WO2000027159A9 - Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited system - Google Patents
Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited systemInfo
- Publication number
- WO2000027159A9 WO2000027159A9 PCT/US1999/026077 US9926077W WO0027159A9 WO 2000027159 A9 WO2000027159 A9 WO 2000027159A9 US 9926077 W US9926077 W US 9926077W WO 0027159 A9 WO0027159 A9 WO 0027159A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wireless unit
- msc
- verification
- wireless
- response
- Prior art date
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W8/00—Network data management
- H04W8/02—Processing of mobility data, e.g. registration information at HLR [Home Location Register] or VLR [Visitor Location Register]; Transfer of mobility data, e.g. between HLR, VLR or external networks
- H04W8/08—Mobility data transfer
- H04W8/12—Mobility data transfer between location registers or mobility servers
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H04W12/12—Detection or prevention of fraud
- H04W12/126—Anti-theft arrangements, e.g. protection against subscriber identity module [SIM] cloning
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- H04W8/02—Processing of mobility data, e.g. registration information at HLR [Home Location Register] or VLR [Visitor Location Register]; Transfer of mobility data, e.g. between HLR, VLR or external networks
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Definitions
- wireless communications are communications that are transmitted through the use of radio frequency (RF) technology.
- Wireless communications include communications that are transmitted through the use of wireless units such as cellular telephones, mobile telephones, car phones, personal communication service (PCS) units, pagers, and the like.
- communication is used herein to refer to any call, message, announcement or other exchange of data or information, whether analog or digital, that may be received on a wireless unit or transmitted from a wireless unit, and/or may be received or transmitted from a wireless unit that is operating as part of any other device such as a computer, or the like.
- the base station Upon receipt of a communication from a wireless unit of a user, the base station transmits the communication to a mobile switching center (MSC) (sometimes referred to as a mobile-service switching center or mobile telecommunications switching office (MTSO)).
- MSC mobile switching center
- MTSO mobile telecommunications switching office
- the MSC further routes the communication as appropriate. This routing may take the communication to and through the PSTN, to and through the same wireless communications system, to and through another wireless communications system, to and through another type of communications system, or combinations thereof.
- a subscriber may receive a communication on his or her wireless unit from a caller.
- the caller directs his or her communication to the number associated with the subscriber's wireless unit, which is referred to herein as the mobile number (MN) of the wireless unit.
- the mobile number may be the mobile identification number (MIN) of the wireless unit.
- the communication is routed through the PSTN, through other networks, and/or wireless communications systems until the communication reaches the MSC serving the subscriber's wireless unit.
- This MSC may be referred to as the serving MSC or the serving switch.
- the serving MSC then further routes the communication to the wireless unit.
- a wireless unit is particularly useful when a subscriber is on the move such as when the subscriber is driving a car.
- the subscriber's mobility may take the subscriber out of the service area served by the service provider from whom the subscriber subscribes.
- the subscriber's mobility may take the subscriber out of his or her home service area served by his or her home service provider or home carrier.
- the subscriber may move so as to be located in another service area that is served by a different service provider with whom the subscriber has no business relationship.
- the subscriber is said to be "roaming" out of his or her home service area and may be referred to as a "roamer", "roaming subscriber” in a visited service area that is served by a visited system.
- service providers have agreed to follow certain procedures in the processing of communications with respect to each other's subscribers.
- a roaming subscriber is validated and may be authenticated by the visited system, which also may be referred to as the visited service provider. Both of these processes (validation and authentication) are used to prevent fraudulent use of wireless units and for other reasons. General descriptions of these processes and other information about wireless communications systems may be found in the book entitled Cellular and PCS - The Big Picture by Lawrence Harte, Steve Prokup and Richard Levine (McGraw-Hill 1997).
- the visited system serving that visited service area attempts to find the wireless unit's identification (also referred to as registration information) in the visitor location register (NLR) of an appropriate MSC in the visited system (MSC-N). If the visited system does not find the identification, then the wireless unit is determined to be not registered with the visited system. Prior to being provided with communications service in the visited system, a wireless unit typically needs to be registered in the visited system.
- the MSC-N To register the wireless unit in the visited system, the MSC-N takes certain actions. Using the wireless unit's identification (which generally may include its mobile number, and electronic serial number (ES ⁇ ), and/or mobile identification number (MI ⁇ )), the visited system sends a message to the wireless communications system ("home system") which generally provides wireless communications service to the subscriber. The message from the visited system to the home system is a message requesting validation of the visiting wireless unit.
- the home system typically checks a home location register (HLR) in an appropriate MSC (MSC-H) of its system, and compares the identification regarding the wireless unit to determine if the wireless unit is valid.
- HLR home location register
- the HLR of the home MSC responds to the serving MSC in the visited system that the validation was successful or positive.
- the HLR in the home system generally keeps track of the information about the location of its subscriber in a visited system for use in the future routing of calls, etc.
- the serving MSC in the visited system After the serving MSC in the visited system receives confirmation that the visiting wireless unit is valid, the communication initiated by the visiting wireless unit is processed.
- the NLR of the serving MSC may then temporarily store the visiting wireless unit's information to validate the identity of the wireless unit itself rather than requesting validation from the home system again for the next call from that wireless unit.
- One of the drawbacks of the above-described validation processes is that typically the validation processes cannot detect illegally cloned wireless units or other fraudulent uses of a wireless unit.
- a process generally referred to as "authentication" of a wireless unit has been used.
- Authentication is the exchange and processing of information to confirm a wireless unit's identity and association with a particular subscriber.
- the visited system searches for the wireless unit's identification in its NLR and determines that the wireless unit is not registered.
- the visited system uses the wireless unit's identification (or other information such as authentication information obtained from the wireless unit) to request authentication of identity from the subscriber's home system.
- the request for authentication may be separate or may be combined with the request for validation.
- the home system may check an HLR in an appropriate MSC-H of its system and compare the wireless unit's identification or authentication information to stored information to determine if the wireless unit is authentic.
- the home system or the visited system may check with an authentication center (AC) to determine if the wireless unit is authentic.
- An authentication center may be an entity of either the home or visited system, or a separate entity.
- an authentication center maintains a database, tables, or the like with respect to the identities of wireless units that are served by the AC.
- the AC compares the identification and/or authentication information which has been provided to the AC with respect to a particular wireless unit, and determines whether the particular wireless unit is authentic based on the comparison.
- the wireless unit is determined to be authentic (whether by the visited system, home system, and/or an AC), then this information is provided to the visited system.
- the visited system may store for a period of time authentication information relating to the wireless unit in a NLR of an appropriate MSC-N. The visited system then may use this stored authentication information rather than contact the home system and/or an AC again. If the wireless unit is validated and determined to be authentic, then the visited system generally provides communications service to the wireless unit.
- the present inventions include methods, systems, and apparatus that substantially prevent the fraudulent use of wireless units roaming in visited systems.
- a visited mobile switching center (MSC-N) carries out a registration of a wireless unit that is roaming in the visited system. After successful registration, the MSC-N implements at least the denial of originating communication service to the wireless unit. In other words, the wireless unit is allowed to receive calls, but is not allowed to make calls.
- the present inventions substantially prevent the fraudulent use of wireless units roaming in visited systems by requiring such units to undergo a verification or authentication process prior to being allowed to make calls.
- Fig. 3 is a block diagram illustrating an exemplary international gateway.
- the present inventions include methods, systems, and apparatus that substantially prevent the fraudulent use of wireless units roaming in a visited wireless communications system.
- Exemplary embodiments of the present inventions describe the international gateway as a stand-alone unit such as may be embodied by or in a service control point (SCP). But the reader is cautioned the international gateway should not be so limited in embodiment.
- the international gateway may be incorporated in or as part of another device such as an intelligent peripheral (IP) in a wireless communications system, a network element, a verification element, or in other devices.
- IP intelligent peripheral
- the international gateway also may be referred to herein as a personal identification (PIN) validation platform, or verification or authentication element.
- the international gateway may be considered a series of functions or actions that may be carried out in a single device or that may be carried out through the use of several devices.
- customers of the service provider of the international gateway also include carriers who provide wireless service to subscribers and who desire to facilitate the provision of wireless service to such subscribers when they are roaming, and particularly roaming in foreign countries or systems.
- a customer may enable its subscribers to change their respective personal identification numbers (PINs) used in the authentication or verification processes described herein.
- PINs personal identification numbers
- FIG. 1 An Exemplary International Gateway in an Exemplary Environment
- Fig. 2 - An Exemplary Method Fig. 2 is a flow diagram illustrating an exemplary method to substantially prevent fraudulent use of a wireless unit roaming in a visited system.
- a wireless unit must be registered, and if the wireless unit is located in a visited system, then the wireless unit must be registered with that visited system.
- the exemplary method of Fig. 2 assumes the wireless unit is registered in the visited system, and further assumes, the wireless unit is blocked in some manner from at least making calls.
- the MSC-V of the wireless unit has implemented a denial of originating service to the wireless unit.
- the roamer uses his or her wireless unit to dial a code, and the code may be followed by identification information such as the roamer's PIN.
- the code may be provided by the MSC-V when the roamer initiates a call, or the code may be provided for use by the roamer when the roamer sets up his or her service agreement with the service provider.
- the code also may be provided in other ways such as through a customer service bureau, etc.
- the identification information for a particular user may be obtained by the user generally in the same way as the code is provided to the user, or in other ways.
- the identification information includes a four digit PIN with the four digits initially being the first four digits of the last name of the subscriber.
- the instructions or programming included in the MSC- V for use when the MSC-V receives a call to code may provide the MSC-V with an association between the FEAT REQ message and a point code for a verification entity or network element such as an international gateway that is to be used in the authentication process.
- the verification entity is not the home system nor the MSC-H of the wireless unit.
- the routing of the FEAT REQ message need not be made to the home system or the MSC-H, but instead, is made to the verification entity.
- the verification entity not being the home system nor the MSC-H of the wireless unit, the authentication or verification of the wireless unit may be quickly obtained from a centralized device such as the verification entity which may include authentication or verification information for many wireless unit.
- the serving MSC (the MSC-V) need not spend time and effort in tracking down the home system or MSC-H of the wireless unit to obtain authentication or verification information.
- the international gateway 10 generates a QualificationDirective message to the MSC-V after a successful authentication or verification process for a wireless unit.
- the purpose of this message is to remove the denial of service (such as originating service) that was set when the wireless unit registered.
- Table III provides the parameters to be included in the QualificationDirective message to the MSC-V:
- the MSC-V In response to the QualificationDirective message, the MSC-V returns a return result for the QualificationDirective message, which informs the international gateway 10 the QualificationDirective message has been accepted.
- the MSC-V receives the code response and updates its VLR as appropriate. If the code including the identification information such as the PIN check-out, and if a denial of service is in place, then the MSC-V removes the denial of service.
- the MSC-V 24 also may update its VLR 26 or other databases with respect to the other information related to the wireless unit 20.
- the MSC-V may provide the roamer with notice of approval or authentication.
- a roamer may be provided with three tones to indicate the wireless unit has been authenticated or verified.
- the code including the identification information such as the PIN does not check out, then the MSC-V does not take any action to allow use of the wireless unit.
- the MSC-V may provide the roamer with notice of the lack of authentication.
- the exemplary method ends.
- Some embodiments of the present inventions allow a user multiple tries or a period of time with respect to authentication or verification of the wireless unit. For example, a user may try to dial a code + identification up to as many as three times in order to obtain originating service for the wireless unit. As another example, a user may repeat the dialing of a code + identification as many times as possible during a period of time. If the user is unsuccessful during that period of time, the wireless unit cannot then be authenticated for at least some period of time.
- the limitations on the number and time of authentication or verification attempts are yet another fraud prevention feature of some of the embodiments of the present invention.
- the roamer may attempt to make a call from country B.
- the service provider is well served by the exemplary method because it reduces the fraudulent use of wireless units.
- a roamer is only allowed to make a call in a visited system, if the roamer successfully passes the registration, validation, and the authentication processes.
- Exemplary embodiments of the present inventions include other fraud preventive features.
- the wireless units operating with any of the embodiments may be provisioned so as to be locked by the user.
- a user may enter a code (i.e., *PIN## or *IRP##) to lock the wireless unit.
- This locking may completely disable the wireless unit.
- this locking may require that the wireless unit be processed so as to include a validation process and/or an authentication process prior to provision of originating service to the unit.
- Another fraud feature is referred to herein as an authorization period.
- the response (or the QualificationDirective message) received from the international gateway by the MSC-V 24 also may include an instruction to the MSC-V 24 with respect to an authorization or authentication period.
- a wireless unit 20 may be registered and/or authenticated with an MSC-V 24 only for a limited amount of time (i.e., an authorization or authentication period) so as to minimize the possibility that the wireless unit 20 may be fraudulently used.
- the international gateway 10 may keep track of the authorization or authentication period with respect to the wireless unit 20. When the authorization or authentication period has expired, the international gateway 10 may send an MSInactive (Invoke Last) message to the MSC-V 24.
- Fig. 3 illustrates elements of an exemplary international gateway 10 such as may be used in the exchange of messages and responses between a visited system and a home system and between a visited system and the international gateway functioning as an authentication or verification entity.
- the international gateway 10 generally includes an interface 73 and a translator 74.
- the interface 73 functions as a connection to the communications systems (and elements thereof) which the international gateway serves.
- An exemplary international gateway 10 has an interface 73 that includes SS7 links 75 that receive the messages and responses, and that pass the messages and responses to an SS7 stack 76.
- the SS7 stack 76 discriminates and passes the messages and responses to an IS- 41 message handler such as provided by the IntelliSS7-IS41 MAP 77, which is a mapping software.
- the SS7 stack 76 passes the data of the IS-41 messages and responses to a parsing library where the message is decoded according to IS-41 standards.
- the message type, components, and parameters are located in the received messages and responses and stored, (or a pointer stored) in structures which can be then accessed directly.
- the data then is passed to the translator 74 carrying out the appropriate operations.
- An exemplary international gateway 10 has a translator 74 that includes a state machine based application 78, which controls or manages each session.
- the translator 74 may include a database access part 79 and a database 80 that may contain the table 32 that is used in determining the routing for a registration message received with respect to a particular wireless unit. More information about the database 80 and the information that may be stored in the database 80 or other memory structure is provided below under the heading "Information With Respect to the International Gateway".
- the translator 74 may include a messaging and process infrastructure 41. This infrastructure 41 provides services such as message buffering, message passing, timers, task management, etc.
- the international gateway 10 also typically includes at least a connection to an administrative console 82. Information regarding a customer and/or a user may be provisioned in the international gateway 10 through the administrative console 82.
- a service manager may use the administrative console 82 to monitor transactions or view transactions in the transaction log by transaction number or by MIN/ESN. Other statistical information relating to the operation of the international gateway 10 may be obtained or viewed through the administrative console 82.
- the international gateway 10 may include an application interface to a network manager that may be accessed and/or operated through the administrative console 82 or through other elements.
- the network manager may be an Openview Network Manager available from Hewlett Packard.
- the application interface may be based on a simple network management protocol (SNMP) to generate traps and alarms to the network manager. Traps may include unknown message or response received and/or PIN modification retries failure.
- SNMP simple network management protocol
- the international gateway 10 functions in accordance with Signaling System 7 (SS7) protocols as well as EIA TIA IS-41 protocols, and thus, may be accessed through the connectivity between and among network elements of wireless communications systems and/or wireline communications systems.
- the international gateway 10 supports the American National Standards Institute (ANSI), International Telecommunications Union (ITU) and ITU International variants of the SS7 protocol up to the transaction capabilities application part (TCAP) layer.
- ANSI American National Standards Institute
- ITU International Telecommunications Union
- TCAP transaction capabilities application part
- the components of the international gateway 10 communicate among themselves and other data networks via TCP/IP connections.
- the connectivity preferably supports Tl/El and V.35 at speeds of up to 64 Kbps. It is further preferred that the international gateway 10 generally does not use the Global Title Translation (GTT) in addressing entities or elements in the systems.
- GTT Global Title Translation
- the international gateway 10 is set up and continually updated with current information as to users, customers, MSC information, etc. so as to facilitate the exchange of messages and responses between a visited system and a home system of a wireless unit and between a visited system and the international gateway acting as an authentication or verification entity with respect to a wireless unit.
- the international gateway 10 operates pursuant to IS-41 specifications. For example, the international gateway 10 starts a timer to time the interval between routing a new message and receiving a response to the new message. If appropriate, the international gateway 10 handles a timeout on the response. The international gateway 10 responds with error messages in the appropriate situations.
- the international gateway 10 responds with a Return Error with an error code of OperationNotSupported if the international gateway 10 receives a message for call delivery to a wireless unit that has not registered, that is outside its authorization period, etc.
- Error codes may include SystemFailure, ParameterError, UnrecognizedParameterValue; MIN/HLRMismatch, UnrecognizedESN, Operation Sequence Problem, and/or ResourceShortage.
- the international gateway 10 may include the table 32 and/or database 80 as well as other memory or storage facilities with respect to the information that is necessary or available with respect to operation of the international gateway 10.
- the table 32 or database 80 may include entries or records related to users. Each entry or record may include the following information or a field (which may be empty until filled) for the following information with respect to the user or the wireless unit of the user: a mobile identification number (MIN); an electronic serial number (ESN); a user or subscriber name; a personal identification number (PIN); a date-time of last PIN change; a number of retries for PIN change in current interval; an MSC-H; a current
- MSC-V MSC-V
- a previous MSC-V a date-time of last successful PIN validation; a number of retries for PIN validation in current interval; a date-time of last Registration Notification; OCOS information returned by the MSC-H; TCOS information returned by the MSC-H; a temporary local dialing number (TLDN); user or subscriber status; calling features mask; carrier digits; billing identification; destination digits; and/or a date-time of first unsuccessful validation attempts in current interval.
- TLDN temporary local dialing number
- the user or subscriber information may be provisioned in the international gateway 10 through the administrative console 82 or in batch mode through bulk updates transferred from customers.
- the international gateway 10 may store system information with respect to the international gateway 10 in the database 80 or in another storage structure.
- the following system configuration information may be stored: a system type code; a point code; a subsystem number (SSN); and/or a carrier identification code.
- the system configuration information may include information relating to the use of PINs such as the maximum number of retries and the retry interval.
- the international gateway may store a point code and a SSN for each of the mobile switching centers (MSCs) or other switches which may serve as either origination or destination points with respect to messages and responses that may be sent to and from the international gateway 10.
- MSCs mobile switching centers
- the international gateway 10 generally carries out transaction and tracing functions with respect to the messages and responses that may be sent to and from the international gateway 10.
- a message and its corresponding response generally is referred to as a transaction, and the message and its corresponding response typically includes a transaction number or other identification of the transaction.
- the international gateway 10 logs the transaction number into a transaction log (not illustrated), which also may be referred to as log files or into the database 80.
- the log of the transaction includes a timestamp for the transaction.
- the international gateway 10 may include a tracing mechanism (not illustrated in Fig. 3) and may include four levels of trace messages with each level providing a different amount of detailed information.
- the international gateway 10 may include audit trails for all changes made to the database, such as changing a PIN, etc. These audit trails may be recorded and stored.
- MSC Information To facilitate the exchange of messages and responses, the international gateway 10 may store information such as attributes with respect to mobile switching centers (MSCs) which are involved in transactions related to a wireless unit.
- These attributes may include: an MSC identification; a location; a point code; a subsystem number (SSN); an HLR identification (null if co-located with the MSC); an HLR point code; an HLR SSN; a VLR identification (null if co-located with the MSC); a VLR point code; a VLR subsystem number (SSN); an authentication center (AC) identification; an AC point code; and/or an AC SSN.
- This information may be stored in the database 80 or in some other memory structure.
- An exemplary embodiment of the international gateway 80 stores this information in a functional entity messaging relationship table (FEMR table).
- the international gateway 10 may include a table or other structure that sets forth a relationship including operating or override values between mobile switching centers (MSCs) in a home-visited relationship.
- This table may be used by the international gateway 10 to override values that are present in the user or subscriber entry or record when appropriate.
- the visited MSC may be located in a high fraud area.
- an authorization period with respect to the registration, authentication, or provision of communications service to a wireless unit may be instituted through the provision of instructions from the MSC-H or the international gateway to the MSC-V or otherwise.
- this table may include the following attributes, information or fields: MSC-H identification; MSC-V identification; authorization period; and/or authorization value.
- the international gateway 10 may have to determine the MSC-H of a particular wireless unit based on the information that is provided to the international gateway 10 by the MSC-V.
- the international gateway 10 uses the MIN of the wireless unit to find the MSC-H (and its point code) by using an MSC-NPA information table.
- the MIN may be compared to the entries of NPA-NXX-x blocks that are stored in the table to determine the NPA-NXX-x block corresponding to the MIN, and then to determine the MSC-H (and its point code) serving the NPA-NXX-x block corresponding to the MIN.
- an entry in the MSC-NPA information table may include the following fields, attributes or information: MSC-H identification; and NPA- NXX-x block (being served by the MSC-H of the entry).
- Fig. 4 Logical Software Entities of an Exemplary International Gateway
- Fig. 4 presents a diagram of logical software entities or modules of such a gateway.
- the modules are presented in the diagram from a logical standpoint. They do not represent separate processes that run the international gateway 10, but rather, each module presents a functionality that may be used in the gateway.
- the modules include INIT 86 which is an initialization function that brings up and monitors the application processes on the international gateway 10.
- DB 88 is a database interface in the form of a functional application program interface (API) for interaction with a user.
- API application program interface
- DB 88 also includes the database server part that is provided by the vendor of the database.
- TM 90 is a transaction manager which registers with the SS7 processes to gain access to the SS7 stack. The transaction manager 90 receives and sends IS-41 messages and responses through the SS7 processes. The transaction manager 90 links with the DB 88 in order to use the database server.
- Log 92 is a library that provides a functional API to record every IS-41 message and response that is sent and received. This API is used to record all of the IS-41 messages and responses that pass through the international gateway 10.
- Trace 94 is a library that provides debugging aids for integration and testing.
- SNMP Agent 96 is a process that forwards simple network management protocol (SNMP) traps to the network manager such as the Openview Network Manager from Hewlett Packard. This SNMP Agent 96 also provides a message queue for the other application software entities to send event/alarm information, which is converted to a trap and forwarded as appropriate.
- SNMP simple network management protocol
- Vision Feed 100 is a process that provides a continuous feed of all IS-41 messages and responses being sent and received by the international gateway 10 to a separate entity for further processing (billing, debugging, network problems, etc.).
- IS-41 API & Vendor's SS7 102 stack is an IS-41 API built on top of the SS7 stack. The SS7 stack functionality is handled within separate processes, i.e., they are not libraries. The IS-41 API is incorporated in these separate processes.
- DIR 104 is a platform configuration task called the Director. It provides a command line interface for configuring the SS7 stack and all network parameters associated with setting up the international gateway 10 as a functional network entity. The DIR 104 also can be used to control the SS7 stack processes.
- the present inventions include methods, systems, and apparatus that substantially prevent the fraudulent use of wireless units roaming in visited systems. After successful registration of a wireless unit in a visited system, the visited system implements at least the denial of originating communication service to the wireless unit.
- the present inventions substantially prevent the fraudulent use of wireless units roaming in visited systems by requiring such units to undergo a verification or authentication process prior to being allowed to make calls.
- a roamer is only allowed to make a call in a visited system, if the roamer successfully passes the registration, validation, and the authentication processes.
- the exemplary embodiments also may include additional anti-fraud features such as the limitation of an authentication or verification period for the provision of communications service to the wireless unit in the visited system.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU16073/00A AU1607300A (en) | 1998-11-05 | 1999-11-05 | Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10722498P | 1998-11-05 | 1998-11-05 | |
US60/107,224 | 1998-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000027159A1 WO2000027159A1 (en) | 2000-05-11 |
WO2000027159A9 true WO2000027159A9 (en) | 2000-11-02 |
Family
ID=22315520
Family Applications (2)
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---|---|---|---|
PCT/US1999/026193 WO2000027160A1 (en) | 1998-11-05 | 1999-11-05 | Methods and systems to obtain a tldn for a home system in response to a call received for a wireless unit roaming in a visited system |
PCT/US1999/026077 WO2000027159A1 (en) | 1998-11-05 | 1999-11-05 | Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited system |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US1999/026193 WO2000027160A1 (en) | 1998-11-05 | 1999-11-05 | Methods and systems to obtain a tldn for a home system in response to a call received for a wireless unit roaming in a visited system |
Country Status (3)
Country | Link |
---|---|
US (3) | US6211462B1 (en) |
AU (2) | AU3098500A (en) |
WO (2) | WO2000027160A1 (en) |
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1999
- 1999-11-04 US US09/434,867 patent/US6211462B1/en not_active Expired - Lifetime
- 1999-11-05 AU AU30985/00A patent/AU3098500A/en not_active Abandoned
- 1999-11-05 WO PCT/US1999/026193 patent/WO2000027160A1/en active Application Filing
- 1999-11-05 AU AU16073/00A patent/AU1607300A/en not_active Abandoned
- 1999-11-05 WO PCT/US1999/026077 patent/WO2000027159A1/en active Application Filing
-
2000
- 2000-06-02 US US09/586,323 patent/US6735429B1/en not_active Expired - Lifetime
-
2006
- 2006-05-09 US US11/430,303 patent/USRE41075E1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6211462B1 (en) | 2001-04-03 |
US6735429B1 (en) | 2004-05-11 |
AU3098500A (en) | 2000-05-22 |
WO2000027159A1 (en) | 2000-05-11 |
AU1607300A (en) | 2000-05-22 |
WO2000027160A9 (en) | 2000-11-02 |
USRE41075E1 (en) | 2010-01-12 |
WO2000027160A1 (en) | 2000-05-11 |
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