WO1999067811A3 - Electronic device having fibrous interface - Google Patents

Electronic device having fibrous interface Download PDF

Info

Publication number
WO1999067811A3
WO1999067811A3 PCT/US1999/012498 US9912498W WO9967811A3 WO 1999067811 A3 WO1999067811 A3 WO 1999067811A3 US 9912498 W US9912498 W US 9912498W WO 9967811 A3 WO9967811 A3 WO 9967811A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
adhesive
fibers
interface
portions
Prior art date
Application number
PCT/US1999/012498
Other languages
French (fr)
Other versions
WO1999067811A2 (en
Inventor
Charles Smith
Michael M Chau
Roger A Emigh
Nancy F Dean
Original Assignee
Johnson Matthey Elect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Elect Inc filed Critical Johnson Matthey Elect Inc
Priority to EP99927222A priority Critical patent/EP1097477A4/en
Priority to JP2000556391A priority patent/JP2002519846A/en
Publication of WO1999067811A2 publication Critical patent/WO1999067811A2/en
Publication of WO1999067811A3 publication Critical patent/WO1999067811A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

An electronic device having a complient fibrous interface is described. The interface comprises a free fiber tip structure having flocked thermally conductive fibers (32) embedded in an adhesive in substantially vertical orientation with portions of the fibers (32) extending out of the adhesive and an encapsulant (30) between the portions of the fibers that extend out of the adhesive and the fiber's free tips (34).
PCT/US1999/012498 1998-06-24 1999-06-04 Electronic device having fibrous interface WO1999067811A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP99927222A EP1097477A4 (en) 1998-06-24 1999-06-04 Electronic device having fibrous interface
JP2000556391A JP2002519846A (en) 1998-06-24 1999-06-04 Electrical element with fibrous interface

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10341598A 1998-06-24 1998-06-24
US09/103,415 1998-06-24

Publications (2)

Publication Number Publication Date
WO1999067811A2 WO1999067811A2 (en) 1999-12-29
WO1999067811A3 true WO1999067811A3 (en) 2000-03-23

Family

ID=22295055

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/012498 WO1999067811A2 (en) 1998-06-24 1999-06-04 Electronic device having fibrous interface

Country Status (7)

Country Link
US (2) US6617199B2 (en)
EP (1) EP1097477A4 (en)
JP (1) JP2002519846A (en)
KR (1) KR100494974B1 (en)
CN (1) CN1213476C (en)
TW (1) TW451259B (en)
WO (1) WO1999067811A2 (en)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713151B1 (en) 1998-06-24 2004-03-30 Honeywell International Inc. Compliant fibrous thermal interface
US6436506B1 (en) * 1998-06-24 2002-08-20 Honeywell International Inc. Transferrable compliant fibrous thermal interface
WO1999067811A2 (en) 1998-06-24 1999-12-29 Johnson Matthey Electronics, Inc. Electronic device having fibrous interface
US20040009353A1 (en) * 1999-06-14 2004-01-15 Knowles Timothy R. PCM/aligned fiber composite thermal interface
US7132161B2 (en) * 1999-06-14 2006-11-07 Energy Science Laboratories, Inc. Fiber adhesive material
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
WO2002067315A2 (en) * 2001-02-14 2002-08-29 Honeywell International Inc. Processes of forming thermal transfer materials, and thermal transfer materials
EP1401641A4 (en) * 2001-05-30 2007-12-12 Honeywell Int Inc Interface materials and methods of production and use thereof
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
US6651736B2 (en) * 2001-06-28 2003-11-25 Intel Corporation Short carbon fiber enhanced thermal grease
US6812064B2 (en) * 2001-11-07 2004-11-02 Micron Technology, Inc. Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate
US6965513B2 (en) 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures
US6761813B2 (en) * 2002-01-31 2004-07-13 Intel Corporation Heat transfer through covalent bonding of thermal interface material
US6566743B1 (en) * 2002-02-21 2003-05-20 Thermal Corp. Electronics package with specific areas having low coefficient of thermal expansion
US7521667B2 (en) 2003-06-23 2009-04-21 Advanced Optical Technologies, Llc Intelligent solid state lighting
US7145125B2 (en) 2003-06-23 2006-12-05 Advanced Optical Technologies, Llc Integrating chamber cone light using LED sources
US20050190541A1 (en) * 2004-03-01 2005-09-01 Hsiang-Hsi Yang Heat dissipation method for electronic apparatus
US20090027857A1 (en) * 2004-03-30 2009-01-29 Dean Nancy F Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry
US6977818B1 (en) * 2004-05-10 2005-12-20 Apple Computer, Inc. Heat dissipating device for an integrated circuit chip
US8548415B2 (en) * 2004-12-16 2013-10-01 Northrop Grumman Systems Corporation Carbon nanotube devices and method of fabricating the same
US20070158611A1 (en) * 2005-11-08 2007-07-12 Oldenburg Steven J Compositions comprising nanorods and methods of making and using them
CN101460779A (en) 2005-12-21 2009-06-17 科锐Led照明技术公司 Lighting device
JP2007251002A (en) 2006-03-17 2007-09-27 Toshiba Corp Heat sink, electronic device, method for manufacturing heat sink and method for manufacturing electronic device
US7625103B2 (en) * 2006-04-21 2009-12-01 Cree, Inc. Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods
WO2007130536A2 (en) 2006-05-05 2007-11-15 Cree Led Lighting Solutions, Inc. Lighting device
CN101454613A (en) 2006-05-31 2009-06-10 科锐Led照明科技公司 Lighting device with color control, and method of lighting
US9179579B2 (en) * 2006-06-08 2015-11-03 International Business Machines Corporation Sheet having high thermal conductivity and flexibility
EP2066968B1 (en) * 2006-09-18 2016-04-27 Cree, Inc. Lighting devices, lighting assemblies, fixtures and methods using same
US8827507B2 (en) 2006-09-21 2014-09-09 Cree, Inc. Lighting assemblies, methods of installing same, and methods of replacing lights
US9605828B2 (en) * 2006-11-14 2017-03-28 Cree, Inc. Light engine assemblies
JP5324458B2 (en) * 2006-11-14 2013-10-23 クリー インコーポレイテッド Lighting assembly and components for the lighting assembly
US7967480B2 (en) * 2007-05-03 2011-06-28 Cree, Inc. Lighting fixture
WO2008137905A1 (en) 2007-05-07 2008-11-13 Cree Led Lighting Solutions, Inc. Light fixtures and lighting devices
JP2008294376A (en) * 2007-05-28 2008-12-04 Sakai Ovex Co Ltd Heat conductive sheet and method of manufacturing the same
US20080310114A1 (en) * 2007-06-18 2008-12-18 Lucent Technologies Inc. Heat-transfer device for an electromagnetic interference (emi) shield using conductive bristles
US20090002949A1 (en) * 2007-06-29 2009-01-01 Lucent Technologies Inc. Heat transfer for electronic component via an electromagnetic interference (emi) shield having shield deformation
US8866410B2 (en) 2007-11-28 2014-10-21 Cree, Inc. Solid state lighting devices and methods of manufacturing the same
US8058724B2 (en) * 2007-11-30 2011-11-15 Ati Technologies Ulc Holistic thermal management system for a semiconductor chip
US8240875B2 (en) 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
US20100081191A1 (en) * 2008-09-26 2010-04-01 Marlow Industries, Inc. Anisotropic heat spreader for use with a thermoelectric device
JP5239768B2 (en) * 2008-11-14 2013-07-17 富士通株式会社 Heat dissipating material, electronic equipment and manufacturing method thereof
US8946833B2 (en) 2012-10-22 2015-02-03 Freescale Semiconductor, Inc. Packaging for semiconductor sensor devices and methods
US9190339B2 (en) 2014-02-03 2015-11-17 Freescale Semiconductor, Inc. Method of limiting capillary action of gel material during assembly of pressure sensor
US9476788B2 (en) 2014-04-22 2016-10-25 Freescale Semiconductor, Inc. Semiconductor sensor with gel filled cavity
US9664183B2 (en) * 2015-01-09 2017-05-30 The Boeing Company Integrated high thermal conductive fiber as cooling fin for SMA actuator with expandable sleeve
US20170108297A1 (en) * 2015-10-19 2017-04-20 KULR Technology Corporation Fiber Thermal Interface
US10653038B2 (en) * 2016-04-14 2020-05-12 Microsoft Technology Licensing, Llc Heat spreader
US10418306B1 (en) * 2018-06-22 2019-09-17 Trw Automotive U.S. Llc Thermal interface for electronics
US11056797B2 (en) 2019-07-29 2021-07-06 Eagle Technology, Llc Articles comprising a mesh formed of a carbon nanotube yarn
US11949161B2 (en) 2021-08-27 2024-04-02 Eagle Technology, Llc Systems and methods for making articles comprising a carbon nanotube material
US11901629B2 (en) 2021-09-30 2024-02-13 Eagle Technology, Llc Deployable antenna reflector

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402006A (en) * 1992-11-10 1995-03-28 Texas Instruments Incorporated Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules
US5726495A (en) * 1992-03-09 1998-03-10 Sumitomo Metal Industries, Ltd. Heat sink having good heat dissipating characteristics

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3973059A (en) 1969-09-29 1976-08-03 Brunswick Corporation Method of making metal flocked fabric
US3972821A (en) 1973-04-30 1976-08-03 Amchem Products, Inc. Heat transfer composition and method of making
US4485429A (en) 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US4685987A (en) 1983-09-02 1987-08-11 The Bergquist Company Method of preparing interfacings of heat sinks with electrical devices
US4459332A (en) * 1983-09-12 1984-07-10 American Cyanamid Company Flocked fabric laminate for protection against chemical agents
US4603731A (en) 1984-11-21 1986-08-05 Ga Technologies Inc. Graphite fiber thermal radiator
US5014161A (en) 1985-07-22 1991-05-07 Digital Equipment Corporation System for detachably mounting semiconductors on conductor substrate
US4849858A (en) 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US4869954A (en) 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
US5077637A (en) 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
US5150748A (en) 1990-06-18 1992-09-29 Mcdonnell Douglas Corporation Advanced survivable radiator
US5178924A (en) 1991-06-17 1993-01-12 Minnesota Mining And Manufacturing Company Release liner
US5213868A (en) 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JPH0664360A (en) * 1992-08-19 1994-03-08 Riso Kagaku Corp Manufacture of stencil printing paper
US5328087A (en) 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US6197859B1 (en) 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
JP2570605B2 (en) 1993-11-15 1997-01-08 日本電気株式会社 Semiconductor device
US5542471A (en) 1993-11-16 1996-08-06 Loral Vought System Corporation Heat transfer element having the thermally conductive fibers
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5852548A (en) 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof
US5585671A (en) * 1994-10-07 1996-12-17 Nagesh; Voddarahalli K. Reliable low thermal resistance package for high power flip clip ICs
US5691022A (en) 1994-10-20 1997-11-25 International Paper Company Release liner base stock for printed films or labels
US5725707A (en) * 1995-04-10 1998-03-10 Northrop Grumman Corporation Enhanced conductive joints from fiber flocking
US5873973A (en) 1995-04-13 1999-02-23 Northrop Grumman Corporation Method for single filament transverse reinforcement in composite prepreg material
US6090484A (en) * 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
US5971253A (en) 1995-07-31 1999-10-26 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
US5674585A (en) 1995-11-15 1997-10-07 United Technologies Corporation Composite thermal insulation structure
EP0824451B1 (en) 1996-01-30 2002-01-02 Raytheon Company Carbon fiber flocking for thermal management of compact missile electronics
WO1997041599A1 (en) 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5858537A (en) 1996-05-31 1999-01-12 The United States Of America As Represented By The Secretary Of The Navy Compliant attachment
US6030856A (en) * 1996-06-10 2000-02-29 Tessera, Inc. Bondable compliant pads for packaging of a semiconductor chip and method therefor
US5695847A (en) * 1996-07-10 1997-12-09 Browne; James M. Thermally conductive joining film
US5904796A (en) 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
WO1998040431A1 (en) * 1997-03-11 1998-09-17 Amoco Corporation Thermally conductive film and method for the preparation thereof
US5968606A (en) 1997-06-30 1999-10-19 Ferro Corporation Screen printable UV curable conductive material composition
US6080605A (en) 1998-10-06 2000-06-27 Tessera, Inc. Methods of encapsulating a semiconductor chip using a settable encapsulant
US6096414A (en) 1997-11-25 2000-08-01 Parker-Hannifin Corporation High dielectric strength thermal interface material
US6436506B1 (en) 1998-06-24 2002-08-20 Honeywell International Inc. Transferrable compliant fibrous thermal interface
WO1999067811A2 (en) 1998-06-24 1999-12-29 Johnson Matthey Electronics, Inc. Electronic device having fibrous interface
US6245400B1 (en) 1998-10-07 2001-06-12 Ucar Graph-Tech Inc. Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
US5912805A (en) 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
AU1616300A (en) 1998-12-02 2000-06-19 Intel Corporation A fibrous thermal interface adaptor
US6084775A (en) 1998-12-09 2000-07-04 International Business Machines Corporation Heatsink and package structures with fusible release layer
US6311769B1 (en) 1999-11-08 2001-11-06 Space Systems/Loral, Inc. Thermal interface materials using thermally conductive fiber and polymer matrix materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726495A (en) * 1992-03-09 1998-03-10 Sumitomo Metal Industries, Ltd. Heat sink having good heat dissipating characteristics
US5402006A (en) * 1992-11-10 1995-03-28 Texas Instruments Incorporated Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
US5455458A (en) * 1993-08-09 1995-10-03 Hughes Aircraft Company Phase change cooling of semiconductor power modules

Also Published As

Publication number Publication date
US20010023968A1 (en) 2001-09-27
KR100494974B1 (en) 2005-06-14
US6740972B2 (en) 2004-05-25
TW451259B (en) 2001-08-21
CN1306675A (en) 2001-08-01
EP1097477A4 (en) 2005-03-16
KR20010071510A (en) 2001-07-28
US20010052652A1 (en) 2001-12-20
WO1999067811A2 (en) 1999-12-29
US6617199B2 (en) 2003-09-09
CN1213476C (en) 2005-08-03
JP2002519846A (en) 2002-07-02
EP1097477A2 (en) 2001-05-09

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