WO1996025741A3 - Mehrwertige festwertspeicherzelle mit verbessertem störabstand - Google Patents
Mehrwertige festwertspeicherzelle mit verbessertem störabstand Download PDFInfo
- Publication number
- WO1996025741A3 WO1996025741A3 PCT/DE1996/000168 DE9600168W WO9625741A3 WO 1996025741 A3 WO1996025741 A3 WO 1996025741A3 DE 9600168 W DE9600168 W DE 9600168W WO 9625741 A3 WO9625741 A3 WO 9625741A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- noise ratio
- storage location
- improved signal
- read
- valued read
- Prior art date
Links
- 230000015654 memory Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
- H01L29/7923—Programmable transistors with more than two possible different levels of programmation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5671—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge trapping in an insulator
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5692—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency read-only digital stores using storage elements with more than two stable states
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
- G11C16/0475—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS] comprising two or more independent storage sites which store independent data
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96901232A EP0809847B1 (de) | 1995-02-16 | 1996-02-05 | Mehrwertige festwertspeicherzelle mit verbessertem störabstand |
DE59600366T DE59600366D1 (de) | 1995-02-16 | 1996-02-05 | Mehrwertige festwertspeicherzelle mit verbessertem störabstand |
US08/875,955 US5825686A (en) | 1995-02-16 | 1996-02-05 | Multi-value read-only memory cell having an improved signal-to-noise ratio |
JP8524568A JPH11500559A (ja) | 1995-02-16 | 1996-02-05 | 改善されたsn比を有する多値固定値メモリセル |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19505293.5 | 1995-02-16 | ||
DE19505293A DE19505293A1 (de) | 1995-02-16 | 1995-02-16 | Mehrwertige Festwertspeicherzelle mit verbessertem Störabstand |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1996025741A2 WO1996025741A2 (de) | 1996-08-22 |
WO1996025741A3 true WO1996025741A3 (de) | 1997-02-06 |
Family
ID=7754185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1996/000168 WO1996025741A2 (de) | 1995-02-16 | 1996-02-05 | Mehrwertige festwertspeicherzelle mit verbessertem störabstand |
Country Status (9)
Country | Link |
---|---|
US (1) | US5825686A (de) |
EP (1) | EP0809847B1 (de) |
JP (1) | JPH11500559A (de) |
KR (1) | KR19980702220A (de) |
CN (1) | CN1107321C (de) |
AR (1) | AR000974A1 (de) |
DE (2) | DE19505293A1 (de) |
IN (1) | IN185754B (de) |
WO (1) | WO1996025741A2 (de) |
Families Citing this family (106)
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US6633499B1 (en) | 1997-12-12 | 2003-10-14 | Saifun Semiconductors Ltd. | Method for reducing voltage drops in symmetric array architectures |
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JP4697993B2 (ja) * | 1999-11-25 | 2011-06-08 | スパンション エルエルシー | 不揮発性半導体メモリ装置の制御方法 |
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JP2002208274A (ja) | 2000-11-10 | 2002-07-26 | Hitachi Ltd | 半導体記憶装置 |
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US9299390B2 (en) | 2011-09-01 | 2016-03-29 | HangZhou HaiCun Informationa Technology Co., Ltd. | Discrete three-dimensional vertical memory comprising off-die voltage generator |
US9117493B2 (en) | 2011-09-01 | 2015-08-25 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional memory comprising off-die address/data translator |
US8921991B2 (en) | 2011-09-01 | 2014-12-30 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional memory |
US8699257B2 (en) | 2011-09-01 | 2014-04-15 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional writable printed memory |
US9305605B2 (en) | 2011-09-01 | 2016-04-05 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional vertical memory |
US8890300B2 (en) | 2011-09-01 | 2014-11-18 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional memory comprising off-die read/write-voltage generator |
US9190412B2 (en) | 2011-09-01 | 2015-11-17 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional offset-printed memory |
US9305604B2 (en) | 2011-09-01 | 2016-04-05 | HangZhou HaiCun Information Technology Co., Ltd. | Discrete three-dimensional vertical memory comprising off-die address/data-translator |
US9508395B2 (en) | 2011-09-01 | 2016-11-29 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional one-time-programmable memory comprising off-die read/write-voltage generator |
US9559082B2 (en) | 2011-09-01 | 2017-01-31 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional vertical memory comprising dice with different interconnect levels |
US9024425B2 (en) | 2011-09-01 | 2015-05-05 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional memory comprising an integrated intermediate-circuit die |
US9123393B2 (en) | 2011-09-01 | 2015-09-01 | HangZhou KiCun nformation Technology Co. Ltd. | Discrete three-dimensional vertical memory |
US8679929B2 (en) * | 2011-12-06 | 2014-03-25 | Texas Instruments Incorporated | On current in one-time-programmable memory cells |
US9001555B2 (en) | 2012-03-30 | 2015-04-07 | Chengdu Haicun Ip Technology Llc | Small-grain three-dimensional memory |
US9293509B2 (en) | 2013-03-20 | 2016-03-22 | HangZhou HaiCun Information Technology Co., Ltd. | Small-grain three-dimensional memory |
US10304495B2 (en) | 2014-04-14 | 2019-05-28 | Chengdu Haicun Ip Technology Llc | Compact three-dimensional memory with semi-conductive address line portion |
US10304553B2 (en) | 2014-04-14 | 2019-05-28 | HangZhou HaiCun Information Technology Co., Ltd. | Compact three-dimensional memory with an above-substrate decoding stage |
US10079239B2 (en) | 2014-04-14 | 2018-09-18 | HangZhou HaiCun Information Technology Co., Ltd. | Compact three-dimensional mask-programmed read-only memory |
US10446193B2 (en) | 2014-04-14 | 2019-10-15 | HangZhou HaiCun Information Technology Co., Ltd. | Mixed three-dimensional memory |
US10199432B2 (en) | 2014-04-14 | 2019-02-05 | HangZhou HaiCun Information Technology Co., Ltd. | Manufacturing methods of MOSFET-type compact three-dimensional memory |
CN104979352A (zh) | 2014-04-14 | 2015-10-14 | 成都海存艾匹科技有限公司 | 混合型三维印录存储器 |
CN104978990B (zh) | 2014-04-14 | 2017-11-10 | 成都海存艾匹科技有限公司 | 紧凑型三维存储器 |
US10211258B2 (en) | 2014-04-14 | 2019-02-19 | HangZhou HaiCun Information Technology Co., Ltd. | Manufacturing methods of JFET-type compact three-dimensional memory |
KR102323612B1 (ko) * | 2015-11-23 | 2021-11-08 | 에스케이하이닉스 주식회사 | 반도체 메모리 장치 및 이의 동작 방법 |
US11170863B2 (en) | 2016-04-14 | 2021-11-09 | Southern University Of Science And Technology | Multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM) |
US10102917B2 (en) | 2016-04-14 | 2018-10-16 | Chengdu Haicun Ip Technology Llc | Multi-bit-per-cell three-dimensional one-time-programmable memory |
US10002872B2 (en) | 2016-04-16 | 2018-06-19 | Chengdu Haicun Ip Technology Llc | Three-dimensional vertical one-time-programmable memory |
US10559574B2 (en) | 2016-04-16 | 2020-02-11 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional vertical one-time-programmable memory comprising Schottky diodes |
US10490562B2 (en) | 2016-04-16 | 2019-11-26 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional vertical one-time-programmable memory comprising multiple antifuse sub-layers |
CN110534519B (zh) | 2018-05-27 | 2022-04-22 | 杭州海存信息技术有限公司 | 改进的三维纵向存储器 |
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DE3842511A1 (de) * | 1987-12-17 | 1989-06-29 | Mitsubishi Electric Corp | Nichtfluechtige halbleiterspeichereinrichtung mit einer einrichtung zum speichern von 3-pegel-daten |
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JP3317459B2 (ja) * | 1993-04-30 | 2002-08-26 | ローム株式会社 | 不揮発性記憶素子およびこれを利用した不揮発性記憶装置、この記憶装置の駆動方法、ならびにこの記憶素子の製造方法 |
-
1995
- 1995-02-16 DE DE19505293A patent/DE19505293A1/de not_active Withdrawn
- 1995-12-28 IN IN1748CA1995 patent/IN185754B/en unknown
-
1996
- 1996-02-05 JP JP8524568A patent/JPH11500559A/ja not_active Abandoned
- 1996-02-05 EP EP96901232A patent/EP0809847B1/de not_active Expired - Lifetime
- 1996-02-05 DE DE59600366T patent/DE59600366D1/de not_active Expired - Lifetime
- 1996-02-05 KR KR1019970705615A patent/KR19980702220A/ko active IP Right Grant
- 1996-02-05 WO PCT/DE1996/000168 patent/WO1996025741A2/de active IP Right Grant
- 1996-02-05 US US08/875,955 patent/US5825686A/en not_active Expired - Lifetime
- 1996-02-05 CN CN96191959A patent/CN1107321C/zh not_active Expired - Fee Related
- 1996-02-16 AR ARP960101414A patent/AR000974A1/es unknown
Patent Citations (5)
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GB2157489A (en) * | 1984-03-23 | 1985-10-23 | Hitachi Ltd | A semiconductor integrated circuit memory device |
DE3842511A1 (de) * | 1987-12-17 | 1989-06-29 | Mitsubishi Electric Corp | Nichtfluechtige halbleiterspeichereinrichtung mit einer einrichtung zum speichern von 3-pegel-daten |
EP0590319A2 (de) * | 1992-10-02 | 1994-04-06 | Matsushita Electric Industrial Co., Ltd. | Nichtflüchtige Speicherzelle |
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EP0643489A1 (de) * | 1993-05-24 | 1995-03-15 | Texas Instruments Incorporated | Binärkonverter |
Non-Patent Citations (1)
Title |
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"read only memory", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 28, no. 7, December 1985 (1985-12-01), NEW YORK US, pages 3048 - 3049, XP002004986 * |
Also Published As
Publication number | Publication date |
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EP0809847B1 (de) | 1998-07-22 |
IN185754B (de) | 2001-04-24 |
AR000974A1 (es) | 1997-08-27 |
US5825686A (en) | 1998-10-20 |
CN1174628A (zh) | 1998-02-25 |
DE59600366D1 (de) | 1998-08-27 |
KR19980702220A (ko) | 1998-07-15 |
JPH11500559A (ja) | 1999-01-12 |
EP0809847A2 (de) | 1997-12-03 |
WO1996025741A2 (de) | 1996-08-22 |
DE19505293A1 (de) | 1996-08-22 |
CN1107321C (zh) | 2003-04-30 |
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