WO1999025165A3 - Modular and multifunctional structure - Google Patents
Modular and multifunctional structure Download PDFInfo
- Publication number
- WO1999025165A3 WO1999025165A3 PCT/US1998/023840 US9823840W WO9925165A3 WO 1999025165 A3 WO1999025165 A3 WO 1999025165A3 US 9823840 W US9823840 W US 9823840W WO 9925165 A3 WO9925165 A3 WO 9925165A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- modular
- electrical
- multifunctional structure
- electronic componentry
- multifunctional
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/10—Artificial satellites; Systems of such satellites; Interplanetary vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/223—Modular spacecraft systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/42—Arrangements or adaptations of power supply systems
- B64G1/428—Power distribution and management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/331,922 US6061243A (en) | 1997-11-06 | 1998-11-06 | Modular and multifunctional structure |
AU19012/99A AU1901299A (en) | 1997-11-06 | 1998-11-06 | Modular and multifunctional structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US6441097P | 1997-11-06 | 1997-11-06 | |
US60/064,410 | 1997-11-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999025165A2 WO1999025165A2 (en) | 1999-05-20 |
WO1999025165A3 true WO1999025165A3 (en) | 1999-07-15 |
Family
ID=22055796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/023840 WO1999025165A2 (en) | 1997-11-06 | 1998-11-06 | Modular and multifunctional structure |
Country Status (3)
Country | Link |
---|---|
US (1) | US6061243A (en) |
AU (1) | AU1901299A (en) |
WO (1) | WO1999025165A2 (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6373391B1 (en) | 1999-08-12 | 2002-04-16 | Micron Technology, Inc. | Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termites |
US6313748B1 (en) * | 1999-08-27 | 2001-11-06 | Micron Technology, Inc. | Electrical apparatuses, termite sensing apparatuses, methods of forming electrical apparatuses, and methods of sensing termites |
US6243014B1 (en) | 1999-08-27 | 2001-06-05 | Micron Technology, Inc. | Electrical apparatuses, termite sensing apparatuses, and methods of forming electrical apparatuses |
US6963124B1 (en) | 2000-11-28 | 2005-11-08 | National Semiconductor Corporation | Locking of mold compound to conductive substrate panels |
US6576989B1 (en) | 2000-11-28 | 2003-06-10 | National Semiconductor Corporation | Locking of mold compound to conductive substrate panels |
US7519000B2 (en) * | 2002-01-30 | 2009-04-14 | Panduit Corp. | Systems and methods for managing a network |
US7295766B2 (en) * | 2002-03-08 | 2007-11-13 | Shining Technology, Inc. | System and method for direct recording of audio, video and/or images for easy access and editing |
US7349225B1 (en) | 2002-10-22 | 2008-03-25 | Odyssian Technology, Llc | Multifunctional composite sandwich element with embedded electronics |
US6963490B2 (en) * | 2003-11-10 | 2005-11-08 | Honeywell International Inc. | Methods and apparatus for conductive cooling of electronic units |
JP4532425B2 (en) * | 2006-03-22 | 2010-08-25 | 三菱電機株式会社 | Satellite equipment panel |
US7977170B2 (en) * | 2006-10-03 | 2011-07-12 | Eastman Kodak Company | Flexible substrate with electronic devices and traces |
US20080084671A1 (en) * | 2006-10-10 | 2008-04-10 | Ronnie Dean Stahlhut | Electrical circuit assembly for high-power electronics |
US7903417B2 (en) * | 2006-10-10 | 2011-03-08 | Deere & Company | Electrical circuit assembly for high-power electronics |
US20090126967A1 (en) * | 2007-11-16 | 2009-05-21 | Continental Automotive Systems Us, Inc. | Thermal packaging of transmission controller using carbon composite printed circuit board material |
KR101466236B1 (en) * | 2008-06-13 | 2014-11-28 | 삼성전자주식회사 | Semiconductor module |
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
US8411451B2 (en) * | 2008-07-30 | 2013-04-02 | Panasonic Corporation | Power line communication apparatus |
US7744252B2 (en) * | 2008-08-15 | 2010-06-29 | Lighting Science Group Corporation | Sustainably constructed heat dissipating integrated lighting surface |
US8460777B2 (en) * | 2008-10-07 | 2013-06-11 | Alliant Techsystems Inc. | Multifunctional radiation-hardened laminate |
US7845956B1 (en) * | 2009-05-26 | 2010-12-07 | Thomas Baycura | Electrical component interface |
US8459831B2 (en) * | 2010-08-30 | 2013-06-11 | Lightel Technologies, Inc. | Linear solid-state lighting free of shock hazard |
DE102011084000A1 (en) * | 2010-11-30 | 2012-05-31 | Behr Gmbh & Co. Kg | Apparatus for guiding a cooling fluid and cooling system for cooling an electrical component |
US20120151758A1 (en) * | 2010-12-20 | 2012-06-21 | Biotronik Se & Co. Kg | In-Situ Fold-Assisting Frame for Flexible Substrates |
TWM437604U (en) * | 2012-04-24 | 2012-09-11 | Askey Technology Jiangsu Ltd | Electromagnetic wave shielding cover |
US10225953B2 (en) | 2014-10-31 | 2019-03-05 | Thermal Corp. | Vehicle thermal management system |
US11021274B1 (en) * | 2015-06-22 | 2021-06-01 | Triad National Security, Llc | Cubesat system |
CN113490331B (en) * | 2021-05-21 | 2022-12-09 | 福建中创新型材料科技有限责任公司 | High thermal conductivity's aluminium base board of flexible concatenation formula |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4730232A (en) * | 1986-06-25 | 1988-03-08 | Westinghouse Electric Corp. | High density microelectronic packaging module for high speed chips |
US5208729A (en) * | 1992-02-14 | 1993-05-04 | International Business Machines Corporation | Multi-chip module |
US5384691A (en) * | 1993-01-08 | 1995-01-24 | General Electric Company | High density interconnect multi-chip modules including embedded distributed power supply elements |
US5646828A (en) * | 1995-02-24 | 1997-07-08 | Lucent Technologies Inc. | Thin packaging of multi-chip modules with enhanced thermal/power management |
US5661339A (en) * | 1992-09-16 | 1997-08-26 | Clayton; James E. | Thin multichip module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0384958A (en) * | 1989-08-29 | 1991-04-10 | Nec Corp | Manufacture of multichip package |
US5159751A (en) * | 1990-02-05 | 1992-11-03 | Motorola, Inc. | Method of manufacturing electronic module assembly |
US5412539A (en) * | 1993-10-18 | 1995-05-02 | Hughes Aircraft Company | Multichip module with a mandrel-produced interconnecting decal |
US5373627A (en) * | 1993-11-23 | 1994-12-20 | Grebe; Kurt R. | Method of forming multi-chip module with high density interconnections |
-
1998
- 1998-11-06 US US09/331,922 patent/US6061243A/en not_active Expired - Fee Related
- 1998-11-06 AU AU19012/99A patent/AU1901299A/en not_active Abandoned
- 1998-11-06 WO PCT/US1998/023840 patent/WO1999025165A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4730232A (en) * | 1986-06-25 | 1988-03-08 | Westinghouse Electric Corp. | High density microelectronic packaging module for high speed chips |
US5208729A (en) * | 1992-02-14 | 1993-05-04 | International Business Machines Corporation | Multi-chip module |
US5661339A (en) * | 1992-09-16 | 1997-08-26 | Clayton; James E. | Thin multichip module |
US5384691A (en) * | 1993-01-08 | 1995-01-24 | General Electric Company | High density interconnect multi-chip modules including embedded distributed power supply elements |
US5646828A (en) * | 1995-02-24 | 1997-07-08 | Lucent Technologies Inc. | Thin packaging of multi-chip modules with enhanced thermal/power management |
Also Published As
Publication number | Publication date |
---|---|
US6061243A (en) | 2000-05-09 |
WO1999025165A2 (en) | 1999-05-20 |
AU1901299A (en) | 1999-05-31 |
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