WO1998043191A1 - Method for continuous, non lot-based integrated circuit manufacturing - Google Patents
Method for continuous, non lot-based integrated circuit manufacturing Download PDFInfo
- Publication number
- WO1998043191A1 WO1998043191A1 PCT/US1998/005921 US9805921W WO9843191A1 WO 1998043191 A1 WO1998043191 A1 WO 1998043191A1 US 9805921 W US9805921 W US 9805921W WO 9843191 A1 WO9843191 A1 WO 9843191A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- devices
- code
- dice
- manufacturing process
- wafers
- Prior art date
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/12—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using record carriers
- G05B19/128—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using record carriers the workpiece itself serves as a record carrier, e.g. by its form, by marks or codes on it
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/006—Identification
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31296—Identification, pallet object data and program code for station
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45026—Circuit board, pcb
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
- H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Definitions
- the present invention relates in general to integrated circuit (IC) manufacturing, and more specifically to methods for tracking IC devices in a substantially continuous flow of IC devices from multiple lots through one or more steps in an IC manufacturing process.
- Background Art Integrated circuits (IC's) are small electronic circuits formed on the surface of a wafer of semiconductor material, such as silicon, in an IC manufacturing process referred to as "fabrication.” Once fabricated, IC's are probed to evaluate a variety of their electronic characteristics, cut from the wafer on which they were formed into discrete IC dice or "chips,” and then assembled for customer use using various well-known IC packaging techniques, including lead frame packaging, Chip-On-Board (COB) packaging, and flip-chip packaging.
- COB Chip-On-Board
- IC's During the manufacturing process, IC's generally undergo a variety of tests to ensure they will function properly once shipped. Testing typically involves a variety of known test steps, such as speed grading, burn-in, and final, which test IC's for defects and functionality and grade IC's for speed.
- IC's are typically tracked through the fabrication, probe, assembly, and test steps described above so correlations can be found between the results of tests performed on IC's in the test steps and the "path" the IC's took through the manufacturing process. For example, by tracking a group of IC's through the manufacturing process, it might be determined that IC's wire-bonded on a particular wire-bonding machine have an unusually high failure rate when tested. Similarly, it might be determined that a test machine itself is failing a disproportionate number of IC's. In either case, tracking IC's through the manufacturing process allows the source of a problem to be pinpointed and addressed. As shown in FIG.
- a conventional procedure 10 for tracking IC's through a process step 12 in an IC manufacturing process involves the use of lot numbers for the IC's.
- Lot numbers are first assigned to wafers during fabrication.
- a group of 20-50 wafers receive a single unique lot number (e.g. , 36/1/9970).
- the wafers are typically split into several sub-lots, with each sub-lot being assigned a new lot number (sometimes referred to as a "sub- lot" number) that is a modified form of the group's original lot number (e.g., 36/1/9970/0, 36/1/9970/1, . . . ).
- sub-lots are split and re-split for a variety of reasons until the group is typically split into many sub-lots, all having a unique lot number that is a modified form of the group's original lot number.
- a sub-lot (e.g., sub-lot H) is received from an input queue 14 where sub-lots wait to proceed through the process step 12.
- the process step 12 may be any step in the IC manufacturing process including, for example, probe, wafer saw, speed grading, burn-in, or final testing.
- data 16 related to the process step 12 is generated.
- data 16 may include, for example: an identification of the processing equipment and the operating personnel for the process step 12; information regarding the set-up of the process step 12; the time and date the sub-lot advanced through the process step 12; and yield and test results from the process step 12.
- a process report 18 is manually or automatically generated based on the generated data 16.
- the report 18 lists the lot number (e.g., "H") of the IC's in the sub-lot.
- the report 18 also physically accompanies the sub-lot through the remainder of the manufacturing process to ensure that the data 16 is correlated with the IC's in the sub-lot, although this is not necessary if other indicia identifying the lot number of the IC's in the sub-lot physically accompany the sub-lot through the manufacturing process.
- a processed sub-lot (e.g., sub-lot H) is cleared from equipment associated with the process step 12 to an output queue 20 to prepare the process step 12 for processing another sub-lot (e.g., sub-lot I).
- another sub-lot e.g., sub-lot I
- the next sub-lot can be processed. This "clearing" process is necessary because if two sub-lots (e.g., sub-lots H and I) proceed through the process step 12 in a continuous manner, the conventional tracking procedure 10 is unable to correlate the data 16 and the process report 18 generated as each of the two sub-lots proceed with the correct sub-lot.
- the conventional tracking procedure described above is problematic because it makes inefficient use of often very expensive manufacturing and test equipment and other resources by leaving sub-lots "parked" in input queues while process reports are generated and the equipment is cleared of already processed sub-lots.
- process steps which use multiple machines in parallel to process a sub-lot some machines may be idle while other machines finish their allotment from the sub-lot being processed and the next sub-lot waits in an input queue.
- generation of the process reports, as well as clearing a processed sub-lot from equipment often requires laborious manual work by operating personnel. Further, a process report that must physically accompany a sub-lot through the manufacturing process may become lost or damaged, and thus is not as reliable as a means of tracking IC's as is desired.
- Fuse ID's and other electrically retrievable ID codes are typically programmed into IC's by blowing selected fuses or anti-fuses in circuitry on the IC's so that the circuitry outputs the ID code when accessed.
- None of these methods addresses the inefficiency problems caused by the conventional lot-based tracking procedure described above.
- An inventive method for tracking integrated circuit (IC) devices of the type to each have a substantially unique identification (ID) code includes: reading the ID code of each of the IC devices; advancing multiple lots of the IC devices through the step in the manufacturing process in a substantially continuous manner; generating data, such as processing equipment data or test data, related to the advancement of each of the IC devices through the step in the process; and associating the data generated for each of the IC devices with the ID code of its associated IC device.
- ID substantially unique identification
- the inventive method allows the IC devices to be tracked through the step in the process. Further, because multiple lots of the IC devices can advance through the step in the manufacturing process continuously, manufacturing resources are used more efficiently. In addition, because the ID codes and associated data read and generated using the inventive method need not physically accompany IC's as they progress through the manufacturing process, the inventive method is more reliable than conventional tracking procedures.
- a method of manufacturing IC devices from semiconductor wafers includes: providing wafers in multiple lots; fabricating IC's on the wafers; causing each of the IC's to permanently store a substantially unique ID code, such as a fuse ID; separating the IC's from their wafers to form IC dice; assembling the IC dice into IC devices; reading the IC code from the IC in each of the IC devices; testing each of the IC devices; while testing the IC devices: advancing the IC devices from the multiple lots of wafers through at least one test step in a substantially continuous manner; generating data related to the advancement of each of the IC devices through the test step; and associating the data generated for each of the IC devices with the ID code of the IC in its associated IC device.
- a substantially unique ID code such as a fuse ID
- a method for correlating variables related to an IC manufacturing process with variables related to the performance of IC devices as they advance through the process includes: causing each of multiple IC's from multiple lots to permanently store a substantially unique ID code, such as a fuse ID; reading the ID code from each of the IC devices; advancing the IC devices from the multiple lots through at least one step in the manufacturing process in a substantially continuous manner; while the IC devices advance through the step in the manufacturing process, generating data related to process variables associated with the step in the process; generating data related to variables associated with the performance of at least some of the IC devices as they advance through at least one step in the manufacturing process; and associating the process variable-related data and the performance variable-related data generated for each of the IC devices with the ID code of the IC device associated with the data to correlate the process variables with the performance variables.
- a substantially unique ID code such as a fuse ID
- FIG. 1 is a flow diagram showing a process step in a conventional lot-based integrated circuit (IC) manufacturing process
- FIG. 2 is a flow diagram showing a process step in a substantially continuous, non lot-based IC manufacturing process in accordance with the present invention.
- IC devices through a step 32 in an IC manufacturing process includes a step 34 of receiving IC devices from multiple, mixed lots 36.
- DRAM's Dynamic Random Access Memories
- SRAM's Static Random Access Memories
- SDRAM's Synchronous DRAM's
- ASIC's Application Specific IC's
- ROM Read Only Memory
- EEPROM Electrically Erasable Programmable ROM
- the step 32 may be any step in an IC manufacturing process, including assembly and test steps.
- the step 32 may encompass processing by a single machine, part of a machine, many machines operating in series or parallel, or any combination thereof.
- the step 34 of receiving IC devices from multiple, mixed lots 36 is without regard to the lots from which the IC devices come, and thus allows a more efficient use of processing equipment than traditional lot-based procedures.
- the present invention is described as being implemented in a single process step 32 for ease of understanding, the invention more typically is implemented on a series of process steps, such as all back-end test steps.
- the IC devices are each programmed with a unique identification (ID) code, such as the well-known fuse ID described above.
- ID is programmed in an IC device by selectively blowing fuses or anti-fuses in a circuit on the IC device so that when the circuit is accessed, it outputs an ID code.
- ID code programmed into each IC device be unique by specifying, for example, a lot number, wafer number, and wafer position for the IC device, it is not necessary to implement the present invention. For example, if the ID code is the same for all IC devices derived from the same semiconductor wafer, or from the same lot, it will work for purposes of the present invention.
- data 40 related to the process step 32 is generated for each IC device.
- data 40 may include, for example, process variables such as the processing equipment used, the operating personnel present, the set-up, and the time and date of processing for the process step 32, and performance variables such as yield and test results from the process step 32.
- the set-up for the process step 32 may include, for example, a standard set-up or a set-up in accordance with a Special Work Request (SWR) by engineering personnel.
- SWR Special Work Request
- the ID code data 38 and process -related data 40 may be automatically correlated by computer with data from process steps prior to the process step 32 through reference to the ID codes common to the ID code data 38 generated in the process step 32 and ID code data generated in the prior process steps.
- correlations can be found between process variables, such as the processing equipment used, and performance variables, such as test results.
- process variables such as the processing equipment used
- performance variables such as test results.
- the process of correlation is preferably performed in real time so information is available immediately, although it is within the scope of the present invention to perform the correlation at a later time.
- the processed IC devices are output from the process step 32 to mixed output lots 42.
- the processed IC devices must be cleared from processing equipment before other IC devices can be processed, and in other cases, such as in serial-feed machines, processed IC devices are being output from the process step 32 while other IC devices are advancing through the process step 32 and still other IC devices are being received by the process step 32. Any of these cases fall within the scope of the present invention.
- the inventive method 30 avoids the need for lot-based manufacturing altogether.
- the input and output lots 36 and 42 may then be mixed without regard to lots, and the processing of IC devices through the process step 32 may proceed in a substantially continuous fashion, thus dramatically improving the utilization of processing equipment.
- the inventive method is more reliable than conventional tracking procedures.
- the present invention has been described with reference to a particular embodiment, the invention is not limited to this described embodiment.
- the present invention includes within its scope the manufacture of Single In-line Memory Modules (SIMM's) and Dual In-line Memory Modules
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54597298A JP3360733B2 (en) | 1997-03-24 | 1998-03-24 | Method of manufacturing continuous, non-lot based integrated circuits |
KR10-1999-7008661A KR100430174B1 (en) | 1997-03-24 | 1998-03-24 | Method for continuous, non lot-based integrated circuit manufacturing |
EP98912047A EP1027675A4 (en) | 1997-03-24 | 1998-03-24 | Method for continuous, non lot-based integrated circuit manufacturing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/822,731 US5856923A (en) | 1997-03-24 | 1997-03-24 | Method for continuous, non lot-based integrated circuit manufacturing |
US08/822,731 | 1997-03-24 |
Publications (1)
Publication Number | Publication Date |
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WO1998043191A1 true WO1998043191A1 (en) | 1998-10-01 |
Family
ID=25236814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US1998/005921 WO1998043191A1 (en) | 1997-03-24 | 1998-03-24 | Method for continuous, non lot-based integrated circuit manufacturing |
Country Status (5)
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US (6) | US5856923A (en) |
EP (1) | EP1027675A4 (en) |
JP (1) | JP3360733B2 (en) |
KR (1) | KR100430174B1 (en) |
WO (1) | WO1998043191A1 (en) |
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Also Published As
Publication number | Publication date |
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US20020183884A1 (en) | 2002-12-05 |
EP1027675A1 (en) | 2000-08-16 |
US20130006411A1 (en) | 2013-01-03 |
KR100430174B1 (en) | 2004-05-03 |
US7555358B2 (en) | 2009-06-30 |
US20070239307A1 (en) | 2007-10-11 |
US6427092B1 (en) | 2002-07-30 |
US8600540B2 (en) | 2013-12-03 |
EP1027675A4 (en) | 2007-05-09 |
US8315730B2 (en) | 2012-11-20 |
US5856923A (en) | 1999-01-05 |
US20100222913A1 (en) | 2010-09-02 |
JP3360733B2 (en) | 2002-12-24 |
JP2001510638A (en) | 2001-07-31 |
US7738988B2 (en) | 2010-06-15 |
KR20010005597A (en) | 2001-01-15 |
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