WO1999056113A1 - A system and method for inspecting semiconductor wafers - Google Patents
A system and method for inspecting semiconductor wafers Download PDFInfo
- Publication number
- WO1999056113A1 WO1999056113A1 PCT/US1999/009555 US9909555W WO9956113A1 WO 1999056113 A1 WO1999056113 A1 WO 1999056113A1 US 9909555 W US9909555 W US 9909555W WO 9956113 A1 WO9956113 A1 WO 9956113A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- modular
- fourier
- inspection
- wafer
- subsystems
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU38758/99A AU3875899A (en) | 1998-04-30 | 1999-04-30 | A system and method for inspecting semiconductor wafers |
EP99921584A EP1075652B1 (en) | 1998-04-30 | 1999-04-30 | Fourier filter system for a surface inspection system, and method of using same |
JP2000546223A JP5060684B2 (en) | 1998-04-30 | 1999-04-30 | System and method for inspecting semiconductor wafers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/070,437 US6020957A (en) | 1998-04-30 | 1998-04-30 | System and method for inspecting semiconductor wafers |
US09/070,437 | 1998-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999056113A1 true WO1999056113A1 (en) | 1999-11-04 |
Family
ID=22095289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/009555 WO1999056113A1 (en) | 1998-04-30 | 1999-04-30 | A system and method for inspecting semiconductor wafers |
Country Status (5)
Country | Link |
---|---|
US (2) | US6020957A (en) |
EP (1) | EP1075652B1 (en) |
JP (2) | JP5060684B2 (en) |
AU (1) | AU3875899A (en) |
WO (1) | WO1999056113A1 (en) |
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US6721045B1 (en) | 1999-09-07 | 2004-04-13 | Applied Materials, Inc. | Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques |
US6630995B1 (en) | 1999-09-07 | 2003-10-07 | Applied Materials, Inc. | Method and apparatus for embedded substrate and system status monitoring |
US7012684B1 (en) | 1999-09-07 | 2006-03-14 | Applied Materials, Inc. | Method and apparatus to provide for automated process verification and hierarchical substrate examination |
US6693708B1 (en) | 1999-09-07 | 2004-02-17 | Applied Materials, Inc. | Method and apparatus for substrate surface inspection using spectral profiling techniques |
US6697517B1 (en) | 1999-09-07 | 2004-02-24 | Applied Magerials, Inc. | Particle detection and embedded vision system to enhance substrate yield and throughput |
US6707545B1 (en) | 1999-09-07 | 2004-03-16 | Applied Materials, Inc. | Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems |
US6813032B1 (en) | 1999-09-07 | 2004-11-02 | Applied Materials, Inc. | Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques |
US7254251B2 (en) | 2001-03-20 | 2007-08-07 | Synopsys, Inc. | System and method of providing mask defect printability analysis |
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US6925202B2 (en) | 2001-03-20 | 2005-08-02 | Synopsys, Inc. | System and method of providing mask quality control |
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US7565001B2 (en) | 2001-03-20 | 2009-07-21 | Synopsys, Inc. | System and method of providing mask defect printability analysis |
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US7969465B2 (en) | 2001-06-19 | 2011-06-28 | Applied Materials, Inc. | Method and apparatus for substrate imaging |
US6560766B2 (en) | 2001-07-26 | 2003-05-06 | Numerical Technologies, Inc. | Method and apparatus for analyzing a layout using an instance-based representation |
US6721928B2 (en) | 2001-07-26 | 2004-04-13 | Numerical Technologies, Inc. | Verification utilizing instance-based hierarchy management |
US7014955B2 (en) | 2001-08-28 | 2006-03-21 | Synopsys, Inc. | System and method for indentifying dummy features on a mask layer |
US6976240B2 (en) | 2001-11-14 | 2005-12-13 | Synopsys Inc. | Simulation using design geometry information |
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US7463351B2 (en) | 2002-07-29 | 2008-12-09 | Applied Materials, Inc. | Process and assembly for non-destructive surface inspection |
US6861660B2 (en) | 2002-07-29 | 2005-03-01 | Applied Materials, Inc. | Process and assembly for non-destructive surface inspection |
US7043071B2 (en) | 2002-09-13 | 2006-05-09 | Synopsys, Inc. | Soft defect printability simulation and analysis for masks |
US6770862B1 (en) | 2003-07-28 | 2004-08-03 | Kla-Tencor Technologies Corporation | Scalable wafer inspection |
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WO2008097012A1 (en) * | 2007-02-06 | 2008-08-14 | Hanmi Semiconductor Co., Ltd. | Vision system of sawing and placement equipment |
Also Published As
Publication number | Publication date |
---|---|
JP5663207B2 (en) | 2015-02-04 |
EP1075652A4 (en) | 2007-06-06 |
US6791680B1 (en) | 2004-09-14 |
EP1075652A1 (en) | 2001-02-14 |
JP5060684B2 (en) | 2012-10-31 |
JP2002513204A (en) | 2002-05-08 |
AU3875899A (en) | 1999-11-16 |
EP1075652B1 (en) | 2011-07-13 |
US6020957A (en) | 2000-02-01 |
JP2010249833A (en) | 2010-11-04 |
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