WO1996001035A1 - Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system - Google Patents

Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system Download PDF

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Publication number
WO1996001035A1
WO1996001035A1 PCT/US1995/006769 US9506769W WO9601035A1 WO 1996001035 A1 WO1996001035 A1 WO 1996001035A1 US 9506769 W US9506769 W US 9506769W WO 9601035 A1 WO9601035 A1 WO 9601035A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
cooling system
ducted
extruded
base portion
Prior art date
Application number
PCT/US1995/006769
Other languages
French (fr)
Inventor
Daryl J. Nelson
Original Assignee
Intel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corporation filed Critical Intel Corporation
Priority to DE69533338T priority Critical patent/DE69533338T2/en
Priority to EP95920676A priority patent/EP0803173B1/en
Priority to AU26055/95A priority patent/AU2605595A/en
Priority to JP8503157A priority patent/JPH10502217A/en
Priority to BR9508153A priority patent/BR9508153A/en
Publication of WO1996001035A1 publication Critical patent/WO1996001035A1/en
Priority to HK98103488A priority patent/HK1004184A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink cooling system for an integrated circuit package in an enclosed computer system.
  • Integrated circuits are typically housed within a plastic or ceramic package.
  • the packages have leads or surface pads that are soldered to a printed circuit board.
  • the circuit board and package are often located within a computer chassis which contains a fan that removes the heat generated by the IC.
  • Heat sinks are sometimes mounted to the top surface of the package housing to increase the thermal performance of the package.
  • Conventional heat sinks typically have a plurality of fins that extend from a bottom base portion. The fins increase the surface area of the heat sink and the heat transfer rate of the package.
  • Microprocessors are a type of IC which often require a heat sink.
  • a high heat transfer rate is particularly important since the interior operating environment of typical computers is 10°C to 25°C above that of the air exterior to the enclosed computer system.
  • a common method of cooling such a microprocessor is by the use of a fan heat sink, in which an axial fan is attached to the heat sink atop the microprocessor in order to blow air across the heat sink to remove the heat dissipated by the microprocessor.
  • the best fan heat sinks are not thermally efficient enough to cool the higher powered new microprocessors.
  • Fan heat sinks One method of increasing the fan heat sink's efficiency, or lowering its thermal resistance, is to increase the speed of rotation of the fan prop, thereby forcing more air through the heat sink.
  • the problem with this method is that at higher speeds of rotation, the fan consumes more power, further heating the fan motor bearings.
  • Reliability of the fan heat sinks is a key concern for these high performance microprocessors.
  • One failure mechanism of these small fans is a breakdown of the lubrication used in the bearings, which results at higher operating temperatures.
  • Fan heat sinks have a drawback that they often require a system fan to move the heated air dissipated by the fan heat sink and to prevent recirculation of the heated air back to the fan heat sink.
  • fan heat sinks have the drawback of having to operate in the elevated-temperature environment of the enclosed computer system. Subsequently, the fan heat sinks can encounter reliability problems due to operation at the elevated temperatures. Fan heat sinks also pose assembling problems since both a heat sink and a fan must be attached to each microprocessor.
  • a device and method is described herein for cooling an integrated circuit package — in particular, a microprocessor.
  • the device and method are particularly useful for cooling high performance microprocessors, which can dissipate over 30W of heat.
  • a microprocessor with a heat sink attached atop operates within a computer chassis.
  • a blower which has an air intake from a source external to the computer chassis, provides an air stream at its output.
  • a first air duct is coupled to the blower, and a first ducted heat sink is coupled to the first air duct. The air stream flows through the first air duct and through the first ducted heat sink, thereby cooling the attached microprocessor.
  • a second air duct can be connected to the first ducted heat sink for directing the air stream to a second ducted heat sink in order to cool a second microprocessor attached to the second ducted heat sink.
  • the air stream is slightly preheated from the heat dissipated from the first microprocessor, the air stream is still able to dissipate heat from the second microprocessor.
  • a ducted heat sink is required for the cooling system previously described.
  • An opposing bonded fin heat sink is easily constructed using two extruded heat sinks.
  • the two extruded heat sinks are attached such that the fins of one of the heat sinks are interleaved with the fins of the other heat sink.
  • the heat sinks are attached by thermally conductive epoxy. Other methods of attachment include soldering, welding, or simply friction contact.
  • the cooling system can be employed to cool modular add-in cards, motherboards, and other electronic components in addition to microprocessors . -5-
  • Fig. 1 is a block diagram of the ducted opposing bonded fin heat sink cooling system 100.
  • Fig. 2 is an alternative block diagram of the ducted opposing bonded fin heat sink cooling system 100.
  • Fig. 3A is a diagram of a ducted opposing bonded fin heat sink 300 before attachment.
  • Fig. 3B is a representation of a ducted opposing bonded fin heat sink 300 after attachment.
  • Fig. 4 is a representation of a cooling design for channeling air to two microprocessors as well as other electronic components.
  • Fig. 5 is a representation showing how the air channel of Fig. 4 can be coupled to a blower 510.
  • FIGS. 1 through 5 of the drawings disclose various embodiments of the present invention for purposes of illustration only.
  • One skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the invention.
  • the following description may include specific numbers and quantities associated with the device and methods described herein. It should be apparent to one skilled in the art that these numbers and quantities are utilized herein for illustrative purposes.
  • Fig. 1 shows a block diagram of the ducted opposing bonded fin heat sink cooling system 100.
  • the cooling system 100 is comprised of three main elements: a blower 110, a first air duct 120, and a first ducted heat sink 130.
  • the blower 110 has an air intake 135 which allows the blower to receive air from a source external to the computer chassis 180.
  • the blower 110 is coupled to the first air duct 120.
  • the first air duct 120 is coupled to the first ducted heat sink 130.
  • the cooling system can additionally include a second air duct 140 and a second ducted heat sink 150.
  • the second air duct 140 couples the first ducted heat sink 130 to the second ducted heat sink 150.
  • the first ducted heat sink 130 is attached to a first microprocessor 160.
  • the first ducted heat sink 130 dissipates heat from the first microprocessor 160.
  • the second ducted heat sink 150 is attached to a second microprocessor 170.
  • the second ducted heat sink 150 dissipates heat from the second microprocessor 170.
  • the blower 110 is located in the interior of the computer chassis 180.
  • a vent 190 in the computer chassis 180 allows air from the exterior of the computer chassis 180 to enter the blower 110.
  • an intake air duct 205 can be employed to couple the air intake 135 of the blower 110 to an air source exterior to the computer chassis 180.
  • the blower 110 could also be located exterior to the computer chassis 180, this is less desirable for noise and safety reasons.
  • the blower 110 can receive air from the exterior of the computer chassis 180 and provides an air stream which flows through the first air duct 120, through the first ducted heat sink 130, through the second air duct 140, and through the second ducted heat sink 150.
  • blower 110 the first air duct 120, the first ducted heat sink 130, the second air duct 140, and the second ducted heat sink 150 may all be detachable as required to meet assembly and manufacturing constraints as well as normal consumer modifications to the computer system.
  • the cooling system must be designed such that the second microprocessor 170 has proper cooling since the air stream used to dissipate the heat of the second microprocessor 170 has been slightly preheated from the heat dissipated from the first microprocessor 160.
  • the blower 110 provides the static air pressure required to force air from the exterior of the system through the air intake duct and eventually through the ducted heat sinks 130 and 150 on the two microprocessors 160 and 170, which are cooled in series.
  • the static pressure produced by the blower 110 is approximately three times that produced by axial fans.
  • the blower 110 produces enough static pressure to generate high air velocities through the narrow heat sink channels.
  • the resulting cooling system is very efficient.
  • the air flow volume from the blower 110 is constrained such that all the air from the blower 110 is forced through the ducted heat sinks 130 and 150.
  • Axial fans are not capable of producing the required static pressure for generating such high air flow volumes.
  • current axial fan cooled systems only a small amount of air from the system fan goes through the microprocessor heat sinks. This is even the case when the microprocessors are located directly in front of the axial fan near the motor.
  • the axial fan approach only a small percentage of the air actually goes through the microprocessor's heat sinks, as opposed to the ducted heat sink approach using a blower 110 where all the air is forced through the ducted heat sinks 130 and 150 by the blower 110.
  • blower 110 may be thermally controlled so as to increase air flow when more cooling is required and decrease air flow when less cooling is required.
  • Fig. 3A is a diagram of a ducted opposing bonded fin heat sink 300.
  • the opposing bonded fin heat sink 300 is comprised of two identical extruded heat sinks 305 and 310.
  • Each of the extruded heat sinks 305 and 310 are comprised of a base portion 312 and a plurality of fins 314 projecting transverse to the base portion 312.
  • the extruded heat sink 305 is inverted and rotated 180° from the extruded heat sink 310.
  • the two extruded heat sinks 305 and 310 are then glued together with a thermally conductive epoxy.
  • the presence of grooves 315 in each of the extruded heat sinks 305 and 310 allows for the placement of the fins of the opposite extruded heat sink.
  • Figure 3B shows extruded heat sinks 305 and 310 attached together.
  • Heat sinks typically require a large surface area to dissipate the heat from a microprocessor.
  • the air gaps between the fins must be very tall and narrow, as viewed from the end of the heat sink.
  • An aspect ratio is the ratio of the air gap height to the air gap width for a given heat sink channel.
  • the maximum aspect ratio for an extruded heat sink is 4 to 1.
  • the requirements of high-power dissipating microprocessor heat sinks is about 10 to 1.
  • the opposing bonded heat sink 300 has the advantage of being cheap and easy to manufacture compared to other heat sinks with a comparable aspect ratio. To attain this same aspect ratio using conventional heat sink designs would require machining or individually gluing fin plates into a base plate at a cost of two to three times more per heat sink. In addition, these complex heat sinks would still require a shroud over the top in order to duct air flow through the heat sink. Conversely, the opposing bonded heat sink 300 has the advantage of automatically providing a duct (or a series of ducts) so that air flow from the blower 110 flows through the opposing bonded heat sink 300. A side benefit of the opposing bonded heat sink 300 is that the top surface can be used for labels.
  • Fig. 4 is a representation of a cooling design for channeling air to two microprocessors 415 and 420 as well as other electronic components.
  • the above described cooling system can be employed to cool modular add-in cards, motherboards, and other electronic components in addition to microprocessors.
  • the connecting duct lengths, cross sectional area, and implementation details can vary depending on the system's design and microprocessor placement. Many variations of this invention can be realized using these basic ingredients of modifying and reorienting the air ducts. For example, in some cases, the system's axial fan can be directly replaced by the blower, thus minimizing the cost of the cooling system.
  • Fig. 4 shows the creation of an air channel by using a molded plastic cover 410.
  • This molded plastic cover 410 encloses two microprocessors 415 and 420 along with two ducted heat sinks 425 and 430 as well as other electronic components.
  • Fig. 5 is a representation showing how the air channel of Fig. 4 can be coupled to a blower 510 in order to cool the two microprocessors 415 and 420 as well as the other electronic components within the molded plastic cover 410.

Abstract

A device and method for cooling an integrated circuit package - in particular, a microprocessor - within an enclosed computer system. The device comprises a blower (110), a first heat sink (130) attached to the microprocessor, and a first air duct (120) coupling the blower (110) to the first heat sink (130). The blower (110) has an air intake (135) from the exterior of the computer system. The blower (110) generates an air stream which flows through the first air duct (120) to the first heat sink (130) for cooling the first microprocessor (160). A second air duct (140) connected to the first heat sink (130) may be used to subsequently direct the air stream to a second heat sink (150) for cooling a second microprocessor (170). An efficient duct heat sink for use in this cooling system (100) can be easily constructed by attaching two extruded heat sinks.

Description

DUCTED OPPOSING BONDED FIN HEAT SINK BLOWER MULTI-MICROPROCESSOR COOLTNG YSTEM
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to a heat sink cooling system for an integrated circuit package in an enclosed computer system.
Description of Related Art
Integrated circuits (ICs) are typically housed within a plastic or ceramic package. The packages have leads or surface pads that are soldered to a printed circuit board. The circuit board and package are often located within a computer chassis which contains a fan that removes the heat generated by the IC.
It is desirable to have a high rate of heat transfer from the IC package in order to maintain the junction temperatures of the integrated circuit within safe operating limits. Excessive IC junction temperatures may affect the performance of the circuit and cause a permanent degradation of the IC. Heat sinks are sometimes mounted to the top surface of the package housing to increase the thermal performance of the package. Conventional heat sinks typically have a plurality of fins that extend from a bottom base portion. The fins increase the surface area of the heat sink and the heat transfer rate of the package.
Microprocessors are a type of IC which often require a heat sink. For high performance microprocessors employed in an enclosed computer system, a high heat transfer rate is particularly important since the interior operating environment of typical computers is 10°C to 25°C above that of the air exterior to the enclosed computer system.
Several methods have been employed for cooling such high performance microprocessors. A common method of cooling such a microprocessor is by the use of a fan heat sink, in which an axial fan is attached to the heat sink atop the microprocessor in order to blow air across the heat sink to remove the heat dissipated by the microprocessor. To date, the best fan heat sinks are not thermally efficient enough to cool the higher powered new microprocessors.
One method of increasing the fan heat sink's efficiency, or lowering its thermal resistance, is to increase the speed of rotation of the fan prop, thereby forcing more air through the heat sink. The problem with this method is that at higher speeds of rotation, the fan consumes more power, further heating the fan motor bearings. Reliability of the fan heat sinks is a key concern for these high performance microprocessors. One failure mechanism of these small fans is a breakdown of the lubrication used in the bearings, which results at higher operating temperatures. Fan heat sinks have a drawback that they often require a system fan to move the heated air dissipated by the fan heat sink and to prevent recirculation of the heated air back to the fan heat sink.
Additionally, fan heat sinks have the drawback of having to operate in the elevated-temperature environment of the enclosed computer system. Subsequently, the fan heat sinks can encounter reliability problems due to operation at the elevated temperatures. Fan heat sinks also pose assembling problems since both a heat sink and a fan must be attached to each microprocessor.
Another approach is the use of passive heat sinks in combination with an axial system fan, but the large surface area requirements result in heat sink volumes that are too large for the typical computer chassis design.
Another approach involves the use of a liquid coolant to move the dissipated heat away from the microprocessor. Liquid cooling, however, is the least desirable and most expensive approach.
Accordingly, it would be advantageous to provide a reliable heat sink cooling system design. It would also be advantageous to provide a heat sink design which physically decouples the air mover (fan) from the heat sink. It would also be advantageous to provide a cheap, easily constructed heat sink to efficiently dissipate the heat generated by the microprocessors.
SUMMARY OF THE INVENTION
A device and method is described herein for cooling an integrated circuit package — in particular, a microprocessor. The device and method are particularly useful for cooling high performance microprocessors, which can dissipate over 30W of heat.
A microprocessor with a heat sink attached atop operates within a computer chassis. A blower, which has an air intake from a source external to the computer chassis, provides an air stream at its output. A first air duct is coupled to the blower, and a first ducted heat sink is coupled to the first air duct. The air stream flows through the first air duct and through the first ducted heat sink, thereby cooling the attached microprocessor.
A second air duct can be connected to the first ducted heat sink for directing the air stream to a second ducted heat sink in order to cool a second microprocessor attached to the second ducted heat sink. Although the air stream is slightly preheated from the heat dissipated from the first microprocessor, the air stream is still able to dissipate heat from the second microprocessor.
A ducted heat sink is required for the cooling system previously described. An opposing bonded fin heat sink is easily constructed using two extruded heat sinks. The two extruded heat sinks are attached such that the fins of one of the heat sinks are interleaved with the fins of the other heat sink. In the described embodiment, the heat sinks are attached by thermally conductive epoxy. Other methods of attachment include soldering, welding, or simply friction contact.
The cooling system can be employed to cool modular add-in cards, motherboards, and other electronic components in addition to microprocessors . -5-
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a block diagram of the ducted opposing bonded fin heat sink cooling system 100.
Fig. 2 is an alternative block diagram of the ducted opposing bonded fin heat sink cooling system 100.
Fig. 3A is a diagram of a ducted opposing bonded fin heat sink 300 before attachment.
Fig. 3B is a representation of a ducted opposing bonded fin heat sink 300 after attachment.
Fig. 4 is a representation of a cooling design for channeling air to two microprocessors as well as other electronic components.
Fig. 5 is a representation showing how the air channel of Fig. 4 can be coupled to a blower 510.
DETATLED DESCRIPTION OF THE PREFERRED EMBODIMENT
Figures 1 through 5 of the drawings disclose various embodiments of the present invention for purposes of illustration only. One skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the invention. The following description may include specific numbers and quantities associated with the device and methods described herein. It should be apparent to one skilled in the art that these numbers and quantities are utilized herein for illustrative purposes.
Fig. 1 shows a block diagram of the ducted opposing bonded fin heat sink cooling system 100. The cooling system 100 is comprised of three main elements: a blower 110, a first air duct 120, and a first ducted heat sink 130. The blower 110 has an air intake 135 which allows the blower to receive air from a source external to the computer chassis 180. The blower 110 is coupled to the first air duct 120. The first air duct 120 is coupled to the first ducted heat sink 130. The cooling system can additionally include a second air duct 140 and a second ducted heat sink 150. The second air duct 140 couples the first ducted heat sink 130 to the second ducted heat sink 150.
The first ducted heat sink 130 is attached to a first microprocessor 160. The first ducted heat sink 130 dissipates heat from the first microprocessor 160. Similarly, the second ducted heat sink 150 is attached to a second microprocessor 170. The second ducted heat sink 150 dissipates heat from the second microprocessor 170.
In the described embodiment, the blower 110 is located in the interior of the computer chassis 180. A vent 190 in the computer chassis 180 allows air from the exterior of the computer chassis 180 to enter the blower 110. Alternatively, referring to Fig. 2, an intake air duct 205 can be employed to couple the air intake 135 of the blower 110 to an air source exterior to the computer chassis 180. Although the blower 110 could also be located exterior to the computer chassis 180, this is less desirable for noise and safety reasons.
In any case, the blower 110 can receive air from the exterior of the computer chassis 180 and provides an air stream which flows through the first air duct 120, through the first ducted heat sink 130, through the second air duct 140, and through the second ducted heat sink 150.
It should be noted that the blower 110, the first air duct 120, the first ducted heat sink 130, the second air duct 140, and the second ducted heat sink 150 may all be detachable as required to meet assembly and manufacturing constraints as well as normal consumer modifications to the computer system.
It should also be noted that the cooling system must be designed such that the second microprocessor 170 has proper cooling since the air stream used to dissipate the heat of the second microprocessor 170 has been slightly preheated from the heat dissipated from the first microprocessor 160.
In the described embodiment, the blower 110 provides the static air pressure required to force air from the exterior of the system through the air intake duct and eventually through the ducted heat sinks 130 and 150 on the two microprocessors 160 and 170, which are cooled in series. The static pressure produced by the blower 110 is approximately three times that produced by axial fans. The blower 110 produces enough static pressure to generate high air velocities through the narrow heat sink channels. The resulting cooling system is very efficient. The air flow volume from the blower 110 is constrained such that all the air from the blower 110 is forced through the ducted heat sinks 130 and 150.
Axial fans are not capable of producing the required static pressure for generating such high air flow volumes. In current axial fan cooled systems, only a small amount of air from the system fan goes through the microprocessor heat sinks. This is even the case when the microprocessors are located directly in front of the axial fan near the motor. Thus, in the axial fan approach, only a small percentage of the air actually goes through the microprocessor's heat sinks, as opposed to the ducted heat sink approach using a blower 110 where all the air is forced through the ducted heat sinks 130 and 150 by the blower 110.
Additionally, the blower 110 may be thermally controlled so as to increase air flow when more cooling is required and decrease air flow when less cooling is required.
Reference is now made to Fig. 3A, which is a diagram of a ducted opposing bonded fin heat sink 300. The opposing bonded fin heat sink 300 is comprised of two identical extruded heat sinks 305 and 310. Each of the extruded heat sinks 305 and 310 are comprised of a base portion 312 and a plurality of fins 314 projecting transverse to the base portion 312.
The extruded heat sink 305 is inverted and rotated 180° from the extruded heat sink 310. The two extruded heat sinks 305 and 310 are then glued together with a thermally conductive epoxy. The presence of grooves 315 in each of the extruded heat sinks 305 and 310 allows for the placement of the fins of the opposite extruded heat sink. Figure 3B shows extruded heat sinks 305 and 310 attached together.
Heat sinks typically require a large surface area to dissipate the heat from a microprocessor. For high efficiency, the air gaps between the fins must be very tall and narrow, as viewed from the end of the heat sink. An aspect ratio is the ratio of the air gap height to the air gap width for a given heat sink channel. Typically, the maximum aspect ratio for an extruded heat sink is 4 to 1. The requirements of high-power dissipating microprocessor heat sinks is about 10 to 1. By attaching the two extruded heat sinks 305 and 310 as described above, an effective aspect ratio of the opposing bonded heat sink 300 is created of approximately 10 to 1.
The opposing bonded heat sink 300 has the advantage of being cheap and easy to manufacture compared to other heat sinks with a comparable aspect ratio. To attain this same aspect ratio using conventional heat sink designs would require machining or individually gluing fin plates into a base plate at a cost of two to three times more per heat sink. In addition, these complex heat sinks would still require a shroud over the top in order to duct air flow through the heat sink. Conversely, the opposing bonded heat sink 300 has the advantage of automatically providing a duct (or a series of ducts) so that air flow from the blower 110 flows through the opposing bonded heat sink 300. A side benefit of the opposing bonded heat sink 300 is that the top surface can be used for labels.
Reference is now made to Fig. 4, which is a representation of a cooling design for channeling air to two microprocessors 415 and 420 as well as other electronic components. The above described cooling system can be employed to cool modular add-in cards, motherboards, and other electronic components in addition to microprocessors.
The connecting duct lengths, cross sectional area, and implementation details can vary depending on the system's design and microprocessor placement. Many variations of this invention can be realized using these basic ingredients of modifying and reorienting the air ducts. For example, in some cases, the system's axial fan can be directly replaced by the blower, thus minimizing the cost of the cooling system.
Fig. 4 shows the creation of an air channel by using a molded plastic cover 410. This molded plastic cover 410 encloses two microprocessors 415 and 420 along with two ducted heat sinks 425 and 430 as well as other electronic components.
Fig. 5 is a representation showing how the air channel of Fig. 4 can be coupled to a blower 510 in order to cool the two microprocessors 415 and 420 as well as the other electronic components within the molded plastic cover 410.
From the above description, it will be apparent that the invention disclosed herein provides a novel and advantageous heat sink cooling system. The foregoing discussion discloses and describes exemplary methods and embodiments of the present invention. As will be understood by those familiar with the art, the invention may be embodied in other specific forms without departing from its spirit or essential characteristics, and thus, the described embodiment is not restrictive of the scope of the invention. The following claims are indicative of the scope of the invention. All variations which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

CLAIMSWHAT IS CLAIMED IS:
1. In an enclosed computer system which has an integrated circuit package, a cooling system comprising: a blower with an air intake from the exterior of said enclosed computer system for providing an air flow; a first heat sink attached to said integrated circuit package; and a first air duct coupling said blower to said heat smk.
2. The cooling system of Claim 1 further comprising an intake air duct, one end of which is coupled to the exterior of said computer system and the other end of which is coupled to said blower for providing said air intake from the exterior of said computer system.
3. The cooling system of Claim 2 wherein said integrated circuit package is a microprocessor.
4. The cooling system of Claim 3 further comprising: a second heat sink connected to a second microprocessor; and a second air duct connecting said first heat sink to said second heat sink.
5. The cooling system of Claim 2 wherein said first heat sink is an opposing bonded heat sink comprised of: a first extruded heat sink comprising a first base portion and a plurality of fins projecting transverse to said first base portion; and a second extruded heat sink comprising a second base portion and a plurality of fins projecting transverse to said second base portion, said second extruded heat sink coupled to said first extruded heat sink to create a ducted heat sink with one or more ducts running through the ducted heat sink.
6. The cooling system of Claim 5 wherein said integrated circuit package is a microprocessor.
7. The cooling system of Claim 6 further comprising: a second heat sink connected to a second microprocessor; and a second air duct connecting said first heat sink to said second heat sink.
8. The cooling system of Claim 1 wherein said integrated circuit package is a microprocessor.
9. The cooling system of Claim 8 further comprising: a second heat sink connected to a second microprocessor; and a second air duct connecting said first heat sink to said second heat sink.
10. The cooling system of Claim 1 wherein said first heat sink is an opposing bonded heat sink comprised of: a first extruded heat sink comprising a first base portion and a plurality of fins projecting transverse to said first base portion; and a second extruded heat sink comprising a second base portion and a plurality of fins projecting transverse to said second base portion, said second extruded heat sink coupled to said first extruded heat sink to create a ducted heat sink with one or more ducts running through the ducted heat sink.
11. The cooling system of Claim 10 wherein said integrated circuit package is a microprocessor.
12. The cooling system of Claim 11 further comprising: a second heat sink connected to a second microprocessor; and a second air duct connecting said first heat sink to said second heat sink.
13. The cooling system of Claim 1 wherein said blower is thermally controlled to increase the air flow when said integrated circuit package requires more cooling and decrease the air flow when said integrated circuit package requires less cooling.
14. The cooling system of Claim 1 wherein said first heat sink is a ducted heat sink having one or more ducts for allowing air to flow through the ducted heat sink.
15. In an enclosed computer system which has an integrated circuit package, a cooling system comprising: a blowing means with an air intake from the exterior of said enclosed computer system for providing an air flow; a first heat sink means attached to said integrated circuit package; and an air channel means connecting said blowing means to said heat sink means.
16. The cooling system of Claim 15 further comprising an intake air channel means, one end of which is coupled to the exterior of said computer system and the other end of which is coupled to said blowing means for providing said air intake from the exterior of said computer system.
17. The cooling system of Claim 16 wherein said integrated circuit package is a microprocessor.
18. The cooling system of Claim 17 further comprising: a second heat sink means connected to a second microprocessor; and a second air channel means connecting said first heat sink means to said second heat sink means.
19. The cooling system of Claim 16 wherein said heat sink means is an opposing bonded heat sink means comprised of: a first extruded heat sink means comprising a first base portion and a plurality of fins projecting transverse to said first base portion; and a second extruded heat sink means comprising a second base portion and a plurality of fins projecting transverse to said second base portion, said second extruded heat sink means coupled to said first extruded heat sink means to create a ducted heat sink means with one or more ducts running through the ducted heat sink means.
20. The cooling system of Claim 19 wherein said integrated circuit package is a microprocessor.
21. The cooling system of Claim 20 further comprising: a second heat sink means connected to a second microprocessor; and a second air channel means connecting said first heat sink means to said second heat sink means.
22. The cooling system of Claim 15 wherein said integrated circuit package is a microprocessor.
23. The cooling system of Claim 22 further comprising: a second heat sink means connected to a second microprocessor; and a second air channel means connecting said first heat sink means to said second heat sink means.
24. The cooling system of Claim 15 wherein said heat sink means is an opposing bonded heat sink means comprised of: a first extruded heat sink means comprising a first base portion and a plurality of fins projecting transverse to said first base portion; and a second extruded heat sink means comprising a second base portion and a plurality of fins projecting transverse to said second base portion, said second extruded heat sink means coupled to said first extruded heat sink means to create a ducted heat sink means with one or more ducts running through the ducted heat sink means.
25. The cooling system of Claim 24 wherein said integrated circuit package is a microprocessor.
26. The cooling system of Claim 25 further comprising: a second heat sink means connected to a second microprocessor; and a second air channel means connecting said first heat sink means to said second heat sink means.
27. The cooling system of Claim 15 wherein said blowing means is thermally controlled to increase the air flow when said integrated circuit package requires more cooling and decrease the air flow when said integrated circuit package requires less cooling.
28. The cooling system of Claim 15 wherein said first heat sink means is a ducted heat sink means having one or more ducts for allowing air to flow through the ducted heat sink means.
29. An opposing bonded heat sink comprised of: a first extruded heat sink comprising a first base portion and a first plurality of fins projecting transverse to said first base portion; and a second extruded heat sink comprising a second base portion and a second plurality of fins projecting transverse to said second base portion, said second extruded heat sink coupled to said first extruded heat sink to create a ducted heat sink with one or more ducts running through the ducted heat sink.
30. The opposing bonded heat sink of Claim 29 wherein said first base portion of the first extruded heat sink includes a first plurality of grooves, said first plurality of grooves providing a receptacle for a portion of the second plurality of fins of the second extruded heat sink, and said second base portion of the second extruded heat sink includes a second plurality of grooves providing a receptacle for a portion of the first plurality of fins of the first extruded heat sink.
31. In a computer system enclosed in a computer chassis, said computer system including a blower, a first air duct, and a first heat sink attached to one or more integrated circuit packages, a cooling method comprising the step of: a) employing said blower for providing an air stream originating from a source external to said computer chassis through said first air duct to said first heat sink.
32. The cooling method of claim 31 wherein the first heat sink is a ducted heat sink having ducts running through it, and the air stream flows through said ducted heat sink.
33. The cooling method of Claim 32 further comprising the steps of: b) providing said air stream through a second air duct; and c) providing said air stream through a second ducted heat sink.
34. In a computer system enclosed in a computer chassis, said computer system including a blowing means, a first air channel means, and a first heat sink means attached to one or more integrated circuit packages, a cooling method comprising the step of: a) employing said blowing means for providing an air stream originating from a source external to said computer chassis through said first air channel means to said first heat sink means.
35. The cooling method of claim 34 wherein the first heat sink means is a ducted heat sink means having ducts running through it, and the air stream flows through said ducted heat sink means.
36. The cooling method of Claim 35 further comprising the steps of: b) providing said air stream through a second air channel means; and c) providing said air stream through a second ducted heat sink means.
37. A method of combining a first extruded heat sink having a plurality of fins projecting from a base portion and a second extruded heat sink having a plurality of fins projecting from a different base portion, said method comprising the step of: using an attachment means to attach the first extruded heat sink to the second extruded heat sink to form a combined heat sink such that one or more ducts are created running through the combined heat sink.
38. The method of claim 37 wherein the attachment means is performed by a thermally conductive glue.
PCT/US1995/006769 1994-06-30 1995-05-25 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system WO1996001035A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE69533338T DE69533338T2 (en) 1994-06-30 1995-05-25 MULTIMIKRORECHNERKUEHLSYSTEM USING A BLOWER AND A KUEHLKOERPER WITH CONDITIONING VERBUND KUEHLRIPPEN FOR AIR INTRODUCTION
EP95920676A EP0803173B1 (en) 1994-06-30 1995-05-25 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
AU26055/95A AU2605595A (en) 1994-06-30 1995-05-25 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
JP8503157A JPH10502217A (en) 1994-06-30 1995-05-25 Opposite joint fin type heat sink and blower multi-microprocessor cooling system with duct
BR9508153A BR9508153A (en) 1994-06-30 1995-05-25 Multi-processor cooling system for opposing combined vane heatsink blowers with ducts
HK98103488A HK1004184A1 (en) 1994-06-30 1998-04-24 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system.

Applications Claiming Priority (2)

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US26943194A 1994-06-30 1994-06-30
US08/269,431 1994-06-30

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EP (1) EP0803173B1 (en)
JP (1) JPH10502217A (en)
CN (1) CN1095318C (en)
AU (1) AU2605595A (en)
BR (1) BR9508153A (en)
DE (1) DE69533338T2 (en)
HK (1) HK1004184A1 (en)
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0810511A1 (en) * 1996-05-14 1997-12-03 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
EP0892337A2 (en) * 1997-07-14 1999-01-20 Sun Microsystems, Inc. Shroud for attachment to motherboard
EP1244002A2 (en) * 2001-03-22 2002-09-25 Kabushiki Kaisha Toshiba Information processing apparatus having cooling air passage with a plurality of heat generating components interposed
EP1267598A2 (en) * 2001-06-13 2002-12-18 Fujikura Ltd. Cooling device for electronic unit
EP1343204A1 (en) * 2000-12-11 2003-09-10 Fujitsu Limited Electronic device unit
EP1420622A1 (en) * 2002-11-14 2004-05-19 Saint Song Corporation Apparatus and method for cooling
JP2004235258A (en) * 2003-01-28 2004-08-19 Fujitsu Ltd Air duct and electronic device
WO2015121069A1 (en) * 2014-02-14 2015-08-20 Fujitsu Technology Solutions Intellectual Property Gmbh Cooling arrangement for a computer system

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997027619A2 (en) * 1996-01-27 1997-07-31 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
US6046905A (en) 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
CN1093445C (en) * 1999-03-25 2002-10-30 富准精密工业(深圳)有限公司 Composite radiator and its prodn. method
CN1085569C (en) * 1999-04-02 2002-05-29 富准精密工业(深圳)有限公司 Manufacture of high-density radiator device
US6223970B1 (en) * 1999-05-11 2001-05-01 Yang-Shiau Chen Die set for welding fins and a base plate of a heat sink
WO2000077601A1 (en) * 1999-06-11 2000-12-21 Wang Jiung Jung The heat-radiator of a portable computer's cpu
US6430041B1 (en) 1999-10-20 2002-08-06 Micronpc, Llc Computer cooling system and method
US6938256B2 (en) 2000-01-18 2005-08-30 Galactic Computing Corporation System for balance distribution of requests across multiple servers using dynamic metrics
US6215662B1 (en) * 2000-03-13 2001-04-10 Intel Corporation Circuit board with interleaved TO-220 heat sinks
JP2001267771A (en) * 2000-03-17 2001-09-28 Hitachi Ltd Electronic apparatus
US6359781B1 (en) 2000-04-21 2002-03-19 Dell Products L.P. Apparatus for cooling heat generating devices
US6478082B1 (en) * 2000-05-22 2002-11-12 Jia Hao Li Heat dissipating apparatus with nest wind duct
US6940716B1 (en) * 2000-07-13 2005-09-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
US7844513B2 (en) * 2000-07-17 2010-11-30 Galactic Computing Corporation Bvi/Bc Method and system for operating a commissioned e-commerce service prover
US6816905B1 (en) * 2000-11-10 2004-11-09 Galactic Computing Corporation Bvi/Bc Method and system for providing dynamic hosted service management across disparate accounts/sites
US6452809B1 (en) 2000-11-10 2002-09-17 Galactic Computing Corporation Scalable internet engine
US8538843B2 (en) 2000-07-17 2013-09-17 Galactic Computing Corporation Bvi/Bc Method and system for operating an E-commerce service provider
US6396693B1 (en) * 2000-08-24 2002-05-28 Ming Fa Shih Heat sink
DE10058574B4 (en) * 2000-11-24 2005-09-15 Danfoss Drives A/S Cooling unit for power semiconductors
US6462948B1 (en) * 2001-06-25 2002-10-08 Intel Corporation Thermal management system for a multiple processor computer appliance
CA2456992A1 (en) * 2001-08-09 2003-02-20 Amy Elise Allen Electronics cooling subassembly
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
DE10141988C1 (en) * 2001-08-28 2003-01-09 Manfred Diels Modular heat sink manufacturing method uses transverse pressure for clamping projection of one extruded profile in channel of adjacent extruded profile by plastic deformation of Al wire
US7252139B2 (en) 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US6587343B2 (en) 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components
US6438984B1 (en) 2001-08-29 2002-08-27 Sun Microsystems, Inc. Refrigerant-cooled system and method for cooling electronic components
WO2003030608A1 (en) * 2001-10-04 2003-04-10 Celestica International Inc. Cooling system having independent fan location
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
US7143615B2 (en) * 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US6658736B1 (en) * 2002-08-09 2003-12-09 Unisys Corporation Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
EP1406147A1 (en) * 2002-10-02 2004-04-07 Saint Song Corporation Computer heat dissipating structure
EP1420331A1 (en) * 2002-11-14 2004-05-19 Saint Song Corporation Miniature computer and method for heat sink
US6765796B2 (en) 2002-11-21 2004-07-20 Teradyne, Inc. Circuit board cover with exhaust apertures for cooling electronic components
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US20040130870A1 (en) * 2003-01-07 2004-07-08 Vulcan Portals Inc. System and method for heat removal from a hand-held portable computer while docked
US20040215764A1 (en) * 2003-04-23 2004-10-28 Sun Microsystems, Inc. Method, system, and program for rendering a visualization of aggregations of network devices
US6978827B2 (en) * 2003-05-23 2005-12-27 Tyco Electronics Canada Ltd. Active heat sink
US7079387B2 (en) * 2003-06-11 2006-07-18 Hewlett-Packard Development Company, L.P. Computer cooling system and method
US6958915B2 (en) * 2003-10-07 2005-10-25 Hon Hai Precision Ind. Co., Ltd. Heat dissipating device for electronic component
US6967845B2 (en) * 2003-11-05 2005-11-22 Cpumate Inc. Integrated heat dissipating device with curved fins
TWI251460B (en) * 2004-01-09 2006-03-11 Delta Electronics Inc Compound heat sink with multi-directional fins
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US7256993B2 (en) * 2004-04-05 2007-08-14 Dell Products L.P. Adjustable heat sink shroud
US7460375B2 (en) * 2004-05-07 2008-12-02 Rackable Systems, Inc. Interface assembly
JP4265505B2 (en) * 2004-08-09 2009-05-20 オムロン株式会社 Heat dissipation structure of electronic equipment
DE202005001212U1 (en) * 2005-01-25 2005-06-09 Gerätebau Felix Schulte GmbH & Co. KG Arrangement for cooling multifunctional system consoles
TWI281376B (en) * 2005-02-25 2007-05-11 Foxconn Tech Co Ltd Cooling device for plural heat generating components
US20060215366A1 (en) * 2005-03-24 2006-09-28 Vinod Kamath Apparatus, system, and method for removing excess heat from a component
US7259965B2 (en) * 2005-04-07 2007-08-21 Intel Corporation Integrated circuit coolant microchannel assembly with targeted channel configuration
US7262964B1 (en) 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
CN100518475C (en) * 2006-06-02 2009-07-22 富准精密工业(深圳)有限公司 Heat radiating device
TW200822845A (en) * 2006-11-03 2008-05-16 Chroma Ate Inc Turbulence heat sink and heat dissipation assembly containing same
US7495916B2 (en) * 2007-06-19 2009-02-24 Honeywell International Inc. Low cost cold plate with film adhesive
CN101252821B (en) * 2007-10-12 2010-09-08 张文 Heat sinking method, system and device
JP4530054B2 (en) * 2008-01-23 2010-08-25 ソニー株式会社 Cooling ducts and electronics
TWI414235B (en) * 2009-08-24 2013-11-01 Compal Electronics Inc Heat dissipating module
WO2011131684A1 (en) 2010-04-23 2011-10-27 Napatech A/S A thermally controlled assembly
CN102196714A (en) * 2011-03-22 2011-09-21 网拓(上海)通信技术有限公司 Heat dissipation device
US20120293952A1 (en) * 2011-05-19 2012-11-22 International Business Machines Corporation Heat transfer apparatus
US8699226B2 (en) 2012-04-03 2014-04-15 Google Inc. Active cooling debris bypass fin pack
US20130306293A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Extruded matching set radiators
CN102769392A (en) * 2012-06-15 2012-11-07 张家港市泓溢电源科技有限公司 Power electric cabinet cooling system
KR102114069B1 (en) * 2012-10-26 2020-05-22 삼성전자주식회사 Cooling device for electronic machine
US11899509B2 (en) 2013-06-07 2024-02-13 Apple Inc. Computer housing
US9285846B2 (en) 2013-06-07 2016-03-15 Apple Inc. Computer thermal management
CN105224052A (en) * 2015-10-30 2016-01-06 同方计算机有限公司 Computer to dissipate heat cooling system
CN107526412A (en) * 2016-06-20 2017-12-29 凌今 Assemble air duct type heat radiator for computer chip
JP6645915B2 (en) * 2016-06-24 2020-02-14 三協立山株式会社 heatsink
JP2018074618A (en) * 2016-10-24 2018-05-10 パナソニックＩｐマネジメント株式会社 Heat dissipation structure of power supply device and on-vehicle power supply device
CN108107998A (en) * 2016-11-24 2018-06-01 研能科技股份有限公司 Be gas-cooled radiator
RU2707443C2 (en) * 2017-09-21 2019-11-26 Дмитрий Валерьевич Хачатуров Method of moisture removal from sealed housing of electronic device
WO2019045668A1 (en) * 2017-08-28 2019-03-07 Дмитрий Валерьевич ХАЧАТУРОВ System and method of forced air cooling for electrical device
DE102017217537B4 (en) 2017-10-02 2021-10-21 Danfoss Silicon Power Gmbh Power module with integrated cooling device
JP6699695B2 (en) 2018-09-07 2020-05-27 日本電気株式会社 Electronics
DE102019201417A1 (en) * 2019-02-05 2020-08-06 Robert Bosch Gmbh Cooling device for a sensor of a means of transportation and sensor assembly comprising the cooling device
JP7213388B2 (en) * 2019-03-29 2023-01-26 三協立山株式会社 Heat sink manufacturing method
JP7214535B2 (en) * 2019-03-29 2023-01-30 三協立山株式会社 Heat sink manufacturing method
DE102020124947B4 (en) 2020-09-24 2022-09-01 Rolf Eggers Air cooling arrangement and method for cooling electronic components
FR3119949A1 (en) * 2021-02-16 2022-08-19 Valeo Systèmes de Contrôle Moteur Electronic assembly with improved cooling circuit

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1150722B (en) * 1960-08-10 1963-06-27 Siemens Ag Ventilated rack insert for devices of high frequency technology with a klystron
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
DE3710198A1 (en) * 1987-03-27 1988-10-06 Zentro Elektrik Gmbh Kg Coolable arrangement
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
US5276584A (en) * 1991-10-31 1994-01-04 Northern Telecom Limited Electronic unit
US5297005A (en) * 1992-09-28 1994-03-22 Energy Innovations, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
US5349498A (en) * 1992-12-23 1994-09-20 Hughes Aircraft Company Integral extended surface cooling of power modules

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
JPS55113349A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Semiconductor device
US4360141A (en) * 1980-09-02 1982-11-23 Kensrue Milo M Holder for welding seam back-up tape
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
US4538168A (en) * 1981-09-30 1985-08-27 Unitrode Corporation High power semiconductor package
JPS607155A (en) * 1983-06-24 1985-01-14 Mitsubishi Electric Corp Heat dissipating device for electronic part
JPS60137042A (en) * 1983-12-26 1985-07-20 Matsushita Electronics Corp Resin-sealed semiconductor device
US4603374A (en) * 1984-07-03 1986-07-29 Motorola, Inc. Packaging module for a semiconductor wafer
JPS6139555A (en) * 1984-07-31 1986-02-25 Toshiba Corp Resin sealed type semiconductor device with heat sink
DE8429523U1 (en) * 1984-10-08 1984-11-29 Nixdorf Computer Ag, 4790 Paderborn Heat sinks for electronic components and / or devices
US4682268A (en) * 1985-02-07 1987-07-21 Nec Corporation Mounting structure for electronic circuit modules
US4605058A (en) * 1985-04-01 1986-08-12 The Staver Company, Inc. Heat dissipating retainer for electronic package
FR2585918A1 (en) * 1985-07-31 1987-02-06 Mcb Method and device for cooling electronic components and assemblies or subassemblies of electronic components
US4833567A (en) * 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
JPH073844B2 (en) * 1986-08-18 1995-01-18 株式会社日立製作所 Heat transfer device
JPS6355966A (en) * 1986-08-26 1988-03-10 Nec Corp Heat radiator of integrated circuit module
US4777560A (en) * 1987-09-02 1988-10-11 Microelectronics And Computer Technology Corporation Gas heat exchanger
JPS63205935A (en) * 1987-02-23 1988-08-25 Toshiba Corp Resin-sealed type semiconductor device equipped with heat sink
JPS6431443A (en) * 1987-07-27 1989-02-01 Nec Corp Semiconductor device
JPH0715963B2 (en) * 1987-08-31 1995-02-22 松下電器産業株式会社 Semiconductor device
US4833766A (en) * 1987-09-02 1989-05-30 Microelectronics And Computer Technology Corporation Method of making gas heat exchanger
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
US5289039A (en) * 1988-02-05 1994-02-22 Citizen Watch Co., Ltd. Resin encapsulated semiconductor device
JPH0249457A (en) * 1988-08-10 1990-02-19 Mitsubishi Electric Corp Semiconductor device
US4901201A (en) * 1988-10-25 1990-02-13 Sundstrand Corporation Plate fin/chic heat exchanger
US5028984A (en) * 1988-11-04 1991-07-02 International Business Machines Corporation Epoxy composition and use thereof
SU1691913A1 (en) * 1989-01-12 1991-11-15 Проектно-конструкторское бюро электрогидравлики АН УССР Heat-sink for cooling of semiconductor devices
SE467795B (en) * 1989-01-24 1992-09-14 Stig Lundbaeck DEPLACEMENT PUMP MAKES SIGNIFICANT VERTICAL COLLECTION
JPH02237055A (en) * 1989-03-09 1990-09-19 Matsushita Electron Corp Resin sealed type semiconductor device
JP2741255B2 (en) * 1989-08-18 1998-04-15 株式会社日立製作所 Heat transfer material for boiling cooling
JPH0378246A (en) * 1989-08-21 1991-04-03 Mitsubishi Electric Corp Resin-sealed type semiconductor device
US5227663A (en) * 1989-12-19 1993-07-13 Lsi Logic Corporation Integral dam and heat sink for semiconductor device assembly
JPH03268483A (en) * 1990-03-19 1991-11-29 Fuji Electric Co Ltd Cooling device for electronic equipment
US5105259A (en) * 1990-09-28 1992-04-14 Motorola, Inc. Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation
JPH088421B2 (en) * 1991-03-20 1996-01-29 さとみ 伊藤 Heat dissipation device
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1150722B (en) * 1960-08-10 1963-06-27 Siemens Ag Ventilated rack insert for devices of high frequency technology with a klystron
DE3710198A1 (en) * 1987-03-27 1988-10-06 Zentro Elektrik Gmbh Kg Coolable arrangement
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
US5276584A (en) * 1991-10-31 1994-01-04 Northern Telecom Limited Electronic unit
US5297005A (en) * 1992-09-28 1994-03-22 Energy Innovations, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
US5349498A (en) * 1992-12-23 1994-09-20 Hughes Aircraft Company Integral extended surface cooling of power modules

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0803173A4 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0810511A1 (en) * 1996-05-14 1997-12-03 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
US6094345A (en) * 1996-05-14 2000-07-25 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
EP0892337A2 (en) * 1997-07-14 1999-01-20 Sun Microsystems, Inc. Shroud for attachment to motherboard
EP0892337A3 (en) * 1997-07-14 1999-08-18 Sun Microsystems, Inc. Shroud for attachment to motherboard
EP1343204A1 (en) * 2000-12-11 2003-09-10 Fujitsu Limited Electronic device unit
EP1343204A4 (en) * 2000-12-11 2006-05-10 Fujitsu Ltd Electronic device unit
EP1244002A2 (en) * 2001-03-22 2002-09-25 Kabushiki Kaisha Toshiba Information processing apparatus having cooling air passage with a plurality of heat generating components interposed
EP1244002A3 (en) * 2001-03-22 2003-09-17 Kabushiki Kaisha Toshiba Information processing apparatus having cooling air passage with a plurality of heat generating components interposed
EP1267598A2 (en) * 2001-06-13 2002-12-18 Fujikura Ltd. Cooling device for electronic unit
EP1267598A3 (en) * 2001-06-13 2005-10-26 Fujikura Ltd. Cooling device for electronic unit
EP1420622A1 (en) * 2002-11-14 2004-05-19 Saint Song Corporation Apparatus and method for cooling
JP2004235258A (en) * 2003-01-28 2004-08-19 Fujitsu Ltd Air duct and electronic device
WO2015121069A1 (en) * 2014-02-14 2015-08-20 Fujitsu Technology Solutions Intellectual Property Gmbh Cooling arrangement for a computer system
US10488895B2 (en) 2014-02-14 2019-11-26 Fujitsu Client Computing Limited Cooling arrangement for computer system

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AU2605595A (en) 1996-01-25
JPH10502217A (en) 1998-02-24
DE69533338D1 (en) 2004-09-09
EP0803173A1 (en) 1997-10-29
BR9508153A (en) 1997-12-23
TW265430B (en) 1995-12-11
DE69533338T2 (en) 2005-09-08
CN1155370A (en) 1997-07-23
CN1095318C (en) 2002-11-27
EP0803173B1 (en) 2004-08-04
EP0803173A4 (en) 1997-12-10
US5912802A (en) 1999-06-15
HK1004184A1 (en) 1998-11-20

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