WO2000055105A3 - Explosive shear wave energy source - Google Patents

Explosive shear wave energy source Download PDF

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Publication number
WO2000055105A3
WO2000055105A3 PCT/US2000/006634 US0006634W WO0055105A3 WO 2000055105 A3 WO2000055105 A3 WO 2000055105A3 US 0006634 W US0006634 W US 0006634W WO 0055105 A3 WO0055105 A3 WO 0055105A3
Authority
WO
WIPO (PCT)
Prior art keywords
energy source
shear wave
wave energy
explosive
explosive shear
Prior art date
Application number
PCT/US2000/006634
Other languages
French (fr)
Other versions
WO2000055105A2 (en
Inventor
William Terry Mcdavid
Original Assignee
Input Output Inc
William Terry Mcdavid
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Input Output Inc, William Terry Mcdavid filed Critical Input Output Inc
Priority to AU37443/00A priority Critical patent/AU3744300A/en
Publication of WO2000055105A2 publication Critical patent/WO2000055105A2/en
Publication of WO2000055105A3 publication Critical patent/WO2000055105A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/001—Structures having a reduced contact area, e.g. with bumps or with a textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0016—Protection against shocks or vibrations, e.g. vibration damping
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G01D18/008—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00 with calibration coefficients stored in memory
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/13—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/02—Generating seismic energy
    • G01V1/04—Details
    • G01V1/047—Arrangements for coupling the generator to the ground
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/02—Generating seismic energy
    • G01V1/04—Details
    • G01V1/047—Arrangements for coupling the generator to the ground
    • G01V1/053—Arrangements for coupling the generator to the ground for generating transverse waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/02—Generating seismic energy
    • G01V1/104—Generating seismic energy using explosive charges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/16—Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
    • G01V1/18—Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
    • G01V1/181—Geophones
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/16—Receiving elements for seismic signals; Arrangements or adaptations of receiving elements
    • G01V1/18—Receiving elements, e.g. seismometer, geophone or torque detectors, for localised single point measurements
    • G01V1/186—Hydrophones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N2001/021—Correlating sampling sites with geographical information, e.g. GPS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

An energy source for shear wave within the surface of the earth. The energy source has a convoluted shape (405). In a preferred embodiment, the pitch of the spacing (425) of the flexible explosive material (405) and the flexible transfer material (430) around the tube (410) ranges from about 20 to 45 degrees relative to the horizontal direction in order to optionally excite a range of frequencies.
PCT/US2000/006634 1999-03-17 2000-03-14 Explosive shear wave energy source WO2000055105A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU37443/00A AU3744300A (en) 1999-03-17 2000-03-14 Explosive shear wave energy source

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12507699P 1999-03-17 1999-03-17
US60/125,076 1999-03-17

Publications (2)

Publication Number Publication Date
WO2000055105A2 WO2000055105A2 (en) 2000-09-21
WO2000055105A3 true WO2000055105A3 (en) 2001-05-31

Family

ID=22418086

Family Applications (8)

Application Number Title Priority Date Filing Date
PCT/US2000/006032 WO2000055652A1 (en) 1999-03-17 2000-03-08 Calibration of sensors
PCT/US2000/006024 WO2000055648A1 (en) 1999-03-17 2000-03-08 Hydrophone assembly
PCT/US2000/006634 WO2000055105A2 (en) 1999-03-17 2000-03-14 Explosive shear wave energy source
PCT/US2000/006832 WO2000056132A1 (en) 1999-03-17 2000-03-15 Low stress die attachment
PCT/US2000/040039 WO2000055638A1 (en) 1999-03-17 2000-03-16 Sensor design and process
PCT/US2000/040038 WO2000055593A2 (en) 1999-03-17 2000-03-16 Sensor
PCT/US2000/006905 WO2000055646A1 (en) 1999-03-17 2000-03-16 Accelerometer transducer used for seismic recording
PCT/US2000/007310 WO2000055577A1 (en) 1999-03-17 2000-03-17 Integrated and multi-axis sensor assembly and packaging

Family Applications Before (2)

Application Number Title Priority Date Filing Date
PCT/US2000/006032 WO2000055652A1 (en) 1999-03-17 2000-03-08 Calibration of sensors
PCT/US2000/006024 WO2000055648A1 (en) 1999-03-17 2000-03-08 Hydrophone assembly

Family Applications After (5)

Application Number Title Priority Date Filing Date
PCT/US2000/006832 WO2000056132A1 (en) 1999-03-17 2000-03-15 Low stress die attachment
PCT/US2000/040039 WO2000055638A1 (en) 1999-03-17 2000-03-16 Sensor design and process
PCT/US2000/040038 WO2000055593A2 (en) 1999-03-17 2000-03-16 Sensor
PCT/US2000/006905 WO2000055646A1 (en) 1999-03-17 2000-03-16 Accelerometer transducer used for seismic recording
PCT/US2000/007310 WO2000055577A1 (en) 1999-03-17 2000-03-17 Integrated and multi-axis sensor assembly and packaging

Country Status (9)

Country Link
US (2) US6861587B1 (en)
EP (11) EP1169657A4 (en)
JP (5) JP5420127B2 (en)
AT (3) ATE355728T1 (en)
AU (8) AU3517600A (en)
CA (7) CA2365868C (en)
DE (4) DE60033643T2 (en)
NO (7) NO336325B1 (en)
WO (8) WO2000055652A1 (en)

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