WO1999013494A3 - Method and apparatus for cleaning electronic test contacts - Google Patents
Method and apparatus for cleaning electronic test contacts Download PDFInfo
- Publication number
- WO1999013494A3 WO1999013494A3 PCT/US1998/018942 US9818942W WO9913494A3 WO 1999013494 A3 WO1999013494 A3 WO 1999013494A3 US 9818942 W US9818942 W US 9818942W WO 9913494 A3 WO9913494 A3 WO 9913494A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact
- electromagnetic radiation
- debris
- conductive material
- probe
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU93143/98A AU9314398A (en) | 1997-09-12 | 1998-09-11 | Method and apparatus for cleaning electronic test contacts |
EP98946037A EP1021822A4 (en) | 1997-09-12 | 1998-09-11 | Method and apparatus for cleaning electronic test contacts |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/928,806 US6573702B2 (en) | 1997-09-12 | 1997-09-12 | Method and apparatus for cleaning electronic test contacts |
US08/928,806 | 1997-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999013494A2 WO1999013494A2 (en) | 1999-03-18 |
WO1999013494A3 true WO1999013494A3 (en) | 1999-07-01 |
Family
ID=25456796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/018942 WO1999013494A2 (en) | 1997-09-12 | 1998-09-11 | Method and apparatus for cleaning electronic test contacts |
Country Status (5)
Country | Link |
---|---|
US (1) | US6573702B2 (en) |
EP (1) | EP1021822A4 (en) |
AU (1) | AU9314398A (en) |
TW (1) | TW455687B (en) |
WO (1) | WO1999013494A2 (en) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
US7202683B2 (en) * | 1999-07-30 | 2007-04-10 | International Test Solutions | Cleaning system, device and method |
JP2001091544A (en) * | 1999-09-27 | 2001-04-06 | Hitachi Ltd | Method for manufacture of semiconductor inspecting device |
US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
DE20114544U1 (en) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
US6813804B2 (en) * | 2002-06-06 | 2004-11-09 | Samsung Electronics Co., Ltd. | Apparatus and method for cleaning probe card contacts |
US7642798B2 (en) * | 2003-02-05 | 2010-01-05 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Probe card needle cleaning frequency optimization |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
KR20060126700A (en) | 2003-12-24 | 2006-12-08 | 캐스케이드 마이크로테크 인코포레이티드 | Active wafer probe |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
CN1716557A (en) * | 2004-02-25 | 2006-01-04 | 库力索法投资公司 | Laser cleaning system for a wire bonding machine |
US7148716B2 (en) * | 2004-06-10 | 2006-12-12 | Texas Instruments Incorporated | System and method for the probing of a wafer |
EP1789812A2 (en) | 2004-09-13 | 2007-05-30 | Cascade Microtech, Inc. | Double sided probing structures |
US20060065290A1 (en) * | 2004-09-28 | 2006-03-30 | Jerry Broz | Working surface cleaning system and method |
US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
KR100688507B1 (en) * | 2004-12-08 | 2007-03-02 | 삼성전자주식회사 | Equipment of inspection of semiconductor chip and method of inspecting semiconductor chip using the same |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US20060219754A1 (en) * | 2005-03-31 | 2006-10-05 | Horst Clauberg | Bonding wire cleaning unit and method of wire bonding using same |
KR100674995B1 (en) * | 2005-09-16 | 2007-01-29 | 삼성전자주식회사 | Method for cleaning socket by using laser |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7474089B2 (en) * | 2006-12-28 | 2009-01-06 | Texas Instruments Incorporated | Contact mechanism cleaning |
US7977602B2 (en) * | 2007-03-21 | 2011-07-12 | Photon Dynamics, Inc. | Laser ablation using multiple wavelengths |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US11311917B2 (en) | 2007-08-09 | 2022-04-26 | Bruker Nano, Inc. | Apparatus and method for contamination identification |
US7993464B2 (en) | 2007-08-09 | 2011-08-09 | Rave, Llc | Apparatus and method for indirect surface cleaning |
KR20090029057A (en) * | 2007-09-17 | 2009-03-20 | 주식회사 동부하이텍 | A method for fabricating semiconductor device |
JP2010044030A (en) * | 2008-08-18 | 2010-02-25 | Fujitsu Ltd | Laser cleaning apparatus and laser cleaning method |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
US20120055909A1 (en) * | 2009-05-15 | 2012-03-08 | Hideaki Miyake | Method of laser-welding and method of manufacturing battery including the same |
CN102770226A (en) * | 2009-11-26 | 2012-11-07 | Ats自动化加工系统公司 | Thermode cleaning method |
US8371316B2 (en) | 2009-12-03 | 2013-02-12 | International Test Solutions, Inc. | Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware |
KR101135499B1 (en) * | 2010-05-28 | 2012-04-13 | 삼성에스디아이 주식회사 | Laser cleaning device of electrode tab for battery and laser cleaning method using the same |
US20160286119A1 (en) * | 2011-04-18 | 2016-09-29 | 360fly, Inc. | Mobile Device-Mountable Panoramic Camera System and Method of Displaying Images Captured Therefrom |
CN103231177B (en) * | 2013-04-19 | 2015-02-25 | 苏州光韵达光电科技有限公司 | Laser cutting method for printed circuit board (PCB) in ball grid array structure |
US9835653B2 (en) | 2014-05-13 | 2017-12-05 | International Business Machines Corporation | Solder bump array probe tip structure for laser cleaning |
JP2016003925A (en) * | 2014-06-16 | 2016-01-12 | 株式会社C.I.C | Contact foreign matter removal method and contact foreign matter removal system |
JP6457981B2 (en) * | 2016-07-08 | 2019-01-23 | 株式会社スギノマシン | Nozzle cleaning method and laser processing apparatus |
CN106345752B (en) * | 2016-08-22 | 2018-08-07 | 沧州致胜机器人科技有限公司 | A kind of double four-rotor helicopter photovoltaic laser wiping board systems |
US9825000B1 (en) | 2017-04-24 | 2017-11-21 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
US11155428B2 (en) | 2018-02-23 | 2021-10-26 | International Test Solutions, Llc | Material and hardware to automatically clean flexible electronic web rolls |
CN110146421A (en) * | 2019-06-14 | 2019-08-20 | 深圳市杰普特光电股份有限公司 | It is a kind of to clean the method for probe, laser resistance adjuster |
US10792713B1 (en) | 2019-07-02 | 2020-10-06 | International Test Solutions, Inc. | Pick and place machine cleaning system and method |
US11756811B2 (en) | 2019-07-02 | 2023-09-12 | International Test Solutions, Llc | Pick and place machine cleaning system and method |
CN110230982A (en) * | 2019-07-03 | 2019-09-13 | 合肥新汇成微电子有限公司 | A kind of probe card fully-automatic dry type cleaning equipment |
US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3628144A (en) * | 1969-01-15 | 1971-12-14 | Ibm | Electrical contact cleaning device |
US3997358A (en) * | 1976-02-19 | 1976-12-14 | Motorola, Inc. | Cleaning process for semiconductor die |
US4590422A (en) * | 1981-07-30 | 1986-05-20 | Pacific Western Systems, Inc. | Automatic wafer prober having a probe scrub routine |
US5373140A (en) * | 1993-03-16 | 1994-12-13 | Vernay Laboratories, Inc. | System for cleaning molding equipment using a laser |
US5389761A (en) * | 1993-09-17 | 1995-02-14 | General Motors Corporation | Method and apparatus for cleaning metal pieces prior to resistive seam welding or laser lap seam welding |
US5592879A (en) * | 1992-12-10 | 1997-01-14 | Baldwin-Gegenheimer Gmbh | Method and apparatus for the contact-free removal of dirt from the cylinders of printing machines |
US5595668A (en) * | 1995-04-05 | 1997-01-21 | Electro-Films Incorporated | Laser slag removal |
US5658148A (en) * | 1995-04-26 | 1997-08-19 | Ceramoptec Industries, Inc. | Dental laser brushing or cleaning device |
US5666063A (en) * | 1996-10-23 | 1997-09-09 | Motorola, Inc. | Method and apparatus for testing an integrated circuit |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2101048C3 (en) | 1971-01-11 | 1973-11-29 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Optical readout process and device for carrying out the process |
US3782823A (en) | 1972-03-23 | 1974-01-01 | American Optical Corp | Laser microprobe |
US4141456A (en) | 1976-08-30 | 1979-02-27 | Rca Corp. | Apparatus and method for aligning wafers |
US4229710A (en) | 1977-10-21 | 1980-10-21 | Itamar Shoshan | Wavelength selector for tunable laser |
US4182024A (en) | 1977-12-15 | 1980-01-08 | National Semiconductor Corporation | Automatic control of integrated circuit trimming |
US4346314A (en) | 1980-05-01 | 1982-08-24 | The University Of Rochester | High power efficient frequency conversion of coherent radiation with nonlinear optical elements |
US4530600A (en) | 1982-02-22 | 1985-07-23 | Northrop Corporation | Variable attenuator for optical transceiver |
DE3584798D1 (en) | 1984-07-17 | 1992-01-16 | Nec Corp | INCENTIVE PROCESS AND DEVICE FOR PHOTOCHEMICAL REACTIONS. |
JPS62124086A (en) | 1985-11-22 | 1987-06-05 | Nec Corp | Laser trimming device |
JPS63154280A (en) | 1986-12-17 | 1988-06-27 | Fuji Electric Corp Res & Dev Ltd | Laser beam machine |
US4864227A (en) | 1987-02-27 | 1989-09-05 | Canon Kabushiki Kaisha | Wafer prober |
US4778263A (en) | 1987-05-29 | 1988-10-18 | The United States Of America As Respresented By The Department Of Energy | Variable laser attenuator |
US4879479A (en) | 1987-08-05 | 1989-11-07 | Martin Marietta Corporation | Poly-yne nonlinear optical materials |
JP2604395B2 (en) | 1988-01-22 | 1997-04-30 | 松下電器産業株式会社 | Laser processing method |
US5059764A (en) | 1988-10-31 | 1991-10-22 | Spectra-Physics, Inc. | Diode-pumped, solid state laser-based workstation for precision materials processing and machining |
JPH066236B2 (en) | 1989-01-20 | 1994-01-26 | ティーディーケイ株式会社 | Laser irradiation processing device |
US4965865A (en) | 1989-10-11 | 1990-10-23 | General Signal Corporation | Probe card for integrated circuit chip |
US5231263A (en) | 1990-03-09 | 1993-07-27 | Hitachi, Ltd. | Liquid crystal mask type laser marking system |
US5065092A (en) | 1990-05-14 | 1991-11-12 | Triple S Engineering, Inc. | System for locating probe tips on an integrated circuit probe card and method therefor |
US5070297A (en) | 1990-06-04 | 1991-12-03 | Texas Instruments Incorporated | Full wafer integrated circuit testing device |
US5047668A (en) | 1990-06-26 | 1991-09-10 | Cornell Research Foundation, Inc. | Optical walkoff compensation in critically phase-matched three-wave frequency conversion systems |
US5083007A (en) | 1990-08-01 | 1992-01-21 | Microelectronics And Computer Technology Corporation | Bonding metal electrical members with a frequency doubled pulsed laser beam |
DE4029530C2 (en) | 1990-09-18 | 1999-10-21 | Erwin Steiger | Modular, pulsed multi-wavelength solid-state laser for medical therapy procedures |
US5521518A (en) | 1990-09-20 | 1996-05-28 | Higgins; H. Dan | Probe card apparatus |
US5151909A (en) | 1990-10-16 | 1992-09-29 | Laserscope | Frequency doubled solid state laser having programmable pump power modes and method for controllable lasers |
US5144630A (en) | 1991-07-29 | 1992-09-01 | Jtt International, Inc. | Multiwavelength solid state laser using frequency conversion techniques |
US5321352A (en) | 1991-08-01 | 1994-06-14 | Tokyo Electron Yamanashi Limited | Probe apparatus and method of alignment for the same |
US5399983A (en) | 1991-08-08 | 1995-03-21 | Tokyo Electron Yamanashi Limited | Probe apparatus |
JPH05192779A (en) | 1992-01-17 | 1993-08-03 | Toshiba Corp | Laser beam machine |
US5293516A (en) | 1992-01-28 | 1994-03-08 | International Business Machines Corporation | Multiprobe apparatus |
US5266889A (en) | 1992-05-29 | 1993-11-30 | Cascade Microtech, Inc. | Wafer probe station with integrated environment control enclosure |
US5247389A (en) | 1992-06-15 | 1993-09-21 | Cygnus Laser Corporation | Nonlinear optical frequency converter |
DE4229397C2 (en) | 1992-09-03 | 1996-11-21 | Deutsche Forsch Luft Raumfahrt | Device for removing material from a target |
JPH06110069A (en) | 1992-09-29 | 1994-04-22 | Matsushita Electric Ind Co Ltd | Method and device for repairing defect of electronic component |
JPH06106378A (en) | 1992-09-30 | 1994-04-19 | Olympus Optical Co Ltd | Laser beam machine |
US5341236A (en) | 1992-12-03 | 1994-08-23 | Northrop Corporation | Nonlinear optical wavelength converters with feedback |
US5489853A (en) | 1993-05-19 | 1996-02-06 | Tokyo Electron Limited | Testing apparatus and connection method for the testing apparatus |
US5611946A (en) | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
JP3293995B2 (en) | 1994-03-10 | 2002-06-17 | 株式会社東芝 | Probing apparatus and probing method |
US5519724A (en) | 1994-08-02 | 1996-05-21 | Panasonic Technologies, Inc. | Multiwavelength and multibeam diffractive optics system for material processing |
-
1997
- 1997-09-12 US US08/928,806 patent/US6573702B2/en not_active Expired - Fee Related
-
1998
- 1998-09-11 AU AU93143/98A patent/AU9314398A/en not_active Abandoned
- 1998-09-11 TW TW087115293A patent/TW455687B/en not_active IP Right Cessation
- 1998-09-11 EP EP98946037A patent/EP1021822A4/en not_active Withdrawn
- 1998-09-11 WO PCT/US1998/018942 patent/WO1999013494A2/en not_active Application Discontinuation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3628144A (en) * | 1969-01-15 | 1971-12-14 | Ibm | Electrical contact cleaning device |
US3997358A (en) * | 1976-02-19 | 1976-12-14 | Motorola, Inc. | Cleaning process for semiconductor die |
US4590422A (en) * | 1981-07-30 | 1986-05-20 | Pacific Western Systems, Inc. | Automatic wafer prober having a probe scrub routine |
US5592879A (en) * | 1992-12-10 | 1997-01-14 | Baldwin-Gegenheimer Gmbh | Method and apparatus for the contact-free removal of dirt from the cylinders of printing machines |
US5373140A (en) * | 1993-03-16 | 1994-12-13 | Vernay Laboratories, Inc. | System for cleaning molding equipment using a laser |
US5389761A (en) * | 1993-09-17 | 1995-02-14 | General Motors Corporation | Method and apparatus for cleaning metal pieces prior to resistive seam welding or laser lap seam welding |
US5595668A (en) * | 1995-04-05 | 1997-01-21 | Electro-Films Incorporated | Laser slag removal |
US5658148A (en) * | 1995-04-26 | 1997-08-19 | Ceramoptec Industries, Inc. | Dental laser brushing or cleaning device |
US5666063A (en) * | 1996-10-23 | 1997-09-09 | Motorola, Inc. | Method and apparatus for testing an integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
WO1999013494A2 (en) | 1999-03-18 |
TW455687B (en) | 2001-09-21 |
US20010007421A1 (en) | 2001-07-12 |
EP1021822A2 (en) | 2000-07-26 |
US6573702B2 (en) | 2003-06-03 |
EP1021822A4 (en) | 2005-02-09 |
AU9314398A (en) | 1999-03-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1999013494A3 (en) | Method and apparatus for cleaning electronic test contacts | |
KR970018873A (en) | Method and apparatus for positioning an electrical circuit member | |
EP0766829B1 (en) | Method of cleaning probe tips of probe cards | |
EP0841571A3 (en) | Wafer level burn-in base unit substrate and assembly | |
ATE371196T1 (en) | DEVICE FOR AN INTERFACE BETWEEN ELECTRONIC HOUSINGS AND TEST DEVICES | |
SG78283A1 (en) | Method and apparatus for performing operative testing on an integrated circuit | |
TW200730834A (en) | Electronic component test device and method for installing performance board of the electronic component test device | |
SE9402082L (en) | Miniature optical capsule | |
GB2324374B (en) | Method and apparatus for the quantitative measurement of the corrosivity effect of residues present on the surface of electronic circuit assemblies | |
EP1637893A4 (en) | Method and apparatus for testing electrical characteristics of object under test | |
DE68908341T2 (en) | Method for mounting an electronic component and memory card using the same. | |
CA2110472A1 (en) | Method and Apparatus for In-Situ Testing of Integrated Circuit Chips | |
EP0748152A3 (en) | Method for mounting an electronic component on a wiring substrate and an illuminated switch unit using this mounting method | |
TW429592B (en) | Manufacturing method for semiconductor device | |
TW358885B (en) | Apparatus and method for testing non-componented printed circuit boards | |
EP0942466A4 (en) | Process for manufacturing semiconductor device and semiconductor component | |
WO1997003365A3 (en) | Laser-induced metallic plasma for con-contact inspection | |
EP0846953A3 (en) | Printed circuit board inspecting apparatus, and method of using a universal-type printed circuit board inspecting apparatus | |
EP1014096A3 (en) | Substrate and method for inspection | |
EP0384586A3 (en) | High reliability plastic package for integrated circuits | |
MY125628A (en) | Ic testing apparatus | |
JP3813285B2 (en) | Flat head for test object | |
DE10347035A1 (en) | Method for generating electrically conducting structures e.g. complete circuit layout for intelligent cards, involves focusing and guiding laser radiation through substrate | |
SE8702704D0 (en) | SET FOR MANUFACTURING A SAMPLE CARD AND APPARATUS FOR USE IN IMPLEMENTATION OF THE SET | |
DE59702080D1 (en) | ELECTRICAL CONNECTING DEVICE AND USE OF THE ELECTRICAL CONNECTING DEVICE |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
NENP | Non-entry into the national phase |
Ref country code: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1998946037 Country of ref document: EP |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWP | Wipo information: published in national office |
Ref document number: 1998946037 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: CA |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1998946037 Country of ref document: EP |