WO1998019140A3 - Ultraschallwandler in oberflächen-mikromechanik - Google Patents

Ultraschallwandler in oberflächen-mikromechanik Download PDF

Info

Publication number
WO1998019140A3
WO1998019140A3 PCT/DE1997/002505 DE9702505W WO9819140A3 WO 1998019140 A3 WO1998019140 A3 WO 1998019140A3 DE 9702505 W DE9702505 W DE 9702505W WO 9819140 A3 WO9819140 A3 WO 9819140A3
Authority
WO
WIPO (PCT)
Prior art keywords
membrane
electronic components
mechanic
ultrasonic transducer
surface micro
Prior art date
Application number
PCT/DE1997/002505
Other languages
English (en)
French (fr)
Other versions
WO1998019140A2 (de
Inventor
Peter-Christian Eccardt
Kurt Niederer
Thomas Scheiter
Martin Vossiek
Thomas Koelpin
Original Assignee
Siemens Ag
Eccardt Peter Christian
Kurt Niederer
Thomas Scheiter
Martin Vossiek
Thomas Koelpin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Eccardt Peter Christian, Kurt Niederer, Thomas Scheiter, Martin Vossiek, Thomas Koelpin filed Critical Siemens Ag
Priority to DE59710477T priority Critical patent/DE59710477D1/de
Priority to US09/297,243 priority patent/US6320239B1/en
Priority to JP51990398A priority patent/JP3395844B2/ja
Priority to EP97949856A priority patent/EP0935741B1/de
Publication of WO1998019140A2 publication Critical patent/WO1998019140A2/de
Publication of WO1998019140A3 publication Critical patent/WO1998019140A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means

Abstract

Auf einem Siliziumsubstrat (1) mit einem darin ausgebildeten dotierten Bereich (5) befinden sich eine Abstandsschicht (7) mit einem darin ausgeätzten Hohlraum (8) und eine darüber auf der Abstandsschicht angeordnete Membran (2), wobei der dotierte Bereich und die Membran über Anschlußkontakte (4, 6) mit elektronischen Bauelementen (13), die ebenfalls in dem Substrat (1) integriert sind, elektrisch verbunden sind. Die elektronischen Bauelemente sind Bestandteil der Betriebsschaltung, die auch zum Ansteuern der Membran und zur Auswertung der Membranschwingungen verwendet werden kann. Die Integration macht es möglich, die mikromechanischen Wandlerkomponenten als Array anzuordnen, das als Phased-Array elektronisch angesteuert werden kann.
PCT/DE1997/002505 1996-10-30 1997-10-28 Ultraschallwandler in oberflächen-mikromechanik WO1998019140A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE59710477T DE59710477D1 (de) 1996-10-30 1997-10-28 Ultraschallwandler in oberflächen-mikromechanik mit integrierter ansteuerschaltung, sowie array
US09/297,243 US6320239B1 (en) 1996-10-30 1997-10-28 Surface micromachined ultrasonic transducer
JP51990398A JP3395844B2 (ja) 1996-10-30 1997-10-28 表面―マイクロ技術による超音波変換器
EP97949856A EP0935741B1 (de) 1996-10-30 1997-10-28 Ultraschallwandler in oberflächen-mikromechanik mit integrierter ansteuerschaltung, sowie array

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19643893A DE19643893A1 (de) 1996-10-30 1996-10-30 Ultraschallwandler in Oberflächen-Mikromechanik
DE19643893.4 1996-10-30

Publications (2)

Publication Number Publication Date
WO1998019140A2 WO1998019140A2 (de) 1998-05-07
WO1998019140A3 true WO1998019140A3 (de) 1998-07-09

Family

ID=7809662

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/002505 WO1998019140A2 (de) 1996-10-30 1997-10-28 Ultraschallwandler in oberflächen-mikromechanik

Country Status (5)

Country Link
US (1) US6320239B1 (de)
EP (1) EP0935741B1 (de)
JP (1) JP3395844B2 (de)
DE (2) DE19643893A1 (de)
WO (1) WO1998019140A2 (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19829609B4 (de) * 1998-07-02 2008-04-30 Robert Bosch Gmbh Verfahren zur Herstellung eines Mikrosystems
DE19839606C1 (de) * 1998-08-31 2000-04-27 Siemens Ag Mikromechanisches Bauelement und Verfahren zu dessen Herstellung
DE19845537A1 (de) * 1998-10-02 2000-04-13 Grundfos A S Bjerringbro Sensor und Verfahren zu seiner Herstellung
DE19922967C2 (de) * 1999-05-19 2001-05-03 Siemens Ag Mikromechanischer kapazitiver Ultraschallwandler und Verfahren zu dessen Herstellung
US6246158B1 (en) 1999-06-24 2001-06-12 Sensant Corporation Microfabricated transducers formed over other circuit components on an integrated circuit chip and methods for making the same
DE10104868A1 (de) 2001-02-03 2002-08-22 Bosch Gmbh Robert Mikromechanisches Bauelement sowie ein Verfahren zur Herstellung eines mikromechanischen Bauelements
US6552404B1 (en) * 2001-04-17 2003-04-22 Analog Devices, Inc. Integratable transducer structure
DE10122765A1 (de) * 2001-05-10 2002-12-05 Campus Micro Technologies Gmbh Elektroakustischer Wandler zur Erzeugung oder Erfassung von Ultraschall, Wandler-Array und Verfahren zur Herstellung der Wandler bzw. der Wandler-Arrays
US6659954B2 (en) * 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
US7313053B2 (en) * 2003-03-06 2007-12-25 General Electric Company Method and apparatus for controlling scanning of mosaic sensor array
US7280435B2 (en) * 2003-03-06 2007-10-09 General Electric Company Switching circuitry for reconfigurable arrays of sensor elements
US7257051B2 (en) * 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US7443765B2 (en) * 2003-03-06 2008-10-28 General Electric Company Reconfigurable linear sensor arrays for reduced channel count
US7353056B2 (en) * 2003-03-06 2008-04-01 General Electric Company Optimized switching configurations for reconfigurable arrays of sensor elements
US6865140B2 (en) * 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
DE10325406B4 (de) * 2003-06-05 2005-04-28 Eads Deutschland Gmbh Schadensermittlung an zu prüfenden Strukturen mittels Ultraschall
TWI240990B (en) * 2003-10-21 2005-10-01 Ind Tech Res Inst Preparation method of micromachined capacitive ultrasonic transducer by the imprinting technique
US20050121734A1 (en) * 2003-11-07 2005-06-09 Georgia Tech Research Corporation Combination catheter devices, methods, and systems
US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US7052464B2 (en) * 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
EP1713399A4 (de) * 2004-02-06 2010-08-11 Georgia Tech Res Inst Cmut-vorrichtungen und herstellungsverfahren
US8008835B2 (en) * 2004-02-27 2011-08-30 Georgia Tech Research Corporation Multiple element electrode cMUT devices and fabrication methods
US7646133B2 (en) * 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
EP1761998A4 (de) * 2004-02-27 2011-05-11 Georgia Tech Res Inst Harmonische cmut-vorrichtungen und herstellungsverfahren
WO2005114820A2 (en) * 2004-05-14 2005-12-01 The University Of Georgia Research Foundation, Inc. Implantable ultrasonic transducer systems and methods
US8658453B2 (en) * 2004-09-15 2014-02-25 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US8309428B2 (en) * 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7888709B2 (en) * 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
JP4471856B2 (ja) * 2005-01-27 2010-06-02 株式会社日立製作所 超音波トランスデューサおよびその製造方法
US7589456B2 (en) * 2005-06-14 2009-09-15 Siemens Medical Solutions Usa, Inc. Digital capacitive membrane transducer
JP4523879B2 (ja) * 2005-06-20 2010-08-11 株式会社日立製作所 電気・音響変換素子、アレイ型超音波トランスデューサおよび超音波診断装置
US20070038088A1 (en) * 2005-08-04 2007-02-15 Rich Collin A Medical imaging user interface and control scheme
JP4724501B2 (ja) * 2005-09-06 2011-07-13 株式会社日立製作所 超音波トランスデューサおよびその製造方法
DE102005050159A1 (de) * 2005-10-19 2007-04-26 Siemens Ag Schwingungssensor
US20070142699A1 (en) * 2005-12-16 2007-06-21 Acoustx Corporation Methods and implantable apparatuses for treating an esophageal disorder such as gastroesophageal reflux disease
US20070142884A1 (en) * 2005-12-16 2007-06-21 Acoustx Corporation Methods and apparatuses for treating an esophageal disorder such as gastroesophageal reflux disease
JP4787648B2 (ja) * 2006-03-29 2011-10-05 パナソニック株式会社 コンデンサマイクロホンの製造方法およびコンデンサマイクロホン
JP4699259B2 (ja) 2006-03-31 2011-06-08 株式会社日立製作所 超音波トランスデューサ
JP4979283B2 (ja) * 2006-06-29 2012-07-18 株式会社日立製作所 半導体装置の製造方法および半導体装置
JP4972350B2 (ja) * 2006-06-30 2012-07-11 株式会社日立製作所 半導体装置の製造方法
JP4952164B2 (ja) * 2006-09-20 2012-06-13 株式会社デンソー 流量計測素子、質量流量計
JP5016884B2 (ja) * 2006-09-29 2012-09-05 株式会社日立製作所 半導体装置およびその製造方法
US7745248B2 (en) * 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
JP5016449B2 (ja) * 2007-11-13 2012-09-05 ローム株式会社 半導体装置
JP2010004199A (ja) * 2008-06-19 2010-01-07 Hitachi Ltd 超音波トランスデューサおよびその製造方法
BRPI0915740A2 (pt) 2008-07-10 2015-10-27 Univ Cornell aparelho gerador de ondas ultrassônicas
JP5851238B6 (ja) 2009-03-05 2023-12-15 株式会社日立メディコ 超音波トランスデューサ、その製造方法、および、それを用いた超音波探触子
US8315125B2 (en) * 2009-03-18 2012-11-20 Sonetics Ultrasound, Inc. System and method for biasing CMUT elements
JP5409784B2 (ja) 2009-05-25 2014-02-05 株式会社日立メディコ 超音波トランスデューサおよびそれを用いた超音波診断装置
US7888844B2 (en) * 2009-06-30 2011-02-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Temperature control of micromachined transducers
US8897470B2 (en) 2009-07-31 2014-11-25 Macronix International Co., Ltd. Method of fabricating integrated semiconductor device with MOS, NPN BJT, LDMOS, pre-amplifier and MEMS unit
JP5414546B2 (ja) * 2010-01-12 2014-02-12 キヤノン株式会社 容量検出型の電気機械変換素子
JP5355777B2 (ja) 2010-03-12 2013-11-27 株式会社日立メディコ 超音波トランスデューサおよびそれを用いた超音波診断装置
US8357981B2 (en) 2010-05-28 2013-01-22 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Transducer devices having different frequencies based on layer thicknesses and method of fabricating the same
JP5178791B2 (ja) * 2010-08-23 2013-04-10 オリンパス株式会社 静電容量型超音波振動子
US9608589B2 (en) 2010-10-26 2017-03-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Method of forming acoustic resonator using intervening seed layer
CA2873394A1 (en) * 2012-05-11 2013-11-14 Volcano Corporation Circuit architectures and electrical interfaces for rotational intravascular ultrasound (ivus) devices
JP6189033B2 (ja) 2012-12-14 2017-08-30 株式会社日立製作所 超音波探触子の製造方法、超音波探触子、及び超音波診断装置
KR102207928B1 (ko) 2014-08-13 2021-01-26 삼성전자주식회사 음향 센싱 소자 및 주파수 정보 획득 방법
JP6251661B2 (ja) * 2014-09-26 2017-12-20 株式会社日立製作所 超音波トランスデューサ、その製造方法、超音波トランスデューサアレイ及び超音波検査装置
WO2017027789A1 (en) 2015-08-12 2017-02-16 Sonectics Ultrasound, Inc. Method and system for measuring pressure using ultrasound
US10972842B2 (en) 2017-06-23 2021-04-06 Butterfly Network, Inc. Differential ultrasonic transducer element for ultrasound devices
WO2024049447A1 (en) * 2022-09-02 2024-03-07 Exo Imaging, Inc. Dual and multiple membrane micromachined ultrasound transducers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102069A2 (de) * 1982-08-27 1984-03-07 Nissan Motor Co., Ltd. Anordnung zur Vibrationsanalyse
US4699009A (en) * 1985-11-05 1987-10-13 Acuson Dynamically focused linear phased array acoustic imaging system
US4873871A (en) * 1988-06-17 1989-10-17 Motorola, Inc. Mechanical field effect transistor sensor
DE4318466A1 (de) * 1993-06-03 1994-12-08 Bosch Gmbh Robert Mikromechanischer Sensor und Verfahren zu dessen Herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09508201A (ja) * 1994-01-18 1997-08-19 シーメンス アクチエンゲゼルシヤフト 加速度センサの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102069A2 (de) * 1982-08-27 1984-03-07 Nissan Motor Co., Ltd. Anordnung zur Vibrationsanalyse
US4699009A (en) * 1985-11-05 1987-10-13 Acuson Dynamically focused linear phased array acoustic imaging system
US4873871A (en) * 1988-06-17 1989-10-17 Motorola, Inc. Mechanical field effect transistor sensor
DE4318466A1 (de) * 1993-06-03 1994-12-08 Bosch Gmbh Robert Mikromechanischer Sensor und Verfahren zu dessen Herstellung

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KUEHNEL W: "SILICON CONDENSER MICROPHONE WITH INTEGRATED FIELD-EFFECT TRANSISTOR", SENSORS AND ACTUATORS A, vol. A26, no. 1 / 03, 1 March 1991 (1991-03-01), pages 521 - 525, XP000246508 *
LADABAUM I ET AL: "Micromachined ultrasonic transducers (MUTs)", 1995 IEEE ULTRASONICS SYMPOSIUM. PROCEEDINGS. AN INTERNATIONAL SYMPOSIUM (CAT. NO.95CH35844), 1995 IEEE ULTRASONICS SYMPOSIUM. PROCEEDINGS. AN INTERNATIONAL SYMPOSIUM, SEATTLE, WA, USA, 7-10 NOV. 1995, ISBN 0-7803-2940-6, 1995, NEW YORK, NY, USA, IEEE, USA, pages 501 - 504 vol.1, XP002063789 *

Also Published As

Publication number Publication date
WO1998019140A2 (de) 1998-05-07
US6320239B1 (en) 2001-11-20
JP3395844B2 (ja) 2003-04-14
EP0935741A2 (de) 1999-08-18
JP2001502871A (ja) 2001-02-27
DE19643893A1 (de) 1998-05-07
DE59710477D1 (de) 2003-08-28
EP0935741B1 (de) 2003-07-23

Similar Documents

Publication Publication Date Title
WO1998019140A3 (de) Ultraschallwandler in oberflächen-mikromechanik
WO2001023105A8 (en) An array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
WO2005084284A3 (en) Multiple element electrode cmut devices and fabrication methods
JP3352457B2 (ja) 半導体加速度センサーおよびその製造方法
WO1997006649A3 (en) Conformable composite acoustic transducer panel
CA2429940A1 (en) Miniature ultrasound transducer
EP1657553A3 (de) Verfahren zur Herstellung eines Sensors zur Detektion der äußeren Kraftgröße
CA2228741A1 (en) Electroding of ceramic piezoelectric transducers
EP2264758A3 (de) Verbindungsstruktur in Halbleitervorrichtung
CA2359225A1 (en) Method and device for vibration control
CA2235754A1 (en) Piezoelectric transducers
WO2002005413A3 (en) Mems actuator with lower power consumption and lower cost simplified fabrication
EP1255299A3 (de) Leistungshalbleitermodul in Druckkontaktierung
WO2002073662A3 (en) Non-uniform power semiconductor and method for making
AU1040895A (en) Method of mounting a piezoelectric element to a substrate
WO2000006309A3 (en) Off-aperture electrical connection for ultrasonic transducer
WO2002027363A3 (en) Method of bonding wafers with controlled height and associated structures
WO2004083802A3 (en) A cantilever array chemical sensor
EP1001531A3 (de) Akustische Oberflächenwellenanordnung
WO2002071560A3 (en) Separating of optical integrated modules and structures formed thereby
EP0992973A3 (de) Verfahren zur Befestigung einer Schallwandler an einem Substrat
WO2000063978A3 (en) Electrode patterning for a differential pzt activator
EP1791178A3 (de) Leistungshalbleitermodul in Druckkontaktausführung
WO2001082376A8 (fr) Dispositif a semi-conducteur
CA2180704A1 (en) Ultrasonic transducer

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

AK Designated states

Kind code of ref document: A3

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1997949856

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 09297243

Country of ref document: US

ENP Entry into the national phase

Ref country code: JP

Ref document number: 1998 519903

Kind code of ref document: A

Format of ref document f/p: F

WWP Wipo information: published in national office

Ref document number: 1997949856

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 1997949856

Country of ref document: EP