WO2000033359A3 - Specimen holding robotic arm end effector - Google Patents

Specimen holding robotic arm end effector Download PDF

Info

Publication number
WO2000033359A3
WO2000033359A3 PCT/US1999/028737 US9928737W WO0033359A3 WO 2000033359 A3 WO2000033359 A3 WO 2000033359A3 US 9928737 W US9928737 W US 9928737W WO 0033359 A3 WO0033359 A3 WO 0033359A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
edge
end effector
exclusion zone
wafers
Prior art date
Application number
PCT/US1999/028737
Other languages
French (fr)
Other versions
WO2000033359A2 (en
WO2000033359B1 (en
Inventor
Paul Bacchi
Paul S Filipski
Original Assignee
Kensington Lab Inc
Paul Bacchi
Paul S Filipski
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/204,747 external-priority patent/US6256555B1/en
Priority to AU20410/00A priority Critical patent/AU2041000A/en
Priority to EP99964097A priority patent/EP1135795B1/en
Priority to DE69938360T priority patent/DE69938360T2/en
Priority to IL14346799A priority patent/IL143467A/en
Priority to US09/890,839 priority patent/US6453214B1/en
Application filed by Kensington Lab Inc, Paul Bacchi, Paul S Filipski filed Critical Kensington Lab Inc
Priority to JP2000585915A priority patent/JP2002531942A/en
Publication of WO2000033359A2 publication Critical patent/WO2000033359A2/en
Publication of WO2000033359A3 publication Critical patent/WO2000033359A3/en
Publication of WO2000033359B1 publication Critical patent/WO2000033359B1/en
Priority to HK02102462.3A priority patent/HK1041104B/en
Priority to IL166019A priority patent/IL166019A/en
Priority to IL166018A priority patent/IL166018A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S700/00—Data processing: generic control systems or specific applications
    • Y10S700/90—Special robot structural element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20317—Robotic arm including electric motor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Fishing Rods (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

Robot arm (16) end effectors (10, 110, 210) of this invention rapidly and cleanly transfer semiconductor wafers (12) between a wafer cassette (14) and a processing station. The end effectors include proximal and distal rest pads (24, 26, 124, 126) having pad and backstop portions (32, 34, 132, 134) that support and grip the wafer either by wafer peripheral edge contact or within an annular exclusion zone (30) that extends inward from a peripheral edge of the wafer. An active contact point (50, 150, 222) is movable by a vacuum actuated piston (52, 152) between a retracted wafer-loading position and an extended position that urges the wafer against the distal rest pads to grip the wafer at its edge or within the exclusion zone. The end effector further includes fiber optic light transmission sensors (90, 102, 202, 214) for determining various wafer surface, edge, thickness, tilt, and location parameters. The sensors provide robot arm extension and elevation positioning data supporting methods of rapidly and accurately placing and retrieving a wafer from among a stack of closely spaced wafers stored in the wafer cassette. The methods effectively prevent accidental contact between the end effector and the wafers while effecting clean, secure gripping of the wafer at its edge or within its exclusion zone.
PCT/US1999/028737 1998-12-02 1999-12-02 Specimen holding robotic arm end effector WO2000033359A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000585915A JP2002531942A (en) 1998-12-02 1999-12-02 Robot arm end effector holding sample
EP99964097A EP1135795B1 (en) 1998-12-02 1999-12-02 Specimen holding robotic arm end effector
DE69938360T DE69938360T2 (en) 1998-12-02 1999-12-02 PULSE GRIP FOR PROBE HALTEROBOTER
IL14346799A IL143467A (en) 1998-12-02 1999-12-02 Specimen holding robotic arm and effector
US09/890,839 US6453214B1 (en) 1998-12-02 1999-12-02 Method of using a specimen sensing end effector to align a robot arm with a specimen stored on or in a container
AU20410/00A AU2041000A (en) 1998-12-02 1999-12-02 Specimen holding robotic arm end effector
HK02102462.3A HK1041104B (en) 1998-12-02 2002-04-03 Specimen holding robotic arm end effector
IL166019A IL166019A (en) 1998-12-02 2004-12-21 Method of removing a specimen from a specimen holder
IL166018A IL166018A (en) 1998-12-02 2004-12-28 Specimen peripheral edge-gripping device that is adapted for operative coupling to a mechanism and gripping a specimen

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/204,747 US6256555B1 (en) 1998-12-02 1998-12-02 Robot arm with specimen edge gripping end effector
US09/204,747 1998-12-02
US09/312,343 US6275748B1 (en) 1998-12-02 1999-05-14 Robot arm with specimen sensing and edge gripping end effector
US09/312,343 1999-05-14

Publications (3)

Publication Number Publication Date
WO2000033359A2 WO2000033359A2 (en) 2000-06-08
WO2000033359A3 true WO2000033359A3 (en) 2000-11-16
WO2000033359B1 WO2000033359B1 (en) 2001-01-04

Family

ID=26899770

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/028737 WO2000033359A2 (en) 1998-12-02 1999-12-02 Specimen holding robotic arm end effector

Country Status (9)

Country Link
US (5) US6453214B1 (en)
EP (1) EP1135795B1 (en)
JP (1) JP2002531942A (en)
CN (1) CN1238882C (en)
AT (1) ATE389237T1 (en)
AU (1) AU2041000A (en)
HK (1) HK1041104B (en)
IL (3) IL143467A (en)
WO (1) WO2000033359A2 (en)

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* Cited by examiner, † Cited by third party
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