WO2000013237A1 - Dispositif photovoltaique - Google Patents
Dispositif photovoltaique Download PDFInfo
- Publication number
- WO2000013237A1 WO2000013237A1 PCT/JP1999/004610 JP9904610W WO0013237A1 WO 2000013237 A1 WO2000013237 A1 WO 2000013237A1 JP 9904610 W JP9904610 W JP 9904610W WO 0013237 A1 WO0013237 A1 WO 0013237A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- transparent
- thin film
- photovoltaic device
- thickness
- Prior art date
Links
- 239000010408 film Substances 0.000 claims abstract description 328
- 239000010409 thin film Substances 0.000 claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 238000009826 distribution Methods 0.000 claims abstract description 12
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 59
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 53
- 229910001887 tin oxide Inorganic materials 0.000 claims description 49
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 48
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 47
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 34
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 34
- 238000000576 coating method Methods 0.000 claims description 21
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 19
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 18
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 18
- 239000000460 chlorine Substances 0.000 claims description 18
- 229910052801 chlorine Inorganic materials 0.000 claims description 18
- 239000011737 fluorine Substances 0.000 claims description 18
- 229910052731 fluorine Inorganic materials 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000010936 titanium Substances 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052787 antimony Inorganic materials 0.000 claims description 7
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000003086 colorant Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 84
- 239000011521 glass Substances 0.000 description 67
- 239000007789 gas Substances 0.000 description 38
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 36
- 239000011135 tin Substances 0.000 description 33
- 230000000052 comparative effect Effects 0.000 description 31
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 19
- 238000011156 evaluation Methods 0.000 description 19
- 229910052757 nitrogen Inorganic materials 0.000 description 18
- 239000002994 raw material Substances 0.000 description 17
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 16
- 229910052760 oxygen Inorganic materials 0.000 description 16
- 238000005229 chemical vapour deposition Methods 0.000 description 15
- YMLFYGFCXGNERH-UHFFFAOYSA-K butyltin trichloride Chemical compound CCCC[Sn](Cl)(Cl)Cl YMLFYGFCXGNERH-UHFFFAOYSA-K 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000002356 single layer Substances 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 229910052718 tin Inorganic materials 0.000 description 9
- 239000011787 zinc oxide Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000005357 flat glass Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910021426 porous silicon Inorganic materials 0.000 description 6
- PKKGKUDPKRTKLJ-UHFFFAOYSA-L dichloro(dimethyl)stannane Chemical compound C[Sn](C)(Cl)Cl PKKGKUDPKRTKLJ-UHFFFAOYSA-L 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 150000002736 metal compounds Chemical class 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- BTFOWJRRWDOUKQ-UHFFFAOYSA-N [Si]=O.[Sn] Chemical compound [Si]=O.[Sn] BTFOWJRRWDOUKQ-UHFFFAOYSA-N 0.000 description 3
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 238000000053 physical method Methods 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- -1 silicon oxide aluminum Chemical compound 0.000 description 3
- 238000010583 slow cooling Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- NPAIMXWXWPJRES-UHFFFAOYSA-N butyltin(3+) Chemical compound CCCC[Sn+3] NPAIMXWXWPJRES-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000572 ellipsometry Methods 0.000 description 2
- 239000008246 gaseous mixture Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- WOFMFGQZHJDGCX-ZULDAHANSA-N mometasone furoate Chemical compound O([C@]1([C@@]2(C)C[C@H](O)[C@]3(Cl)[C@@]4(C)C=CC(=O)C=C4CC[C@H]3[C@@H]2C[C@H]1C)C(=O)CCl)C(=O)C1=CC=CO1 WOFMFGQZHJDGCX-ZULDAHANSA-N 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- SBMYBOVJMOVVQW-UHFFFAOYSA-N 2-[3-[[4-(2,2-difluoroethyl)piperazin-1-yl]methyl]-4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound FC(CN1CCN(CC1)CC1=NN(C=C1C=1C=NC(=NC=1)NC1CC2=CC=CC=C2C1)CC(=O)N1CC2=C(CC1)NN=N2)F SBMYBOVJMOVVQW-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VOPWNXZWBYDODV-UHFFFAOYSA-N Chlorodifluoromethane Chemical compound FC(F)Cl VOPWNXZWBYDODV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000001840 Dandruff Diseases 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- VMPVEPPRYRXYNP-UHFFFAOYSA-I antimony(5+);pentachloride Chemical compound Cl[Sb](Cl)(Cl)(Cl)Cl VMPVEPPRYRXYNP-UHFFFAOYSA-I 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- DAMJCWMGELCIMI-UHFFFAOYSA-N benzyl n-(2-oxopyrrolidin-3-yl)carbamate Chemical compound C=1C=CC=CC=1COC(=O)NC1CCNC1=O DAMJCWMGELCIMI-UHFFFAOYSA-N 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- RJCQBQGAPKAMLL-UHFFFAOYSA-N bromotrifluoromethane Chemical compound FC(F)(F)Br RJCQBQGAPKAMLL-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- RJGHQTVXGKYATR-UHFFFAOYSA-L dibutyl(dichloro)stannane Chemical compound CCCC[Sn](Cl)(Cl)CCCC RJGHQTVXGKYATR-UHFFFAOYSA-L 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- JDTCYQUMKGXSMX-UHFFFAOYSA-N dimethyl(methylsilyl)silane Chemical compound C[SiH2][SiH](C)C JDTCYQUMKGXSMX-UHFFFAOYSA-N 0.000 description 1
- UTUAUBOPWUPBCH-UHFFFAOYSA-N dimethylsilylidene(dimethyl)silane Chemical compound C[Si](C)=[Si](C)C UTUAUBOPWUPBCH-UHFFFAOYSA-N 0.000 description 1
- PWEVMPIIOJUPRI-UHFFFAOYSA-N dimethyltin Chemical compound C[Sn]C PWEVMPIIOJUPRI-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- ZMHZSHHZIKJFIR-UHFFFAOYSA-N octyltin Chemical compound CCCCCCCC[Sn] ZMHZSHHZIKJFIR-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229940098458 powder spray Drugs 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- VXKWYPOMXBVZSJ-UHFFFAOYSA-N tetramethyltin Chemical compound C[Sn](C)(C)C VXKWYPOMXBVZSJ-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
Definitions
- a transparent conductive film is formed on one surface of a transparent substrate on which light is incident, a photoelectric conversion active layer made of amorphous silicon is provided thereon, and a metal electrode film is further provided thereon. This is related to a photovoltaic device that is used. Height
- amorphous silicon solar cells have been widely used as power supplies for calculators and watches. Since solar cells for these devices require only a small area, the interference color unevenness caused by the film thickness distribution (hereinafter referred to as “film thickness unevenness”) of each thin film forming the solar cell (hereinafter referred to as “reflection”). Color unevenness) was not a very serious problem.
- a transparent conductive film is formed and then formed into a desired fllip.
- a method of etching and a method of forming a wedge-shaped thin film having a non-uniform thickness on the back surface of a substrate as disclosed in Japanese Patent Application Laid-Open No. 60-142576.
- a method of controlling the reflection color tone of a glass substrate having a transparent conductive film formed thereon as disclosed in Japanese Patent Publication No.
- a layer having a high refractive index is formed on the substrate side, and furthermore, There is known a method in which a layer having a lower refractive index than this layer is formed into a two-layer film, and these two-layer films are formed under an infrared-reflective transparent semiconductor which is a transparent conductive film.
- the control of the etching amount is not specifically shown. Not only is it difficult to control the film thickness, but etching a thin film once formed is a method that considerably reduces productivity.
- the method of forming a wedge-shaped thin film having a non-uniform film thickness on the back surface of a transparent substrate uses an iridescent pattern. Therefore, when it is used for a roof of a house, not only is there an aesthetic problem, but also it is a problem that it is difficult to form a wedge-shaped thin film having a non-uniform film thickness and a decrease in productivity.
- Japanese Patent Publication No. 3-72586 discloses that there is no description regarding the reflection tone when an amorphous silicon film is formed on the transparent conductive JI and a metal film such as aluminum is formed thereon. There is no description. Therefore, it is difficult to guess what the reflection color tone of such a configuration is, and there remains a problem that a desired color tone cannot always be obtained.
- the photovoltaic device according to the present invention overcomes the aforementioned disadvantages of the prior art. When used for the roof or wall of a house, the unevenness of the reflected color is small, and the reflected color including at least one of an achromatic color and a green color system indicates the reflected color.
- the roof and walls have excellent aesthetics and productivity. Disclosure of the invention
- the present invention has been made to solve the above-mentioned problems, and the invention according to claim 1 has a structure in which a transparent conductive film, a semiconductor thin film, and a metal electrode film are sequentially laminated on one surface of a transparent substrate.
- the film thickness distribution of the transparent conductive film is within a range of 10% of the core film thickness, and at least one transparent layer is provided between the transparent substrate and the transparent conductive film.
- the invention according to claim 2 is the invention according to claim 1, wherein the transparent thin film has a refractive index of 1.45 to 1.8 and an expansion of 20 to 8 O nm. is there.
- the invention according to claim 3 is the invention according to claim 2, wherein the transparent thin film is a thin film containing silicon oxide or aluminum oxide as a main component.
- the invention according to claim 4 is the invention according to claim 1, wherein the transparent thin film includes a first layer and a second layer, and a refractive index of the first layer thin film on the transparent substrate side is set. 1.8 to 2.5, the film thickness is 10 to 5 O nm, the refractive index of the second layer thin film laminated on the first layer thin film is 1.45 to 1.8, In addition, the film thickness is set to 10 to 50 nm.
- the invention according to claim 5 is the invention according to claim 4, wherein the first layer thin film is a thin film mainly composed of silicon oxide tin or titanium oxide, and the second layer thin film is an acid thin film.
- the invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the transparent conductive film has a thickness of less than 80 nm.
- the invention according to claim 7 is the invention according to claim 1, wherein the expansion of the transparent conductive film is 800 to 150 nm.
- the invention according to claim 8 is a photovoltaic device in which a transparent conductive film, a semiconductor thin film, and a metal electrode film are sequentially laminated on one surface of a transparent substrate, wherein the transparent conductive film is disposed between the transparent substrate and the transparent conductive film.
- This is a photovoltaic device in which one or more transparent thin films are laminated, and the reflected color seen from the transparent substrate side, which is the light incident side, includes at least one of an achromatic color and a green color.
- the refractive index of the transparent thin film is set to 1.45 to 2.5, and its Ji J ⁇ is set to 15 to 100 nm. It was done.
- the invention according to claim 10 is the invention according to claim 9, wherein the transparent thin film is a thin film containing silicon oxide, silicon oxide aluminum, silicon oxide tin or titanium oxide as main components. It was done.
- the invention according to claim 11 is the invention according to claim 8, wherein the transparent thin film includes a first layer and a second layer, and a refractive index of the first layer thin film located on the transparent substrate side. Is set to 1.8 to 2.5, the film thickness is set to 15 to 100 nm, and the refractive index of the second layer thin film laminated on the first layer thin film is set to 1.45 to 1. 8, and M is set to 15 to: L00 nm.
- the first layer thin film is a thin film mainly composed of silicon oxide tin or titanium oxide
- the second layer The thin film is a thin film containing silicon oxide or aluminum oxide as a main component.
- the main component of the transparent conductive film is tin oxide.
- the invention according to claim 14 is the invention according to claim 13, wherein the transparent conductive film contains at least one of fluorine, chlorine and antimony.
- a fifteenth aspect of the present invention is the invention according to the fifteenth aspect, wherein the transparent conductive film contains 0.11% by weight or less of chlorine and fluorine of the chlorine concentration or more. It is.
- the invention according to claim 16 is the invention according to claim 15, wherein the chlorine concentration in the transparent conductive film is 0.05 to 0.11% by weight, and the fluorine concentration is 0%. . 0 1 ⁇ 0.7% by weight.
- the invention according to claim 17 is the invention according to any one of claims 1 to 16, wherein at least one layer of transparent material is provided on the surface of the transparent substrate on which the transparent conductive film is not formed.
- the reflectance of the transparent substrate on which the transparent coating is formed is the reflectance of the transparent substrate on which the transparent coating is not formed. It is smaller than that.
- the invention according to claim 18 is the invention according to claim 17, wherein the transparent film has a refractive index of about 1.25 to: L.35 and a film thickness of 50 to 20.
- the invention according to claim 19 is the invention according to claim 17, wherein the transparent film is a two-layer film, and the refractive index of the transparent film on the transparent substrate side is determined by the refractive index of the transparent film formed thereon. It is larger than the rate.
- the invention according to claim 20 is the invention according to claim 19, wherein the transparent film on the transparent substrate side has a refractive index of 1.6 to 2.0 and a film thickness of 50 to 20O.
- a transparent film formed thereon has a refractive index of 1.25 to 1.8 and a film thickness of 30 to 15 O nm.
- the photovoltaic device of the present invention can control the siif of a transparent thin film such as a silicon oxide film, a tin oxide film, a titanium oxide film, and an aluminum oxide film formed on a glass substrate.
- a transparent thin film such as a silicon oxide film, a tin oxide film, a titanium oxide film, and an aluminum oxide film formed on a glass substrate.
- the control of the reflection color unevenness and the reflection color is achieved by forming one or more transparent thin films having a controlled refractive index and film thickness between the transparent conductive substrate J3 and the transparent substrate.
- a thin film By forming a thin film on the other surface of the transparent substrate that has not been formed, and by controlling the thickness of the transparent conductive film, there is no unevenness of the reflected color, and the reflected color can be achromatic or green.
- achromatic and green colors used herein are defined as L * a * b * color system chromaticity indices a * and b * specified in JIS Z 8729-1980, respectively. ⁇ g +, — 5 ⁇ g +5
- the film thickness unevenness that causes the reflection color unevenness is a problem related to any film constituting the amorphous silicon solar cell.
- the thickness of the transparent film formed between the transparent substrate and the transparent conductive film is small compared to the transparent conductive film, so that the influence on the reflection color unevenness is small.
- the MJ ⁇ distribution unevenness of the amorphous silicon layer formed by the plasma CVD method described later is small, the influence on the reflection color unevenness is also small.
- the influence on the reflection color of the amorphous silicon solar cell is small even for a thin metal film such as aluminum because the film thickness is not uneven. Therefore, in such an amorphous silicon solar cell, it can be said that the state of the film thickness distribution of the transparent conductive film has the greatest influence on the reflection color unevenness.
- the center thickness is represented by (5max + Smin) / 2, where the maximum Ulff is (5max) and the minimum Hi? Is 5min.
- the CVD method described below is excellent in terms of economy and productivity, but the transparent conductive film obtained by this method has uneven fliif distribution when the Slif is thick. Tends to be larger. Therefore, in order to reduce the uneven reflection color due to the uneven thickness of the transparent conductive film, the refractive index and the refractive index between the transparent substrate and the transparent conductive film are reduced. It was decided to provide one or more transparent thin films in which the above was adjusted.
- the reason why the reflection color unevenness is reduced or the achromatic or green color reflection color is obtained is that, in addition to the transparent conductive film layer, the amorphous silicon layer and the metal film layer, the transparent substrate and the transparent conductive This is because by providing one or more thin films whose refractive index and film thickness are adjusted between the films, the light interference effect of the multilayer thin film is adjusted.
- the transparent conductive film may have a Jili of less than 80 O nm.
- the transparent conductive film has a thickness of 80 O nm or more, the refractive index and the refractive index of the transparent thin film provided between the transparent substrate and the transparent conductive film need not be adjusted. The reason for this is that since i is thick, the interference effect of visible light is reduced, and uneven reflection color is reduced.
- J5 iP is thicker than 150 O nm, more raw materials are required and the production cost is increased.In addition, the deposition rate is slowed down, the deposition time is lengthened, and the productivity is reduced and the production cost is reduced. Will be higher.
- the transparent substrate may be a transparent resin or the like.
- a glass plate is preferable in terms of fire resistance, durability, impact resistance, and the like.
- the thin film having a refractive index of 1.45 to 1.8 used as a single-layer film or a second-layer thin film of a two-layer film may be silicon oxide, an oxide containing carbon or nitrogen. Examples include silicon, aluminum oxide, and a metal oxide film containing silicon or aluminum as a main component. Judging from the viewpoint that the film can be easily formed, silicon oxide, silicon oxide containing carbon or nitrogen, and aluminum oxide are preferable when the CVD method described later is used.
- examples of the thin film having a refractive index of 1.8 to 2.5 used as the first layer thin film of the two-layer film include tin oxide, indium oxide, zinc oxide, and titanium oxide.
- oxidized tin or titanium oxide is preferred because it is easily available and easy to form a film, and is relatively inexpensive.
- fluorine, chlorine or antimony may be added to the oxidized tin. If the thickness of these transparent thin films is too thin, they cannot be formed uniformly on the transparent substrate, and the effect of reducing the reflection color unevenness cannot be obtained.
- the thickness range is about 20 to 8 O nm.
- the MJf: of each layer is preferably 10 to 5 O nm.
- the transparent conductive film examples include tin oxide to which fluorine, chlorine or antimony is added, indium oxide to which tin is added, zinc oxide to which aluminum or indium is added, and the like. It is preferable to use those containing tin oxide as a main component from the problem of the composition. Further, tin oxide containing at least one selected from fluorine, chlorine and antimony is preferable.
- the chlorine concentration in the transparent conductive film is adjusted to or less than 0.1% by weight and the fluorine concentration in the transparent conductive film to be equal to or more than the chlorine concentration.
- the refractive index of the transparent conductive film is adjusted and the transparent substrate is formed. In addition to the effect of the transparent thin film formed between the transparent conductive film and the transparent conductive film, reflection color unevenness is reduced.
- an achromatic color or a green color can be obtained as a reflection color by optimizing the film thickness.
- the preferred chlorine concentration is 0.05 to 0.11% by weight, and the fluorine concentration is 0.01 to 0.7% by weight. A more preferred fluorine concentration is 0.01 to 0.3% by weight. If the chlorine concentration is less than 0.05% by weight and the fluorine concentration is less than 0.01% by weight, the refractive index hardly changes, and no effect on the reflection color unevenness can be obtained. When the chlorine concentration exceeds 0.11% by weight or when the fluorine concentration exceeds 0.3% by weight, the absorption of light wavelength effective for the solar cell increases, and the light amount to the amorphous silicon decreases. This reduces the conversion efficiency of the photovoltaic device.
- a method for forming these transparent thin films or transparent conductive films there are so-called physical methods such as a vacuum deposition method using each metal or each metal oxide, a sputtering method, an ion plating method, and the like.
- Chemical vapor deposition (CVD) which forms a film by spraying a gaseous vapor of a metal compound onto a heated glass substrate, or spraying droplets of a solution in which each metal compound is dissolved onto a heated glass substrate
- a so-called chemical method such as a spray method and a powder spray method of spraying a powder made of a metal compound can be used.
- film formation by a physical method is excellent in uniformity of film thickness, but is difficult to mass-produce because a cut glass is washed and formed in a vacuum apparatus.
- the chemical method is superior in terms of responding to the enlargement of the glass substrate.
- the spray method has an advantage that a film can be formed at low cost because the method is simple.
- each metal oxide film In the case of forming each metal oxide film by the CVD method, a glass substrate cut into about 500 mm square is generally heated, and a gaseous metal compound is sprayed to form the film.
- a glass substrate with a transparent conductive film on which such various thin films are formed is used for a roof of a house or the like for an amorphous solar cell, the glass substrate needs to be further enlarged. I have.
- Examples of the aluminum raw material of the aluminum oxide include trimethylaluminum, aluminum triisopropoxide, getylaluminum chloride, aluminum acetylacetonate, and aluminum chloride.
- Titanium raw materials for titanium oxide formed by the CVD method include titanium tetrachloride, titanium isopropoxide, and the like.
- the tin compound raw materials used in the CVD method include tin tetrachloride, dimethyltin dichloride, dibutyltin dichloride, tetrabutyltin, tetramethyltin, octyltin dichloride, monobutyltin trichloride, etc.
- Acid dandruff for obtaining Examples include oxygen, steam, and dry air.
- silicon, aluminum, zinc, copper, indium, bismuth, gallium, boron, vanadium, manganese, zirconium, etc. are used to improve the properties of the transparent conductive film. May be added as appropriate within a range that does not significantly reduce the amount.
- a transparent thin film such as an oxide silicon film and an aluminum oxide film formed between the transparent conductive oxide film and the transparent substrate is formed in a transparent conductive film in which sodium in glass is a tin oxide film. It also has the purpose of preventing the conductivity of the material from lowering (so-called alkaline barrier layer).
- the silicon raw materials for silicon oxide formed by the CVD method include monosilane, disilane, trisilane, monochlorosilane, dichlorosilane, 1,2-dimethyl ⁇ / silane, 1,1,2-trimethyldisilane, 1,1 , 2,2-tetramethyldisilane and the like.
- the oxidizing agent include oxygen, steam, dry air, carbon dioxide, carbon monoxide, nitrogen dioxide and the like.
- unsaturated hydrocarbon gas such as ethylene, acetylene, toluene or the like is used for the purpose of preventing oxidation until reaching the glass surface and controlling the refractive index of the obtained silicon oxide film. It may be added.
- a plasma CVD method using plasma energy is generally used, and monosilane, disilane, or the like is used as a raw material when forming a film by the plasma CVD method. Is common.
- an amorphous silicon solar cell When forming an amorphous silicon solar cell, it is necessary to provide P-type and n-type semiconductor layers of amorphous silicon.
- a p-type semiconductor layer When obtaining a p-type semiconductor layer, it is common to add diborane or the like to monosilane or the like, and to obtain an n-type semiconductor layer, it is common to add phosphine or the like.
- an oxide semiconductor thin film such as zinc oxide for the purpose of reducing reflection color unevenness and adjusting reflection color.
- metal electrode film formed on the amorphous silicon film or the zinc oxide film aluminum, silver, and the like are generally used.
- a method for forming these metal-1 films a physical method such as a vacuum evaporation method or a sputtering method using these metal targets is generally used.
- the reflection color viewed from the transparent substrate side on the light incident side includes at least one of an achromatic color and a green color system.
- the reason why such a reflected color is obtained is that, in addition to the transparent conductive film layer, the amorphous silicon layer and the metal film layer, the refractive index and the JilJf By providing one or more adjusted thin films, the light interference effect of the multilayer thin film can be adjusted.
- the thin film having a refractive index of 1.45 to 2.5 used as a single-layer film uses the CVD method described later, judging from the viewpoint that the film can be easily formed.
- silicon oxide, aluminum oxide, tin oxide, and titanium oxide are preferred.
- the silicon oxide may contain carbon or nitrogen, and the tin oxide may contain fluorine, chlorine or antimony.
- examples of the thin film having a refractive index of 1.8 to 2.5 used as the first layer thin film of the two-layer film include tin oxide, indium oxide, zinc oxide, and titanium oxide.
- tin oxide or titanium oxide is preferable from the viewpoint of film forming properties in the CVD method.
- silicon oxide or aluminum oxide is preferable as in the first configuration example.
- the thickness of the transparent thin film of this configuration example is preferably 15 to 100 nm in the case of a single-layer film and in the case of a film having two or more layers.
- This reflection reduction layer may be formed of two or more multilayer films. In this case, it is necessary to adjust each film thickness of the multilayer film to match the refractive index of each coating layer.
- the preferable thickness of the reflection reducing film is 50 to 200 nm for a single-layer film having a refractive index of substantially 1.25 to 1.35. The reason is that if it is less than 5 O nm, there is almost no effect of reducing reflection, and if it exceeds 20 O nm, the effect of reducing reflection at a wavelength effective for solar cells decreases, and the productivity becomes poor. This is because the manufacturing cost increases.
- the refractive index is 45 to 19Onm.
- the film thickness slightly moves to a smaller suitable film thickness range.
- Porous silicon oxide as a transparent film having a refractive index of 1.25-35, and a transparent film having a refractive index of 1.35-1.5 have a different porosity from the porous silicon oxide. Examples include porous silicon oxide or a film mainly composed of silicon oxide.
- This reflection reduction layer may be formed by a multilayer film of two or more layers.
- the refractive index of the transparent film on the transparent substrate side is changed by the refractive index of the transparent film formed thereon. It is preferable that the ratio be larger than the ratio.
- the transparent film has a refractive index of 1.6 to 2.0 and a film thickness of 50 to 200 nm
- the transparent film formed thereon has a refractive index of 1.25 to: L ⁇ 8 and a film thickness of 30 to 150 nm.
- the transparent film having a refractive index of 1.6 to 2.0 for example, a film mainly composed of titanium oxide, tin oxide, aluminum oxide, silicon oxide, and a mixed film thereof are used.
- these oxides particularly silicon oxide and aluminum oxide, and a high ratio of silicon oxide and aluminum oxide in a mixed film of the oxides are used. And a porous silicon oxide film.
- the photovoltaic device of the present invention is obtained by laminating a transparent thin film composed of a silicon oxide film, a tin oxide film, a titanium oxide film, etc. on a glass substrate by a CVD method.
- a tin oxide film as a transparent conductive film is laminated thereon, and an amorphous silicon film or an oxidized zinc film formed on an amorphous silicon film as a semiconductor thin film is formed thereon, and then an aluminum film is formed as a metal electrode film.
- a reflection reduction layer comprising at least one transparent film is formed on the surface of the transparent substrate on which the transparent conductive film is not formed. It was done.
- the above sheet glass is treated with a mixed gas consisting of monosilane, ethylene, oxygen and nitrogen when passing below a plurality of nozzles in the first half in a tin tank, and is mainly made of silicon oxide. A transparent thin film was formed.
- the glass substrate temperature was 220 ° C.
- the thickness of the amorphous silicon film was controlled by the film formation time.
- the A 1 layer was formed at about 3 0 O nm of film thickness so as vacuum deposition at a pressure of about 1 0- 4 P a as a back electrode, the thickness A positive battery was used, and the glass was cut into a size of 43 mm x 43 mm.
- amorphous silicon solar cells were also manufactured by the above procedure.
- a transparent thin film and a transparent conductive film before and after forming these multilayer films, film formation for forming only a single layer film is performed, and using these single layer films, the following method is used.
- the refractive index and thickness of the transparent thin film and the thickness distribution of the transparent conductive film were determined.
- the refractive index of the silicon oxide film as a transparent thin film was measured at a wavelength of 633.3 nm using ellipsometry (the refractive index of aluminum oxide, tin oxide and titanium oxide as transparent thin films was also determined). Determined in the same way).
- the thickness of the silicon oxide was determined assuming the extinction coefficient of the coating to be 0 when measuring the refractive index by ellipsometry.
- the thickness of the aluminum oxide was determined by the same method.
- the thickness of the tin oxide, a transparent thin film was determined by applying a zinc powder to the oxidized tin film masked with tape, pouring dilute hydrochloric acid from above, etching the coating, and using a stylus meter. .
- the thickness of titanium oxide, which is a transparent thin film was determined by the same method.
- the thickness distribution of the tin oxide film, which is a transparent conductive film was determined by selecting several points with different reflection colors from the glass surface with the coating, and using the same stylometer as above for these points.
- the visible light reflection color of the obtained amorphous silicon solar cell was measured by Hitachi 330 type spectrophotometer according to JISZ 872 2-1982, and L * a * b specified in JISZ 8729-1980. * Calculated from a * and b * of the colorimetric chromaticness index, the values in Table 1 were obtained. The maximum and minimum values of the distribution values of a * and b * were measured at different reflection colors in the plane of the amorphous silicon solar cell, and the results are shown in Table 1. In Examples 3 to 13, 15 and 25 to 36 and Comparative Examples 1 to 7, measurements and calculations were also performed according to this method.
- the presence or absence of reflected color unevenness and the reflected color can be determined by standing the amorphous silicon solar cell sample prepared above on a white wall with the surface on which the film is not laminated facing up, illuminating the surface with light, and looking lm away. was determined by visual inspection. The results are shown in Table 1 or Table 2. In addition, in Examples 3-13, 15, 16 and 18-39 and Comparative Examples 1-7, the judgment was also made by this method.
- the chlorine concentration and the fluorine concentration in the transparent conductive film were calculated from the characteristic X-ray intensity of the electron beam microanalyzer, and the results are shown in Table 3. In Examples 3 to 13, 15, 16, 18-39 and Comparative Examples 1 to 7, measurements and calculations were also performed by this method.
- a regular soda-lime-silica glass plate with a thickness of about 1 mm cut into a size of 45 Omm x 450 mm was placed on a mesh belt and heated to about 570 ° C through a heating furnace.
- This glass plate is passed under the first film-forming nozzle and treated with a mixed gas consisting of monosilane, oxygen and nitrogen. A transparent thin film was formed. Once the glass plate on which this thin film has been formed is taken out through the slow cooling step, the glass plate is placed on a mesh belt again and passed through a heating furnace.
- an amorphous silicon solar cell was prepared in the same manner as in Example 1, cut into a size of 43 mm ⁇ 430 mm, and evaluated in the same manner as in Example 1.
- Table 1 shows the results.
- Example 3 Using a glass plate of the same dimensions and the same material as in Example 3, and using a mixed gas consisting of aluminum isopropoxide, oxygen, and nitrogen instead of the monosilane mixed gas in the same manner, the acid was mainly placed on the glass plate. A transparent thin film made of aluminum was formed. The subsequent steps are the same as those after the formation of the silicon oxide film in Example 3. The glass plate was gradually cooled, taken out, re-heated at 600 ° C., and monobutyltin was placed on the aluminum oxide transparent thin film. A transparent conductive film made of tin oxide was formed using a mixed gas such as trichloride vapor.
- a mixed gas such as trichloride vapor.
- Example 2 Using a glass of the same material and the same manufacturing method as in Example 1, a coating made of tin oxide was formed in the same manner using a mixed gas consisting of steam, oxygen, water vapor, helium, and nitrogen of dimethyl tin nozzle. Formed on sheet glass. Subsequent steps were the same as those in Example 1. A film made of silicon oxide was formed on this film using a mixed gas of monosilane, and a two-layered transparent thin film layer was formed. Further, a transparent conductive film made of tin oxide was formed on the film by using a mixed gas consisting of vapor of dimethyltin dichloride or the like.
- Example 1 The sheet glass on which these coatings were formed was pressed in the same manner as in Example 1 to produce an amorphous silicon solar cell, and the same evaluation as in Example 1 was performed. Conclusion The results are shown in Table 1.
- Example 3 Using a glass plate of the same dimensions and the same material as in Example 3, and using a mixed gas consisting of monobutyltin trichloride vapor, oxygen, water vapor, and nitrogen in the same manner, using a tin oxide on a glass plate A coating was formed. Subsequent steps were the same as those in Example 3, using a mixed gas of monosilane, forming a film made of silicon oxide, and forming a two-layered transparent thin film layer. Next, the glass plate was gradually cooled, taken out, and reheated at 600 ° C., and then a transparent conductive material made of tin oxide was formed on the silicon oxide film using a mixed gas consisting of monobutyltin trichloride vapor or the like. A film was formed.
- Example 3 Using a glass plate having the same dimensions and the same material as in Example 3, a cover made of titanium oxide was formed on glass using a mixed gas consisting of titanium isopropoxide, oxygen and nitrogen in the same manner. Subsequent steps are the same as in Example 3. A mixed film of monosilane or the like is used to form a film of silicon oxide on the titanium oxide film, and a transparent thin film layer of two layers is formed. did. Next, the glass plate was gradually cooled, taken out, reheated at 600 ° C, and a transparent conductive film made of tin oxide was formed thereon using a mixed gas such as monobutyltin trichloride vapor. .
- a mixed gas such as monobutyltin trichloride vapor.
- a coating made of titanium oxide was formed on a glass plate.
- Subsequent steps are the same as those in Examples 4 and 5, and a film made of aluminum oxide is formed on the titanium oxide film by using a mixed gas such as aluminum isopropoxide to form a two-layer film. A transparent thin film layer was formed.
- the glass plate was gradually cooled, taken out, reheated at 600 ° C., and a transparent conductive film made of tin oxide was formed thereon by using a mixed gas such as vapor of monobutyltin trichloride.
- a transparent thin film made of titanium oxide was formed on a glass plate in the same manner as in Examples 9 to 10.
- the subsequent steps were the same as those after the formation of the silicon oxide film in Example 3, and the glass plate was gradually cooled and taken out.
- a transparent conductive film made of tin oxide was formed on the titanium oxide film using a mixed gas such as a vapor of monobutyltin trichloride.
- the thickness of each coating was controlled by changing the concentration of the raw material used by changing the concentration of the raw material used.
- an amorphous silicon solar cell was prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Table 1 shows the results of Example 15 and Table 2 shows the results of Example 18.
- Example 2 Using a glass of the same material and the same manufacturing method as in Example 1, in a similar manner, using a mixed gas consisting of dimethyltin dichloride vapor, oxygen, water vapor, helium and nitrogen, a coating made of tin oxide was plated. Formed on the glass. Subsequent steps were the same as those in Example 1, and a film made of silicon oxide was formed on this film using a mixed gas of monosilane to form a two-layer transparent thin film. Further, a transparent conductive film made of tin oxide was formed on the film using a mixed gas consisting of dimethyltin dichloride vapor or the like.
- Example 1 The sheet glass on which these films were formed was cut in the same manner as in Example 1 to form an amorphous silicon layer. Next, a zinc oxide layer was formed on the amorphous silicon layer by a known sputtering method. Further, an A1 layer was formed thereon as a back electrode in the same manner as in Example 1 to produce a solar cell, and the same evaluation as in Example 1 was performed. Table 1 shows the results.
- Example 6 In the same manner as in Example 6, a transparent thin film and a transparent conductive film were formed on the surface of the glass plate by forming a tin oxide film, an oxidized silicon film, and a tin oxide film in this order.
- the sheet glass on which these coatings were formed was cut into glass plates having dimensions of 450 mm ⁇ 450 mm in a cutting step after a slow cooling step.
- a transparent coating is formed as follows on a surface of the other glass on which the transparent conductive film is not formed as a reflection reducing film for reducing the reflectance. Done.
- Example 29 after masking the surface of the glass plate on which the transparent conductive film was formed, the glass plate was subjected to a concentration of 0.05 mol of boric acid and 0.08 mol of potassium fluoride. It was immersed in a 1.25 mol / L aqueous solution of hydrosilicofluoric acid for 2 hours. Further, the glass plate was taken out, the mask was removed, and the substrate was washed and dried, whereby a silicon oxide film was formed on the other glass main surface on which the transparent conductive film was not formed. This film was a porous silicon oxide film having a substantial refractive index of 1.26 and had a thickness of 100 nm.
- Example 2 an amorphous silicon layer is formed on the surface of the plate on which the transparent conductive film is formed in the same manner as in Example 1, and then zinc oxide is formed on the amorphous silicon layer by a known sputtering method. A layer was formed. Further, an A1 layer was formed thereon as a back electrode in the same manner as in Example 1 to produce a solar cell, and the same evaluation as in Example 1 was performed. Table 1 shows the results.
- the visible light reflectivity (reflectance for light rays incident from the surface on which the reflection reducing film is formed) of the glass plate on which the porous silicon oxide layer (reflection reducing film) is formed is 5.5%, and the reflection is reduced.
- the reflectance was reduced by about 3.6% as compared with before the film was formed.
- the visible light reflectance was measured with a spectrophotometer.
- Example 32 a mixed oxidized film of titanium oxide and silicon oxide having a refractive index of 1.70 and a thickness of 120 nm was first formed on a glass surface by a known sol-gel method.
- an amorphous silicon layer is formed on the surface of the glass plate on which the transparent conductive film is formed in the same manner as in Example 1, and then a known sputtering method is formed on the amorphous silicon layer.
- a zinc oxide layer was formed.
- an A1 layer was formed thereon as a back electrode in the same manner as in Example 1 to produce a solar cell, and the same evaluation as in Example 1 was performed. Table 1 shows the results.
- a transparent thin film made of titanium oxide was formed on a glass plate using a mixed gas consisting of titanium isopropoxide and the like. Perform the subsequent steps In the same process as that after the formation of the silicon oxide film in Example 3, slowly cooled, taken out, and reheated at 600 ° C., and then oxidized on the titanium oxide film using a mixed gas such as vapor of monobutyltin trichloride. A transparent conductive film made of dani tin was formed. The film thicknesses of titanium oxide and tin oxide were adjusted so that the concentration of each raw material became each film thickness.
- Example 3 Using a glass plate of the same dimensions and the same material as in Example 3, a coating made of silicon oxide was formed on the glass plate in the same manner and using a mixed gas consisting of monosilane, oxygen and nitrogen. Subsequent steps are the same as those in Comparative Examples 1 and 2, using a mixed gas of titanium isopropoxide and the like, forming a film of titanium oxide on the silicon oxide film, and forming a two-layer transparent film. A thin film was formed. Thereafter, the glass plate is gradually cooled, taken out, and reheated at 600 ° C., and then mixed with a gaseous mixture of monobutyltin trichloride and the like. A transparent conductive film was formed. Next, an amorphous silicon solar cell was prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Table 1 shows the results.
- Example 3 Using a glass plate of the same dimensions and the same material as in Example 3, a film mainly composed of silicon oxide was formed on the glass plate in the same manner and using a mixed gas consisting of monosilane, ethylene, oxygen and nitrogen. .
- the subsequent steps are the same as those in Comparative Examples 1 and 2, except that a mixed gas made of titanium isopropoxide or the like is used to form a film made of titanium oxide on the silicon oxide film, and a two-layer transparent film is formed. A thin film was formed.
- the glass plate is gradually cooled, taken out, and reheated at 600 ° C., and then, using a mixed gas of monobutyltin trichloride vapor or the like, a transparent conductive material of tin oxide is formed on the titanium oxide film. A film was formed.
- Example 8 a mixed gas consisting of monobutyltin trichloride vapor or the like was used. This was used to form Ji Mo on a glass plate. Subsequent steps are the same as those of Comparative Examples 1 and 2, using a mixed gas consisting of titanium isopropoxide and the like, forming a titanium oxide film on the tin oxide film, and forming a two-layer transparent thin film. did. Thereafter, the glass plate was gradually cooled, taken out, reheated at 600 ° C., and then mixed with a gaseous mixture of monobutyltin trichloride vapor and the like to form a film on the titanium oxide film. A transparent conductive film was formed.
- Example 3 Using a glass plate of the same dimensions and the same material as in Example 3, and using a mixed gas consisting of monobutyltin trichloride vapor, oxygen, water vapor and nitrogen in the same manner, was formed. Subsequent steps were the same as in Example 3, using a mixed gas of monosilane to form a film made of silicon oxide, thereby forming a two-layer transparent thin film. Next, the glass plate was gradually cooled, taken out, and reheated at 600 ° C., and then a mixed gas comprising monobutyltin trichloride vapor, oxygen, nitrogen and a small amount of water vapor was applied onto the silicon oxide film. Then, a transparent conductive film made of tin oxide was formed.
- Example 3 Using a glass plate of the same dimensions and the same material as in Example 3, in a similar manner, using a mixed gas consisting of monobutyltin trichloride vapor, oxygen, water vapor, nitrogen and trifluoroacetic acid, Only a transparent conductive film made of Dani Tin was formed. Next, an amorphous silicon solar cell was prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. Table 1 shows the results. Reflection color unevenness was observed at several places, and the reflection color was reddish.
- the red color means L * a * b * color system chromaticity exponents a * and b * specified in JISZ8729-19080, respectively, +5 ⁇ a *, One is represented by 1 0 ⁇ b * ku + 3.
- Examples 1 to 15 and 25 to 36 almost no recognizable reflection color unevenness was recognized, but in Comparative Examples 1 to 7, all samples of 4300 mm square 1 were used. In the sheet, reflection color unevenness at several places was observed.
- Example 3 In the same manner as in Example 3, a transparent thin film made of silicon oxide was formed, and a transparent conductive film made of tin oxide was formed thereon.
- Example 2 An amorphous silicon solar cell was prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. The results are shown in Table 2. The reflected color was achromatic.
- Example 15 As in Example 15, a transparent thin film made of titanium oxide was formed, and a transparent conductive film made of tin oxide was formed thereon.
- Example 2 An amorphous silicon solar cell was prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. The results are shown in Table 2, and the reflected color was at least one of achromatic and green.
- Example 8 In the same manner as in Example 8, a coating composed of tin oxide was formed, a coating composed of silicon oxide was formed thereon, a transparent thin film composed of two layers was formed, and a transparent thin film composed of tin oxide was further formed thereon. A transparent conductive film was formed. The thicknesses of tin oxide and silicon oxide were adjusted so that the concentration of each raw material would be Ji-thick.
- Example 2 An amorphous silicon solar cell was prepared in the same manner as in Example 1, and the same evaluation as in Example 1 was performed. The results are shown in Table 2, and the reflected colors were all achromatic.
- Example 2 In the same manner as in Example 1, a film made of tin oxide was formed, and a film made of silicon oxide was formed thereon, thereby forming a two-layer transparent thin film. Further, a transparent conductive film made of tin oxide was formed thereon. The film thicknesses of the oxidized tin and the oxidized silicon were adjusted so that the concentrations of the respective raw materials became the respective film thicknesses.
- First layer Second layer Sn0 2 a-Si Reflection of reflection color Refractive index film Refractive film thickness Film thickness range Film thickness Variation range Color unevenness (nm) Dir (nm) (ran) (nm) a * b *
- Example 1 Si 1.65 50 550 '650 350 ⁇ 3.5 ⁇ 2.0 None
- Example 2 Si 1.65 75 540' 660 350 ⁇ 2.5 ⁇ 2.0 None
- Example 3 Si 1.46 25 650 '750 350 ⁇ 2.5 ⁇ 2.5 None
- Example 4 A1 1.79 30 650- 750 350 ⁇ 3.5 ⁇ 2.0 None
- Example 5 A1 1.79 50 540 '660 350 ⁇ 3.5 ⁇ 1.5 None
- Example 6 Sn 2.02 25 Si 1.65 25 540' 660 350 ⁇ 3.0 ⁇ 2.0 None
- Example 7 Sn 2.02 25 Si 1.65 50 540 '660 350 ⁇ 2.5 ⁇ 3.5 None
- Example 8 Sn 2.02 25 Si 1.46 25 540' 660 350 ⁇ 2.0 ⁇ 3.0 None
- Example 9 Ti 2.37 15 Si 1.65 25 540 '660 350 ⁇ 4.0 ⁇ 4.0 None
- Example 10 Ti 2.37 15 Si 1.46 25 540 to 660 350 ⁇ 3.0 ⁇ 4.0 None
- Example 11 Ti 2.37 15 Al 1.79
- Si Ti Sn under the metal oxide in Table 2 represents silicon oxide, titanium oxide, and tin oxide, respectively.
- Example 1 0.02 0.07 Example 24 0.03 0.08 Example 2 0.03 0.06 Example 25 0.01 0.04 Example 3 0.03 0.09 Example 26 0.01 0.05 Example 4 0.03 0.08 Example 27 0.01 0.05 Example 5 0.02 0.07 Example 28 0.02 0.08 Example 6 0.04 0.08 Example 29 0.02 0.07 Example 7 0.03 0.07 Example 30 0.02 0.08 Example 8 0.02 0.07 Example 31 0.02 0.07 Example 9 0.03 0.08 Example 32 0.02 0.06 Example 10 0.02 0.06 Example 33 0.02 0.04 Example 11 0.07 0.09 Example 34 0.02 0.04 Example 12 0.03 0.06 Example 35 0.05 0.07 Example 13 0.09 0.11 Example 36 0.04 0.06 Example 14 0.02 0.05 Example 37 0.02 0.07 Example 15 0.03 0.07 Example 38 0.03 0.07 Example 16 0.04 0.08 Example 39 0.03 0.07 Example 17 0.03 0.07 Comparative example 1 0.08 0.10 Example 18 0.04 0.08 Comparative example 2 0.03 0.08 Example 19 0.03 0.07 Comparative Example 3 0.03 0.07 Example 1 0.02 0.07 Example 24 0.03 0.08 Example 2 0.03 0.08 Example 19
- the reflection color unevenness is small even in the large area for the roof or wall surface of a house, or the reflection color is an achromatic color or a green color system, which is different from the normal color of red to magenta.
- An amorphous silicon solar cell can be provided at low cost.
Description
Claims
Priority Applications (3)
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EP99940496A EP1115160A4 (en) | 1998-08-26 | 1999-08-26 | PHOTOVOLTAIC DEVICE |
CA002341629A CA2341629A1 (en) | 1998-08-26 | 1999-08-26 | Photovoltaic device |
US09/791,843 US6395973B2 (en) | 1998-08-26 | 2001-02-23 | Photovoltaic device |
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JP23969998 | 1998-08-26 | ||
JP10/239699 | 1998-08-26 |
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US09/791,843 Continuation US6395973B2 (en) | 1998-08-26 | 2001-02-23 | Photovoltaic device |
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WO2000013237A1 true WO2000013237A1 (fr) | 2000-03-09 |
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US (1) | US6395973B2 (ja) |
EP (1) | EP1115160A4 (ja) |
CA (1) | CA2341629A1 (ja) |
WO (1) | WO2000013237A1 (ja) |
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- 1999-08-26 EP EP99940496A patent/EP1115160A4/en not_active Withdrawn
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WO2010097972A1 (ja) | 2009-02-27 | 2010-09-02 | 三菱重工業株式会社 | 薄膜検査装置及びその方法 |
JP2012146873A (ja) * | 2011-01-13 | 2012-08-02 | Ulvac Japan Ltd | 太陽電池、太陽電池用透明導電膜付き基板及びそれらの製造方法 |
JP2013012705A (ja) * | 2011-06-01 | 2013-01-17 | Sumco Corp | 太陽電池用ウェーハ、太陽電池セルおよび太陽電池モジュール |
JP2016517630A (ja) * | 2013-03-12 | 2016-06-16 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドPPG Industries Ohio,Inc. | 選択的にドープされた導電性酸化物層を有する太陽電池およびそれを作製する方法 |
Also Published As
Publication number | Publication date |
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CA2341629A1 (en) | 2000-03-09 |
US20010013361A1 (en) | 2001-08-16 |
US6395973B2 (en) | 2002-05-28 |
EP1115160A4 (en) | 2006-01-04 |
EP1115160A1 (en) | 2001-07-11 |
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