WO1999013498A8 - Combined cmp and wafer cleaning apparatus and associated methods - Google Patents

Combined cmp and wafer cleaning apparatus and associated methods

Info

Publication number
WO1999013498A8
WO1999013498A8 PCT/US1998/018897 US9818897W WO9913498A8 WO 1999013498 A8 WO1999013498 A8 WO 1999013498A8 US 9818897 W US9818897 W US 9818897W WO 9913498 A8 WO9913498 A8 WO 9913498A8
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
station
effector
polishing
index table
Prior art date
Application number
PCT/US1998/018897
Other languages
French (fr)
Other versions
WO1999013498A2 (en
WO1999013498A3 (en
Inventor
Jose R Gonzalez-Martin
Chris Karlsrud
Robert F Allen
Toby Jordan
Craig M Howard
Arthur Hamer
Jeff Cunnane
Periya Gopalan
William Thornton
Jon R Macernie
Fernando Calderon
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25453584&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO1999013498(A8) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Speedfam Corp filed Critical Speedfam Corp
Priority to EP98946024A priority Critical patent/EP1012876A2/en
Priority to KR1020007002594A priority patent/KR20010023908A/en
Priority to JP2000511187A priority patent/JP3417925B2/en
Publication of WO1999013498A2 publication Critical patent/WO1999013498A2/en
Publication of WO1999013498A3 publication Critical patent/WO1999013498A3/en
Publication of WO1999013498A8 publication Critical patent/WO1999013498A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines

Abstract

An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.
PCT/US1998/018897 1997-09-10 1998-09-10 Combined cmp and wafer cleaning apparatus and associated methods WO1999013498A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP98946024A EP1012876A2 (en) 1997-09-10 1998-09-10 Combined cmp and wafer cleaning apparatus and associated methods
KR1020007002594A KR20010023908A (en) 1997-09-10 1998-09-10 Combined cmp and wafer cleaning apparatus and associated methods
JP2000511187A JP3417925B2 (en) 1997-09-10 1998-09-10 Combined CMP and wafer cleaning tool and related method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/926,700 1997-09-10
US08/926,700 US6213853B1 (en) 1997-09-10 1997-09-10 Integral machine for polishing, cleaning, rinsing and drying workpieces

Publications (3)

Publication Number Publication Date
WO1999013498A2 WO1999013498A2 (en) 1999-03-18
WO1999013498A3 WO1999013498A3 (en) 1999-06-03
WO1999013498A8 true WO1999013498A8 (en) 1999-09-23

Family

ID=25453584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/018897 WO1999013498A2 (en) 1997-09-10 1998-09-10 Combined cmp and wafer cleaning apparatus and associated methods

Country Status (6)

Country Link
US (7) US6213853B1 (en)
EP (1) EP1012876A2 (en)
JP (4) JP3417925B2 (en)
KR (1) KR20010023908A (en)
TW (1) TW432446B (en)
WO (1) WO1999013498A2 (en)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5885138A (en) 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US6004828A (en) * 1997-09-30 1999-12-21 Semitool, Inc, Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces
US6213853B1 (en) * 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
JP3615931B2 (en) * 1998-03-26 2005-02-02 株式会社荏原製作所 Polishing apparatus and conditioning method in the polishing apparatus
WO2000023230A1 (en) * 1998-10-19 2000-04-27 Speedfam-Ipec Corporation Catastrophic error recovery apparatus and associated methods
US20010047810A1 (en) * 1999-06-29 2001-12-06 Jeff Farber High rpm megasonic cleaning
KR100510066B1 (en) * 1999-06-30 2005-08-26 주식회사 하이닉스반도체 Method for monitoring error of stocker in semiconductor manufacturing line
WO2001012384A2 (en) * 1999-08-12 2001-02-22 Speedfam-Ipec Corporation Apparatus for moving a workpiece
US6537416B1 (en) * 1999-10-01 2003-03-25 Novellus Systems, Inc. Wafer chuck for use in edge bevel removal of copper from silicon wafers
US7780867B1 (en) * 1999-10-01 2010-08-24 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
US6636626B1 (en) * 1999-11-30 2003-10-21 Wafermasters, Inc. Wafer mapping apparatus and method
US6562184B2 (en) * 2000-02-29 2003-05-13 Applied Materials, Inc. Planarization system with multiple polishing pads
US6662070B1 (en) * 2000-03-08 2003-12-09 Advanced Micro Devices, Inc. Wafer rotation randomization in cluster tool processing
JP3510177B2 (en) * 2000-03-23 2004-03-22 株式会社東京精密 Wafer polishing equipment
JP3556148B2 (en) * 2000-03-23 2004-08-18 株式会社東京精密 Wafer polishing equipment
US6435941B1 (en) * 2000-05-12 2002-08-20 Appllied Materials, Inc. Apparatus and method for chemical mechanical planarization
US20040079633A1 (en) * 2000-07-05 2004-04-29 Applied Materials, Inc. Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
US6634930B1 (en) * 2000-08-09 2003-10-21 Taiwan Semiconductor Manufacturing Co. Ltd Method and apparatus for preventing metal corrosion during chemical mechanical polishing
US6460414B1 (en) * 2000-11-17 2002-10-08 Sonoscan, Inc. Automated acoustic micro imaging system and method
KR20020053584A (en) * 2000-12-27 2002-07-05 한효용 Rinse Device of Saw system
WO2002067481A1 (en) * 2001-02-20 2002-08-29 University Of Maryland, Baltimore County Widely tunable and integrated optical system and method
US6748961B2 (en) * 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same
US6530736B2 (en) * 2001-07-13 2003-03-11 Asyst Technologies, Inc. SMIF load port interface including smart port door
US7121919B2 (en) 2001-08-30 2006-10-17 Micron Technology, Inc. Chemical mechanical polishing system and process
US6586336B2 (en) 2001-08-31 2003-07-01 Oriol, Inc. Chemical-mechanical-polishing station
US6638145B2 (en) * 2001-08-31 2003-10-28 Koninklijke Philips Electronics N.V. Constant pH polish and scrub
US20030098069A1 (en) * 2001-11-26 2003-05-29 Sund Wesley E. High purity fluid delivery system
JP2003209075A (en) * 2002-01-15 2003-07-25 Speedfam Co Ltd System and control method for polishing wafer edge
US20060255016A1 (en) * 2002-01-17 2006-11-16 Novellus Systems, Inc. Method for polishing copper on a workpiece surface
US20030134576A1 (en) * 2002-01-17 2003-07-17 Saket Chadda Method for polishing copper on a workpiece surface
US6831436B2 (en) 2002-04-22 2004-12-14 Jose Raul Gonzalez Modular hybrid multi-axis robot
US6875076B2 (en) 2002-06-17 2005-04-05 Accretech Usa, Inc. Polishing machine and method
US7131333B2 (en) * 2002-07-16 2006-11-07 Sonix, Inc. Pulse echo ultrasonic test chamber for tray production system
US7181969B2 (en) * 2002-07-16 2007-02-27 Sonix, Inc. Ultrasonic test chamber for tray production system and the like
FR2842755B1 (en) * 2002-07-23 2005-02-18 Soitec Silicon On Insulator RINSING WITH A SURFACE SOLUTION AFTER MECHANICAL CHEMICAL PLANARIZATION OF A WAFER
US6804579B1 (en) * 2002-10-16 2004-10-12 Abb, Inc. Robotic wash cell using recycled pure water
JP3916148B2 (en) 2002-11-15 2007-05-16 Ｔｄｋ株式会社 Wafer processing apparatus with wafer mapping function
US6916233B2 (en) * 2002-11-28 2005-07-12 Tsc Corporation Polishing and cleaning compound device
US7107158B2 (en) * 2003-02-03 2006-09-12 Qcept Technologies, Inc. Inspection system and apparatus
US7308367B2 (en) * 2003-02-03 2007-12-11 Qcept Technologies, Inc. Wafer inspection system
US6957154B2 (en) * 2003-02-03 2005-10-18 Qcept Technologies, Inc. Semiconductor wafer inspection system
US7103482B2 (en) * 2003-02-03 2006-09-05 Qcept Technologies, Inc. Inspection system and apparatus
US7013732B2 (en) * 2003-02-19 2006-03-21 Sonix, Inc. Method and apparatus for temperature-controlled ultrasonic inspection
US20040221871A1 (en) * 2003-05-07 2004-11-11 Fletcher Matthew F. Semiconductor wafer processing apparatus and method therefor
DE10329868A1 (en) * 2003-07-02 2005-01-20 Dynamic Microsystems Semiconductor Equipment Gmbh Storage system for wafers
DE10394095D2 (en) * 2003-07-09 2006-11-02 Rena Sondermaschinen Gmbh Apparatus for cleaning wafers after the CMP process
WO2005012853A1 (en) * 2003-07-25 2005-02-10 Qcept Technologies, Inc. Measurement of motions of rotating shafts using non-vibrating contact potential difference sensor
US20050069399A1 (en) * 2003-08-12 2005-03-31 Chih-Ming Hsieh Apparatus and method for dry-loading of substrates in scrubber cleaner
US20050061775A1 (en) * 2003-09-19 2005-03-24 Kuo-Tang Hsu Novel design to eliminate wafer sticking
KR100621620B1 (en) * 2003-12-03 2006-09-13 삼성전자주식회사 Wafer transporter and polishing apparatus comprising the same
KR100808798B1 (en) * 2003-12-31 2008-02-29 동부일렉트로닉스 주식회사 Equipment for wet cleaning process
US7661315B2 (en) * 2004-05-24 2010-02-16 Sonix, Inc. Method and apparatus for ultrasonic scanning of a fabrication wafer
US7182673B2 (en) * 2004-06-29 2007-02-27 Novellus Systems, Inc. Method and apparatus for post-CMP cleaning of a semiconductor work piece
US7249992B2 (en) * 2004-07-02 2007-07-31 Strasbaugh Method, apparatus and system for use in processing wafers
US7229339B2 (en) * 2004-07-02 2007-06-12 Novellus Systems, Inc. CMP apparatus and method
JP4012189B2 (en) 2004-10-26 2007-11-21 Ｔｄｋ株式会社 Wafer detection device
KR100820560B1 (en) 2004-12-03 2008-04-07 동부일렉트로닉스 주식회사 CMP equipment and stabilization thereof
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7255747B2 (en) * 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
KR101247933B1 (en) 2005-02-18 2013-03-26 아이로보트 코퍼레이션 Autonomous surface cleaning robot for wet and dry cleaning
JP2007005582A (en) * 2005-06-24 2007-01-11 Asm Japan Kk Substrate transfer apparatus and semiconductor substrate manufacturing apparatus mounted with the same
JP2009500869A (en) * 2005-07-11 2009-01-08 ブルックス オートメーション インコーポレイテッド Equipment with on-the-fly workpiece centering
US7172496B1 (en) * 2005-08-17 2007-02-06 Agere Systems, Inc. Method and apparatus for cleaning slurry depositions from a water carrier
US7549204B1 (en) * 2005-11-30 2009-06-23 Western Digital Technologies, Inc. Methods for picking and placing workpieces into small form factor hard disk drives
US8054752B2 (en) * 2005-12-22 2011-11-08 Intuitive Surgical Operations, Inc. Synchronous data communication
US20070281589A1 (en) * 2006-06-02 2007-12-06 Applied Materials, Inc. Rotational alignment mechanism for load cups
US8100081B1 (en) 2006-06-30 2012-01-24 Novellus Systems, Inc. Edge removal of films using externally generated plasma species
US7917317B2 (en) 2006-07-07 2011-03-29 Sonix, Inc. Ultrasonic inspection using acoustic modeling
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
KR100790817B1 (en) * 2006-12-06 2008-01-03 삼성전자주식회사 System for managing semiconductor divice manufacturing equipment
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7659734B2 (en) * 2007-03-07 2010-02-09 Qcept Technologies, Inc. Semiconductor inspection system and apparatus utilizing a non-vibrating contact potential difference sensor and controlled illumination
US7811153B1 (en) * 2007-03-30 2010-10-12 Novellus Systems, Inc. High throughput servo load cup with integrated wet chemistry delivery
US9732416B1 (en) 2007-04-18 2017-08-15 Novellus Systems, Inc. Wafer chuck with aerodynamic design for turbulence reduction
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US20080279658A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory
US7496423B2 (en) * 2007-05-11 2009-02-24 Applied Materials, Inc. Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
US7909677B2 (en) * 2007-05-14 2011-03-22 United Microelectronics Corp. Method of transferring a wafer
US7794194B2 (en) 2007-09-14 2010-09-14 Seagate Technology Llc Pick and place work piece flipper
US7900526B2 (en) * 2007-11-30 2011-03-08 Qcept Technologies, Inc. Defect classification utilizing data from a non-vibrating contact potential difference sensor
MY144526A (en) * 2008-04-18 2011-09-30 Khoo Hun Sniah Semiconductor die sorter for wafer level packaging
WO2009131945A2 (en) * 2008-04-25 2009-10-29 Applied Materials, Inc. High throughput chemical mechanical polishing system
US7752000B2 (en) * 2008-05-02 2010-07-06 Qcept Technologies, Inc. Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion
TWI550760B (en) * 2008-06-04 2016-09-21 荏原製作所股份有限公司 Substrate processing apparatus, substrate processing method, substrate hodlding mechanism, and substrate holding method
KR101958874B1 (en) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US8419964B2 (en) * 2008-08-27 2013-04-16 Novellus Systems, Inc. Apparatus and method for edge bevel removal of copper from silicon wafers
US8180487B1 (en) 2008-09-30 2012-05-15 Western Digital Technologies, Inc. Calibrated vision based robotic system
DE102008055889A1 (en) 2008-11-05 2010-01-14 Siltronic Ag Semiconductor wafer i.e. silicon wafer, treating method for producing microelectronic component, involves transporting semiconductor wafer away from output opening of liquid container in transporting direction by transporting device
US8135208B1 (en) 2009-01-15 2012-03-13 Western Digital Technologies, Inc. Calibrated vision based robotic system utilizing upward and downward looking cameras
US8172646B2 (en) * 2009-02-27 2012-05-08 Novellus Systems, Inc. Magnetically actuated chuck for edge bevel removal
US8746270B2 (en) * 2010-02-10 2014-06-10 Brg Industries Incorporated Precision low flow rate fluid delivery system and methods for controlling same
CN102049730B (en) * 2010-12-29 2012-02-15 清华大学 Wafer replacing device used in chemical mechanical polishing equipment
JP6010613B2 (en) 2011-06-03 2016-10-19 ティーイーエル ネックス，インコーポレイテッド Single substrate parallel processing system
TWI456684B (en) * 2011-06-29 2014-10-11 Grand Plastic Technology Co Ltd An apparatus of wet processor with wafer cassette automatically transfering from a spin dryer
US20130084147A1 (en) * 2011-10-03 2013-04-04 Denton Vacuum, L.L.C. Semiconductor wafer treatment system
US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
US9013176B2 (en) 2012-01-27 2015-04-21 Applied Materials, Inc. Methods and apparatus for sensing a substrate in a load cup
US20130199405A1 (en) * 2012-02-08 2013-08-08 Applied Materials, Inc. Circular track actuator system
JP6133120B2 (en) 2012-05-17 2017-05-24 株式会社荏原製作所 Substrate cleaning device
US20140080229A1 (en) * 2012-09-14 2014-03-20 Stmicroelectronics, Inc. Adaptive semiconductor processing using feedback from measurement devices
US9483055B2 (en) 2012-12-28 2016-11-01 Irobot Corporation Autonomous coverage robot
US9282867B2 (en) 2012-12-28 2016-03-15 Irobot Corporation Autonomous coverage robot
JP2015138856A (en) * 2014-01-22 2015-07-30 株式会社ディスコ Cutting device
JP2015201598A (en) * 2014-04-10 2015-11-12 株式会社荏原製作所 Substrate processor
JP6339909B2 (en) * 2014-09-17 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
WO2016123713A1 (en) * 2015-02-04 2016-08-11 Ats Automation Tooling Systems Inc. System and method for testing or calibrating in a pressurized and/or wet environment
WO2016181466A1 (en) * 2015-05-11 2016-11-17 株式会社安川電機 Dispensing system, controller, and control method
JP6367763B2 (en) 2015-06-22 2018-08-01 株式会社荏原製作所 Wafer drying apparatus and wafer drying method
KR102440321B1 (en) * 2015-09-04 2022-09-06 삼성전자주식회사 method for treating substrate
CN106541329B (en) * 2015-09-16 2019-01-01 泰科电子(上海)有限公司 Integrated equipment
JP6745673B2 (en) 2016-08-05 2020-08-26 東京エレクトロン株式会社 Semiconductor system
TW201812893A (en) * 2016-08-26 2018-04-01 美商應用材料股份有限公司 Chemical mechanical polishing tool with robot access to cassettes
US10357861B2 (en) 2016-11-28 2019-07-23 Baker Hughes, A Ge Company, Llc Magnetic sample holder for abrasive operations and related methods
CN108466118B (en) * 2018-03-14 2019-11-05 郑州工程技术学院 A kind of numerical control processing management system and method based on Internet of Things
CN109230533B (en) * 2018-09-03 2024-03-19 郑州福耀玻璃有限公司 Uninterrupted baking and bending line for automobile glass
CN109822419A (en) * 2019-03-04 2019-05-31 天通日进精密技术有限公司 Wafer transfer device and wafer transfer method
CN110767587B (en) * 2019-10-21 2022-04-01 西安奕斯伟材料科技有限公司 Wafer processing device and loading and unloading method
CN113035751B (en) * 2021-03-02 2022-08-19 桂林雷光科技有限公司 Chip rotating device of stress-relief etching machine and equipment thereof
US20220310424A1 (en) * 2021-03-25 2022-09-29 Applied Materials, Inc. Automated dry-in dry-out dual side polishing of silicon substrates with integrated spin rinse dry and metrology

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939514A (en) 1974-11-11 1976-02-24 Kayex Corporation Apparatus for cleaning thin, fragile wafers of a material
US4141180A (en) 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4313266A (en) 1980-05-01 1982-02-02 The Silicon Valley Group, Inc. Method and apparatus for drying wafers
US4680893A (en) 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4653231A (en) 1985-11-01 1987-03-31 Motorola, Inc. Polishing system with underwater Bernoulli pickup
US4811522A (en) 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
US4851101A (en) 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
JPH02250324A (en) 1989-03-23 1990-10-08 Hitachi Ltd Manufacture of semiconductor device and cleaning apparatus used therefor
US5357645A (en) 1989-04-09 1994-10-25 System Seiko Co., Ltd. Apparatus for cleaning and drying hard disk substrates
JP2683940B2 (en) 1989-08-09 1997-12-03 信越半導体 株式会社 Automatic work cleaning device
JPH0411728A (en) * 1990-04-30 1992-01-16 Seiichiro Sogo Washer for semiconductor wafer
US5203360A (en) 1990-12-17 1993-04-20 Seagate Technology, Inc. Disc washing system
DE4100526A1 (en) 1991-01-10 1992-07-16 Wacker Chemitronic DEVICE AND METHOD FOR AUTOMATICALLY SEPARATING STACKED DISCS
JPH0615565A (en) 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd Automatic wafer lapping machine
US5498199A (en) 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5329732A (en) 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
JPH0663862A (en) 1992-08-22 1994-03-08 Fujikoshi Mach Corp Polishing device
JP2655975B2 (en) 1992-09-18 1997-09-24 三菱マテリアル株式会社 Wafer polishing equipment
US5442828A (en) 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5605428A (en) * 1993-03-05 1997-02-25 Jenoptik Gmbh Device for indexing magazine compartments and wafer-shaped objects in the compartments
JP2513426B2 (en) 1993-09-20 1996-07-03 日本電気株式会社 Wafer polishing machine
KR100390293B1 (en) 1993-09-21 2003-09-02 가부시끼가이샤 도시바 Polishing device
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US5649854A (en) 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
US5605487A (en) 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
DE69512971T2 (en) 1994-08-09 2000-05-18 Ontrak Systems Inc Linear polisher and wafer planarization process
US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US5655954A (en) 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
US5522965A (en) 1994-12-12 1996-06-04 Texas Instruments Incorporated Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface
JP3044277B2 (en) * 1994-12-21 2000-05-22 信越半導体株式会社 Wafer cleaning and cleaning / drying equipment
US5554065A (en) 1995-06-07 1996-09-10 Clover; Richmond B. Vertically stacked planarization machine
US6360144B1 (en) * 1995-07-10 2002-03-19 Newport Corporation Self-teaching robot arm position method
KR100487590B1 (en) 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 Polishing device
US6481956B1 (en) * 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
EP1498934A3 (en) 1996-02-28 2005-12-21 Ebara Corporation Robotic wafer transport apparatus
TW363903B (en) 1996-03-11 1999-07-11 Memc Electronic Materials Spa Apparatus for use in automatically cleaning semiconductor wafers and methods for drying a semiconductor wafer in the automatic drying machine
JP3696690B2 (en) * 1996-04-23 2005-09-21 不二越機械工業株式会社 Wafer polisher system
US6012966A (en) * 1996-05-10 2000-01-11 Canon Kabushiki Kaisha Precision polishing apparatus with detecting means
US5904611A (en) 1996-05-10 1999-05-18 Canon Kabushiki Kaisha Precision polishing apparatus
EP0807492B1 (en) 1996-05-16 2003-03-19 Ebara Corporation Method for polishing workpieces and apparatus therefor
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
US6221171B1 (en) * 1996-06-04 2001-04-24 Ebara Corporation Method and apparatus for conveying a workpiece
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
US5950327A (en) * 1996-07-08 1999-09-14 Speedfam-Ipec Corporation Methods and apparatus for cleaning and drying wafers
US6021380A (en) * 1996-07-09 2000-02-01 Scanis, Inc. Automatic semiconductor wafer sorter/prober with extended optical inspection
KR100202659B1 (en) 1996-07-09 1999-06-15 구본준 Apparatus for chemical mechanical polishing semiconductor wafer
US6082949A (en) * 1996-10-11 2000-07-04 Asyst Technologies, Inc. Load port opener
JPH10242110A (en) * 1997-03-03 1998-09-11 Hitachi Ltd Method and device for rotational treatment
US6275744B1 (en) * 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
US6213853B1 (en) * 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US5957764A (en) * 1997-11-05 1999-09-28 Aplex, Inc. Modular wafer polishing apparatus and method
JPH11195687A (en) * 1997-12-27 1999-07-21 Nippon Seiko Kk Substrate transportation device
JPH11204615A (en) * 1998-01-19 1999-07-30 Speedfam Co Ltd Wafer loading and unloading mechanism of loading robot
US5954888A (en) * 1998-02-09 1999-09-21 Speedfam Corporation Post-CMP wet-HF cleaning station
US6057662A (en) * 1998-02-25 2000-05-02 Applied Materials, Inc. Single motor control for substrate handler in processing system

Also Published As

Publication number Publication date
JP2006216988A (en) 2006-08-17
WO1999013498A2 (en) 1999-03-18
JP2005322936A (en) 2005-11-17
TW432446B (en) 2001-05-01
US6364745B1 (en) 2002-04-02
JP2001516152A (en) 2001-09-25
JP3417925B2 (en) 2003-06-16
US6350177B1 (en) 2002-02-26
WO1999013498A3 (en) 1999-06-03
US6227946B1 (en) 2001-05-08
US6213853B1 (en) 2001-04-10
US6520839B1 (en) 2003-02-18
KR20010023908A (en) 2001-03-26
US6390897B1 (en) 2002-05-21
JP2003224097A (en) 2003-08-08
US6852007B1 (en) 2005-02-08
EP1012876A2 (en) 2000-06-28

Similar Documents

Publication Publication Date Title
WO1999013498A3 (en) Combined cmp and wafer cleaning apparatus and associated methods
US6547638B2 (en) Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US6887124B2 (en) Method of polishing and cleaning substrates
US7591711B2 (en) Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
CN110815035B (en) Chemical mechanical planarization equipment combining grinding and single-wafer cleaning module
WO2002003431A3 (en) Apparatus and methods for semiconductor wafer processing equipment
US7374471B2 (en) Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
US20090061739A1 (en) Polishing apparatus and method for polishing semiconductor wafers using load-unload stations
US6358131B1 (en) Polishing apparatus
US6579798B2 (en) Processes for chemical-mechanical polishing of a semiconductor wafer
JP3420849B2 (en) Polishing apparatus and method
JP2001009713A (en) Polishing device
US20090280727A1 (en) Polishing system with three headed carousel
KR101527898B1 (en) Supporting unit, substrate treating apparatus, substrate treating equipment, and substrate treating method
US20030022498A1 (en) CMP system and method for efficiently processing semiconductor wafers
CN218891676U (en) Chemical mechanical polishing system
JP3496007B2 (en) Polishing apparatus and method
JP2000317827A (en) Polishing device
KR100253374B1 (en) Method for polishing wafer
JP2003220556A (en) Polishing apparatus and method
CN117415722A (en) Chemical mechanical polishing system and polishing method
JP2002141318A (en) Method and device for polishing
CN116175398A (en) Chemical mechanical polishing system and polishing method
JPH0817899A (en) Substrate treating device
JP2004006992A (en) Polishing apparatus

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP KR SG

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

AK Designated states

Kind code of ref document: A3

Designated state(s): JP KR SG

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: C1

Designated state(s): JP KR SG

AL Designated countries for regional patents

Kind code of ref document: C1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

CFP Corrected version of a pamphlet front page
CR1 Correction of entry in section i
ENP Entry into the national phase

Ref country code: JP

Ref document number: 2000 511187

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 1020007002594

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 1998946024

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1998946024

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020007002594

Country of ref document: KR

WWR Wipo information: refused in national office

Ref document number: 1020007002594

Country of ref document: KR

WWW Wipo information: withdrawn in national office

Ref document number: 1998946024

Country of ref document: EP