WO1999008495A3 - Method of manufacturing surface-mountable sil hybrid circuit - Google Patents
Method of manufacturing surface-mountable sil hybrid circuit Download PDFInfo
- Publication number
- WO1999008495A3 WO1999008495A3 PCT/FI1998/000622 FI9800622W WO9908495A3 WO 1999008495 A3 WO1999008495 A3 WO 1999008495A3 FI 9800622 W FI9800622 W FI 9800622W WO 9908495 A3 WO9908495 A3 WO 9908495A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hybrid circuit
- sil
- lead frame
- mountable
- members
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU87335/98A AU8733598A (en) | 1997-08-08 | 1998-08-10 | Method of manufacturing surface-mountable sil hybrid circuit |
JP2000506807A JP2001513593A (en) | 1997-08-08 | 1998-08-10 | Method of manufacturing surface-mounted SIL hybrid circuit |
EP98938718A EP1021937A2 (en) | 1997-08-08 | 1998-08-10 | Method of manufacturing surface-mountable sil hybrid circuit |
US09/485,338 US6295726B1 (en) | 1997-08-08 | 1998-08-10 | Method of manufacturing surface-mountable SIL hybrid circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI973268A FI973268A (en) | 1996-11-07 | 1997-08-08 | A method of manufacturing a SIL hybrid circuit |
FI973268 | 1997-08-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999008495A2 WO1999008495A2 (en) | 1999-02-18 |
WO1999008495A3 true WO1999008495A3 (en) | 1999-04-15 |
Family
ID=8549328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FI1998/000622 WO1999008495A2 (en) | 1997-08-08 | 1998-08-10 | Method of manufacturing surface-mountable sil hybrid circuit |
Country Status (6)
Country | Link |
---|---|
US (1) | US6295726B1 (en) |
EP (1) | EP1021937A2 (en) |
JP (1) | JP2001513593A (en) |
CN (1) | CN1113588C (en) |
AU (1) | AU8733598A (en) |
WO (1) | WO1999008495A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10057460C1 (en) * | 2000-11-20 | 2002-08-08 | Tyco Electronics Amp Gmbh | Holding element with a holding clip, arrangement with a carrier plate and a holding element and arrangement with holding element and carrier strip |
US6790102B2 (en) * | 2002-10-10 | 2004-09-14 | Delphi Technologies, Inc. | Twisted flat electrical terminal |
CN2626076Y (en) * | 2003-06-04 | 2004-07-14 | 邓莉敏 | Conducting strip |
CA2532647C (en) * | 2003-07-28 | 2010-06-08 | Michael Charles Kallen | Composite form for stabilizing earthen embankments |
EP1700516B1 (en) * | 2004-04-08 | 2007-08-01 | ebm-papst St. Georgen GmbH & Co. KG | Arrangement with a contact element |
US7682207B2 (en) * | 2008-07-24 | 2010-03-23 | Illinois Tool Works Inc. | Carrier strip for electrical contacts |
DE102009058825B4 (en) * | 2009-12-18 | 2021-08-05 | Webasto Ag | Contact device for fastening to a circuit board, method for fastening a contact device to a circuit board and circuit board |
DE102018101792B4 (en) * | 2018-01-26 | 2021-03-25 | Harting Electric Gmbh & Co. Kg | Circuit card connector and associated circuit card arrangement for the transmission of high currents |
CN112688100B (en) * | 2020-12-11 | 2022-08-02 | 中国北方发动机研究所(天津) | Seed plate connecting and fixing structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5352851A (en) * | 1992-09-08 | 1994-10-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount integrated circuit device |
US5441430A (en) * | 1994-04-06 | 1995-08-15 | North American Specialties Corporation | Electrical lead for surface mounting of substrates |
EP0682366A2 (en) * | 1994-05-12 | 1995-11-15 | Texas Instruments Incorporated | Mounting of integrated circuit devices |
US5490788A (en) * | 1994-11-01 | 1996-02-13 | Emc Technology, Inc. | Surface mount terminal for electrical component |
US5635760A (en) * | 1993-07-01 | 1997-06-03 | Nec Corporation | Surface mount semiconductor device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3873890A (en) * | 1973-08-20 | 1975-03-25 | Allen Bradley Co | Terminal construction for electrical circuit device |
CA1055134A (en) * | 1975-09-02 | 1979-05-22 | Lawrence D. Radosevich | Terminal lead construction for electrical circuit substrate |
US4978307A (en) | 1989-08-07 | 1990-12-18 | Amp Incorporated | Electrical socket for substrates |
JPH04243155A (en) | 1991-01-17 | 1992-08-31 | Nec Corp | Hybrid integrated circuit device |
-
1998
- 1998-08-10 JP JP2000506807A patent/JP2001513593A/en active Pending
- 1998-08-10 AU AU87335/98A patent/AU8733598A/en not_active Abandoned
- 1998-08-10 CN CN98808016A patent/CN1113588C/en not_active Expired - Fee Related
- 1998-08-10 US US09/485,338 patent/US6295726B1/en not_active Expired - Fee Related
- 1998-08-10 EP EP98938718A patent/EP1021937A2/en not_active Withdrawn
- 1998-08-10 WO PCT/FI1998/000622 patent/WO1999008495A2/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5352851A (en) * | 1992-09-08 | 1994-10-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount integrated circuit device |
US5635760A (en) * | 1993-07-01 | 1997-06-03 | Nec Corporation | Surface mount semiconductor device |
US5441430A (en) * | 1994-04-06 | 1995-08-15 | North American Specialties Corporation | Electrical lead for surface mounting of substrates |
EP0682366A2 (en) * | 1994-05-12 | 1995-11-15 | Texas Instruments Incorporated | Mounting of integrated circuit devices |
US5490788A (en) * | 1994-11-01 | 1996-02-13 | Emc Technology, Inc. | Surface mount terminal for electrical component |
Also Published As
Publication number | Publication date |
---|---|
CN1113588C (en) | 2003-07-02 |
AU8733598A (en) | 1999-03-01 |
WO1999008495A2 (en) | 1999-02-18 |
CN1266607A (en) | 2000-09-13 |
JP2001513593A (en) | 2001-09-04 |
EP1021937A2 (en) | 2000-07-26 |
US6295726B1 (en) | 2001-10-02 |
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