001-01-19 | 2004-08-31 | Chevron U.S.A. Inc. | Diamondoid-containing materials in microelectronics |
US6649431B2 (en) * | 2001-02-27 | 2003-11-18 | Ut. Battelle, Llc | Carbon tips with expanded bases grown with simultaneous application of carbon source and etchant gases |
JP3768908B2 (ja) * | 2001-03-27 | 2006-04-19 | キヤノン株式会社 | 電子放出素子、電子源、画像形成装置 |
GB0109546D0 (en) * | 2001-04-18 | 2001-06-06 | Va Tech Transmission & Distrib | Vacuum power switches |
US6739932B2 (en) * | 2001-06-07 | 2004-05-25 | Si Diamond Technology, Inc. | Field emission display using carbon nanotubes and methods of making the same |
US6682382B2 (en) * | 2001-06-08 | 2004-01-27 | Sony Corporation | Method for making wires with a specific cross section for a field emission display |
US6756730B2 (en) * | 2001-06-08 | 2004-06-29 | Sony Corporation | Field emission display utilizing a cathode frame-type gate and anode with alignment method |
US7002290B2 (en) * | 2001-06-08 | 2006-02-21 | Sony Corporation | Carbon cathode of a field emission display with integrated isolation barrier and support on substrate |
US6700454B2 (en) | 2001-06-29 | 2004-03-02 | Zvi Yaniv | Integrated RF array using carbon nanotube cathodes |
JP3774682B2 (ja) * | 2001-06-29 | 2006-05-17 | キヤノン株式会社 | 電子放出素子、電子源および画像形成装置 |
US6897603B2 (en) * | 2001-08-24 | 2005-05-24 | Si Diamond Technology, Inc. | Catalyst for carbon nanotube growth |
US6890230B2 (en) * | 2001-08-28 | 2005-05-10 | Motorola, Inc. | Method for activating nanotubes as field emission sources |
US7070472B2 (en) * | 2001-08-29 | 2006-07-04 | Motorola, Inc. | Field emission display and methods of forming a field emission display |
US6891319B2 (en) * | 2001-08-29 | 2005-05-10 | Motorola, Inc. | Field emission display and methods of forming a field emission display |
JP3703415B2 (ja) * | 2001-09-07 | 2005-10-05 | キヤノン株式会社 | 電子放出素子、電子源及び画像形成装置、並びに電子放出素子及び電子源の製造方法 |
JP3605105B2 (ja) * | 2001-09-10 | 2004-12-22 | キヤノン株式会社 | 電子放出素子、電子源、発光装置、画像形成装置および基板の各製造方法 |
US6902658B2 (en) * | 2001-12-18 | 2005-06-07 | Motorola, Inc. | FED cathode structure using electrophoretic deposition and method of fabrication |
US7351604B2 (en) * | 2002-01-15 | 2008-04-01 | International Business Machines Corporation | Microstructures |
US20050161750A1 (en) * | 2002-03-20 | 2005-07-28 | Hongjie Dai | Molybdenum-based electrode with carbon nanotube growth |
US6873118B2 (en) * | 2002-04-16 | 2005-03-29 | Sony Corporation | Field emission cathode structure using perforated gate |
US6747416B2 (en) * | 2002-04-16 | 2004-06-08 | Sony Corporation | Field emission display with deflecting MEMS electrodes |
US6791278B2 (en) * | 2002-04-16 | 2004-09-14 | Sony Corporation | Field emission display using line cathode structure |
US6979947B2 (en) * | 2002-07-09 | 2005-12-27 | Si Diamond Technology, Inc. | Nanotriode utilizing carbon nanotubes and fibers |
US6798127B2 (en) * | 2002-10-09 | 2004-09-28 | Nano-Proprietary, Inc. | Enhanced field emission from carbon nanotubes mixed with particles |
US7012582B2 (en) * | 2002-11-27 | 2006-03-14 | Sony Corporation | Spacer-less field emission display |
US6958475B1 (en) | 2003-01-09 | 2005-10-25 | Colby Steven M | Electron source |
US20040145299A1 (en) * | 2003-01-24 | 2004-07-29 | Sony Corporation | Line patterned gate structure for a field emission display |
JP3907626B2 (ja) * | 2003-01-28 | 2007-04-18 | キヤノン株式会社 | 電子源の製造方法、画像表示装置の製造方法、電子放出素子の製造方法、画像表示装置、特性調整方法、及び画像表示装置の特性調整方法 |
US6764874B1 (en) | 2003-01-30 | 2004-07-20 | Motorola, Inc. | Method for chemical vapor deposition of single walled carbon nanotubes |
JP4004973B2 (ja) * | 2003-02-19 | 2007-11-07 | 双葉電子工業株式会社 | 炭素物質とその製造方法及び電子放出素子、複合材料 |
US6987835B2 (en) * | 2003-03-26 | 2006-01-17 | Xoft Microtube, Inc. | Miniature x-ray tube with micro cathode |
EP1614135A4 (de) * | 2003-03-26 | 2010-04-28 | Xoft Microtube Inc | Miniatur-röntgenröhre mit mikrokathode |
US7071629B2 (en) * | 2003-03-31 | 2006-07-04 | Sony Corporation | Image display device incorporating driver circuits on active substrate and other methods to reduce interconnects |
US20040189552A1 (en) * | 2003-03-31 | 2004-09-30 | Sony Corporation | Image display device incorporating driver circuits on active substrate to reduce interconnects |
US20040245224A1 (en) * | 2003-05-09 | 2004-12-09 | Nano-Proprietary, Inc. | Nanospot welder and method |
US7202596B2 (en) * | 2003-06-06 | 2007-04-10 | Electrovac Ag | Electron emitter and process of fabrication |
US7157848B2 (en) * | 2003-06-06 | 2007-01-02 | Electrovac Fabrikation Elektrotechnischer Spezialartikel Gmbh | Field emission backlight for liquid crystal television |
US20050064167A1 (en) * | 2003-09-12 | 2005-03-24 | Nano-Proprietary, Inc. | Carbon nanotubes |
US20050140261A1 (en) * | 2003-10-23 | 2005-06-30 | Pinchas Gilad | Well structure with axially aligned field emission fiber or carbon nanotube and method for making same |
US7125308B2 (en) * | 2003-12-18 | 2006-10-24 | Nano-Proprietary, Inc. | Bead blast activation of carbon nanotube cathode |
US7312562B2 (en) * | 2004-02-04 | 2007-12-25 | Chevron U.S.A. Inc. | Heterodiamondoid-containing field emission devices |
FR2872826B1 (fr) * | 2004-07-07 | 2006-09-15 | Commissariat Energie Atomique | Croissance a basse temperature de nanotubes de carbone orientes |
US7736209B2 (en) * | 2004-09-10 | 2010-06-15 | Applied Nanotech Holdings, Inc. | Enhanced electron field emission from carbon nanotubes without activation |
US20080012461A1 (en) * | 2004-11-09 | 2008-01-17 | Nano-Proprietary, Inc. | Carbon nanotube cold cathode |
DE112006000713T5 (de) * | 2005-04-25 | 2008-05-29 | The University Of North Carolina At Chapel Hill | Röntgenstrahl-Bildgebungssysteme und -verfahren unter Verwendung einer zeitlichen digitalen Signalverarbeitung zum Verringern von Rauschen und zum gleichzeitigen Erzeugen mehrfacher Bilder |
US8155262B2 (en) * | 2005-04-25 | 2012-04-10 | The University Of North Carolina At Chapel Hill | Methods, systems, and computer program products for multiplexing computed tomography |
US20070158768A1 (en) * | 2006-01-06 | 2007-07-12 | Honeywell International, Inc. | Electrical contacts formed of carbon nanotubes |
US8501136B2 (en) * | 2006-02-06 | 2013-08-06 | The University Of North Carolina At Chapel Hill | Synthesis and processing of rare-earth boride nanowires as electron emitters |
US20070227700A1 (en) * | 2006-03-29 | 2007-10-04 | Dimitrakopoulos Christos D | VLSI chip hot-spot minimization using nanotubes |
US7796999B1 (en) | 2006-04-03 | 2010-09-14 | Sprint Spectrum L.P. | Method and system for network-directed media buffer-size setting based on device features |
CN101051596B (zh) * | 2006-04-07 | 2010-09-29 | 清华大学 | 碳纳米管场发射电子源及其制造方法 |
US8189893B2 (en) | 2006-05-19 | 2012-05-29 | The University Of North Carolina At Chapel Hill | Methods, systems, and computer program products for binary multiplexing x-ray radiography |
WO2008105820A2 (en) * | 2006-08-25 | 2008-09-04 | Philadelphia Health And Education Corporation | Method of loading a nanotube structure and loaded nanotube structure |
DE102006054206A1 (de) * | 2006-11-15 | 2008-05-21 | Till Keesmann | Feldemissionsvorrichtung |
DE102007010463B4 (de) * | 2007-03-01 | 2010-08-26 | Sellmair, Josef, Dr. | Vorrichtung zur Feldemission von Teilchen |
US7751528B2 (en) * | 2007-07-19 | 2010-07-06 | The University Of North Carolina | Stationary x-ray digital breast tomosynthesis systems and related methods |
US8063483B2 (en) * | 2007-10-18 | 2011-11-22 | International Business Machines Corporation | On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity |
US8600003B2 (en) * | 2009-01-16 | 2013-12-03 | The University Of North Carolina At Chapel Hill | Compact microbeam radiation therapy systems and methods for cancer treatment and research |
FR2946456A1 (fr) * | 2009-06-05 | 2010-12-10 | Thales Sa | Source de faisceau electronique collimate a cathode froide |
CZ305429B6 (cs) * | 2009-07-01 | 2015-09-16 | Technická univerzita v Liberci | Rentgenový zářič a/nebo urychlovač elektricky nabitých částic |
US8358739B2 (en) | 2010-09-03 | 2013-01-22 | The University Of North Carolina At Chapel Hill | Systems and methods for temporal multiplexing X-ray imaging |
US9171690B2 (en) | 2011-12-29 | 2015-10-27 | Elwha Llc | Variable field emission device |
US8970113B2 (en) | 2011-12-29 | 2015-03-03 | Elwha Llc | Time-varying field emission device |
US8692226B2 (en) | 2011-12-29 | 2014-04-08 | Elwha Llc | Materials and configurations of a field emission device |
US8928228B2 (en) | 2011-12-29 | 2015-01-06 | Elwha Llc | Embodiments of a field emission device |
US8946992B2 (en) | 2011-12-29 | 2015-02-03 | Elwha Llc | Anode with suppressor grid |
US9646798B2 (en) | 2011-12-29 | 2017-05-09 | Elwha Llc | Electronic device graphene grid |
US9018861B2 (en) | 2011-12-29 | 2015-04-28 | Elwha Llc | Performance optimization of a field emission device |
US9349562B2 (en) | 2011-12-29 | 2016-05-24 | Elwha Llc | Field emission device with AC output |
US8810131B2 (en) | 2011-12-29 | 2014-08-19 | Elwha Llc | Field emission device with AC output |
US8575842B2 (en) | 2011-12-29 | 2013-11-05 | Elwha Llc | Field emission device |
US8810161B2 (en) | 2011-12-29 | 2014-08-19 | Elwha Llc | Addressable array of field emission devices |
WO2013163439A1 (en) * | 2012-04-26 | 2013-10-31 | Elwha Llc | Variable field emission device |
US9659734B2 (en) | 2012-09-12 | 2017-05-23 | Elwha Llc | Electronic device multi-layer graphene grid |
US9659735B2 (en) | 2012-09-12 | 2017-05-23 | Elwha Llc | Applications of graphene grids in vacuum electronics |
US9362078B2 (en) | 2012-12-27 | 2016-06-07 | Schlumberger Technology Corporation | Ion source using field emitter array cathode and electromagnetic confinement |
US8866068B2 (en) | 2012-12-27 | 2014-10-21 | Schlumberger Technology Corporation | Ion source with cathode having an array of nano-sized projections |
US20140183349A1 (en) * | 2012-12-27 | 2014-07-03 | Schlumberger Technology Corporation | Ion source using spindt cathode and electromagnetic confinement |
KR20140112270A (ko) * | 2013-03-13 | 2014-09-23 | 삼성전자주식회사 | 방열 블록을 포함한 엑스선 발생 장치 |
US10269527B2 (en) * | 2013-11-27 | 2019-04-23 | Nanox Imaging Plc | Electron emitting construct configured with ion bombardment resistant |
US9782136B2 (en) | 2014-06-17 | 2017-10-10 | The University Of North Carolina At Chapel Hill | Intraoral tomosynthesis systems, methods, and computer readable media for dental imaging |
CN105374654B (zh) * | 2014-08-25 | 2018-11-06 | 同方威视技术股份有限公司 | 电子源、x射线源、使用了该x射线源的设备 |
US10980494B2 (en) | 2014-10-20 | 2021-04-20 | The University Of North Carolina At Chapel Hill | Systems and related methods for stationary digital chest tomosynthesis (s-DCT) imaging |
DE102014226812A1 (de) * | 2014-12-22 | 2016-06-23 | Siemens Aktiengesellschaft | Vorrichtung zum Erzeugen eines Elektronenstrahls |
DE102014226814B4 (de) * | 2014-12-22 | 2023-05-11 | Siemens Healthcare Gmbh | Metallstrahlröntgenröhre |
US10835199B2 (en) | 2016-02-01 | 2020-11-17 | The University Of North Carolina At Chapel Hill | Optical geometry calibration devices, systems, and related methods for three dimensional x-ray imaging |
JP6923344B2 (ja) | 2017-04-13 | 2021-08-18 | 株式会社Screenホールディングス | 周縁処理装置および周縁処理方法 |
EP3933881A1 (de) | 2020-06-30 | 2022-01-05 | VEC Imaging GmbH & Co. KG | Röntgenquelle mit mehreren gittern |
US11810774B2 (en) | 2020-08-26 | 2023-11-07 | Government Of The United States As Represented By The Secretary Of The Air Force | Field emission devices |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5089742A (en) * | 1990-09-28 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Navy | Electron beam source formed with biologically derived tubule materials |
US5138220A (en) * | 1990-12-05 | 1992-08-11 | Science Applications International Corporation | Field emission cathode of bio-molecular or semiconductor-metal eutectic composite microstructures |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4110612A (en) * | 1977-04-27 | 1978-08-29 | General Electric Company | Mass spectrometer desorption device including field anode eutectic alloy wire and auxiliary electrical resistance heating means |
US5449970A (en) * | 1992-03-16 | 1995-09-12 | Microelectronics And Computer Technology Corporation | Diode structure flat panel display |
US5495143A (en) * | 1993-08-12 | 1996-02-27 | Science Applications International Corporation | Gas discharge device having a field emitter array with microscopic emitter elements |
US5709577A (en) * | 1994-12-22 | 1998-01-20 | Lucent Technologies Inc. | Method of making field emission devices employing ultra-fine diamond particle emitters |
USRE38561E1 (en) * | 1995-02-22 | 2004-08-03 | Till Keesmann | Field emission cathode |
US5872422A (en) * | 1995-12-20 | 1999-02-16 | Advanced Technology Materials, Inc. | Carbon fiber-based field emission devices |
-
1994
- 1994-02-23 DE DE4405768A patent/DE4405768A1/de not_active Withdrawn
-
1995
- 1995-02-22 US US09/504,635 patent/USRE38223E1/en not_active Expired - Lifetime
- 1995-02-22 EP EP95910405A patent/EP0801805B1/de not_active Expired - Lifetime
- 1995-02-22 WO PCT/DE1995/000221 patent/WO1995023424A1/de active IP Right Grant
- 1995-02-22 US US08/702,684 patent/US5773921A/en not_active Ceased
- 1995-02-22 AT AT95910405T patent/ATE186422T1/de active
- 1995-02-22 DE DE59507196T patent/DE59507196D1/de not_active Expired - Lifetime
-
2003
- 2003-04-08 US US10/409,363 patent/US20040036402A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5089742A (en) * | 1990-09-28 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Navy | Electron beam source formed with biologically derived tubule materials |
US5138220A (en) * | 1990-12-05 | 1992-08-11 | Science Applications International Corporation | Field emission cathode of bio-molecular or semiconductor-metal eutectic composite microstructures |
Non-Patent Citations (4)
Title |
---|
"atomic force microscope with high dynamic range using bunny or dopy balls", IBM TDB, vol. 35, no. 7, pages 410- - 411 * |
D.A.KIRKPATRICK ET AL.: "demonstration of vacuum field emission from a self-assembling biomolecular microstructure composite", APPLIED PHYSICS LETTERS, vol. 60, no. 13, 30 March 1992 (1992-03-30), pages 1556 - 1558 * |
M.E.LIN ET AL.: "electron emission from an individual,supported c60 molecule", PHYSICAL REVIEW B, vol. 47, no. 12, 15 March 1993 (1993-03-15), pages 7546 - 7553 * |
P.M.AJAYAN ET AL.: "capillarity-induced filling of carbon nanotubes", NATURE, vol. 361, 28 January 1993 (1993-01-28), pages 333 - 334 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6097139A (en) * | 1995-08-04 | 2000-08-01 | Printable Field Emitters Limited | Field electron emission materials and devices |
DE102008049654A1 (de) | 2008-09-30 | 2010-04-08 | Carl Zeiss Nts Gmbh | Elektronenstrahlquelle und Verfahren zur Herstellung derselben |
US8164071B2 (en) | 2008-09-30 | 2012-04-24 | Carl Zeiss Nts Gmbh | Electron beam source and method of manufacturing the same |
US8723138B2 (en) | 2008-09-30 | 2014-05-13 | Carl Zeiss Microscopy Gmbh | Electron beam source and method of manufacturing the same |
US8536773B2 (en) | 2011-03-30 | 2013-09-17 | Carl Zeiss Microscopy Gmbh | Electron beam source and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
USRE38223E1 (en) | 2003-08-19 |
US5773921A (en) | 1998-06-30 |
US20040036402A1 (en) | 2004-02-26 |
EP0801805B1 (de) | 1999-11-03 |
ATE186422T1 (de) | 1999-11-15 |
EP0801805A1 (de) | 1997-10-22 |
DE59507196D1 (de) | 1999-12-09 |
DE4405768A1 (de) | 1995-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0801805B1 (de) | Feldemissionskathodeneinrichtung und verfahren zur herstellung | |
USRE38561E1 (en) | Field emission cathode | |
DE60122747T2 (de) | Feldemissionsvorrichtung mit kohlenstoffhaltigen spitzen | |
DE60014461T2 (de) | Feld Emissions Vorrichtung mit ausgerichteten und verkürzten Kohlenstoffnanoröhren und Herstellungsverfahren | |
DE69724376T2 (de) | Elektronenemittierende Beschichtung und Verfahren | |
EP1595266B1 (de) | Quantenpunkt aus elektrisch leitendem kohlenstoff, verfahren zur herstellung und anwendung | |
WO2005117058A1 (de) | Röntgenröhre für hohe dosisleistungen | |
US8766522B1 (en) | Carbon nanotube fiber cathode | |
AT408157B (de) | Verfahren zur herstellung eines feldemissions-displays | |
DE602004005848T2 (de) | Kathode für eine elektronenquelle | |
EP2092542B1 (de) | Feldemissionsvorrichtung | |
EP3523684A1 (de) | Multilayer-spiegel zur reflexion von euv-strahlung und verfahren zu dessen herstellung | |
DE69816604T2 (de) | Metall-kohlenstoff-sauerstoff-feldemissionsanordnungen | |
Xavier et al. | Stable field emission from arrays of vertically aligned free-standing metallic nanowires | |
DE102014226048A1 (de) | Feldemissionskathode | |
EP1157402B1 (de) | Elektronenemitter und verfahren zu dessen herstellung | |
Teo | Carbon nanotube electron source technology | |
DE69829502T2 (de) | Ionenbeschussteter graphit-beschichteter draht-elektronenemitter | |
Knápek et al. | Explanation of the quasi-harmonic field emission behaviour observed on epoxy-coated polymer graphite cathodes | |
EP2130211B1 (de) | Feldemissionsquelle für elektronen als feldemissionskathode | |
DE19802779A1 (de) | Elektronenemittervorrichtung | |
DE60128063T2 (de) | Elektronengenerierende kathode und herstellungsverfahren | |
DE10005057C2 (de) | Feldemissionsspitzen | |
EP4022663A1 (de) | Elektronenquelle zum erzeugen eines elektronenstrahls | |
DE19931328A1 (de) | Flächige Elektronen-Feldemissionsquelle und Verfahren zu deren Herstellung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1995910405 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 08702684 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 1995910405 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1995910405 Country of ref document: EP |