WO2000022814A3 - Image sensor mounted by mass reflow - Google Patents

Image sensor mounted by mass reflow Download PDF

Info

Publication number
WO2000022814A3
WO2000022814A3 PCT/US1999/023771 US9923771W WO0022814A3 WO 2000022814 A3 WO2000022814 A3 WO 2000022814A3 US 9923771 W US9923771 W US 9923771W WO 0022814 A3 WO0022814 A3 WO 0022814A3
Authority
WO
WIPO (PCT)
Prior art keywords
image sensor
mass reflow
sensor mounted
imaging system
reflow process
Prior art date
Application number
PCT/US1999/023771
Other languages
French (fr)
Other versions
WO2000022814A2 (en
WO2000022814A9 (en
Inventor
Kabul S Sengupta
Azar Assadi
Alan B Alley
Robert C Sundahl
Original Assignee
Intel Corp
Kabul S Sengupta
Azar Assadi
Alan B Alley
Robert C Sundahl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Kabul S Sengupta, Azar Assadi, Alan B Alley, Robert C Sundahl filed Critical Intel Corp
Priority to AU14449/00A priority Critical patent/AU1444900A/en
Priority to DE69933040T priority patent/DE69933040T2/en
Priority to EP99970538A priority patent/EP1121799B1/en
Priority to JP2000576612A priority patent/JP5201770B2/en
Publication of WO2000022814A2 publication Critical patent/WO2000022814A2/en
Publication of WO2000022814A3 publication Critical patent/WO2000022814A3/en
Publication of WO2000022814A9 publication Critical patent/WO2000022814A9/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]

Abstract

An imaging system (400) includes an image sensor (410) that is attached to a circuit board via a mass reflow process. The image sensor (410) captures image data and provides the image data at an output of the imaging system (400). In one embodiment, the image sensor (410) uses a color filter array (CFA) material that is substantially stable through the mass reflow process.
PCT/US1999/023771 1998-10-13 1999-10-11 Image sensor mounted by mass reflow WO2000022814A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU14449/00A AU1444900A (en) 1998-10-13 1999-10-11 Image sensor mounted by mass reflow
DE69933040T DE69933040T2 (en) 1998-10-13 1999-10-11 MASS FLUID MOUNTED PICTOR SENSOR
EP99970538A EP1121799B1 (en) 1998-10-13 1999-10-11 Image sensor mounted by mass reflow
JP2000576612A JP5201770B2 (en) 1998-10-13 1999-10-11 Image sensor implemented by batch reflow

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/172,734 US6753922B1 (en) 1998-10-13 1998-10-13 Image sensor mounted by mass reflow
US09/172,734 1998-10-13

Publications (3)

Publication Number Publication Date
WO2000022814A2 WO2000022814A2 (en) 2000-04-20
WO2000022814A3 true WO2000022814A3 (en) 2000-08-03
WO2000022814A9 WO2000022814A9 (en) 2000-09-21

Family

ID=22628985

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/023771 WO2000022814A2 (en) 1998-10-13 1999-10-11 Image sensor mounted by mass reflow

Country Status (9)

Country Link
US (5) US6753922B1 (en)
EP (1) EP1121799B1 (en)
JP (1) JP5201770B2 (en)
KR (1) KR100527897B1 (en)
AU (1) AU1444900A (en)
DE (1) DE69933040T2 (en)
MY (1) MY118657A (en)
TW (1) TW454411B (en)
WO (1) WO2000022814A2 (en)

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Also Published As

Publication number Publication date
US20040159902A1 (en) 2004-08-19
US6072232A (en) 2000-06-06
US7223631B2 (en) 2007-05-29
AU1444900A (en) 2000-05-01
KR100527897B1 (en) 2005-11-15
WO2000022814A2 (en) 2000-04-20
DE69933040T2 (en) 2007-03-01
EP1121799A4 (en) 2004-08-04
EP1121799A2 (en) 2001-08-08
US6753922B1 (en) 2004-06-22
MY118657A (en) 2004-12-31
TW454411B (en) 2001-09-11
JP5201770B2 (en) 2013-06-05
EP1121799B1 (en) 2006-08-30
US6692993B2 (en) 2004-02-17
DE69933040D1 (en) 2006-10-12
JP2002527912A (en) 2002-08-27
US20020125552A1 (en) 2002-09-12
WO2000022814A9 (en) 2000-09-21
KR20010080129A (en) 2001-08-22
US7026707B2 (en) 2006-04-11
US20060141674A1 (en) 2006-06-29

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