WO1998032159A3 - Mounting structure and mounting process from semiconductor devices - Google Patents
Mounting structure and mounting process from semiconductor devices Download PDFInfo
- Publication number
- WO1998032159A3 WO1998032159A3 PCT/US1998/000856 US9800856W WO9832159A3 WO 1998032159 A3 WO1998032159 A3 WO 1998032159A3 US 9800856 W US9800856 W US 9800856W WO 9832159 A3 WO9832159 A3 WO 9832159A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor devices
- mounting
- mounting structure
- circuit board
- provides
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98902589A EP0970520A4 (en) | 1997-01-17 | 1998-01-16 | Mounting structure and mounting process from semiconductor devices |
US09/341,288 US6274389B1 (en) | 1997-01-17 | 1998-01-16 | Mounting structure and mounting process from semiconductor devices |
CA002278006A CA2278006A1 (en) | 1997-01-17 | 1998-01-16 | Mounting structure and mounting process from semiconductor devices |
KR1019997006453A KR100563158B1 (en) | 1997-01-17 | 1998-01-16 | Semiconductor device assembly and preparation process thereof |
BR9806742-7A BR9806742A (en) | 1997-01-17 | 1998-01-16 | Assembly structure and assembly process for semiconductor devices. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9/6575 | 1997-01-17 | ||
JP00657597A JP3543902B2 (en) | 1997-01-17 | 1997-01-17 | Semiconductor device mounting structure and mounting method |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998032159A2 WO1998032159A2 (en) | 1998-07-23 |
WO1998032159A3 true WO1998032159A3 (en) | 1999-02-18 |
Family
ID=11642138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/000856 WO1998032159A2 (en) | 1997-01-17 | 1998-01-16 | Mounting structure and mounting process from semiconductor devices |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0970520A4 (en) |
JP (1) | JP3543902B2 (en) |
KR (1) | KR100563158B1 (en) |
CN (1) | CN1112723C (en) |
BR (1) | BR9806742A (en) |
CA (1) | CA2278006A1 (en) |
ID (1) | ID22705A (en) |
TW (1) | TW396469B (en) |
WO (1) | WO1998032159A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3613367B2 (en) * | 1997-01-17 | 2005-01-26 | ヘンケル コーポレイション | Thermosetting resin composition |
US6316528B1 (en) | 1997-01-17 | 2001-11-13 | Loctite (R&D) Limited | Thermosetting resin compositions |
US6358354B1 (en) * | 2000-07-05 | 2002-03-19 | Lexmark International, Inc. | UV and thermally curable adhesive formulation |
JP5280597B2 (en) * | 2001-03-30 | 2013-09-04 | サンスター技研株式会社 | One-component thermosetting epoxy resin composition and underfill material for semiconductor mounting |
JP2006303192A (en) * | 2005-04-20 | 2006-11-02 | Sumitomo Bakelite Co Ltd | Semiconductor device and method for reproducing chip |
KR100757093B1 (en) * | 2005-07-20 | 2007-09-10 | 주식회사 룩스비타 | Reproduction Method of Camera Module |
WO2008069178A1 (en) | 2006-12-04 | 2008-06-12 | Panasonic Corporation | Sealing material and mounting method using the sealing material |
JP5967489B2 (en) | 2011-04-04 | 2016-08-10 | パナソニックIpマネジメント株式会社 | Mounting structure |
TWI695657B (en) * | 2015-03-30 | 2020-06-01 | 日商則武股份有限公司 | Flexible wiring board and its utilization |
EP3911132A1 (en) | 2020-05-12 | 2021-11-17 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with a solid body protecting a component carrier hole from foreign material ingression |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5120665A (en) * | 1988-12-05 | 1992-06-09 | Hitachi Chemical Company | Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits |
US5250848A (en) * | 1990-03-14 | 1993-10-05 | International Business Machines Corporation | Solder interconnection structure |
US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
US5355580A (en) * | 1991-12-26 | 1994-10-18 | International Business Machines | Method for replacing semiconductor chips |
US5371328A (en) * | 1993-08-20 | 1994-12-06 | International Business Machines Corporation | Component rework |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US355580A (en) * | 1887-01-04 | Elijah windsor | ||
US4159976A (en) * | 1977-03-10 | 1979-07-03 | Loctite Corporation | Curable systems containing epoxy resin and methanol or ethanol solvent to suppress the catalytic reaction between epoxy resin and an imidazole catalytic curing agent |
JPS60147140A (en) * | 1984-01-11 | 1985-08-03 | Hitachi Ltd | Mounting process of semiconductor element chip |
JPS61255032A (en) * | 1985-05-08 | 1986-11-12 | Seiko Epson Corp | Replacement of semiconductor integrated circuit element |
US4866108A (en) * | 1988-01-19 | 1989-09-12 | Hughes Aircraft Company | Flexible epoxy adhesive blend |
JP2620611B2 (en) * | 1989-01-12 | 1997-06-18 | イビデン株式会社 | Substrate for mounting electronic components |
JP2679849B2 (en) * | 1989-07-26 | 1997-11-19 | 松下電器産業株式会社 | Electronic component mounting method and adhesive used in this method |
JP2728106B2 (en) * | 1991-09-05 | 1998-03-18 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Cleavable diepoxide for removable device protection in electronic packaging |
JPH05109838A (en) * | 1991-10-21 | 1993-04-30 | Fujitsu Ltd | Repair method for bare chip |
US5567266A (en) * | 1994-10-13 | 1996-10-22 | Loctite Corporation | Non-environmentally hazardous, non-volatile adhesive promoter composition for curing adhesives |
JPH10107095A (en) * | 1996-10-01 | 1998-04-24 | Matsushita Electric Ind Co Ltd | Mounting structure and repairing method for semiconductor device |
-
1997
- 1997-01-17 JP JP00657597A patent/JP3543902B2/en not_active Expired - Fee Related
-
1998
- 1998-01-16 EP EP98902589A patent/EP0970520A4/en not_active Withdrawn
- 1998-01-16 CA CA002278006A patent/CA2278006A1/en not_active Abandoned
- 1998-01-16 KR KR1019997006453A patent/KR100563158B1/en not_active IP Right Cessation
- 1998-01-16 CN CN98801883A patent/CN1112723C/en not_active Expired - Fee Related
- 1998-01-16 ID IDW990702A patent/ID22705A/en unknown
- 1998-01-16 BR BR9806742-7A patent/BR9806742A/en not_active IP Right Cessation
- 1998-01-16 WO PCT/US1998/000856 patent/WO1998032159A2/en active IP Right Grant
- 1998-01-17 TW TW087100681A patent/TW396469B/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5120665A (en) * | 1988-12-05 | 1992-06-09 | Hitachi Chemical Company | Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits |
US5250848A (en) * | 1990-03-14 | 1993-10-05 | International Business Machines Corporation | Solder interconnection structure |
US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
US5355580A (en) * | 1991-12-26 | 1994-10-18 | International Business Machines | Method for replacing semiconductor chips |
US5371328A (en) * | 1993-08-20 | 1994-12-06 | International Business Machines Corporation | Component rework |
Non-Patent Citations (1)
Title |
---|
See also references of EP0970520A4 * |
Also Published As
Publication number | Publication date |
---|---|
KR100563158B1 (en) | 2006-03-22 |
ID22705A (en) | 1999-12-09 |
WO1998032159A2 (en) | 1998-07-23 |
EP0970520A2 (en) | 2000-01-12 |
KR20000070227A (en) | 2000-11-25 |
BR9806742A (en) | 2000-06-06 |
CA2278006A1 (en) | 1998-07-23 |
CN1112723C (en) | 2003-06-25 |
CN1243601A (en) | 2000-02-02 |
EP0970520A4 (en) | 2000-08-30 |
TW396469B (en) | 2000-07-01 |
JPH10209342A (en) | 1998-08-07 |
JP3543902B2 (en) | 2004-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY118700A (en) | Thermosetting resin compositions | |
HK1018719A1 (en) | Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment | |
AU6121598A (en) | Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board | |
EP0630046A3 (en) | Cooling apparatus for integrated circuit chips. | |
HK1004872A1 (en) | Leadframe for an integrated circuit device | |
MY118657A (en) | Windowed non-ceramic package having embedded frame | |
AU7082798A (en) | Board for mounting semiconductor element, method for manufacturing the same, andsemiconductor device | |
KR20010012977A (en) | Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device | |
WO1998032159A3 (en) | Mounting structure and mounting process from semiconductor devices | |
GB9701856D0 (en) | Heat sink for electrical or electronic components | |
SG76592A1 (en) | Semiconductor integrated circuit device and process for manufacturing the same | |
TW374976B (en) | Protective shield | |
DE69005342T2 (en) | Intermediate structure for heat dissipation from the electrical module. | |
WO2003085703A3 (en) | Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof | |
CA2377336A1 (en) | Mounting method and apparatus for electrical components | |
SG75976A1 (en) | Process for manufacturing semiconductor integrated circuit device | |
TW592386U (en) | Mounting structure of semiconductor chip and semiconductor device | |
EP0411405A3 (en) | Encapsulation method, microelectronic devices made therefrom, and heat curable compositions | |
EP0691679A3 (en) | Process for manufacturing an integrated circuit package assembly | |
JPS542067A (en) | Semiconductor device | |
TW200515515A (en) | BGA semiconductor device with protection of component on ball-planting surface | |
GB2199650B (en) | Heat dissipating mounting for electronic components | |
MY121028A (en) | Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device. | |
EP0833383A3 (en) | Power module circuit board and a process for the manufacture thereof | |
EP0449150A3 (en) | Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 98801883.7 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): BR CA CN ID KR MX SG US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): BR CA CN ID KR MX SG US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 09341288 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 2278006 Country of ref document: CA Ref document number: 2278006 Country of ref document: CA Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019997006453 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: PA/a/1999/006673 Country of ref document: MX |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1998902589 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1998902589 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019997006453 Country of ref document: KR |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1998902589 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1019997006453 Country of ref document: KR |