WO1999041772A3 - A method of component manufacture - Google Patents

A method of component manufacture Download PDF

Info

Publication number
WO1999041772A3
WO1999041772A3 PCT/SE1999/000146 SE9900146W WO9941772A3 WO 1999041772 A3 WO1999041772 A3 WO 1999041772A3 SE 9900146 W SE9900146 W SE 9900146W WO 9941772 A3 WO9941772 A3 WO 9941772A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
component
mould
die
producing
Prior art date
Application number
PCT/SE1999/000146
Other languages
French (fr)
Other versions
WO1999041772A2 (en
Inventor
Hans Goeran Evald Martin
Per Ove Oehman
Original Assignee
Aamic Ab
Hans Goeran Evald Martin
Per Ove Oehman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aamic Ab, Hans Goeran Evald Martin, Per Ove Oehman filed Critical Aamic Ab
Priority to AU26494/99A priority Critical patent/AU2649499A/en
Priority to US09/622,398 priority patent/US6372542B1/en
Priority to CA002320920A priority patent/CA2320920A1/en
Priority to EP99906637A priority patent/EP1057213A2/en
Priority to JP2000531864A priority patent/JP2002503556A/en
Publication of WO1999041772A2 publication Critical patent/WO1999041772A2/en
Publication of WO1999041772A3 publication Critical patent/WO1999041772A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0214—Biosensors; Chemical sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0136—Comb structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/034—Moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures

Abstract

The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component (12), where the component substrate is given a three-dimensional structure (3') or configuration, and where said substrate is adapted for further treatment or processing to form the component (12). The substrate is formed by shaping said substrate against a die or mould, such as by moulding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mould.
PCT/SE1999/000146 1998-02-17 1999-02-04 A method of component manufacture WO1999041772A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU26494/99A AU2649499A (en) 1998-02-17 1999-02-04 A method of component manufacture
US09/622,398 US6372542B1 (en) 1998-02-17 1999-02-04 Method of component manufacture
CA002320920A CA2320920A1 (en) 1998-02-17 1999-02-04 A method of component manufacture
EP99906637A EP1057213A2 (en) 1998-02-17 1999-02-04 A method of component manufacture
JP2000531864A JP2002503556A (en) 1998-02-17 1999-02-04 Device manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9800462-5 1998-02-17
SE9800462A SE521415C2 (en) 1998-02-17 1998-02-17 Method for producing a gas sensor-associated detector, as well as a detector made according to the method

Publications (2)

Publication Number Publication Date
WO1999041772A2 WO1999041772A2 (en) 1999-08-19
WO1999041772A3 true WO1999041772A3 (en) 1999-11-04

Family

ID=20410206

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/SE1999/000146 WO1999041772A2 (en) 1998-02-17 1999-02-04 A method of component manufacture
PCT/SE1999/000145 WO1999041592A1 (en) 1998-02-17 1999-02-04 A method of producing a detector belonging to a gas sensor, and a detector produced in accordance with the method

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/SE1999/000145 WO1999041592A1 (en) 1998-02-17 1999-02-04 A method of producing a detector belonging to a gas sensor, and a detector produced in accordance with the method

Country Status (10)

Country Link
US (1) US6372542B1 (en)
EP (2) EP1057006B1 (en)
JP (2) JP2002503556A (en)
CN (1) CN1174237C (en)
AT (1) ATE497156T1 (en)
AU (2) AU748969B2 (en)
CA (2) CA2320920A1 (en)
DE (1) DE69943160D1 (en)
SE (1) SE521415C2 (en)
WO (2) WO1999041772A2 (en)

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Also Published As

Publication number Publication date
AU2649399A (en) 1999-08-30
US6372542B1 (en) 2002-04-16
CA2320920A1 (en) 1999-08-19
JP2002503806A (en) 2002-02-05
WO1999041592A1 (en) 1999-08-19
CN1174237C (en) 2004-11-03
SE521415C2 (en) 2003-10-28
JP2002503556A (en) 2002-02-05
AU748969B2 (en) 2002-06-13
EP1057006B1 (en) 2011-01-26
DE69943160D1 (en) 2011-03-10
JP4401021B2 (en) 2010-01-20
CN1297530A (en) 2001-05-30
EP1057006A1 (en) 2000-12-06
SE9800462D0 (en) 1998-02-17
CA2320919A1 (en) 1999-08-19
WO1999041772A2 (en) 1999-08-19
ATE497156T1 (en) 2011-02-15
AU2649499A (en) 1999-08-30
SE9800462L (en) 1999-08-18
EP1057213A2 (en) 2000-12-06

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