WO1996030937A1 - A curing method and equipment design for epoxy mounted flip chip devices - Google Patents

A curing method and equipment design for epoxy mounted flip chip devices Download PDF

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Publication number
WO1996030937A1
WO1996030937A1 PCT/US1996/004086 US9604086W WO9630937A1 WO 1996030937 A1 WO1996030937 A1 WO 1996030937A1 US 9604086 W US9604086 W US 9604086W WO 9630937 A1 WO9630937 A1 WO 9630937A1
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WIPO (PCT)
Prior art keywords
assembly
substrate
conveyor
cover film
anisotropic adhesive
Prior art date
Application number
PCT/US1996/004086
Other languages
French (fr)
Inventor
Rickie Charles Lake
Original Assignee
Micron Technology, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology, Inc. filed Critical Micron Technology, Inc.
Priority to JP52957596A priority Critical patent/JP3626200B2/en
Publication of WO1996030937A1 publication Critical patent/WO1996030937A1/en

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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Definitions

  • This invention relates generally to electronics manufacturing and more particularly to a method and apparatus for mounting a component to a substrate using conductive anisotropic adhesives.
  • the method and apparatus are particularly suited to flip chip mounting unpackaged semiconductor dice on a substrate.
  • unpackaged semiconductor dice are mounted face down on a substrate such as a printed circuit board.
  • This type of mounting is referred to as flip chip mounting because each unpackaged die is flipped circuit side down onto the substrate.
  • flip chip mounting the bond pads on the die are in direct electrical contact with corresponding contact pads on the substrate.
  • anisotropic adhesives take the place of conventional solder and socket connections for securing the die to the substrate and also for establishing an electrical pathway.
  • Anisotropic adhesives are provided in a variety of forms. Anisotropic adhesives are formed such that electrical resistance in one direction through the material will differ from that measured in another direction. Typically high resistance is provided in at least one orthogonal direction (e.g., x-y direction) while low resistance is provided in the remaining orthogonal direction (e.g., z direction).
  • the conductivity in one direction is typically pressure sensitive requiring that the material be compressed in that direction.
  • Z-axis anisotropic adhesives are filled with conductive particles to a low level such that the particles do not contact each other in the x-y plane.
  • Z-axis anisotropic adhesives are formed as a viscous paste or as a film that is applied and then cured to harden. Both types of z-axis anisotropic adhesives (film or paste) come in a thermoplastic or thermosetting variety. Thermoplastic anisotropic adhesives are heated to soften for use and then cooled for curing. Thermoset anisotropic adhesives require heat curing. Using an anisotropic adhesive, a die can be adhered to a substrate and multiple connections can be made to the bond pads on the die with a single piece of material.
  • an improved method for mounting a component to a substrate using an anisotropic adhesive and an improved curing apparatus are provided.
  • the method and apparatus are used for flip chip mounting a semiconductor die to a substrate. Initially, an anisotropic adhesive is applied to the substrate and the die is placed on the anisotropic adhesive. During a heat curing process, a cover film is drawn over the die and substrate. The cover film exerts a uniform force on the die and maintains the anisotropic adhesive in compression.
  • the curing apparatus includes a heat source and a mesh conveyor belt. As the die and substrate are moved by the conveyor belt through the curing apparatus, an endless roll of cover film covers the substrate and die.
  • a vacuum plenum associated with the conveyor belt draws the cover film over the die and substrate holding these components together and exerting a compressive load on the anisotropic adhesive.
  • the anisotropic adhesive cures under compression.
  • the cover film withdraws, and the assembled components exit the curing apparatus.
  • the curing apparatus is formed as a bench top unit rather than with a conveyer belt.
  • the bench top curing apparatus includes a heated platen for the substrate, a vacuum plenum and a cover film that is drawn by the vacuum plenum over the die and substrate.
  • a curing apparatus for flip chip mounting broadly stated, comprises: an enclosed process chamber; a heat source for heating the process chamber; a conveyor for moving a substrate and die through the process chamber; an endless belt of cover film mounted with respect to the conveyor to move at a same speed as the substrate and die; and a vacuum plenum in fluid communication with a vacuum source and adapted to draw the cover film over the substrate and die.
  • Figure 1 A-1C are schematic diagrams illustrating the assembly of a die and substrate with an anisotropic adhesive therebetween;
  • Figure 2 is a cross sectional view taken along section line 2-2 illustrating application of force during a curing process for the anisotropic adhesive
  • Figure 3 is an enlarged schematic view illustrating the cured anisotropic adhesive and the conductive path from the die to the substrate;
  • Figure 4 is a schematic view of a conveyorized apparatus constructed in accordance with the invention for flip chip mounting a semiconductor die under a compressive load using an anisotropic adhesive;
  • Figure 5 is an enlarged schematic view illustrating a cover film of the apparatus of Figure 4 drawn over the die and substrate;
  • Figure 6 is a partial plan view of a conveyor which defines a plurality of vacuum openings therein; and Figure 7 is a schematic view of the invention for flip chip mounting a semiconductor die using an anisotropic adhesive.
  • a substrate 10 is used in the construction of a multi chip module.
  • the substrate 10 will typically be a printed circuit board formed with various circuits and electrical devices. Conductive, resistive and dielectric patterns of a circuit can be formed on the substrate 10 by screen printing or other suitable process.
  • the substrate 10 includes one or more die mounting areas 11 (Figure 1A).
  • the die mounting areas 11 include contact pads 13 that are to be electrically connected to corresponding contact locations on a semiconductor die 14 ( Figure 1C).
  • the contact pads 13 on the substrate 10 can be metal pads in electrical communication with circuit traces (not shown) on the substrate 10.
  • the semiconductor die 14 ( Figure 1C) can include corresponding contact locations formed as metal bumps 15 ( Figure 3).
  • This type of die 14 is known in the art as a bumped die.
  • a z-axis anisotropic adhesive 12 is applied to the die mounting area 11.
  • the z-axis anisotropic adhesive 12 can be formed as a thermoplastic adhesive.
  • the ⁇ noset epoxy based anisotropic adhesives are often referred to as z-axis conductive epoxies.
  • Suitable z-axis anisotropic adhesives are sold under the trademarks: "x-poly” and “z-poxy”, by A. I. Technology, Trenton, NJ; and "Shel-Zac", by Sheldahl, Northfield, MN.
  • Z-axis anisotropic adhesives are also sold by 3M, St. Paul, MN.
  • the z-axis anisotropic adhesive 12 can be deposited on the die mounting area 11 using a suitable process.
  • a screen printing process can be used to dispense the anisotropic adhesive 12 onto the substrate 10 in a desired pattern.
  • the film can be cut and then placed in contact with the die mounting area 11. The z-axis anisotropic adhesive 12 is heated during the deposition process.
  • the die 14 is placed over the z-axis anisotropic adhesive 12 and the elastomer is cured.
  • a force F is applied to the die 14.
  • the force F maintains the die 14 over the die mounting area 11 and compresses the z-axis anisotropic adhesive 12.
  • Thermoplastic z-axis anisotropic adhesives are cured by cooling.
  • Thermoset anisotropic adhesives are cured under heat.
  • the z-axis anisotropic adhesive 12 must be compressed during the curing process to permit conduction in the cured assembly.
  • the z-axis anisotropic adhesive 12 includes conductive particles 18 that conduct between the bumps 15 on the die 14 and the contact pads 13 on the substrate 10.
  • the bumps 15 on the die 14 press against the z-axis anisotropic adhesive 12 which presses against the contact pads 13 on the substrate 10.
  • conduction is provided in a z-direction
  • the z-axis anisotropic adhesive 12 provides insulation in the x and y directions.
  • the conveyorized curing apparatus broadly stated, comprises: an enclosed process chamber 22; a heat source 24 for heating the process chamber 22 to a predetermined temperature; an open mesh conveyor 26 for moving the substrate 10 and flip chip mounted dice 14 through the process chamber 22; an endless belt of cover film 30 adapted to move at a same speed as the conveyor 26; and a vacuum plenum 28 adapted to draw the cover film 30 over the substrate 10 and die 14.
  • the conveyorized curing apparatus 20 is similar in construction to a conveyorized curing oven.
  • the process chamber 22 for the curing apparatus 20 includes an entrance opening 32 and an exit opening 34.
  • the heat source 24 is adapted to heat the process chamber 22 to a predetermined temperature. Depending on the anisotropic adhesive, this temperature is preferably on the order of 100°C to 300°C.
  • the heat source 24 can be gas or electric.
  • the open mesh conveyor 26 is mounted on drive rollers 36, 38 which rotate as indicated by directional arrows 40, 42.
  • the conveyor 26 is adapted to move the substrate 10 and dice 14 through the process chamber 22 from the entrance opening 32 to the exit opening 34 of the curing apparatus 20.
  • the speed of the conveyor 26 is selected to provide a predetermined cure time (e.g., 20-30 minutes) within the process chamber 22.
  • the vacuum plenum 28 and cover film 30 cooperate to apply a uniform pressure across the substrate 10 and dice 14. This is accomplished as the substrate 10 and dice 14 are moved through the process chamber 22 by the conveyor 26.
  • the cover film 30 moves at the same speed as the conveyor 26. This uniform pressure forces each die 14 and its respective substrate 10 together, and compresses the z-axis anisotropic adhesive 12 ( Figure 2) therebetween.
  • the cover film 30 is formed as an endless loop of material mounted to a pair of drive rollers 44, 46.
  • the drive rollers 44, 46 rotate as indicated by arrows 48, 50 and move the cover film 30 in the same direction and at the same speed as the conveyor 26.
  • the cover film 30 can be formed of any flexible, heat resistant material. Suitable materials include thin polymeric or elastomeric materials such as polyester, silicone, rubber (natural or synthetic) or Teflon (tetrafluoroethylene fluorocaibon polymers, fluorinated ethylene propylene).
  • the cover film 30 can also be formed of metal foil. Another requirement is that the cover film be slightly larger in width than the width of the substrate 10.
  • the cover film 30 is drawn over the substrate 10 and dice 14 by the vacuum plenum 28.
  • the vacuum plenum 28 is in communication with a vacuum source 52.
  • the vacuum plenum 28 can include vacuum openings 54 for drawing the cover film 30 against the conveyor 26.
  • the conveyor 26 is formed of open mesh chain so that the vacuum source 52 has a substantially unobstructed path to the cover film 30.
  • the placement and construction of the drive rollers 44, 46 for the cover film 30 is such that the cover film 30 is drawn over the substrate 10 and dice 14 as the uncured components pass through the entrance opening 32 for the process chamber.
  • the drive rollers 44, 46 are constructed to release the cover film 30 from the substrates 10 and dice 14 as the fully cured components pass through the exit opening 34 for the process chamber 22.
  • the cover film 30 completely envelopes the pre-assembled substrate 10 and dice 14 as these mated components travel through the curing apparatus 20.
  • the vacuum source 52 exerts a negative pressure that is selected to exert a desired force on the cover film 30.
  • the cover film 30 exerts a force on the dice 14 which is on the order of 6,895 Newtons per square meter (1 lb/in 2 ) to 137,900 Newtons per square meter (20 lbs/in 2 ). In addition this force is exerted uniformly across the back side of the dice 14.
  • the cover film, 30 thus functions to compress the anisotropic adhesive 12 (Figure 2) during the curing process.
  • the anisotropic adhesive 12 is cured.
  • the curing time is determined by the speed of the conveyor 26.
  • the cover film 30 is adapted to pull away from the substrate 10 and dice 14. The force on each die 14 is thus withdrawn and the fully cured components exist the curing apparatus 20.
  • the bench top curing apparatus 60 includes a heated platen 62 for supporting one or more substrates 10.
  • the heated platen 62 is in flow communication with a vacuum plenum 64.
  • the vacuum plenum 62 is in flow communication with a vacuum source 68 and is adapted to draw a cover film 66 over the substrate 10 and flip chip mounted dice 14. This allows the anisotropic adhesive 12 between the dice 14 and substrate 10 to cure substantially as previously described.
  • the invention provides an improved method and apparatus for mounting a component to a substrate particularly adapted for flip chip mounting semiconductor dice on a substrate. While the invention has been described with reference to certain preferred embodiments, as will be apparent to those skilled in the art, certain changes and modifications can be made without departing from the scope of the invention as defined by the following claims.

Abstract

A method and apparatus for mounting a component, such as a semiconductor die (14), to a substrate (10) are provided. A z-axis anisotropic adhesive (12) is applied to the substrate (10) and the component is placed on the anisotropic adhesive (12). During a curing process a cover film (30) is drawn over the component and substrate (10) to maintain the anisotropic adhesive (12) in compression. A conveyorized curing apparatus includes a conveyor belt (26) for moving the substrate (10) through a heated process chamber (22). The cover film (30) is mounted on an endless belt and is adapted to move at a same speed as the conveyor belt. As the die (14) and substrate (10) are moved through the process chamber (22), a vacuum plenum (28) draws the cover film (30) over the die (14) and substrate (10) to exert a uniform force on the component.

Description

A CURING METHOD AND EQUIPMENT DESIGN FOR EPOXY MOUNTED FLIP CHIP DEVICES
Technical Field
This invention relates generally to electronics manufacturing and more particularly to a method and apparatus for mounting a component to a substrate using conductive anisotropic adhesives. The method and apparatus are particularly suited to flip chip mounting unpackaged semiconductor dice on a substrate.
Background
In the manufacture of microelectronic packages called hybrids, or multi chip modules, unpackaged semiconductor dice are mounted face down on a substrate such as a printed circuit board. This type of mounting is referred to as flip chip mounting because each unpackaged die is flipped circuit side down onto the substrate. With flip chip mounting the bond pads on the die are in direct electrical contact with corresponding contact pads on the substrate.
One method of attaching a flip chip mounted semiconductor die to a substrate employs anisotropic adhesives. A anisotropic adhesive takes the place of conventional solder and socket connections for securing the die to the substrate and also for establishing an electrical pathway.
Anisotropic adhesives are provided in a variety of forms. Anisotropic adhesives are formed such that electrical resistance in one direction through the material will differ from that measured in another direction. Typically high resistance is provided in at least one orthogonal direction (e.g., x-y direction) while low resistance is provided in the remaining orthogonal direction (e.g., z direction).
The conductivity in one direction is typically pressure sensitive requiring that the material be compressed in that direction.
One type of conductive anisotropic adhesive is known as a z-axis anisotropic adhesive. Z-axis anisotropic adhesives are filled with conductive particles to a low level such that the particles do not contact each other in the x-y plane.
Compression in the z-direction establishes an electrical path. Z-axis anisotropic adhesives are formed as a viscous paste or as a film that is applied and then cured to harden. Both types of z-axis anisotropic adhesives (film or paste) come in a thermoplastic or thermosetting variety. Thermoplastic anisotropic adhesives are heated to soften for use and then cooled for curing. Thermoset anisotropic adhesives require heat curing. Using an anisotropic adhesive, a die can be adhered to a substrate and multiple connections can be made to the bond pads on the die with a single piece of material.
One problem with flip chip mounting using z-axis anisotropic adhesives is that the conductivity of the material is pressure sensitive. Accordingly the anisotropic adhesive must be compressed during the curing process to establish a permanent electrical connection through the material. In the past, compression of the z-axis anisotropic adhesive has been accomplished by maintaining a load on the die during the curing process. This load is typically applied using some type of mechanical tooling fixture.
One problem with this type of arrangement is that mechanical fixtures tend to be complex and expensive. Mechanical fixtures also have a tendency to damage the die or substrate. In addition, the compressive load must be maintained for a relatively long time period, which is required to sufficiently cure the elastomer (e.g., twenty to thirty minutes). For a high volume manufacturing process this type of curing process is unacceptably long. Additionally, if more than one flip chip is to be attached, a sequential process is used in which one chip is attached and cured, followed by attachment and curing of subsequent chips. This sequential process can result in multiple high temperature exposure of some of the chips.
In view of the foregoing, it is an object of the present invention to provide an improved method and apparatus for mounting components to a substrate using anisotropic adhesives. It is a further object of the present invention to provide an improved method and apparatus for flip chip mounting semiconductor dice to a substrate. It is yet another object of the present invention to provide an improved method and apparatus for flip chip mounting semiconductor dice that are compatible with high volume manufacturing operations. Other objects, advantages and capabilities of the present invention will become more apparent as the description proceeds. Disclosure of the Invention
In accordance with the present invention, an improved method for mounting a component to a substrate using an anisotropic adhesive, and an improved curing apparatus are provided. In an illustrative embodiment the method and apparatus are used for flip chip mounting a semiconductor die to a substrate. Initially, an anisotropic adhesive is applied to the substrate and the die is placed on the anisotropic adhesive. During a heat curing process, a cover film is drawn over the die and substrate. The cover film exerts a uniform force on the die and maintains the anisotropic adhesive in compression. In an illustrative embodiment, the curing apparatus includes a heat source and a mesh conveyor belt. As the die and substrate are moved by the conveyor belt through the curing apparatus, an endless roll of cover film covers the substrate and die. A vacuum plenum associated with the conveyor belt, draws the cover film over the die and substrate holding these components together and exerting a compressive load on the anisotropic adhesive. As the die and substrate are moved along the heat source, the anisotropic adhesive cures under compression. Once the die and substrate are moved past the vacuum plenum, the cover film withdraws, and the assembled components exit the curing apparatus. In an alternate embodiment, the curing apparatus is formed as a bench top unit rather than with a conveyer belt. The bench top curing apparatus includes a heated platen for the substrate, a vacuum plenum and a cover film that is drawn by the vacuum plenum over the die and substrate.
The method for flip chip bonding, broadly stated, includes the steps of: assembling a die and substrate with an anisotropic adhesive therebetween; drawing a cover film over the die and substrate to compress the anisotropic adhesive; curing the anisotropic adhesive while the anisotropic adhesive is compressed; and then withdrawing the cover film from the die and substrate.
A curing apparatus for flip chip mounting, broadly stated, comprises: an enclosed process chamber; a heat source for heating the process chamber; a conveyor for moving a substrate and die through the process chamber; an endless belt of cover film mounted with respect to the conveyor to move at a same speed as the substrate and die; and a vacuum plenum in fluid communication with a vacuum source and adapted to draw the cover film over the substrate and die. Brief Description of the Drawings
Figure 1 A-1C are schematic diagrams illustrating the assembly of a die and substrate with an anisotropic adhesive therebetween;
Figure 2 is a cross sectional view taken along section line 2-2 illustrating application of force during a curing process for the anisotropic adhesive;
Figure 3 is an enlarged schematic view illustrating the cured anisotropic adhesive and the conductive path from the die to the substrate;
Figure 4 is a schematic view of a conveyorized apparatus constructed in accordance with the invention for flip chip mounting a semiconductor die under a compressive load using an anisotropic adhesive;
Figure 5 is an enlarged schematic view illustrating a cover film of the apparatus of Figure 4 drawn over the die and substrate;
Figure 6 is a partial plan view of a conveyor which defines a plurality of vacuum openings therein; and Figure 7 is a schematic view of the invention for flip chip mounting a semiconductor die using an anisotropic adhesive.
Best Mode of the Invention
With reference to Figures 1A-1C, a substrate 10 is used in the construction of a multi chip module. The substrate 10 will typically be a printed circuit board formed with various circuits and electrical devices. Conductive, resistive and dielectric patterns of a circuit can be formed on the substrate 10 by screen printing or other suitable process.
The substrate 10 includes one or more die mounting areas 11 (Figure 1A). The die mounting areas 11 include contact pads 13 that are to be electrically connected to corresponding contact locations on a semiconductor die 14 (Figure 1C). As an example, the contact pads 13 on the substrate 10 can be metal pads in electrical communication with circuit traces (not shown) on the substrate 10. The semiconductor die 14 (Figure 1C) can include corresponding contact locations formed as metal bumps 15 (Figure 3). This type of die 14 is known in the art as a bumped die. As shown in Figure IB, a z-axis anisotropic adhesive 12 is applied to the die mounting area 11. The z-axis anisotropic adhesive 12 can be formed as a thermoplastic adhesive. Theπnoset epoxy based anisotropic adhesives are often referred to as z-axis conductive epoxies. Suitable z-axis anisotropic adhesives are sold under the trademarks: "x-poly" and "z-poxy", by A. I. Technology, Trenton, NJ; and "Shel-Zac", by Sheldahl, Northfield, MN. Z-axis anisotropic adhesives are also sold by 3M, St. Paul, MN.
The z-axis anisotropic adhesive 12 can be deposited on the die mounting area 11 using a suitable process. For a z-axis anisotropic adhesive 12 formed as a viscous paste, a screen printing process can be used to dispense the anisotropic adhesive 12 onto the substrate 10 in a desired pattern. For a z-axis anisotropic adhesive 12 formed as a film, the film can be cut and then placed in contact with the die mounting area 11. The z-axis anisotropic adhesive 12 is heated during the deposition process. Next, as shown in Figure 1C, the die 14 is placed over the z-axis anisotropic adhesive 12 and the elastomer is cured. As shown in Figure 2, during the curing process a force F is applied to the die 14. The force F maintains the die 14 over the die mounting area 11 and compresses the z-axis anisotropic adhesive 12. Thermoplastic z-axis anisotropic adhesives are cured by cooling. Thermoset anisotropic adhesives are cured under heat.
In general, the z-axis anisotropic adhesive 12 must be compressed during the curing process to permit conduction in the cured assembly. As shown in Figure 3, the z-axis anisotropic adhesive 12 includes conductive particles 18 that conduct between the bumps 15 on the die 14 and the contact pads 13 on the substrate 10. The bumps 15 on the die 14 press against the z-axis anisotropic adhesive 12 which presses against the contact pads 13 on the substrate 10. Although conduction is provided in a z-direction, the z-axis anisotropic adhesive 12 provides insulation in the x and y directions.
The pitch or spacing of the bumps 15 and contact pads 13 must be approximately equal. Using this arrangement, numerous low resistance electrical contacts can be made with a single continuous segment of z-axis anisotropic adhesive 12. The z-axis anisotropic adhesive 12 in addition to providing conduction adheres the die 14 to the substrate 10. Referring now to Figures 4 and 5, a conveyorized curing apparatus 20 constructed in accordance with the invention is shown. The conveyorized curing apparatus 20, broadly stated, comprises: an enclosed process chamber 22; a heat source 24 for heating the process chamber 22 to a predetermined temperature; an open mesh conveyor 26 for moving the substrate 10 and flip chip mounted dice 14 through the process chamber 22; an endless belt of cover film 30 adapted to move at a same speed as the conveyor 26; and a vacuum plenum 28 adapted to draw the cover film 30 over the substrate 10 and die 14.
The conveyorized curing apparatus 20 is similar in construction to a conveyorized curing oven. The process chamber 22 for the curing apparatus 20 includes an entrance opening 32 and an exit opening 34. The heat source 24 is adapted to heat the process chamber 22 to a predetermined temperature. Depending on the anisotropic adhesive, this temperature is preferably on the order of 100°C to 300°C. The heat source 24 can be gas or electric. The open mesh conveyor 26 is mounted on drive rollers 36, 38 which rotate as indicated by directional arrows 40, 42. The conveyor 26 is adapted to move the substrate 10 and dice 14 through the process chamber 22 from the entrance opening 32 to the exit opening 34 of the curing apparatus 20. The speed of the conveyor 26 is selected to provide a predetermined cure time (e.g., 20-30 minutes) within the process chamber 22.
The vacuum plenum 28 and cover film 30 cooperate to apply a uniform pressure across the substrate 10 and dice 14. This is accomplished as the substrate 10 and dice 14 are moved through the process chamber 22 by the conveyor 26. The cover film 30 moves at the same speed as the conveyor 26. This uniform pressure forces each die 14 and its respective substrate 10 together, and compresses the z-axis anisotropic adhesive 12 (Figure 2) therebetween.
The cover film 30 is formed as an endless loop of material mounted to a pair of drive rollers 44, 46. The drive rollers 44, 46 rotate as indicated by arrows 48, 50 and move the cover film 30 in the same direction and at the same speed as the conveyor 26.
The cover film 30 can be formed of any flexible, heat resistant material. Suitable materials include thin polymeric or elastomeric materials such as polyester, silicone, rubber (natural or synthetic) or Teflon (tetrafluoroethylene fluorocaibon polymers, fluorinated ethylene propylene). The cover film 30 can also be formed of metal foil. Another requirement is that the cover film be slightly larger in width than the width of the substrate 10.
The cover film 30 is drawn over the substrate 10 and dice 14 by the vacuum plenum 28. As shown in Figure 5, the vacuum plenum 28 is in communication with a vacuum source 52. Additionally, as shown in Figure 6, the vacuum plenum 28 can include vacuum openings 54 for drawing the cover film 30 against the conveyor 26. Preferably, the conveyor 26 is formed of open mesh chain so that the vacuum source 52 has a substantially unobstructed path to the cover film 30.
The placement and construction of the drive rollers 44, 46 for the cover film 30 is such that the cover film 30 is drawn over the substrate 10 and dice 14 as the uncured components pass through the entrance opening 32 for the process chamber. Similarly, the drive rollers 44, 46 are constructed to release the cover film 30 from the substrates 10 and dice 14 as the fully cured components pass through the exit opening 34 for the process chamber 22.
As clearly shown in Figure 5, the cover film 30 completely envelopes the pre-assembled substrate 10 and dice 14 as these mated components travel through the curing apparatus 20. The vacuum source 52 exerts a negative pressure that is selected to exert a desired force on the cover film 30. The cover film 30 exerts a force on the dice 14 which is on the order of 6,895 Newtons per square meter (1 lb/in2) to 137,900 Newtons per square meter (20 lbs/in2). In addition this force is exerted uniformly across the back side of the dice 14.
The cover film, 30 thus functions to compress the anisotropic adhesive 12 (Figure 2) during the curing process. As the substrate 10 and dice 14, continue to move through the curing apparatus 20, the anisotropic adhesive 12 is cured. The curing time is determined by the speed of the conveyor 26. At the exit opening 34 the cover film 30 is adapted to pull away from the substrate 10 and dice 14. The force on each die 14 is thus withdrawn and the fully cured components exist the curing apparatus 20.
Referring now to Figure 7, a bench top curing apparatus 60 is shown. The bench top curing apparatus 60 includes a heated platen 62 for supporting one or more substrates 10. The heated platen 62 is in flow communication with a vacuum plenum 64. The vacuum plenum 62 is in flow communication with a vacuum source 68 and is adapted to draw a cover film 66 over the substrate 10 and flip chip mounted dice 14. This allows the anisotropic adhesive 12 between the dice 14 and substrate 10 to cure substantially as previously described. Thus the invention provides an improved method and apparatus for mounting a component to a substrate particularly adapted for flip chip mounting semiconductor dice on a substrate. While the invention has been described with reference to certain preferred embodiments, as will be apparent to those skilled in the art, certain changes and modifications can be made without departing from the scope of the invention as defined by the following claims.

Claims

WHAT IS CLAIMED IS:
1. A method for mounting a component to a substrate comprising: forming an assembly comprised of the component positioned on the substrate with a anisotropic adhesive positioned between the substrate and the component; drawing a cover film over the assembly; compressing the anisotropic adhesive between the component and the substrate; curing the anisotropic adhesive while under compression; and withdrawing the cover film from the component and the substrate.
2. The method according to Claim 1, wherein the step of drawing the cover film over the assembly is effected by applying a vacuum to the cover film.
3. The method according to Claim 2 further comprising applying a sufficient vacuum to the cover film to abut the cover film against the assembly to compress the anisotropic adhesive between the component and the substrate.
4. The method according to Claim 1 further comprising applying heat to the assembly from below the assembly.
5. The method according to Claim 1 further comprising applying heat to the assembly from above the assembly.
6. The method according to Claim 5 further comprising applying heat also from below the assembly.
7. The method according to Claim 1, wherein the anisotropic adhesive is selected from the class consisting of thermoplastic and thermoset z-axis anisotropic adhesives.
8. The method according to Claim 1 wherein the assembly is moved through a process chamber by the first conveyor to effect the curing of the anisotropic adhesive.
9. The method according to Claim 1, wherein the cover film is selected from the group consisting of polyester, tetrafluoroethylene fluorocaibon polymers, silicone, natural rubber, synthetic rubber, fluorinated ethylene propylene and metal foil.
10. The method according to Claim 1 further comprising applying the anisotropic adhesive to the substrate in the form of a viscous paste.
11. The method according to Claim 1 further comprising applying the anisotropic adhesive to the substrate in the form of a film.
12. The method according to claim 1 further comprising curing the anisotropic adhesive by moving the assembly through a process chamber, wherein heat is applied to the assembly from above the assembly.
13. The method according to claim 1 further comprising curing the anisotropic adhesive by moving the assembly through a process chamber wherein heat is also applied to the assembly from below the assembly.
14. The method according to claim 1, wherein the cover film is in the form of an endless member trained about a pair of drive rollers.
15. The method according to Claim 1, wherein the anisotropic adhesive is cured by placement of the assembly on a heated platen.
16. The method according to Claim 1 further comprising the steps of: providing a first conveyor and a second conveyor, the cover film being mechanically associated with the second conveyor; positioning the assembly on the first conveyor; and operating the second conveyor to draw the cover film over the assembly positioned on the first conveyor.
17. The method according to Claim 16 further comprising curing the anisotropic adhesive by operating the first conveyor to move the assembly, with the cover film drawn over the assembly, through a process chamber and applying heat to the assembly.
18. The method according to Claim 16 further comprising the step of operating the first conveyor at a speed identical to the speed of the second conveyor.
19. The method according to Claim 16, wherein the second conveyor draws the cover film over the assembly prior to its entrance into the process chamber and maintains the cover film in contact with the assembly during the transit of the assembly through the process chamber and then withdraws the cover film from the assembly thereafter.
20. The method according to Claim 16, wherein the cover film is made of a material selected form the group consisting of polyester, tetrafluoroethylene fluorocaibon polymers, silicon, natural rubber, synthetic rubber, fluorinated ethylene propylene and metal foil.
21. The method according to Claim 16, wherein a vacuum is directed through a conveyor belt of the first conveyor.
22. An apparatus for curing an anisotropic adhesive positioned between a component and a substrate, said apparatus comprising: a process chamber; a heat source, associated with the process chamber, for supplying heat to the process chamber; a first conveyor, positioned within the process chamber, for moving the anisotropic adhesive through the process chamber; a second conveyor, having a cover film associated therewith, the second conveyor being positioned in the process chamber, adjacent the first conveyor for facilitating placement and retention of the cover film over the component and substrate as the component and substrate move through the process chamber; and a vacuum plenum in fluid communication with a vacuum source, the vacuum plenum being positioned adjacent a conveyor belt of the first conveyor; the vacuum plenum being adapted to draw the cover film over the substrate and component to exert a force on the component and compress the anisotropic adhesive between the component and the substrate, during the curing of the anisotropic adhesive.
23. The apparatus according to claim 22, wherein the cover film is mounted on drive rollers.
24. The apparatus according to 22, wherein the cover film is formed of a material selected from the group consisting of tetrafluoroethylene fluorocarbon polymers, polyester, silicone, natural rubber, fluorinated ethylene propylene, synthetic rubber and metal foil.
25. The apparatus according to claim 22, wherein the heat source is positioned elevationally above the first conveyor.
26. The apparatus of claim 22, wherein the heat source is positioned to apply heat to the substrate from a location elevationally below the substrate.
27. The apparatus according to claim 22, wherein the heat source is positioned elevationally below the conveyor belt of the first conveyor.
28. The apparatus of claim 22, wherein a conveyor belt of the first conveyor defines a plurality of apertures therethrough to facilitate an application of vacuum through the conveyor belt.
PCT/US1996/004086 1995-03-27 1996-03-26 A curing method and equipment design for epoxy mounted flip chip devices WO1996030937A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10019443A1 (en) * 2000-04-19 2001-10-31 Texas Instruments Deutschland Device for fastening a semiconductor chip on a chip carrier
DE10140661C1 (en) * 2001-08-24 2003-01-16 Orga Kartensysteme Gmbh Production of a flip-chip module, comprises placing chip on a continuously moving support using an adhesive, and applying a pressure to the chips on the support until the adhesive is hardened
DE10200538A1 (en) * 2002-01-09 2003-07-24 Infineon Technologies Ag Device and method for the flat compression of disc-shaped elements to be connected
DE102005006978B3 (en) * 2005-02-15 2006-06-08 Mühlbauer Ag Method for joining semiconductor components with a flexible support band comprises moving an endless band parallel to the running direction of the support band between heating elements and the components
WO2014001446A1 (en) 2012-06-28 2014-01-03 Muehlbauer Ag Thermocompression device and method for bonding electrical components to a substrate

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
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US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
US6273339B1 (en) 1999-08-30 2001-08-14 Micron Technology, Inc. Tamper resistant smart card and method of protecting data in a smart card
US6513236B2 (en) * 2000-02-18 2003-02-04 Matsushita Electric Industrial Co., Ltd. Method of manufacturing bump-component mounted body and device for manufacturing the same
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JP2022092661A (en) 2020-12-11 2022-06-23 日本航空電子工業株式会社 Device and method of manufacturing device

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382833A (en) * 1981-08-25 1983-05-10 Rca Corporation Vacuum lamination fixture
US4863546A (en) * 1983-07-01 1989-09-05 Roland Melzer Apparatus and method for manufacturing plastic cards
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
US4997507A (en) * 1988-06-03 1991-03-05 Herbert Meyer Gmbh & Co. Kg Method and apparatus for bonding laminar workpieces
FR2659344A1 (en) * 1990-03-09 1991-09-13 Thomson Csf Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use
US5107586A (en) * 1988-09-27 1992-04-28 General Electric Company Method for interconnecting a stack of integrated circuits at a very high density
US5292388A (en) * 1991-08-09 1994-03-08 Morton International, Inc. Conveyorized vacuum applicator and method therefor
US5352629A (en) * 1993-01-19 1994-10-04 General Electric Company Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
US5365656A (en) * 1991-09-06 1994-11-22 At&T Corp. Surface mount assembly of devices using AdCon interconnections
US5367253A (en) * 1991-06-04 1994-11-22 Micron Semiconductor, Inc. Clamped carrier for testing of semiconductor dies
US5490900A (en) * 1993-04-01 1996-02-13 Held; Kurt In-line applications of facing foils to particle boards
US5495179A (en) * 1991-06-04 1996-02-27 Micron Technology, Inc. Carrier having interchangeable substrate used for testing of semiconductor dies

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729166A (en) * 1985-07-22 1988-03-08 Digital Equipment Corporation Method of fabricating electrical connector for surface mounting
US5467253A (en) * 1994-06-30 1995-11-14 Motorola, Inc. Semiconductor chip package and method of forming

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382833A (en) * 1981-08-25 1983-05-10 Rca Corporation Vacuum lamination fixture
US4863546A (en) * 1983-07-01 1989-09-05 Roland Melzer Apparatus and method for manufacturing plastic cards
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
US4997507A (en) * 1988-06-03 1991-03-05 Herbert Meyer Gmbh & Co. Kg Method and apparatus for bonding laminar workpieces
US5107586A (en) * 1988-09-27 1992-04-28 General Electric Company Method for interconnecting a stack of integrated circuits at a very high density
FR2659344A1 (en) * 1990-03-09 1991-09-13 Thomson Csf Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use
US5367253A (en) * 1991-06-04 1994-11-22 Micron Semiconductor, Inc. Clamped carrier for testing of semiconductor dies
US5495179A (en) * 1991-06-04 1996-02-27 Micron Technology, Inc. Carrier having interchangeable substrate used for testing of semiconductor dies
US5292388A (en) * 1991-08-09 1994-03-08 Morton International, Inc. Conveyorized vacuum applicator and method therefor
US5365656A (en) * 1991-09-06 1994-11-22 At&T Corp. Surface mount assembly of devices using AdCon interconnections
US5352629A (en) * 1993-01-19 1994-10-04 General Electric Company Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
US5490900A (en) * 1993-04-01 1996-02-13 Held; Kurt In-line applications of facing foils to particle boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, Volume 9, No. 10, issued 10 March 1967, R.F. PENOYER, "Thin Foil Laminator", page 1411. *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10019443A1 (en) * 2000-04-19 2001-10-31 Texas Instruments Deutschland Device for fastening a semiconductor chip on a chip carrier
DE10140661C1 (en) * 2001-08-24 2003-01-16 Orga Kartensysteme Gmbh Production of a flip-chip module, comprises placing chip on a continuously moving support using an adhesive, and applying a pressure to the chips on the support until the adhesive is hardened
DE10200538A1 (en) * 2002-01-09 2003-07-24 Infineon Technologies Ag Device and method for the flat compression of disc-shaped elements to be connected
DE10200538B4 (en) * 2002-01-09 2004-01-08 Infineon Technologies Ag Device and method for the flat compression of disc-shaped elements to be connected
DE102005006978B3 (en) * 2005-02-15 2006-06-08 Mühlbauer Ag Method for joining semiconductor components with a flexible support band comprises moving an endless band parallel to the running direction of the support band between heating elements and the components
WO2014001446A1 (en) 2012-06-28 2014-01-03 Muehlbauer Ag Thermocompression device and method for bonding electrical components to a substrate

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US5605547A (en) 1997-02-25

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