WO1997024213A1 - Closed mold for led alphanumeric displays - Google Patents
Closed mold for led alphanumeric displays Download PDFInfo
- Publication number
- WO1997024213A1 WO1997024213A1 PCT/US1996/019791 US9619791W WO9724213A1 WO 1997024213 A1 WO1997024213 A1 WO 1997024213A1 US 9619791 W US9619791 W US 9619791W WO 9724213 A1 WO9724213 A1 WO 9724213A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mold
- epoxy
- plattens
- closed mold
- led alphanumeric
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09524347A JP3095783B2 (en) | 1995-12-27 | 1996-12-17 | Closed mold for light emitting diode alphanumeric display |
KR1019980704929A KR19990076804A (en) | 1995-12-27 | 1996-12-17 | Sealing Mold for LED Alphanumeric Display |
EP96944332A EP0873231A1 (en) | 1995-12-27 | 1996-12-17 | Closed mold for led alphanumeric displays |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/579,535 | 1995-12-27 | ||
US08/579,535 US5855924A (en) | 1995-12-27 | 1995-12-27 | Closed-mold for LED alphanumeric displays |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997024213A1 true WO1997024213A1 (en) | 1997-07-10 |
Family
ID=24317306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/019791 WO1997024213A1 (en) | 1995-12-27 | 1996-12-17 | Closed mold for led alphanumeric displays |
Country Status (5)
Country | Link |
---|---|
US (1) | US5855924A (en) |
EP (1) | EP0873231A1 (en) |
JP (1) | JP3095783B2 (en) |
KR (1) | KR19990076804A (en) |
WO (1) | WO1997024213A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5833903A (en) * | 1996-12-10 | 1998-11-10 | Great American Gumball Corporation | Injection molding encapsulation for an electronic device directly onto a substrate |
AU747260B2 (en) | 1997-07-25 | 2002-05-09 | Nichia Chemical Industries, Ltd. | Nitride semiconductor device |
JP3770014B2 (en) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | Nitride semiconductor device |
EP1168539B1 (en) | 1999-03-04 | 2009-12-16 | Nichia Corporation | Nitride semiconductor laser device |
US6334971B1 (en) * | 2000-07-20 | 2002-01-01 | Wen-Ping Huang | Manufacturing method for diode group processed by injection molding on the surface |
US7153462B2 (en) * | 2004-04-23 | 2006-12-26 | Vishay Infrared Components, Inc. | Injection casting system for encapsulating semiconductor devices and method of use |
US8821778B2 (en) * | 2006-02-24 | 2014-09-02 | Hilmar Kraus | Method for encapsulating electrical and/or electronic components in a housing |
TWI368624B (en) * | 2007-10-29 | 2012-07-21 | Ind Tech Res Inst | Coplymer and method for manufacturing the same and packaging material utilizing the same |
TWI344226B (en) * | 2007-10-29 | 2011-06-21 | Ind Tech Res Inst | Method of packaging light emitted diode |
TWI362769B (en) * | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3899305A (en) * | 1973-07-23 | 1975-08-12 | Capsonic Group Inc | Insert frame for insert molding |
EP0070320A1 (en) * | 1981-01-26 | 1983-01-26 | Dai-Ichi Seiko Co. Ltd. | Sealing and molding machine |
GB2104827A (en) * | 1981-07-01 | 1983-03-16 | Kras Corp | Molding of electronic components |
EP0100574A1 (en) * | 1982-07-26 | 1984-02-15 | Motorola, Inc. | Slot transfer molding means and methods |
FR2545653A1 (en) * | 1983-05-04 | 1984-11-09 | Pichot Michel | Method and device for encapsulating integrated circuits |
JPH01232006A (en) * | 1988-03-14 | 1989-09-18 | Nippon Kayaku Co Ltd | Molding of polarizing plastic lens |
GB2252746A (en) * | 1991-01-17 | 1992-08-19 | Towa Corp | Resin sealing of electronic parts |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4084312A (en) * | 1976-01-07 | 1978-04-18 | Motorola, Inc. | Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies |
US4480975A (en) * | 1981-07-01 | 1984-11-06 | Kras Corporation | Apparatus for encapsulating electronic components |
NL8203253A (en) * | 1982-08-19 | 1984-03-16 | Arbo Handel Ontwikkeling | METHOD AND APPARATUS FOR COVERING ELECTRONIC COMPONENTS WITH PLASTIC |
FR2572987B1 (en) * | 1984-09-21 | 1987-01-02 | Pont A Mousson | METHOD AND DEVICE FOR OVER-MOLDING A SURROUNDING OF PRECISE DIMENSIONS ON THE SURROUNDING OF A FLAT OR GALBED PART WITH DIMENSIONAL TOLERANCES |
US4655274A (en) * | 1984-10-26 | 1987-04-07 | Ube Industries, Ltd. | Horizontal mold clamping and vertical injection type die cast machine |
US4615857A (en) * | 1984-11-30 | 1986-10-07 | Motorola, Inc. | Encapsulation means and method for reducing flash |
DE3736022A1 (en) * | 1987-10-24 | 1989-05-03 | Hennecke Gmbh Maschf | DEVICE FOR PRODUCING MOLDED PARTS FROM A PLASTIC, IN PARTICULAR FOAM PLASTIC, REACTIVE, FLOWABLE REACTION MIXTURE FROM FLOWABLE REACTION COMPONENTS |
US4948359A (en) * | 1987-12-11 | 1990-08-14 | M. Yasui & Co., Ltd. | Mold holding and positioning means for use with wax injector |
US4881885A (en) * | 1988-04-15 | 1989-11-21 | International Business Machines Corporation | Dam for lead encapsulation |
US5059105A (en) * | 1989-10-23 | 1991-10-22 | Motorola, Inc. | Resilient mold assembly |
JP2564707B2 (en) * | 1991-01-09 | 1996-12-18 | ローム株式会社 | Multi-type molding method and molding apparatus for molding part in lead frame for electronic component |
US5391346A (en) * | 1991-11-20 | 1995-02-21 | Rohm Co., Ltd. | Method for making molded photointerrupters |
US6458109B1 (en) * | 1998-08-07 | 2002-10-01 | Hill-Rom Services, Inc. | Wound treatment apparatus |
-
1995
- 1995-12-27 US US08/579,535 patent/US5855924A/en not_active Expired - Lifetime
-
1996
- 1996-12-17 WO PCT/US1996/019791 patent/WO1997024213A1/en not_active Application Discontinuation
- 1996-12-17 JP JP09524347A patent/JP3095783B2/en not_active Expired - Fee Related
- 1996-12-17 EP EP96944332A patent/EP0873231A1/en not_active Withdrawn
- 1996-12-17 KR KR1019980704929A patent/KR19990076804A/en not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3899305A (en) * | 1973-07-23 | 1975-08-12 | Capsonic Group Inc | Insert frame for insert molding |
EP0070320A1 (en) * | 1981-01-26 | 1983-01-26 | Dai-Ichi Seiko Co. Ltd. | Sealing and molding machine |
GB2104827A (en) * | 1981-07-01 | 1983-03-16 | Kras Corp | Molding of electronic components |
EP0100574A1 (en) * | 1982-07-26 | 1984-02-15 | Motorola, Inc. | Slot transfer molding means and methods |
FR2545653A1 (en) * | 1983-05-04 | 1984-11-09 | Pichot Michel | Method and device for encapsulating integrated circuits |
JPH01232006A (en) * | 1988-03-14 | 1989-09-18 | Nippon Kayaku Co Ltd | Molding of polarizing plastic lens |
GB2252746A (en) * | 1991-01-17 | 1992-08-19 | Towa Corp | Resin sealing of electronic parts |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Week 8943, Derwent World Patents Index; AN 89-313577, XP002028257 * |
Also Published As
Publication number | Publication date |
---|---|
EP0873231A1 (en) | 1998-10-28 |
KR19990076804A (en) | 1999-10-15 |
JP3095783B2 (en) | 2000-10-10 |
US5855924A (en) | 1999-01-05 |
JP2000502965A (en) | 2000-03-14 |
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