WO2000001207A1 - Apparatus and method for improving computer memory speed and capacity - Google Patents
Apparatus and method for improving computer memory speed and capacity Download PDFInfo
- Publication number
- WO2000001207A1 WO2000001207A1 PCT/US1999/013836 US9913836W WO0001207A1 WO 2000001207 A1 WO2000001207 A1 WO 2000001207A1 US 9913836 W US9913836 W US 9913836W WO 0001207 A1 WO0001207 A1 WO 0001207A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bus
- board
- switches
- boards
- memory
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10212—Programmable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Definitions
- the DATA LINES are bi-directional. They connect bi-directional points of the
- the memory assembly consists of three boards, or
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dram (AREA)
- Semiconductor Memories (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99930417A EP1092337A4 (en) | 1998-06-26 | 1999-06-22 | Apparatus and method for improving computer memory speed and capacity |
JP2000557667A JP2002519871A (en) | 1998-06-26 | 1999-06-22 | Apparatus and method for increasing the speed and capacity of computer memory |
AU46962/99A AU4696299A (en) | 1998-06-26 | 1999-06-22 | Apparatus and method for improving computer memory speed and capacity |
KR1020007012307A KR20010043335A (en) | 1998-06-26 | 1999-06-22 | Apparatus and method for improving computer memory speed and capacity |
CA002334681A CA2334681A1 (en) | 1998-06-26 | 1999-06-22 | Apparatus and method for improving computer memory speed and capacity |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/105,892 US5953215A (en) | 1997-12-01 | 1998-06-26 | Apparatus and method for improving computer memory speed and capacity |
US09/105,892 | 1998-06-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000001207A1 true WO2000001207A1 (en) | 2000-01-06 |
Family
ID=22308364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/013836 WO2000001207A1 (en) | 1998-06-26 | 1999-06-22 | Apparatus and method for improving computer memory speed and capacity |
Country Status (8)
Country | Link |
---|---|
US (1) | US5953215A (en) |
EP (1) | EP1092337A4 (en) |
JP (1) | JP2002519871A (en) |
KR (1) | KR20010043335A (en) |
CN (1) | CN1306735A (en) |
AU (1) | AU4696299A (en) |
CA (1) | CA2334681A1 (en) |
WO (1) | WO2000001207A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002076363A1 (en) | 2001-03-23 | 2002-10-03 | Sca Hygiene Products Ab | A panty liner |
EP1383052A1 (en) * | 2002-07-15 | 2004-01-21 | Infineon Technologies AG | Memory system |
US7188204B2 (en) * | 2001-12-19 | 2007-03-06 | Infineon Technologies Ag | Memory unit and branched command/address bus architecture between a memory register and a plurality of memory units |
Families Citing this family (97)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5953215A (en) * | 1997-12-01 | 1999-09-14 | Karabatsos; Chris | Apparatus and method for improving computer memory speed and capacity |
US6349051B1 (en) | 1998-01-29 | 2002-02-19 | Micron Technology, Inc. | High speed data bus |
US6721860B2 (en) * | 1998-01-29 | 2004-04-13 | Micron Technology, Inc. | Method for bus capacitance reduction |
US6188595B1 (en) | 1998-06-30 | 2001-02-13 | Micron Technology, Inc. | Memory architecture and addressing for optimized density in integrated circuit package or on circuit board |
US6115278A (en) * | 1999-02-09 | 2000-09-05 | Silicon Graphics, Inc. | Memory system with switching for data isolation |
KR100287190B1 (en) * | 1999-04-07 | 2001-04-16 | 윤종용 | Memory module system connecting a selected memory module with data line &data input/output method for the same |
US6643752B1 (en) * | 1999-12-09 | 2003-11-04 | Rambus Inc. | Transceiver with latency alignment circuitry |
US6172895B1 (en) * | 1999-12-14 | 2001-01-09 | High Connector Density, Inc. | High capacity memory module with built-in-high-speed bus terminations |
US7010642B2 (en) * | 2000-01-05 | 2006-03-07 | Rambus Inc. | System featuring a controller device and a memory module that includes an integrated circuit buffer device and a plurality of integrated circuit memory devices |
US20050010737A1 (en) * | 2000-01-05 | 2005-01-13 | Fred Ware | Configurable width buffered module having splitter elements |
US7356639B2 (en) * | 2000-01-05 | 2008-04-08 | Rambus Inc. | Configurable width buffered module having a bypass circuit |
US7404032B2 (en) * | 2000-01-05 | 2008-07-22 | Rambus Inc. | Configurable width buffered module having switch elements |
US6502161B1 (en) * | 2000-01-05 | 2002-12-31 | Rambus Inc. | Memory system including a point-to-point linked memory subsystem |
US7363422B2 (en) * | 2000-01-05 | 2008-04-22 | Rambus Inc. | Configurable width buffered module |
US7266634B2 (en) * | 2000-01-05 | 2007-09-04 | Rambus Inc. | Configurable width buffered module having flyby elements |
US6449166B1 (en) * | 2000-08-24 | 2002-09-10 | High Connection Density, Inc. | High capacity memory module with higher density and improved manufacturability |
US6487102B1 (en) * | 2000-09-18 | 2002-11-26 | Intel Corporation | Memory module having buffer for isolating stacked memory devices |
US6820163B1 (en) * | 2000-09-18 | 2004-11-16 | Intel Corporation | Buffering data transfer between a chipset and memory modules |
US6697888B1 (en) * | 2000-09-29 | 2004-02-24 | Intel Corporation | Buffering and interleaving data transfer between a chipset and memory modules |
US20030234443A1 (en) * | 2001-10-26 | 2003-12-25 | Staktek Group, L.P. | Low profile stacking system and method |
US7656678B2 (en) | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
US6914324B2 (en) * | 2001-10-26 | 2005-07-05 | Staktek Group L.P. | Memory expansion and chip scale stacking system and method |
US20060255446A1 (en) | 2001-10-26 | 2006-11-16 | Staktek Group, L.P. | Stacked modules and method |
US6956284B2 (en) * | 2001-10-26 | 2005-10-18 | Staktek Group L.P. | Integrated circuit stacking system and method |
US6940729B2 (en) * | 2001-10-26 | 2005-09-06 | Staktek Group L.P. | Integrated circuit stacking system and method |
US6771536B2 (en) | 2002-02-27 | 2004-08-03 | Sandisk Corporation | Operating techniques for reducing program and read disturbs of a non-volatile memory |
US6850133B2 (en) * | 2002-08-14 | 2005-02-01 | Intel Corporation | Electrode configuration in a MEMS switch |
US7149841B2 (en) * | 2003-03-31 | 2006-12-12 | Micron Technology, Inc. | Memory devices with buffered command address bus |
KR100585099B1 (en) * | 2003-08-13 | 2006-05-30 | 삼성전자주식회사 | Stacked memory module and memoey system |
US8250295B2 (en) | 2004-01-05 | 2012-08-21 | Smart Modular Technologies, Inc. | Multi-rank memory module that emulates a memory module having a different number of ranks |
US7289386B2 (en) | 2004-03-05 | 2007-10-30 | Netlist, Inc. | Memory module decoder |
US7916574B1 (en) | 2004-03-05 | 2011-03-29 | Netlist, Inc. | Circuit providing load isolation and memory domain translation for memory module |
US7443023B2 (en) | 2004-09-03 | 2008-10-28 | Entorian Technologies, Lp | High capacity thin module system |
US7423885B2 (en) | 2004-09-03 | 2008-09-09 | Entorian Technologies, Lp | Die module system |
US7760513B2 (en) | 2004-09-03 | 2010-07-20 | Entorian Technologies Lp | Modified core for circuit module system and method |
US7571296B2 (en) * | 2004-11-11 | 2009-08-04 | Nvidia Corporation | Memory controller-adaptive 1T/2T timing control |
US8796830B1 (en) | 2006-09-01 | 2014-08-05 | Google Inc. | Stackable low-profile lead frame package |
US8359187B2 (en) | 2005-06-24 | 2013-01-22 | Google Inc. | Simulating a different number of memory circuit devices |
US8081474B1 (en) | 2007-12-18 | 2011-12-20 | Google Inc. | Embossed heat spreader |
US8041881B2 (en) | 2006-07-31 | 2011-10-18 | Google Inc. | Memory device with emulated characteristics |
US8090897B2 (en) | 2006-07-31 | 2012-01-03 | Google Inc. | System and method for simulating an aspect of a memory circuit |
US8077535B2 (en) | 2006-07-31 | 2011-12-13 | Google Inc. | Memory refresh apparatus and method |
US9542352B2 (en) | 2006-02-09 | 2017-01-10 | Google Inc. | System and method for reducing command scheduling constraints of memory circuits |
US8619452B2 (en) | 2005-09-02 | 2013-12-31 | Google Inc. | Methods and apparatus of stacking DRAMs |
US8055833B2 (en) | 2006-10-05 | 2011-11-08 | Google Inc. | System and method for increasing capacity, performance, and flexibility of flash storage |
US8244971B2 (en) | 2006-07-31 | 2012-08-14 | Google Inc. | Memory circuit system and method |
US20080082763A1 (en) | 2006-10-02 | 2008-04-03 | Metaram, Inc. | Apparatus and method for power management of memory circuits by a system or component thereof |
US8111566B1 (en) | 2007-11-16 | 2012-02-07 | Google, Inc. | Optimal channel design for memory devices for providing a high-speed memory interface |
US8397013B1 (en) | 2006-10-05 | 2013-03-12 | Google Inc. | Hybrid memory module |
US8335894B1 (en) | 2008-07-25 | 2012-12-18 | Google Inc. | Configurable memory system with interface circuit |
US7472220B2 (en) | 2006-07-31 | 2008-12-30 | Metaram, Inc. | Interface circuit system and method for performing power management operations utilizing power management signals |
US8386722B1 (en) | 2008-06-23 | 2013-02-26 | Google Inc. | Stacked DIMM memory interface |
US7590796B2 (en) * | 2006-07-31 | 2009-09-15 | Metaram, Inc. | System and method for power management in memory systems |
KR101318116B1 (en) | 2005-06-24 | 2013-11-14 | 구글 인코포레이티드 | An integrated memory core and memory interface circuit |
US7386656B2 (en) | 2006-07-31 | 2008-06-10 | Metaram, Inc. | Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit |
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US20080028136A1 (en) | 2006-07-31 | 2008-01-31 | Schakel Keith R | Method and apparatus for refresh management of memory modules |
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US7724589B2 (en) | 2006-07-31 | 2010-05-25 | Google Inc. | System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits |
US7417310B2 (en) | 2006-11-02 | 2008-08-26 | Entorian Technologies, Lp | Circuit module having force resistant construction |
US8301833B1 (en) | 2007-06-01 | 2012-10-30 | Netlist, Inc. | Non-volatile memory module |
US8904098B2 (en) | 2007-06-01 | 2014-12-02 | Netlist, Inc. | Redundant backup using non-volatile memory |
US8874831B2 (en) | 2007-06-01 | 2014-10-28 | Netlist, Inc. | Flash-DRAM hybrid memory module |
US8209479B2 (en) | 2007-07-18 | 2012-06-26 | Google Inc. | Memory circuit system and method |
US8080874B1 (en) | 2007-09-14 | 2011-12-20 | Google Inc. | Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween |
US8154901B1 (en) | 2008-04-14 | 2012-04-10 | Netlist, Inc. | Circuit providing load isolation and noise reduction |
US8417870B2 (en) | 2009-07-16 | 2013-04-09 | Netlist, Inc. | System and method of increasing addressable memory space on a memory board |
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EP2441007A1 (en) | 2009-06-09 | 2012-04-18 | Google, Inc. | Programming of dimm termination resistance values |
US9128632B2 (en) | 2009-07-16 | 2015-09-08 | Netlist, Inc. | Memory module with distributed data buffers and method of operation |
US20110047318A1 (en) * | 2009-08-19 | 2011-02-24 | Dmitroca Robert W | Reducing capacitive load in a large memory array |
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US10198350B2 (en) | 2011-07-28 | 2019-02-05 | Netlist, Inc. | Memory module having volatile and non-volatile memory subsystems and method of operation |
US10380022B2 (en) | 2011-07-28 | 2019-08-13 | Netlist, Inc. | Hybrid memory module and system and method of operating the same |
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US10372551B2 (en) | 2013-03-15 | 2019-08-06 | Netlist, Inc. | Hybrid memory system with configurable error thresholds and failure analysis capability |
US9436600B2 (en) | 2013-06-11 | 2016-09-06 | Svic No. 28 New Technology Business Investment L.L.P. | Non-volatile memory storage for multi-channel memory system |
US10324841B2 (en) | 2013-07-27 | 2019-06-18 | Netlist, Inc. | Memory module with local synchronization |
US10248328B2 (en) | 2013-11-07 | 2019-04-02 | Netlist, Inc. | Direct data move between DRAM and storage on a memory module |
KR20160102770A (en) * | 2015-02-23 | 2016-08-31 | 삼성전자주식회사 | Memory module, memory system including the smae, and data storage system including the memory module |
JP6683670B2 (en) * | 2017-11-21 | 2020-04-22 | ファナック株式会社 | Lock mechanism |
CN108174506A (en) * | 2017-12-13 | 2018-06-15 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its wires design |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5953215A (en) * | 1997-12-01 | 1999-09-14 | Karabatsos; Chris | Apparatus and method for improving computer memory speed and capacity |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5426759A (en) * | 1989-12-21 | 1995-06-20 | Microchip Technology Incorporated | On-chip/off-chip memory switching using system configuration bit |
US5257233A (en) * | 1990-10-31 | 1993-10-26 | Micron Technology, Inc. | Low power memory module using restricted RAM activation |
US5272664A (en) * | 1993-04-21 | 1993-12-21 | Silicon Graphics, Inc. | High memory capacity DRAM SIMM |
US5530623A (en) * | 1993-11-19 | 1996-06-25 | Ncr Corporation | High speed memory packaging scheme |
US5699315A (en) * | 1995-03-24 | 1997-12-16 | Texas Instruments Incorporated | Data processing with energy-efficient, multi-divided module memory architectures |
US5654566A (en) * | 1995-04-21 | 1997-08-05 | Johnson; Mark B. | Magnetic spin injected field effect transistor and method of operation |
IN188196B (en) * | 1995-05-15 | 2002-08-31 | Silicon Graphics Inc | |
US5666322A (en) * | 1995-09-21 | 1997-09-09 | Nec Electronics, Inc. | Phase-locked loop timing controller in an integrated circuit memory |
US5708597A (en) * | 1996-11-20 | 1998-01-13 | Xilinx, Inc. | Structure and method for implementing a memory system having a plurality of memory blocks |
KR100647189B1 (en) * | 1996-12-19 | 2007-08-16 | 텍사스 인스트루먼츠 인코포레이티드 | Selectable memory modules and method of operation |
-
1998
- 1998-06-26 US US09/105,892 patent/US5953215A/en not_active Expired - Lifetime
-
1999
- 1999-06-22 EP EP99930417A patent/EP1092337A4/en not_active Withdrawn
- 1999-06-22 JP JP2000557667A patent/JP2002519871A/en not_active Withdrawn
- 1999-06-22 AU AU46962/99A patent/AU4696299A/en not_active Abandoned
- 1999-06-22 CA CA002334681A patent/CA2334681A1/en not_active Abandoned
- 1999-06-22 WO PCT/US1999/013836 patent/WO2000001207A1/en not_active Application Discontinuation
- 1999-06-22 CN CN99807738A patent/CN1306735A/en active Pending
- 1999-06-22 KR KR1020007012307A patent/KR20010043335A/en not_active Application Discontinuation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5953215A (en) * | 1997-12-01 | 1999-09-14 | Karabatsos; Chris | Apparatus and method for improving computer memory speed and capacity |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002076363A1 (en) | 2001-03-23 | 2002-10-03 | Sca Hygiene Products Ab | A panty liner |
US7188204B2 (en) * | 2001-12-19 | 2007-03-06 | Infineon Technologies Ag | Memory unit and branched command/address bus architecture between a memory register and a plurality of memory units |
EP1383052A1 (en) * | 2002-07-15 | 2004-01-21 | Infineon Technologies AG | Memory system |
US6856554B2 (en) | 2002-07-15 | 2005-02-15 | Infineon Technologies Ag | Memory system |
Also Published As
Publication number | Publication date |
---|---|
EP1092337A1 (en) | 2001-04-18 |
CA2334681A1 (en) | 2000-01-06 |
JP2002519871A (en) | 2002-07-02 |
AU4696299A (en) | 2000-01-17 |
KR20010043335A (en) | 2001-05-25 |
US5953215A (en) | 1999-09-14 |
CN1306735A (en) | 2001-08-01 |
EP1092337A4 (en) | 2004-07-21 |
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