WO1998043317A1 - A contact device and a tool for handling it - Google Patents

A contact device and a tool for handling it Download PDF

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Publication number
WO1998043317A1
WO1998043317A1 PCT/DK1998/000126 DK9800126W WO9843317A1 WO 1998043317 A1 WO1998043317 A1 WO 1998043317A1 DK 9800126 W DK9800126 W DK 9800126W WO 9843317 A1 WO9843317 A1 WO 9843317A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact device
contact
tool
top portion
diameter
Prior art date
Application number
PCT/DK1998/000126
Other languages
Danish (da)
French (fr)
Inventor
Kaj Børge HANSEN
Original Assignee
Kirk Acoustics A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kirk Acoustics A/S filed Critical Kirk Acoustics A/S
Priority to AU63932/98A priority Critical patent/AU6393298A/en
Priority to EP98909373A priority patent/EP0970544B1/en
Priority to KR10-1999-7008710A priority patent/KR100498581B1/en
Priority to DE69800400T priority patent/DE69800400T2/en
Priority to US09/381,091 priority patent/US6239393B1/en
Priority to JP54091798A priority patent/JP2001517357A/en
Priority to DK98909373T priority patent/DK0970544T3/en
Publication of WO1998043317A1 publication Critical patent/WO1998043317A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00—Springs
    • F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
    • F16F1/04—Wound springs
    • F16F1/08—Wound springs with turns lying in mainly conical surfaces, i.e. characterised by varying diameter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches

Definitions

  • the present invention relates to a contact device of the type defined in the introductory portion of claim 1 and to a tool for handling the contact device as defined in the introductory of claim 8.
  • spring contacts For electrical contacting of separate components for printed electrical circuits it is known to provide the component with spring contacts, or to provide the circuit with a contact housing which contains the desired number of spring contacts to establish electrical connections.
  • the spring contacts may be of different types, e.g. elastomer contacts either with carbon contact elements or gold wires. It is moreover known to provide differently constructed metal contacts or contact faces with a metal plating of superior conductivity or wear resistance.
  • US Patent Specification No. 4,458,293 discloses an elec- trically conducting contact spring which, according to the document, may be wave soldered at a solder point.
  • a problem in connection with this spring is that it is not suitable for automatic handling in SDM mounting, since vacuum retention of the upper air permeable windings of the spring in a suction tool is difficult or directly impossible. It should be recalled in this connection that handling of very small contact springs of the above-mentioned type will be difficult if not impossible, as the springs with very small diameters and wire diameters will be extremely vulnerable to e.g. deformations caused by inexpedient adaptation of a necessary and sufficient vacuum suction.
  • the object of the invention is to provide a contact device of the type mentioned in the opening paragraph which makes it possible to achieve a generally better and less expensive contacting between separate components, such as acoustic transducers, batteries, etc. and printed circuit boards, by means of simple features.
  • the contact device is characterized in that the top portion is adapted for SMD mounting, said helical spring being formed with a base part adapted to be positioned on and attached to a contact face by soldering or gluing, and formed with a top portion adapted for handling with a pneumatic tool, preferably associated with an SMD apparatus, said top portion having a predominantly cylindrical shape with two or more closely wound windings and having a plane top or contact face.
  • the top portion is formed with a winding diameter as small as possible with respect to the wire diameter, thereby achieving an increased air resistance.
  • a further advantage of the invention is achieved in that the contact spring may be used in SMD tools at very high rates, since the springs may be handled at relatively small suction pressures because of the increased engagement face. This moreover results in a very small percentage of faulty mounting, as a relatively small suction pressure directed against a relatively fragile contact spring subjects the contact spring to a minimum of strain during handling.
  • Providing the top portion of the contact spring with a closed suction face formed by one of the windings thus enables the contact spring to be "gripped" by a vacuum suction, as the air resistance of the very small tube formed by the windings is so great that this provides a relatively great air resistance with respect to an en- closing part of a corresponding suction tool.
  • said top portion is given a predominantly cylindrical shape with one or more closely wound windings and has a plane top or contact face.
  • the predominantly cylindrical top portion is important to achieve a sufficient contact face with the suction air along the outer side of the top portion.
  • the plane top or contact face of the stable top portion may be relatively small, which reduces the necessary contact area on the component, thereby allowing its overall size to be minimized.
  • the longitudinal ratio of unaffected to affected contact device may be maximized according to the invention in that the helical spring has a conical shape between said top and base portions.
  • the conical shape of the screw or helical spring moreover counteracts tipping over of the contact spring device during the soldering process.
  • the contact device according to the invention is constructed such that, in addition to the top portion, the base portion has one or more closely wound, conical windings.
  • the top portion as well as the base portion of the contact device has two or more closely wound windings having a pitch which corresponds to the wire diameter or slightly more than this, it being thereby possible to separate the contact devices in a vi- brator feeder for positioning in tape and reel or in another standard package for feeding in an SMD mounting apparatus. Also a stabilization of the contact position of the contact device with respect to the soldering point is obtained.
  • the contact device as a screw or helical spring provides a great safeguard against transfer of laterally directed forces or moments from the contact face which destroy the contact face and/or the solder connection with the printed circuit.
  • SMD Surface Mounted Device
  • SMD refers to components having one or more contact faces which are adapted or intended for direct connection (soldering or optionally gluing) with contact points of circuit boards.
  • the contact device may alter- natively be constructed such that said base portion is wound with one or more additional windings to form a wide base portion which is flush with the contact face and the soldering face.
  • a contact device may e.g. be wound of spring wire with a thickness of the order of 0.2 mm, a top diameter of about 1.1 mm, a base portion- with a diameter of about 2.4 mm, a winding spacing of about 0.5 - 0.5 mm and a free height of about 4 mm.
  • a contact device may be wound of spring wire with a thickness of the order of 0.2 mm, a top diameter of about 1.1 mm, a base portion with a diameter of about 2.4 mm, a free height of about 2 mm, a compressed height of about 0.8 mm and a lower portion of great conicity.
  • the actual thickness of the spring wire must be adapted to the actual spring size, of course.
  • the invention also relates to a tool for handling the contact device according to the invention, said tool be- ing characterized in that it consists of a preferably vacuum driven mounting pick-up having a central control mandrel which fits loosely inside the top portion of the contact device, and which has an enclosing recess adapted to the external shape of the top portion of the contact device.
  • the tool is moreover constructed such that said recess preferably has a greater depth than the length of the control mandrel and has a downwardly/out- wardly increasing cross-section with an outer lip-shaped mouth.
  • the tool can hereby grip and position a contact device more easily, if the cylindrical top portion is e.g. not positioned or oriented completely correctly with respect to the mouth of the tool.
  • the control mandrel may be omitted completely if the springs are shaped carefully.
  • the central control mandrel of the tool according to the invention may be provided with an external diameter which is slightly larger than the internal passage of the top portion of the contact device, said tool moreover comprising a slidable stripper part which encloses the control mandrel, and which may be activated to release the contact device.
  • fig. 1 is a lateral view of an embodiment of a contact device according to the invention.
  • fig. 2 is a lateral view of another embodiment of a contact device according to the invention.
  • fig. 3 is a lateral sectional view of an embodiment of a tool for handling the contact device according to the invention.
  • fig. 4 is a lateral sectional view of another embodiment of a tool for handling the contact device according to the invention.
  • Fig. 1 shows an embodiment of a contact device 2 according to the invention which is formed by a helical spring 2 having a base portion 4, a top portion 6 and a conical intermediate portion 8.
  • the contact device/helical spring 2 is wound of spring wire having a thickness of 0.2 mm, and its overall unloaded height is about 4 mm; the base portion 4 has an external diameter of about 2.4 mm, and the top portion 6 has an external diameter of about 1.1 mm.
  • the base portion 4 and the top portion 6 have a plurality of closely wound windings with the smallest possible winding diameter relative to the wire diameter, while the pitch between the windings of the intermediate portion 8 is 0.4 - 0.5 mm, i.e. the compressed helical spring 2 has a height of about 2.5 mm.
  • Fig. 2 shows an embodiment of a contact device 10 accord- ing to the invention which is formed by a relatively short conical helical spring 10 having a wide base portion 12 and a top portion 14 which has a plurality of closely wound windings with the smallest possible diameter. Unloaded, the contact device 10 has an overall height (H) of about 2 mm; while its compressed height (h) is about 0.8 mm.
  • Both contact devices 2 and 10 have identical predominantly cylindrical top portions 6 and 14, so that the top portions have the appearance of outwardly closed predominantly cylindrical units that may be handled with a simple suction tool 16, which is shown in fig. 3, and which e.g. belongs to a common SMD mounting apparatus.
  • the suction tool 16 comprises a central mandrel 18 which - as shown - is adapted to be inserted into the top portion 14 of the spring contact 10, and which fits loosely in the top portion 14, and an enclosing recess 20 which is adapted to the outer shape of the top portion, and which is connected with a source of vacuum via bores 22 in the bottom of the recess 20 and a pressure reduction chamber 23.
  • the recess 20 is formed by the central mandrel 18 and an enclosing engagement face 33.
  • Fig. 4 shows an alternative tool 24 which comprises a central mandrel 26 having an external diameter which is slightly greater than the internal diameter of the top portion 6 and 14, i.e. the top portion 6 or 14 will be clamped externally on the mandrel 26 when this is inserted from above into the top portion 6 or 14.
  • the tool 24 moreover comprises a stripper 28 which encloses the mandrel 26, and which may be displaced externally on it in order to strip the spring contact 2 or 10 when this is positioned correctly on contact points of a given circuit board.
  • the contact device according to the invention e.g. has the following basic advantages :
  • the contact device As the micro contact (contact device) is attached to the printed circuit by soldering (or optionally gluing) without any housing, the contact device takes up a minimum of space, which also contributes to reducing the total costs.

Abstract

A contact device (2, 10) consisting of a helical spring which is adapted for SMD mounting, and which is formed with a base portion (4, 12) adapted to be positioned on and attached to a contact face by soldering or gluing, and with a top portion (6, 14) adapted for handling with a tool (16) preferably associated with an SMD apparatus. This provides the possibility of achieving a generally better and less expensive contacting between components, such as acoustic transducers, batteries or the like and printed circuit boards by means of simple features. Constructing the contact device as a screw or helical spring provides a great safeguard against transfer of laterally directed forces or moments from the contact face which destroy the contact face and/or the solder connection with the printed circuit. A tool (16) for handling the contact device (2, 10) consists of a preferably vacuum-driven mounting pick-up with a central control mandrel (18) which fits internally in the top portion (6, 14) of the contact device (2, 10), and which has an enclosing, ring-shaped recess (20) adapted to the outer shape of the top portion (6, 14) of the contact device (2, 10).

Description

A contact device and a tool for handling it
Field of the invention
The present invention relates to a contact device of the type defined in the introductory portion of claim 1 and to a tool for handling the contact device as defined in the introductory of claim 8.
For electrical contacting of separate components for printed electrical circuits it is known to provide the component with spring contacts, or to provide the circuit with a contact housing which contains the desired number of spring contacts to establish electrical connections. The spring contacts may be of different types, e.g. elastomer contacts either with carbon contact elements or gold wires. It is moreover known to provide differently constructed metal contacts or contact faces with a metal plating of superior conductivity or wear resistance.
It is known from EP-A1-0 755 165 to use a helical spring for contacting between a circuit board and an electroa- coustic transducer, where the helical spring is firmly connected with the transducer outside the diaphragm face, i.e. where the transducer housing has a special protruding housing part in which a base part of the contact spring is secured.
US Patent Specification No. 4,458,293 discloses an elec- trically conducting contact spring which, according to the document, may be wave soldered at a solder point. A problem in connection with this spring is that it is not suitable for automatic handling in SDM mounting, since vacuum retention of the upper air permeable windings of the spring in a suction tool is difficult or directly impossible. It should be recalled in this connection that handling of very small contact springs of the above-mentioned type will be difficult if not impossible, as the springs with very small diameters and wire diameters will be extremely vulnerable to e.g. deformations caused by inexpedient adaptation of a necessary and sufficient vacuum suction.
The object of the invention is to provide a contact device of the type mentioned in the opening paragraph which makes it possible to achieve a generally better and less expensive contacting between separate components, such as acoustic transducers, batteries, etc. and printed circuit boards, by means of simple features.
Summary of the invention
The contact device according to the invention is characterized in that the top portion is adapted for SMD mounting, said helical spring being formed with a base part adapted to be positioned on and attached to a contact face by soldering or gluing, and formed with a top portion adapted for handling with a pneumatic tool, preferably associated with an SMD apparatus, said top portion having a predominantly cylindrical shape with two or more closely wound windings and having a plane top or contact face.
According to an advantageous embodiment, the top portion is formed with a winding diameter as small as possible with respect to the wire diameter, thereby achieving an increased air resistance.
By means of simple features it is hereby possible to obtain a generally better and less expensive mounting of contact springs for contacting between components, such as acoustic transducers, batteries or the like and printed circuit boards .
A further advantage of the invention is achieved in that the contact spring may be used in SMD tools at very high rates, since the springs may be handled at relatively small suction pressures because of the increased engagement face. This moreover results in a very small percentage of faulty mounting, as a relatively small suction pressure directed against a relatively fragile contact spring subjects the contact spring to a minimum of strain during handling.
Providing the top portion of the contact spring with a closed suction face formed by one of the windings thus enables the contact spring to be "gripped" by a vacuum suction, as the air resistance of the very small tube formed by the windings is so great that this provides a relatively great air resistance with respect to an en- closing part of a corresponding suction tool.
To enable simple and safe handling of the contact device according to the invention by means of simple vacuum pick-up, it may be advantageous that said top portion is given a predominantly cylindrical shape with one or more closely wound windings and has a plane top or contact face. The predominantly cylindrical top portion is important to achieve a sufficient contact face with the suction air along the outer side of the top portion. The plane top or contact face of the stable top portion may be relatively small, which reduces the necessary contact area on the component, thereby allowing its overall size to be minimized.
The longitudinal ratio of unaffected to affected contact device may be maximized according to the invention in that the helical spring has a conical shape between said top and base portions. The conical shape of the screw or helical spring moreover counteracts tipping over of the contact spring device during the soldering process.
It may also be advantageous that the contact device according to the invention is constructed such that, in addition to the top portion, the base portion has one or more closely wound, conical windings. In other words, it may be advantageous that the top portion as well as the base portion of the contact device has two or more closely wound windings having a pitch which corresponds to the wire diameter or slightly more than this, it being thereby possible to separate the contact devices in a vi- brator feeder for positioning in tape and reel or in another standard package for feeding in an SMD mounting apparatus. Also a stabilization of the contact position of the contact device with respect to the soldering point is obtained.
Construction of the contact device as a screw or helical spring provides a great safeguard against transfer of laterally directed forces or moments from the contact face which destroy the contact face and/or the solder connection with the printed circuit.
The designation SMD (Surface Mounted Device) refers to components having one or more contact faces which are adapted or intended for direct connection (soldering or optionally gluing) with contact points of circuit boards.
Expediently and according to the invention, with a view to ensuring a good and stable connection with the contact face of the circuit board, the contact device may alter- natively be constructed such that said base portion is wound with one or more additional windings to form a wide base portion which is flush with the contact face and the soldering face.
A contact device according to the invention may e.g. be wound of spring wire with a thickness of the order of 0.2 mm, a top diameter of about 1.1 mm, a base portion- with a diameter of about 2.4 mm, a winding spacing of about 0.5 - 0.5 mm and a free height of about 4 mm.
Or a contact device according to the invention may be wound of spring wire with a thickness of the order of 0.2 mm, a top diameter of about 1.1 mm, a base portion with a diameter of about 2.4 mm, a free height of about 2 mm, a compressed height of about 0.8 mm and a lower portion of great conicity. The actual thickness of the spring wire must be adapted to the actual spring size, of course.
The invention also relates to a tool for handling the contact device according to the invention, said tool be- ing characterized in that it consists of a preferably vacuum driven mounting pick-up having a central control mandrel which fits loosely inside the top portion of the contact device, and which has an enclosing recess adapted to the external shape of the top portion of the contact device.
Preferably, the tool is moreover constructed such that said recess preferably has a greater depth than the length of the control mandrel and has a downwardly/out- wardly increasing cross-section with an outer lip-shaped mouth. The tool can hereby grip and position a contact device more easily, if the cylindrical top portion is e.g. not positioned or oriented completely correctly with respect to the mouth of the tool. However, it will be appreciated that the control mandrel may be omitted completely if the springs are shaped carefully.
Alternatively, the central control mandrel of the tool according to the invention may be provided with an external diameter which is slightly larger than the internal passage of the top portion of the contact device, said tool moreover comprising a slidable stripper part which encloses the control mandrel, and which may be activated to release the contact device.
The invention will be explained more fully below in connection with the drawing, in which:
fig. 1 is a lateral view of an embodiment of a contact device according to the invention,
fig. 2 is a lateral view of another embodiment of a contact device according to the invention,
fig. 3 is a lateral sectional view of an embodiment of a tool for handling the contact device according to the invention, and
fig. 4 is a lateral sectional view of another embodiment of a tool for handling the contact device according to the invention.
Fig. 1 shows an embodiment of a contact device 2 according to the invention which is formed by a helical spring 2 having a base portion 4, a top portion 6 and a conical intermediate portion 8. The contact device/helical spring 2 is wound of spring wire having a thickness of 0.2 mm, and its overall unloaded height is about 4 mm; the base portion 4 has an external diameter of about 2.4 mm, and the top portion 6 has an external diameter of about 1.1 mm. The base portion 4 and the top portion 6 have a plurality of closely wound windings with the smallest possible winding diameter relative to the wire diameter, while the pitch between the windings of the intermediate portion 8 is 0.4 - 0.5 mm, i.e. the compressed helical spring 2 has a height of about 2.5 mm.
Fig. 2 shows an embodiment of a contact device 10 accord- ing to the invention which is formed by a relatively short conical helical spring 10 having a wide base portion 12 and a top portion 14 which has a plurality of closely wound windings with the smallest possible diameter. Unloaded, the contact device 10 has an overall height (H) of about 2 mm; while its compressed height (h) is about 0.8 mm.
Both contact devices 2 and 10 have identical predominantly cylindrical top portions 6 and 14, so that the top portions have the appearance of outwardly closed predominantly cylindrical units that may be handled with a simple suction tool 16, which is shown in fig. 3, and which e.g. belongs to a common SMD mounting apparatus. The suction tool 16 comprises a central mandrel 18 which - as shown - is adapted to be inserted into the top portion 14 of the spring contact 10, and which fits loosely in the top portion 14, and an enclosing recess 20 which is adapted to the outer shape of the top portion, and which is connected with a source of vacuum via bores 22 in the bottom of the recess 20 and a pressure reduction chamber 23. As will appear from fig. 3, the recess 20 is formed by the central mandrel 18 and an enclosing engagement face 33.
Fig. 4 shows an alternative tool 24 which comprises a central mandrel 26 having an external diameter which is slightly greater than the internal diameter of the top portion 6 and 14, i.e. the top portion 6 or 14 will be clamped externally on the mandrel 26 when this is inserted from above into the top portion 6 or 14. The tool 24 moreover comprises a stripper 28 which encloses the mandrel 26, and which may be displaced externally on it in order to strip the spring contact 2 or 10 when this is positioned correctly on contact points of a given circuit board.
It should moreover be stressed that the contact device according to the invention e.g. has the following basic advantages :
1) The total costs of the manufacture, storage and distribution of springs of several lengths and of components to be adapted to various mounting heights are lower than the costs of the manufacture, storage and distribution of components pro- vided with springs of various lengths.
2) When the contact face is provided on the components rather than on the printed circuit, the necessary area with a safe (enhanced) contact surface is reduced to the very limited contact points of the component, whereby the printed circuit may have a less expensive plating.
3) As the micro contact (contact device) is attached to the printed circuit by soldering (or optionally gluing) without any housing, the contact device takes up a minimum of space, which also contributes to reducing the total costs.

Claims

Patent Claims :
1. A contact device comprising a galvanically conducting low ohmic wound helical spring, c h a r a c t e r i z e d in that it is adapted for SMD mounting, said helical spring being formed with a base portion (4; 12) adapted to be positioned on and attached to a contact face by soldering or gluing, and formed with a top portion (6;
14) adapted for handling with a pneumatic tool, prefer- ably associated with an SMD apparatus, said top portion
(6; 14) having a predominantly cylindrical shape with two or more closely wound windings and having a substantially plane top or contact face.
2. A contact device according to claim 1, c h a r a c t e r i z e d in that the closely wound windings of the tip portion have a small diameter with respect to the wire thickness.
3. A contact device according to claim 1 or 2, c h a r a c t e r i z e d in that the top portion has a mean winding diameter of about 4 times the wire diameter.
4. A contact device according to claims 1-3, c h a r - a c t e r i z e d in that said base portion is wound with one or more additional helical windings to form a wide base portion which is flush with the contact face and the soldering face.
5. A contact device according to claims 1-4, c h a r a c t e r i z e d in that the top portion of the device forms an annular substantially cylindrical face of at least two windings.
6. A contact device according to claims 1-5, c h a r - a c t e r i z e d in that the helical spring between said top and base portions has a conical shape.
7. A contact device according to claims 1-6, c h a r - a c t e r i z e d in that said base portion has one or more closely wound, conical windings.
8. A contact device according to claims 1-7, c h a r a c t e r i z e d in that it is wound of spring wire with a thickness of the order of 0.2 mm, a top diameter of about 1.1 mm, a base portion with a diameter of about 2.4 mm, a winding spacing of about 0.5 - 0.5 mm, and a free height of about 4 mm.
9. A contact device according to any one of claims 1-8, c h a r a c t e r i z e d in that it is wound of spring wire with a thickness of the order of 0.2 mm, a top diameter of about 1.1 mm, a base portion with a diameter of about 2.4 mm, a free height of about 2 mm, a compressed height of about 0.8 mm, and a lower portion of great conicity.
10. A tool for handling a contact device according to claims 1-9, c h a r a c t e r i z e d in that it con- sists of a vacuum-driven mounting pick-up having an enclosing engagement face (33) which is adapted to the external shape of the top portion of the contact device.
11. A tool for handling a contact device according to claim 10, c h a r a c t e r i z e d in that the vacuum- driven mounting pick-up additionally comprises a central control mandrel (18) which fits loosely inside the top portion of the contact device.
12. A tool according to claim 11, c h a r a c t e r - i z e d in that the recess (20) formed by the central control mandrel (18) and the enclosing engagement face (33) preferably has a greater depth than the length of the control mandrel (18) and a downwardly/outwardly in- creasing cross-section with an outer lip-shaped mouth.
13. A tool according to claim 11 or 12, c h a r a c t e r i z e d in that the central control mandrel (18) has an external diameter which is slightly larger than the internal passage of the top portion of the contact device, and that the tool moreover comprises a slidable stripper part (18) which encloses the control mandrel (26) , and which may be activated to release the contact device.
PCT/DK1998/000126 1997-03-26 1998-03-26 A contact device and a tool for handling it WO1998043317A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU63932/98A AU6393298A (en) 1997-03-26 1998-03-26 A contact device and a tool for handling it
EP98909373A EP0970544B1 (en) 1997-03-26 1998-03-26 A contact spring and a tool for handling it
KR10-1999-7008710A KR100498581B1 (en) 1997-03-26 1998-03-26 A contact device and a tool for handling it
DE69800400T DE69800400T2 (en) 1997-03-26 1998-03-26 CONTACT SPRING AND TOOL FOR THEIR HANDLING
US09/381,091 US6239393B1 (en) 1997-03-26 1998-03-26 Contact device and a tool for handling it
JP54091798A JP2001517357A (en) 1997-03-26 1998-03-26 Contact device and its handling tool
DK98909373T DK0970544T3 (en) 1997-03-26 1998-03-26 Contact spring and tools for handling this

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK35797 1997-03-26
DK357/97 1997-03-26

Publications (1)

Publication Number Publication Date
WO1998043317A1 true WO1998043317A1 (en) 1998-10-01

Family

ID=8092614

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DK1998/000126 WO1998043317A1 (en) 1997-03-26 1998-03-26 A contact device and a tool for handling it

Country Status (10)

Country Link
US (1) US6239393B1 (en)
EP (2) EP0970544B1 (en)
JP (1) JP2001517357A (en)
KR (1) KR100498581B1 (en)
CN (1) CN1101068C (en)
AU (1) AU6393298A (en)
DE (1) DE69800400T2 (en)
DK (1) DK0970544T3 (en)
ES (1) ES2151764T3 (en)
WO (1) WO1998043317A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK173719B1 (en) * 2000-07-07 2001-07-23 Kirk Acoustics As Electric motor
WO2008092520A1 (en) * 2007-01-31 2008-08-07 Gigaset Communications Gmbh Contact system
EP2403070A1 (en) * 2010-07-03 2012-01-04 Amphenol-Tuchel Electronics GmbH Spring contact
WO2013017737A1 (en) * 2011-07-29 2013-02-07 Salcomp Oyj Electrical contact device

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030130713A1 (en) * 2001-05-21 2003-07-10 Stewart Mark T. Trans-septal catheter with retention mechanism
US6720511B2 (en) * 2002-09-05 2004-04-13 Litton Systems, Inc. One-piece semi-rigid electrical contact
US7058366B2 (en) * 2002-12-09 2006-06-06 Sony Ericsson Mobile Communications Ab Wireless terminal providing sound pressure level dissipation through channeled porting of sound
US7505602B2 (en) * 2003-02-28 2009-03-17 Sony Ericsson Mobile Communications Ab Mobile device with improved acoustic porting
US20050023119A1 (en) * 2003-07-29 2005-02-03 Lu Yao Tsun Restorable conductive elastic connector
DE102005008758A1 (en) 2004-09-29 2006-04-13 BSH Bosch und Siemens Hausgeräte GmbH Capacitive proximity and / or touch switch
US7419486B2 (en) * 2005-06-15 2008-09-02 St. Jude Medical, Atrial Fibrillation Division, Inc. Treatment and diagnostic catheters with hydrogel electrodes
DE102005034487A1 (en) * 2005-07-20 2007-01-25 Siemens Ag Electric motor for e.g. ring indicator, has coil electrically connected with connection pins, where connection pins are electrically and mechanically connected with spring elements, which include screwed spring shaped area
EP1835570A1 (en) 2006-03-13 2007-09-19 Ariose Electronics Co., ltd. Restorable conductive elastic connector
US7503774B2 (en) * 2007-07-06 2009-03-17 Kitagawa Industries Co., Ltd Surface mount contact member
JP4854612B2 (en) * 2007-07-09 2012-01-18 センサータ テクノロジーズ マサチューセッツ インコーポレーテッド Socket adapter
US8367953B2 (en) * 2008-06-17 2013-02-05 Mac Valves, Inc. Pneumatic system electrical contact device
EP2299104B1 (en) * 2009-08-25 2014-11-12 Makita Corporation Starter device for combustion engine
DE102010027230A1 (en) * 2010-07-15 2012-01-19 Siebe Appliance Controls Gmbh Contact means and operating device for a household appliance
US8919656B2 (en) * 2011-06-02 2014-12-30 Key Systems, Inc. Memory button mount
CN103352947A (en) * 2013-07-04 2013-10-16 昆山杰升精密五金有限公司 Special-shaped compression spring
WO2015036048A1 (en) * 2013-09-16 2015-03-19 Siemens Aktiengesellschaft Operator control- and detector device having differentiated signal generation
EP2874233B1 (en) * 2013-11-14 2017-01-25 Joinset Co., Ltd Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same
CN104033519A (en) * 2014-07-02 2014-09-10 安庆谢德尔汽车零部件有限公司 Horn-shaped compression spring
FR3033672B1 (en) * 2015-03-13 2018-07-13 Societe Technique De Productions Industrielles FEMALE CONTACT COMPRISING A SPRING
WO2017084566A1 (en) * 2015-11-17 2017-05-26 Ampd Electrosprings Limited Coil spring
JP6874607B2 (en) * 2017-09-01 2021-05-19 オムロン株式会社 Key switch
JP7255840B2 (en) * 2018-12-20 2023-04-11 北川工業株式会社 contact
TWI726585B (en) * 2020-01-17 2021-05-01 宏碁股份有限公司 Key structure
DE102022208922A1 (en) 2022-08-29 2024-02-29 Robert Bosch Gesellschaft mit beschränkter Haftung EMC contact spring

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842230A (en) * 1972-03-09 1974-10-15 Casio Computer Co Ltd Pushbutton switch with coil spring contact
US4458293A (en) * 1981-11-05 1984-07-03 Cherry Electrical Products Corporation Capacitive keyboard
EP0141305A2 (en) * 1983-10-26 1985-05-15 Hans Hackner Holding and touching device for an electrical connector
DE4127696A1 (en) * 1991-08-21 1993-02-25 Adalbert Fritsch Handling system for assembly of SMD devices onto printed circuit board - has suction pad gripper used to extract components from magazine under control of optical viewing system
WO1996000994A1 (en) * 1994-06-29 1996-01-11 Vorwerk & Co. Interholding Gmbh Electric plug connection
EP0755165A1 (en) * 1995-07-17 1997-01-22 AKG Akustische u. Kino-Geräte Gesellschaft m.b.H. Contacting of an electroacoustic transducer inside a telephone handset

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205402A (en) * 1962-09-10 1965-09-07 Zeller Corp Spark plug with resilient connector to electrical resistor
US3781497A (en) * 1972-10-12 1973-12-25 Allied Chem Seat belt buckle plunger type switch and housing containing belt latch mechanism
US4678880A (en) * 1984-04-18 1987-07-07 Omron Tateisi Electronics Co. Keyboard switch
US4733036A (en) 1984-04-19 1988-03-22 Omron Tateisi Electronics Co. Coil spring for key switch
US4831223A (en) * 1987-03-25 1989-05-16 Jelco Co. Ltd. Push-button switch
US5173578A (en) * 1988-11-18 1992-12-22 Matsushita Electric Industrial Co., Ltd. Push button switch assembly
US5158357A (en) * 1990-09-11 1992-10-27 Mcdermott Kevin Flashlight of selectable colors
US5111009A (en) * 1990-11-14 1992-05-05 Cooper Industries, Inc. Operating mechanism for throwing toggle switches
EP0616395B1 (en) * 1993-03-16 1997-09-10 Hewlett-Packard Company Method and system for producing electrically interconnected circuits

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842230A (en) * 1972-03-09 1974-10-15 Casio Computer Co Ltd Pushbutton switch with coil spring contact
US4458293A (en) * 1981-11-05 1984-07-03 Cherry Electrical Products Corporation Capacitive keyboard
EP0141305A2 (en) * 1983-10-26 1985-05-15 Hans Hackner Holding and touching device for an electrical connector
DE4127696A1 (en) * 1991-08-21 1993-02-25 Adalbert Fritsch Handling system for assembly of SMD devices onto printed circuit board - has suction pad gripper used to extract components from magazine under control of optical viewing system
WO1996000994A1 (en) * 1994-06-29 1996-01-11 Vorwerk & Co. Interholding Gmbh Electric plug connection
EP0755165A1 (en) * 1995-07-17 1997-01-22 AKG Akustische u. Kino-Geräte Gesellschaft m.b.H. Contacting of an electroacoustic transducer inside a telephone handset

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK173719B1 (en) * 2000-07-07 2001-07-23 Kirk Acoustics As Electric motor
WO2002005409A1 (en) * 2000-07-07 2002-01-17 Kirk Acoustics A/S Dc electric motor with two commutators and permanent magnet rotor
WO2008092520A1 (en) * 2007-01-31 2008-08-07 Gigaset Communications Gmbh Contact system
EP2403070A1 (en) * 2010-07-03 2012-01-04 Amphenol-Tuchel Electronics GmbH Spring contact
WO2013017737A1 (en) * 2011-07-29 2013-02-07 Salcomp Oyj Electrical contact device
CN103718385A (en) * 2011-07-29 2014-04-09 萨尔康普有限公司 Electrical contact device

Also Published As

Publication number Publication date
KR20010049171A (en) 2001-06-15
KR100498581B1 (en) 2005-07-01
DE69800400D1 (en) 2000-12-21
DK0970544T3 (en) 2000-12-11
CN1101068C (en) 2003-02-05
DE69800400T2 (en) 2001-03-15
EP1026787A2 (en) 2000-08-09
EP0970544A1 (en) 2000-01-12
US6239393B1 (en) 2001-05-29
ES2151764T3 (en) 2001-01-01
AU6393298A (en) 1998-10-20
JP2001517357A (en) 2001-10-02
EP0970544B1 (en) 2000-11-15
EP1026787A3 (en) 2000-08-16
CN1251219A (en) 2000-04-19

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