WO1997013301A1 - Test socket for leadless ic device - Google Patents

Test socket for leadless ic device Download PDF

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Publication number
WO1997013301A1
WO1997013301A1 PCT/US1996/016018 US9616018W WO9713301A1 WO 1997013301 A1 WO1997013301 A1 WO 1997013301A1 US 9616018 W US9616018 W US 9616018W WO 9713301 A1 WO9713301 A1 WO 9713301A1
Authority
WO
WIPO (PCT)
Prior art keywords
contacts
socket
contact
conductor pins
mounting
Prior art date
Application number
PCT/US1996/016018
Other languages
French (fr)
Inventor
Nasser Barabi
Original Assignee
Oz Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oz Technologies, Inc. filed Critical Oz Technologies, Inc.
Publication of WO1997013301A1 publication Critical patent/WO1997013301A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the present invention generally relates to the surface mounting of integrated circuit (IC) devices to a printed circuit (PC) board, and more particularly to test sockets for the test and burn-in of IC devices.
  • the invention is particuarly suited to the testing of leadless IC chips, but is not limited to such applications.
  • BGA ball grid array
  • test sockets for leadless IC devices most commonly employ stamped or formed metal contact pins for achieving electrical interconnection between the I/O contacts of the IC device being tested and the PC test board circuits.
  • Such socket designs have a relatively high profile and relatively high capacitance and inductance making them undesirable for high speed applications. They also require soldering of the socket pins to the PC board and do not operate efficiently with IC devices having noncompliant I/O contacts. Sockets having elastomeric contactors which do not require soldering have also been devised.
  • These test sockets utilize flexible wire filaments which extend in a perpendicular relation to the contact points. Such wire filaments are generally not reliable and will not hold up with repetitive use. In addition, they are not likely to withstand the thermal shock while testing an IC device.
  • pogo pins Still another known IC test socket design is a test socket having high profile, spring-loaded pins, called “pogo pins. "
  • pogo pins the use of pogo pins in test sockets have been limited to relatively long, single-ended pogo pins wherein one end of each pogo pin is a fixed end soldered to the PC board and the other end is spring-loaded. Again, the relatively high profile of such test sockets make them unsuitable for high speed test applications. Also, since the fixed ends of the pogo pins are soldered to the
  • the present invention overcomes the disadvantages of conventional test sockets for leadless IC devices by providing a low profile test socket suitable for high frequency test applications which will provide efficient and solderless contacts for both the PC board and the IC devices being tested.
  • the present invention provides for an improved IC socket for surface mounting an IC device having a predetermined array of I/O contacts to a circuit board having a corresponding array of circuit contacts using an array of miniature, double- ended pogo pins which provide an array of resilient contacts for both the circuit contacts of the PC board and the I/O contacts of the IC device.
  • the IC socket has a body portion which includes a contact interface wall having opposed and substantially parallel mounting surfaces, one of the mounting surfaces of the interface wall is an interior mounting surface for receiving an IC device and the other of the mounting surfaces being an exterior surface for mounting the body portion of the socket to the circuit board.
  • a plurality of substantially parallel conductor pins in the form of double-ended pogo pins extend through and are held by the contact interface wall in an array that corresponds to die predetermined array of the I/O contacts of the IC device (as well as to the corresponding circuit contacts of the circuit board).
  • the conductor pins which have contact ends that project beyond the mounting surfaces of the contact interface wall, provide a conductive path between these mounting surfaces.
  • Means for releasably holding an IC device against the interior mounting surface of the contact interface wall of the socket's body portion is provided such that the I/O contacts of the IC device remain in contact with the ends of the conductor pins at all times.
  • the invention's substantially parallel conductor pin provide a conductor pin footprint that is the same on both sides of the socket.
  • the socket receives an IC device having the same contact footprint as the contact footprint on the PC board to which it is mounted. This permits the IC device to be soldered directly to the PC board after the test socket, which is not soldered to the PC board, is removed.
  • a primary object of the present invention is to provide an IC test socket suitable for high frequency applications and which provides efficient electrical contacts to both the I/O contacts of an IC device and the circuit contacts of a PC board.
  • Another object of the invention is to provide a durable test socket that can withstand the thermal shock encountered in test and burn-in applications, and that can further withstand the repeated insertions and extractions of IC devices into and from the test socket.
  • FIG. 1 is an exploded perspective view of an IC test socket in accordance with the invention as it would be mounted to a PC board.
  • FIG. 2 is an exploded side elevational view of the test socket shown in FIG. 1 with the base portion of the socket secured to the PC board.
  • FIG. 2A is a side elevational view of the test socket and PC board shown in FIG. 2 fully assembled.
  • FIG. 3 is an enlarged, fragmentary view in cross-section of the interface wall of the test socket body motion illustrated in FIG. 1 showing double-ended pogo pins held in the interface wall.
  • FIG. 3 A is an enlarged, fragmentary view in cross-section of the contact interface wall of the test socket's body portion showing the contact ends of the double-ended pogo pins depressed by the contacts of an IC device and the contacts of a PC board to which the test socket is mounted.
  • FIG. 4 is an enlarged view of one of the double-ended pogo pins illustrated in FIG. 3.
  • FIG. 4A shows the pogo pin of FIG. 4 with the contact ends of the pogo pin depressed.
  • FIGS. 1, 2 and 2 A illustrates a test socket 11 for surface mounting IC chip 13 to PC board 15.
  • the test socket includes body portion 17 and a latch cover 19 which serves as a means for releaseably holding IC chip 13 in the socket's body portion.
  • the body portion is formed to provide a relatively thin contact interface wall 20 having opposed and substantially parallel mounting surfaces.
  • One of the mounting surfaces is the interior mounting surface 21 which receives IC chip 13, while the other mounting surface of the contact interface wall is an exterior mounting surface 22 against which the IC test socket is mounted to PC board 15.
  • the body portion of the test socket fiirther includes shoulder portions 23 which form an elevated perimeter 24 having a latch cover alignment slots 25.
  • Perimeter 24 further defines an interior region 27 sized to capture and hold IC chip 13 such that its I/O contacts 30 (see FIG. 3) are precisely aligned with the array of parallel conductor pins 29 held in the body's contact interface wall.
  • the sockets latch cover 19 has a cover plate 31 which can suitably be fabricated of aluminum and which can serve as a heat sink for the IC chip.
  • the cover plate includes lateral edge portions 33 and upwardly extending heat fins 35 distributed along die top of the cover plate between the cover plate's two lateral edges.
  • Alignment posts 37 which are shaped to mate with the alignment slots 25 of the socket's body portion 17, are provided to permit the gross alignment of the latch cover over the socket body portion.
  • An additional pressure plate 39 is also provided on the bottom of the cover plate and is centrally located to permit it to bear against the top of IC chip 13 when the socket is assembled.
  • the pressure plate 39 is metal, and suitably integral to cover plate 31, to conduct heat away from the IC chip.
  • pressure plate 39 can suitably be a plastic material such as UlternTM 1000.
  • the alignment ports 37 can be fabricated of a metal or plastic material, depending on the application.
  • Latch cover 19 is releaseably held to the body portion of the socket by means of opposed latch handles 41 pivotally mounted to lateral edges 33 of cover plate 31.
  • the latch handles are spring-loaded by means of compression springs 43 and has a cammed locking ridge 45 which snaps into locking groove 47 on the perimeter of the socket's body portion as shown in FIG. 2 A when the latch cover is placed down over the body portion.
  • FIGS. 3, 3A, 4 and 4A illustrate in greater detail die contact interface wall 20 of the socket body portion and d e conductor pins held d ereby.
  • Conductor pins 29 are held in the contact interface wall 20 in an array of straight and parallel pins that corresponds to the footprint of both the array of I/O contacts 30 on the bottom of IC chip 13 and die circuit contacts or "pads" 32 of PC board 15 to which the IC chip is to be surface mounted.
  • each of the straight conductor pins is in the form of a double ended pogo pin having oppositely extending contact ends 51, 52 which are depressible within pin casing 53 against internal compression spring 55 which exerts a restoring force against the enlarged base ends 57, 58 of each of the contact ends.
  • Body portion 17 of the socket is fabricated from an insulator material, suitably a plastic material, the composition of which will depend on die application.
  • a material such as VespelTM can be used, while for low temperamre applications, a material such as UlternTM can be employed.
  • the body portion can suitably be provided with a separate bottom cover plate 61 which fits onto the bottom of the body portion 17 after the conductor pins have been inserted into predrilled holes in the interface wall.
  • Enlarged collar portions 63 on the outside diameter of the conductor pin casing 53 will fit into a counterboard portion of the pin holes and will fix the pins in the wall when bottom cover plate 61 is installed.
  • Bottom cover plate 61 can be secured to the body portion by mechanical means, such as screws, or a suitable adhesive, or both.
  • the socket's body portion 17 is first secured to PC board 15 by means of any suitable attachment means such as attachment screws 65 which extend dirough aligned attachment screw openings 67, 68 in, respectively, the socket's body portion and die PC board. Attachment nuts thread onto the attachment screw 65 from the back side of die PC board. Locator pins 71 and corresponding locator holes 73 are provided to precisely locate the socket body 17 over the PC board circuit contacts 32.
  • FIG. 3 The operation of the double-ended pogo pin type conductor pins is best illustrated in reference to FIG. 3.
  • the bottom contact ends 51 of conductor pins 29 contact and are depressed slightly when the contact ends meet die circuit contacts 32 of PC board 15 when die socket's body portion is mounted to the PC board as above described.
  • the IC chip 13 is pressed against the top of the interface wall 20 by means of pressure plate 39 of the socket's latch cover 19, the I/O contacts on the bottom of the IC chip are pressed against the upper contact ends 51 of conductor pins 29 to slightly depress these ends.
  • Conductor pins 29 while be miniature conductor pins capable of providing a low profile contact between PC board and the IC chip.
  • the conductor pins can suitably have an overall length, including the contact ends, of approximately 0.220 inches, a casing outside diameter of approximately 0.025 inches, and a contact end diameter of approximately 0.0120 inches.
  • the overall length of die conductor pins will be less than approximately 0.250 inches.
  • the length of the conductor pin casing 53 can suitably have a dimension of approximately 0.160 inches with the overall thickness of die contact interface wall 20 being slightly larger than this dimension. Such dimensions will be consistent with a low profile contact suitable for high frequency test applications.
  • the present invention provides a test socket for efficiently surface mounting a leadless IC chip to a circuit board involving solderless connections and small insertion forces.
  • the test socket of the invention has a relatively low profile and is suitable for use in high frequency test and burn-in applications.
  • the test socket of the invention also provides a uniform contact footprint from one side of die socket to the other which permits the socket to be removed and die IC device soldered directly to the PC board. While the invention has been described in considerable detail in the foregoing specification, it is understood that it is not intended diat die invention be limited to such detail, except as necessitated by die following claims.

Abstract

A test socket (11) for an IC device (13) has relatively thin contact interface wall (20) having an array of double-ended pogo pins (29). The double-ended pogo pins (29) provide resilient spring-loaded contacts for the I/O contacts (30) of an IC device (13) held in the socket as well as for the circuit contacts (32) of a PC board (15) to which the socket is mounted.

Description

TITLE OF THE INVENTION
Test Socket for Leadless IC Device
TECHNICAL FIELD The present invention generally relates to the surface mounting of integrated circuit (IC) devices to a printed circuit (PC) board, and more particularly to test sockets for the test and burn-in of IC devices. The invention is particuarly suited to the testing of leadless IC chips, but is not limited to such applications.
BACKGROUND ART
The increased capabilities of IC chips have led to increased input/output (I/O) densities and alternative techniques for mounting IC chips to printed circuit (PC) boards involving leadless IC chips. For example, ball grid array (BGA) mounting techniques have been developed to replace pin grid array (PGA) mounting approaches in order to achieve more densely packed contacts and smaller contact dimensions (in the order of
25 mils.). To facilitate the testing and burn-in of leadless IC devices, special test sockets have been devised to hold these devices and to temporarily connect them to a PC test board. Test sockets for leadless IC devices most commonly employ stamped or formed metal contact pins for achieving electrical interconnection between the I/O contacts of the IC device being tested and the PC test board circuits. Such socket designs have a relatively high profile and relatively high capacitance and inductance making them undesirable for high speed applications. They also require soldering of the socket pins to the PC board and do not operate efficiently with IC devices having noncompliant I/O contacts. Sockets having elastomeric contactors which do not require soldering have also been devised. These test sockets utilize flexible wire filaments which extend in a perpendicular relation to the contact points. Such wire filaments are generally not reliable and will not hold up with repetitive use. In addition, they are not likely to withstand the thermal shock while testing an IC device.
Still another known IC test socket design is a test socket having high profile, spring-loaded pins, called "pogo pins. " Heretofore, the use of pogo pins in test sockets have been limited to relatively long, single-ended pogo pins wherein one end of each pogo pin is a fixed end soldered to the PC board and the other end is spring-loaded. Again, the relatively high profile of such test sockets make them unsuitable for high speed test applications. Also, since the fixed ends of the pogo pins are soldered to the
PC board, such sockets are relatively difficult to remove.
The present invention overcomes the disadvantages of conventional test sockets for leadless IC devices by providing a low profile test socket suitable for high frequency test applications which will provide efficient and solderless contacts for both the PC board and the IC devices being tested.
DISCLOSURE OF THE INVENTION
Briefly, the present invention provides for an improved IC socket for surface mounting an IC device having a predetermined array of I/O contacts to a circuit board having a corresponding array of circuit contacts using an array of miniature, double- ended pogo pins which provide an array of resilient contacts for both the circuit contacts of the PC board and the I/O contacts of the IC device. More specifically, the IC socket has a body portion which includes a contact interface wall having opposed and substantially parallel mounting surfaces, one of the mounting surfaces of the interface wall is an interior mounting surface for receiving an IC device and the other of the mounting surfaces being an exterior surface for mounting the body portion of the socket to the circuit board. A plurality of substantially parallel conductor pins in the form of double-ended pogo pins extend through and are held by the contact interface wall in an array that corresponds to die predetermined array of the I/O contacts of the IC device (as well as to the corresponding circuit contacts of the circuit board). The conductor pins, which have contact ends that project beyond the mounting surfaces of the contact interface wall, provide a conductive path between these mounting surfaces. By using double-ended pogo pins, both contact ends of the pins will be resiliently depressible to provide spring-loaded contacts for both the IC device held in the socket and the circuit board to which the socket is mounted. Means for releasably holding an IC device against the interior mounting surface of the contact interface wall of the socket's body portion is provided such that the I/O contacts of the IC device remain in contact with the ends of the conductor pins at all times. It is noted that the invention's substantially parallel conductor pin provide a conductor pin footprint that is the same on both sides of the socket. Thus, the socket receives an IC device having the same contact footprint as the contact footprint on the PC board to which it is mounted. This permits the IC device to be soldered directly to the PC board after the test socket, which is not soldered to the PC board, is removed.
Therefore, it can be seen that a primary object of the present invention is to provide an IC test socket suitable for high frequency applications and which provides efficient electrical contacts to both the I/O contacts of an IC device and the circuit contacts of a PC board. Another object of the invention is to provide a durable test socket that can withstand the thermal shock encountered in test and burn-in applications, and that can further withstand the repeated insertions and extractions of IC devices into and from the test socket. It is still another object of the invention to provide a test socket for an IC device having the same I/O contact footprint as the footprint of the circuit contacts (also called "pads") of die PC board to which it is mounted. Yet other objects of the invention will be apparent from the following specification and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view of an IC test socket in accordance with the invention as it would be mounted to a PC board. FIG. 2 is an exploded side elevational view of the test socket shown in FIG. 1 with the base portion of the socket secured to the PC board.
FIG. 2A is a side elevational view of the test socket and PC board shown in FIG. 2 fully assembled.
FIG. 3 is an enlarged, fragmentary view in cross-section of the interface wall of the test socket body motion illustrated in FIG. 1 showing double-ended pogo pins held in the interface wall. FIG. 3 A is an enlarged, fragmentary view in cross-section of the contact interface wall of the test socket's body portion showing the contact ends of the double-ended pogo pins depressed by the contacts of an IC device and the contacts of a PC board to which the test socket is mounted.
FIG. 4 is an enlarged view of one of the double-ended pogo pins illustrated in FIG. 3.
FIG. 4A shows the pogo pin of FIG. 4 with the contact ends of the pogo pin depressed.
BEST MODE FOR CARRYING OUT THE INVENTION
Referring now to the drawings, FIGS. 1, 2 and 2 A illustrates a test socket 11 for surface mounting IC chip 13 to PC board 15. The test socket includes body portion 17 and a latch cover 19 which serves as a means for releaseably holding IC chip 13 in the socket's body portion. Referring to FIG. 3, it can be seen that the body portion is formed to provide a relatively thin contact interface wall 20 having opposed and substantially parallel mounting surfaces. One of the mounting surfaces is the interior mounting surface 21 which receives IC chip 13, while the other mounting surface of the contact interface wall is an exterior mounting surface 22 against which the IC test socket is mounted to PC board 15. The body portion of the test socket fiirther includes shoulder portions 23 which form an elevated perimeter 24 having a latch cover alignment slots 25. Perimeter 24 further defines an interior region 27 sized to capture and hold IC chip 13 such that its I/O contacts 30 (see FIG. 3) are precisely aligned with the array of parallel conductor pins 29 held in the body's contact interface wall. Further referring to FIGS. 1, 2 and 2A, the sockets latch cover 19 has a cover plate 31 which can suitably be fabricated of aluminum and which can serve as a heat sink for the IC chip. The cover plate includes lateral edge portions 33 and upwardly extending heat fins 35 distributed along die top of the cover plate between the cover plate's two lateral edges. Alignment posts 37, which are shaped to mate with the alignment slots 25 of the socket's body portion 17, are provided to permit the gross alignment of the latch cover over the socket body portion. An additional pressure plate 39 is also provided on the bottom of the cover plate and is centrally located to permit it to bear against the top of IC chip 13 when the socket is assembled. In applications where the latch cover is to act as a heat sink, the pressure plate 39 is metal, and suitably integral to cover plate 31, to conduct heat away from the IC chip. In applications where the latch cover is not intended to act as a heat sink, pressure plate 39 can suitably be a plastic material such as Ultern™ 1000. Similarly, the alignment ports 37 can be fabricated of a metal or plastic material, depending on the application. Latch cover 19 is releaseably held to the body portion of the socket by means of opposed latch handles 41 pivotally mounted to lateral edges 33 of cover plate 31. The latch handles are spring-loaded by means of compression springs 43 and has a cammed locking ridge 45 which snaps into locking groove 47 on the perimeter of the socket's body portion as shown in FIG. 2 A when the latch cover is placed down over the body portion.
FIGS. 3, 3A, 4 and 4A illustrate in greater detail die contact interface wall 20 of the socket body portion and d e conductor pins held d ereby. Conductor pins 29 are held in the contact interface wall 20 in an array of straight and parallel pins that corresponds to the footprint of both the array of I/O contacts 30 on the bottom of IC chip 13 and die circuit contacts or "pads" 32 of PC board 15 to which the IC chip is to be surface mounted. Referring to FIG. 4, it can be seen that each of the straight conductor pins is in the form of a double ended pogo pin having oppositely extending contact ends 51, 52 which are depressible within pin casing 53 against internal compression spring 55 which exerts a restoring force against the enlarged base ends 57, 58 of each of the contact ends.
Body portion 17 of the socket is fabricated from an insulator material, suitably a plastic material, the composition of which will depend on die application. For high temperature applications, a material such as Vespel™ can be used, while for low temperamre applications, a material such as Ultern™ can be employed. To permit insertion and retention of the conductor pins in the contact interface wall of the body portion, the body portion can suitably be provided with a separate bottom cover plate 61 which fits onto the bottom of the body portion 17 after the conductor pins have been inserted into predrilled holes in the interface wall. Enlarged collar portions 63 on the outside diameter of the conductor pin casing 53 will fit into a counterboard portion of the pin holes and will fix the pins in the wall when bottom cover plate 61 is installed. Bottom cover plate 61 can be secured to the body portion by mechanical means, such as screws, or a suitable adhesive, or both.
To use the test socket of the invention, the socket's body portion 17 is first secured to PC board 15 by means of any suitable attachment means such as attachment screws 65 which extend dirough aligned attachment screw openings 67, 68 in, respectively, the socket's body portion and die PC board. Attachment nuts thread onto the attachment screw 65 from the back side of die PC board. Locator pins 71 and corresponding locator holes 73 are provided to precisely locate the socket body 17 over the PC board circuit contacts 32.
The operation of the double-ended pogo pin type conductor pins is best illustrated in reference to FIG. 3. In FIG. 3, the bottom contact ends 51 of conductor pins 29 contact and are depressed slightly when the contact ends meet die circuit contacts 32 of PC board 15 when die socket's body portion is mounted to the PC board as above described. Similarly, as the IC chip 13 is pressed against the top of the interface wall 20 by means of pressure plate 39 of the socket's latch cover 19, the I/O contacts on the bottom of the IC chip are pressed against the upper contact ends 51 of conductor pins 29 to slightly depress these ends. Because bodi contact ends of die conductor pins are resiliently depressible, they will exert a spring-like force against the contacts of the IC chip and circuit board and will account for any lack of coplanarity in these contact points. Such contacts can be made with minimal insertion force, that is, only that force required to slightly depress the contact ends of die conductor pins. It is noted diat the tips 75 of the contact ends of die conductor pins have a recessed V- shape shape to increase the area of the conductor pin diat actually comes into contact with die ball-shaped contact points of the PC board, which are well suited to provide good electrical contact with die ball-shaped contacts of the IC device and d e surface pad contacts of the PC board.
Conductor pins 29 while be miniature conductor pins capable of providing a low profile contact between PC board and the IC chip. The conductor pins can suitably have an overall length, including the contact ends, of approximately 0.220 inches, a casing outside diameter of approximately 0.025 inches, and a contact end diameter of approximately 0.0120 inches. Preferably the overall length of die conductor pins will be less than approximately 0.250 inches. The length of the conductor pin casing 53 can suitably have a dimension of approximately 0.160 inches with the overall thickness of die contact interface wall 20 being slightly larger than this dimension. Such dimensions will be consistent with a low profile contact suitable for high frequency test applications.
Therefore, it can be seen that the present invention provides a test socket for efficiently surface mounting a leadless IC chip to a circuit board involving solderless connections and small insertion forces. At the same time, the test socket of the invention has a relatively low profile and is suitable for use in high frequency test and burn-in applications. The test socket of the invention also provides a uniform contact footprint from one side of die socket to the other which permits the socket to be removed and die IC device soldered directly to the PC board. While the invention has been described in considerable detail in the foregoing specification, it is understood that it is not intended diat die invention be limited to such detail, except as necessitated by die following claims.

Claims

CLAIMS:
1. An IC socket for surface mounting an IC device having a predetermined array of I/O contacts to a circuit board having a corresponding array of circuit contacts, said IC socket comprising a body portion which includes a contact interface wall having opposed and substantially parallel mounting surfaces, one of said mounting surfaces being an interior mounting surface for receiving an IC device and the other of said mounting surfaces being an exterior mounting surface for mounting the body portion to a circuit board, a plurality of conductor pins extending through and held by said contact interface wall in a array corresponding to a predetermined array of I/O contacts of an IC device, said conductor pins having contact ends projecting beyond d e mounting surfaces of said contact interface wall to provide a conductive padi therebetween, and each of the contact ends of said conductor pins being resiliently depressible to provide spring loaded contacts for both die I/O contacts of an IC device and d e circuit contacts of a circuit board contacted tiiereby, and means for releaseably holding an IC device against the interior mounting surface of the contact interface wall of said body portion such that the I/O contacts of the IC device remain in contact widi the contact ends of the conductor pins projecting from said interior mounting surface.
2. The IC socket of claim 1 wherein the thickness of said contact interface wall and die lengdi of said conductor pins are relatively small to provide a low profile
interface between the IC device and the circuit board.
3. The IC socket of claim 2 wherein the lengdi of said conductor pins is less
than approximately .250 inches.
4. The IC socket of claim 1 wherein said conductor pins are straight conductor pins held in parallel relation in said contact interface wall to provide an array of conductor pins that has the same footprint at each of said interior and exterior
mounting surfaces.
5. An IC socket for surface mounting an IC device having a predetermined
array of I/O contacts to a circuit board having a corresponding array of circuit contacts,
said IC socket comprising a body portion which includes a relatively thin contact interface wall having opposed and substantially parallel mounting surfaces, one of said mounting surfaces being an interior mounting surface for receiving an IC device and die other of said mounting surfaces being an exterior mounting surface for mounting the body portion
to a circuit board, a plurality of straight, parallel and relatively short conductor pins extending dirough and held by said contact interface wall in a array corresponding to a predetermined array of I/O contacts of an IC device, said conductor pins having contact 97/13301 PC17US96/16018
10 ends projecting beyond the mounting surfaces of said contact interface wall to provide a conductive padi tiierebetween, and each of die contact ends of said conductor pins being resiliently depressible to provide spring loaded contacts for both die I/O contacts of an IC device and d e circuit contacts of a circuit board contacted tiiereby, and means for releaseably holding an IC device against die interior mounting surface of die contact interface wall of said body portion such that the I/O contacts of the IC device remain in contact with the contact ends of the conductor pins projecting from said interior mounting surface.
PCT/US1996/016018 1995-10-04 1996-10-04 Test socket for leadless ic device WO1997013301A1 (en)

Applications Claiming Priority (2)

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US08/538,956 1995-10-04
US08/538,956 US6046597A (en) 1995-10-04 1995-10-04 Test socket for an IC device

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FR2958756A1 (en) * 2010-04-09 2011-10-14 Eads Europ Aeronautic Defence System for high frequency testing of integrated circuit to form surface mount electronic component, has extension set assuring variable length electrical connections between balls and system, and deformable to compensate unevenness of balls
JP2021519928A (en) * 2018-04-24 2021-08-12 テラダイン、 インコーポレイテッド Thermal control in test system
JP7320527B2 (en) 2018-04-24 2023-08-03 テラダイン、 インコーポレイテッド test system
US20220155343A1 (en) * 2020-11-17 2022-05-19 Yamaichi Electronics Co., Ltd Socket for inspection
US11821915B2 (en) * 2020-11-17 2023-11-21 Yamaichi Electronics Co., Ltd. Socket for inspection

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