WO1999031302A1 - Printed circuit manufacturing process using tin-nickel plating - Google Patents
Printed circuit manufacturing process using tin-nickel plating Download PDFInfo
- Publication number
- WO1999031302A1 WO1999031302A1 PCT/US1998/025594 US9825594W WO9931302A1 WO 1999031302 A1 WO1999031302 A1 WO 1999031302A1 US 9825594 W US9825594 W US 9825594W WO 9931302 A1 WO9931302 A1 WO 9931302A1
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- WO
- WIPO (PCT)
- Prior art keywords
- nickel
- tin
- plating
- solution
- copper
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- the present invention relates to an improved printed circuit manufacturing process. More particularly, it relates to a process for manufacturing a printed circuit incorporating tin-nickel plating.
- a typically employed printed circuit manufacturing process begins with a non- conductive substrate covered with a copper foil layer.
- a resist or plating resist
- a film or artwork containing an image of a desired circuitry pattern is associated with the resist-covered copper surface and exposed to a light source.
- the board is passed through a "developing" process to selectively remove some of the resist from the board.
- resist is removed from the desired circuitry pattern, but encompasses the remainder of the board surface.
- the desired circuitry pattern no longer has an resist, such that the copper foil surface is exposed.
- the remainder of the copper foil remains coated with the resist material.
- the board is processed through an electroplating process by which additional copper is electroplated to the exposed circuitry pattern. . Any areas covered by resist are not plated with copper. Thus, the exposed circuitry pattern is "plated up" with additional copper.
- Tin or tin-lead (or solder) is electroplated over the previously-plated copper.
- the resist prevents any of the tin or tin-lead material from plating to any board surface covered with the resist.
- the desired circuitry pattern is defined by the previously-plated copper and a layer of tin or tin-lead. The remainder of the board otherwise covered with resist does not have additional material plated to the copper foil surface.
- the tin or tin-lead serves as a barrier to prevent subsequent etching of the desired circuitry pattern and acts as a protective coating on the plated copper to prevent oxidation.
- the board is then processed through a "stripping" procedure during which the resist is stripped away (or removed) from the board surface. With the resist removed, the copper foil previously covered by the resist is now exposed.
- the board is then subjected to an "etching" process.
- the etching process acts to etch or remove copper from the surface of the board not otherwise protected by the tin or tin-lead material. Any copper foil not covered is entirely etched from the substrate surface.
- the desired circuitry pattern defined by copper foil, electroplated copper, and a tin or tin-lead layer, remains adhered to the laminate surface. All other copper, however, is now removed.
- tin-lead (or solder) is used as the etch resistant
- the tin-lead is then cleaned in a conditioner and a flux.
- the solder is "reflowed” using infrared heat or "hot oil”. The reflowed solder forms a protective alloy over the entire copper trace.
- tin as opposed to tin-lead
- SMOBC Solder Mask Over Bare Copper
- solder mask is then applied to the board as a protective coating for the various copper traces.
- the solder mask is coated on the board in a predetermined pattern, leaving selected areas of the circuitry pattern unprotected
- HAL Hot Air Leveling
- SMT surface mount technology
- HAL oftentimes results in a "crown"-like surface, hindering proper chip SMT placement.
- chip SMT application requires a wave solder step to secure the chip or other component to the board surface. Wave soldering, while widely accepted, may result in undesired chip migrations as the solder liquefies.
- a subsequent procedure sometimes employed in printed circuit fabrication is plating nickel and gold to select areas of the circuitry pattern, such as surface mount pads and/or tabs.
- solder or tin is first selectively stripped and the underlying copper cleaned.
- Nickel is then electroplated to desired areas of the printed circuits followed by gold electroplating.
- Electroplating of nickel is required to prevent "migration" of copper into the electroplated gold.
- the layer of electroplated nickel acts as a metallic barrier, thereby preventing copper migration.
- the migration of copper into gold is undesirable, as copper reduces the anti-corrosive properties of gold, which is essential to the integrity of printed circuit contacts, requiring exposed conductive leads, such as keypads and contact tabs.
- Printed circuits continue to be an integral part of the evolution of the electronics industry. To this end, any technique able to maintain or even improve board integrity and performance while eliminating process steps, costs and hazardous waste is highly desirable. Therefore, a substantial need exists for a printed circuit manufacturing process with reduced steps, costs and waste.
- the present invention provides an improved method for manufacturing a printed circuit, utilizing a tin-nickel based electroplating bath in place of tin or tin-lead.
- the method includes providing a board defined by a substrate having at least one surface coated with a copper foil.
- a circuitry pattern is printed onto the copper-coated surface such that the circuitry pattern is defined by exposed copper, whereas the remainder of the board is coated with a resist material.
- a tin-nickel material is electroplated to the exposed copper surfaces.
- the resist material is stripped from the board.
- any copper not covered by the previously plated tin-nickel material is etched from the substrate surface, thereby leaving a circuitry pattern in the form of various copper traces each having an outer surface covered with tin-nickel.
- an immersion coating of tine is deposited along side walls of the copper traces and a solder mask is applied over selected areas of the board.
- an additional layer of copper is electroplated to the circuitry pattern prior to tin-nickel plating.
- the circuitry pattern has been plated with tin-nickel, subsequent gold plating at selective locations can be achieved with a single processing step.
- the above-described tin-nickel electroplating is accomplished without the use or production of hydrofluoric acid as an electrolyte.
- the method preferably makes use of a tin-nickel plating solution comprised of nickel fluoborate, stannous fluoborate and a brightener solution.
- the brightener solution consists of a bifluoride salt, diethylenetriamine and triethylenetetramine.
- This unique plating solution is configured to plate a tin-nickel material onto exposed copper without the creation of hydrofluoric acid otherwise found with standard tin-nickel plating techniques, and by elimination of chloride as an electrolyte, produces a more ductile deposit.
- the tin-nickel plating solution further includes a silicone glycol copolymer.
- a tin-nickel-cobalt material is plated.
- the tin-nickel bath of the present invention can be maintained within proper operating parameters through the use of a buffer solution preferably consisting of diethylenetriamine, triethylenetetramine and ammonium carbonate. Additionally, a bath replenisher preferably consisting of a bifluoride salt and an ethyleneamine mixture is also envisioned.
- FIG. 1 is a table showing the sequence of steps for manufacturing a printed circuit in accordance with the present invention.
- FIGS. 2A-2H depict cross-sectional views of a representative part of a printed circuit at various stages of processing in accordance with the present invention.
- FIG. 1 provides a step-by-step explanation of a printed circuit manufacturing technique in accordance with the present invention.
- FIGS. 2A-2H present an operational view of the steps associated with the present invention with reference to a portion of a printed circuit.
- FIGS. 2A-2H depict a magnified view of the printed circuit.
- a laminate substrate 12 is first provided.
- the laminent substrate 12 is normally made of a nonconductive material, such as epoxy-glass.
- the laminate substrate 12 is coated with a copper foil layer 14.
- the copper foil layer 14 is adhered to at least one outer surface of the laminate substrate 12, but may encompass both sides of the laminate substrate 12.
- the combination of the laminate substrate 12 and the copper foil layer 14 is pre-assembled by an outside source, the resulting product referred to as a "copper-clad laminate".
- the board 10 is then drilled in accordance with a predetermined pattern, such as by a C-N-C drilling machine.
- a predetermined pattern such as by a C-N-C drilling machine.
- variously sized holes are imparted through the board 10 at a variety of locations, in the exact configuration of a desired hole pattern for the printed circuit.
- FIGS. 2A-2H do not show any of the holes.
- the resist material 16 is preferably a photopolymer plating resist solution well-lcnown in the art, and is normally light sensitive.
- a photographic film image or artwork (not shown) of a desired circuitry pattern is then associated with the board 10.
- the artwork provides a picture or image of various circuitry traces and is properly designed to selectively prevent light from passing through portions of the film.
- the circuitry pattern is presented on the film in the form of an emulsion material which prevents the passage of light. The remainder of the film, where no circuitry is desired, is clear.
- the board 10 is "exposed".
- the board 10 and associated artwork are subjected to ultraviolet light.
- the artwork is designed to selectively allow and/or prevent passage of ultraviolet light at desired locations.
- ultraviolet light will not pass through the emulsion.
- the resist material 16 is normally configured to "cure,” harden or otherwise react in response to exposure to ultraviolet light such that it is impervious to developer chemistry.
- the resist material 16 will not cure, such that it will be attacked by developer chemistry.
- the board 10 is then "developed". With this commonly-used technique, any resist material 16 not cured during exposure is removed from the board 10. As shown in FIG. 2B, then, following developing a circuitry pattern 18 is defined on the board 10. Once again, the resist material 16 has been removed from the desired circuitry pattern 18, thereby exposing the copper foil layer 14. The circuitry pattern 18 is defined by the copper foil layer 14 not otherwise covered by the resist material 16.
- the board 10 is then preferably processed through a copper electroplating line. Prior to actual copper plating, the board 10 may be cleaned and otherwise prepared to receive additional copper material. Following preparation of the board 10, an electrolytic copper layer is deposited onto the circuitry pattern 18 via an energized copper-based plating bath, such as sulfuric acid/copper sulfate. During the copper electroplating process, the resist material 16 resists or shields copper from plating to certain areas of the board 10. In other words, as shown in FIG. 2C, electroplated copper 20 is deposited only on exposed portions of the copper foil layer 14, such that only the desired circuitry pattern 18 receives the electroplated copper 20.
- an electrolytic copper layer is deposited onto the circuitry pattern 18 via an energized copper-based plating bath, such as sulfuric acid/copper sulfate.
- the resist material 16 resists or shields copper from plating to certain areas of the board 10.
- electroplated copper 20 is deposited only on exposed portions of the copper foil layer 14, such that only the desired circuitry pattern 18 receives
- the board 10 is then passed through a tin-nickel electroplating process.
- the tin-nickel electroplating process may include subjecting the board 10 to various preliminary solutions to clean and otherwise prepare the board 10 for receiving the electroplated tin-nickel.
- the resist material 16 again resists the deposit of tin-nickel on to portions of the copper foil layer 14 otherwise coated with the resist material 16.
- the electroplated copper 20 previously plated will receive and maintain tin-nickel. Therefore, as shown in FIG. 2D, following the tin-nickel electroplating procedure, a layer of tin-nickel 22 is adhered to the electroplated copper 20.
- the desired circuitry pattern 18 is now defined by the copper foil layer 14, the electroplated copper 20 and the tin-nickel layer 22.
- the tin- nickel layer 22 serves as a barrier to prevent subsequent etching of the circuitry pattern 18 and as a protective coating on the electroplated copper 20 to prevent oxidation.
- a layer of tin-nickel-cobalt is instead electroplated to the board 10 in a similar manner.
- FIG. 2E depicts the board 10 following the resist stripping process. As shown in FIG.
- resist stripping process does not affect the tin-nickel layer 22 (or, alternatively, the tin-nickel-cobalt layer), the electroplated copper 20 or the copper foil layer 14.
- a commonly used resist stripping solution is comprised of an ethanolamine, such as monoethanolamine, and/or additional alkaline components including potassium or sodium hydroxide, tetramethyl ammonium hydroxide, or the like, but many other types are available and would be obvious to one of skill in the art.
- the board 10 is processed through an "etching" line.
- the copper foil layer 14 not otherwise encompassed by the tin-nickel layer 22 is
- the tin-nickel layer 22 is resistant to the etchant solution such that the tin-nickel layer 22 (or, alternatively, the tin-nickel-cobalt layer), and the electroplated copper 20 and the copper foil layer 14 directly beneath the tin-nickel layer 22, is not removed during etching.
- the board 10 may be immersed in a cleansing bath or other preparatory solution prior to actual etching.
- an ammonium hydroxide or ammonium chloride solution is used as a copper etchant, although other commonly used solutions are equally acceptable. Following etching, all copper is removed from the board 10 other than at the desired circuitry pattern 18.
- the board 10 is then processed through a tin coating process in which a tin or tin alloy 24 is coated along side walls of the remaining copper foil layer 14 and the electroplated copper 20, as shown in FIG. 2G.
- the tin coating procedure may include various cleaning and other preparatory steps, such as immersing the board 10 in an acid dip. Regardless of the exact procedure, however, the coating of tin or tin alloy 24 adheres to the side walls of the circuitry pattern 18, thus offering complete protection for subsequent processing and board applications.
- a solder mask 26 is then applied to the board 10 as shown in FIG. 2H.
- solder mask solutions are well-known in the art, sold, for example, by Dupont, and generally serve to prevent accidental solder connections (or "bridging") between the desired circuitry pattern 18 from occurring.
- the solder mask 26 can be selectively applied to the board 10 such that select portions of the circuitry pattern 18 are not entirely encompassed by the solder mask 26.
- FIG. 2H shows a first and second circuitry trace 28a and 28b of the desired circuitry pattern 18.
- the first circuitry trace 28a is covered by the solder mask 26, whereas the second circuitry trace 28b is uncovered or "bare”.
- This desired application of the solder mask 26 is done to prepare identified areas (such as the second circuitry trace 28b or "pad”) for subsequently receiving various electrical components during SMT.
- the solder mask 26 is designed to resist depositing of gold. Conversely, gold will adhere to the tin-nickel layer 22.
- the gold depositing process normally includes "activating" the tin-nickel layer 22 in a diluted acid bath. Subsequently, the board 10 is at least partially immersed in a gold bearing bath. Once again, the gold material will adhere to the tin-nickel layer 22, not otherwise encompassed by the solder mask 26.
- the above-described fabrication method is vastly different from techniques presently employed by printed circuit manufacturers.
- the above-described process eliminates the steps of tin and/or solder plating, stripping, solder conditioning and subsequent hot oil or infrared reflow and hot air leveling.
- previously-used gold plating techniques require an additional step of depositing a nickel layer at desired locations. Because the tin- nickel layer 22 has previously been applied as an etch resistant, there is no need to subject the board 10 to this additional step. As a result, another processing step (and its related costs) normally required by printed circuit manufacturing is eliminated.
- the above-described method does not require the use of solder stripping or hot air leveling, no lead-bearing waste is produced.
- the focus of the present invention is upon the use of a tin-nickel electroplating process step in place of tin or tin-lead normally used.
- the tin-nickel electroplating step includes depositing a tin-nickel material consisting of 10-60% nickel and 40-90% tin, preferably 20-50% nickel and 50-80% tin; and most preferably 35% nickel and 65% tin.
- tin-nickel-cobalt is instead electroplated.
- the tin-nickel-cobalt electroplating step includes depositing a tin- nickel-cobalt material consisting of 5-30% nickel, 5-30% cobalt and 40-90% tin; preferably 10-25% nickel, 10-25% cobalt and 50-80% tin; and most preferably 17.5%) cobalt and 65% tin.
- the preferred tin-nickel plating bath is comprised of approximately 25-35%, preferably 30.7%, deionized water; approximately 30-40%, preferably 34.7%, electroless grade liquid nickel fluoborate; approximately 10-20%, preferably 14.6%, stannous fluoborate; and
- tin sources other than liquid stannous fluoborate, which is relatively inexpensive, are available.
- liquid stannous chloride or stannous sulfate may also be used.
- an alternative embodiment of the present invention electroplates a tin-nickel-cobalt material.
- the preferred tin-nickel-cobalt bath is comprised of approximately 25-35%>, preferably 30.7%>, deionized water; approximately 30-40%>, preferably 34.7%, electroless grade liquid nickel fluoborate; approximately 5-10%, preferably 7.3%, stannous fluoborate; approximately 5-10%, preferably 7.3%, cobalt fluoborate; and approximately 15-25%), preferably 20%, of a plating starter solution.
- the plating starter solution consists of 1-
- the starter solution can be used with both tin-nickel plating and tin-nickel-cobalt plating.
- an appropriate volume of the preferred tin-nickel plating bath is formulated in accordance with the above parameters.
- 30.7 gallons of deionized water was poured into a tank and heated to 140 F.
- 34.7 gallons of liquid stannous fluoborate was added, and the bath mixed thoroughly.
- 20 gallons of the above-described starter solution was then added and mixed.
- the bath was filtered until completely clear, and dummy plating was performed for one hour at 5 ASF.
- the tin-nickel electroplated material was bright, compatible with standard photopolymer plating resists, and was fully functional as an etch resistant without cosmetic degradation when subjected to ammonium hydroxide/ammonium chloride etchant.
- the tin-nickel deposit was highly solderable and was amenable to solder mask adhesion.
- the above- described ratios apply to the tin-nickel-cobalt plating bath.
- different stannous, nickel and cobalt sources are readily available and will produce acceptable plating results.
- the preferred bath does not utilize fluoride as a complexing agent for the nickel or as a stabilizing agent for tin. Therefore, plating with the above-described bath does not result in the production of hydrofluoric acid.
- the board Prior to submersing a board or boards within the tin-nickel plating bath, the board is preferably subjected to various preparatory steps. More particularly, in the preferred embodiment, the board is immersed in a 10%> by volume solution of fluoboric acid and water for five minutes at ambient temperature. The board(s) is then rinsed in a continuously flowing deionized water rinse for five minutes at ambient temperature. The board(s) is then placed in a pre-plating solution consisting of 80% water and 20% plating starter solution (as described above). Following the pre-dip procedure, the board is placed into the tin-nickel plating bath for subsequent plating.
- a pre-plating solution consisting of 80% water and 20% plating starter solution (as described above).
- the pH of the plating bath may require adjustment.
- the tin-nickel plating bath operates at a pH of 4.2-4.8, with an optimum pH of 4.5.
- a buffer solution can be used.
- the present invention envisions use of a buffer solution comprising an ethyleneamine mixture.
- the ethyleneamine mixture includes 5-50%> diethylenetriamine, 5-50%> triethylenetetramine; and OJ-10% ammonium carbonate.
- the present invention includes, in one preferred embodiment a replenisher solution consisting of l-20%> of a bifluoride salt, preferably ammonium bifluoride; and 1-10% of the above-described buffer mixture.
- the etch resistant material whether solder, tin, tin-nickel, etc., functions during the etching process to "protect" the copper- based circuitry traces from being removed with the exposed copper foil (as shown in FIGS. 2E and 2F).
- the etching process in which the etchant solution is brought into contact with the board, is somewhat difficult to precisely control, such that, on some occasions, the copper-based sidewalls of the circuitry pattern (18 in FIGS. 2E and 2F) are attacked by the etchant, resulting in the copper beneath the etch resistant material (22 in FIGS.
- over-etching a portion of the etch resistant material (22 in FIGS. 2E and 2F) will overhang the remaining copper trace (14 and 20 in FIGS. 2E and 2F).
- the overhang may create potential problems. More particularly, where the etch resistant material is hard, and not ductile, it is not uncommon for the portion to break off or "splinter". These splinters can become embedded in the board, requiring expensive reworking activities to remove the splinter, or even board failure. Therefore, any efforts to reduce etch resistant material hardness and increase ductility is of great importance.
- an alternative embodiment of the present invention includes a bath additive for reducing material hardness and increasing ductility of the electroplated tin-nickel or tin-nickel-cobalt.
- the bath additive is silicone glycol copolymer-based.
- the bath additive includes silicone polyethylene glycol (available, for example, from Witco of Friendly, WN), although any silicone glycol copolymer may be used, such as Harcross Chemicals .AF-100 and AF-6050 Series.
- a bath additive consisting of 10-50 g/1 of boric acid and 1-10 mls/1 of silicone polyethylene glycol was added to the above-described tin-nickel plating bath.
- the resulting electroplated tin-nickel material (run at a temperature of 150-170 F) had a hardness of 150- 170 on the Knoop scale of hardness.
- a typical tin-nickel electroplated material such as that described in U.S. Patent No. 3,772,168 to Dillenberg, the teachings of which are incorporated herein by reference, has a hardness of 400-480 on the Knoop scale of hardness. The large decrease in hardness achieved with the bath additive of the present invention, and resulting dramatic change in ductility, virtually eliminates the potential for splintering.
- the board Prior to submersing a board or boards within the tin-nickel (or tin-nickel- cobalt) plating bath, the board is preferably subjected to various preparatory steps. More particularly, in the preferred embodiment, the board is immersed in a 10%) by volume solution of hydrochloric acid and water for five minutes at ambient temperature. The board(s) is then rinsed in a continuously flowing deionized water rinse for five minutes at ambient temperature. The board(s) is then placed in a pre-plating solution consisting of 80% water and 20%> plating starter solution (as described above). Following the pre-dip procedure, the board is placed into the tin-nickel plating bath for subsequent plating.
- a pre-plating solution consisting of 80% water and 20%> plating starter solution (as described above).
- the tin-nickel plating process of the present invention can be practiced with other tin-nickel plating solutions.
- a tin-nickel alloy plating electrolyte using stannous salt, a nickel salt and an alkali-metal pyrophosphate, chloride, fluoride, bromide, sulfate or sulfumate may also be used.
- An example of such an electrolyte is provided in U.S. Patent No. 3,887,444, the teachings of which are incorporated herein by reference.
- tin-nickel plating solutions include that described, at least in part, in, for example, U.S. Patent Nos. 3,772,168; 3,887,444; 4,033,835; 4,049,508 and 4,828,657.
- the tin-nickel electroplating process for fabrication of a printed circuit of the present invention presents numerous advantages over prior art manufacturing techniques.
- numerous steps, wastes and associated costs are eliminated.
- hot air leveling is eliminated, along with the associated thermal shock.
- the desired circuitry pattern has already been plated with a nickel alloy, gold can easily be plated to desired areas of the board without requiring an additional nickel/plating step.
- the electroplating process does not result in free hydrofluoric acid.
- the process exhibits excellent throwing power, resulting in a near-perfect 1 : 1 hole aspect ratio, for superior through hole control and solder wetting.
- the deposited tin-nickel alloy exhibits a very low coefficient of friction, excellent wear resistance, and can be used as a substitute for gold electroplating in many applications.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98961874A EP1042539A4 (en) | 1997-12-18 | 1998-12-03 | Printed circuit manufacturing process using tin-nickel plating |
AU17088/99A AU1708899A (en) | 1997-12-18 | 1998-12-03 | Printed circuit manufacturing process using tin-nickel plating |
JP2000539196A JP2002508453A (en) | 1997-12-18 | 1998-12-03 | Printed circuit manufacturing process using tin-nickel plating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/993,389 | 1997-12-18 | ||
US08/993,389 US6015482A (en) | 1997-12-18 | 1997-12-18 | Printed circuit manufacturing process using tin-nickel plating |
Publications (1)
Publication Number | Publication Date |
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WO1999031302A1 true WO1999031302A1 (en) | 1999-06-24 |
Family
ID=25539487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US1998/025594 WO1999031302A1 (en) | 1997-12-18 | 1998-12-03 | Printed circuit manufacturing process using tin-nickel plating |
Country Status (7)
Country | Link |
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US (1) | US6015482A (en) |
EP (1) | EP1042539A4 (en) |
JP (1) | JP2002508453A (en) |
CN (1) | CN1286734A (en) |
AU (1) | AU1708899A (en) |
TW (1) | TW475950B (en) |
WO (1) | WO1999031302A1 (en) |
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WO2002072923A2 (en) | 2001-03-13 | 2002-09-19 | Macdermid Plc | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
EP1430166A2 (en) * | 2001-03-13 | 2004-06-23 | MacDermid Plc | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys |
EP1430166B1 (en) * | 2001-03-13 | 2017-02-08 | MacDermid Limited | Method for depositing tin alloys |
EP1936009A1 (en) * | 2006-11-23 | 2008-06-25 | Samsung Electronics Co., Ltd. | Plating method |
CN108778710A (en) * | 2016-03-11 | 2018-11-09 | 富士胶片株式会社 | Band by the film of coating precursor layer, with pattern-like by the film, conductive membrane and touch panel of coating |
CN108778710B (en) * | 2016-03-11 | 2021-03-23 | 富士胶片株式会社 | Film with plated precursor layer, film with patterned plated layer, conductive film, and touch panel |
CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
Also Published As
Publication number | Publication date |
---|---|
AU1708899A (en) | 1999-07-05 |
TW475950B (en) | 2002-02-11 |
CN1286734A (en) | 2001-03-07 |
JP2002508453A (en) | 2002-03-19 |
EP1042539A4 (en) | 2003-01-22 |
EP1042539A1 (en) | 2000-10-11 |
US6015482A (en) | 2000-01-18 |
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