WO2000060917A3 - Bi-modal abrasive slurries for planarization - Google Patents

Bi-modal abrasive slurries for planarization Download PDF

Info

Publication number
WO2000060917A3
WO2000060917A3 PCT/US2000/009156 US0009156W WO0060917A3 WO 2000060917 A3 WO2000060917 A3 WO 2000060917A3 US 0009156 W US0009156 W US 0009156W WO 0060917 A3 WO0060917 A3 WO 0060917A3
Authority
WO
WIPO (PCT)
Prior art keywords
solution
abrasive particles
flow
type
treated
Prior art date
Application number
PCT/US2000/009156
Other languages
French (fr)
Other versions
WO2000060917A2 (en
Inventor
Guy F Hudson
Original Assignee
Micron Technology Inc
Guy F Hudson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc, Guy F Hudson filed Critical Micron Technology Inc
Priority to AU43321/00A priority Critical patent/AU4332100A/en
Publication of WO2000060917A2 publication Critical patent/WO2000060917A2/en
Publication of WO2000060917A3 publication Critical patent/WO2000060917A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Abstract

A method and apparatus for making and using slurries for planarizing microelectronic-device substrate assemblies (12) in mechanical and/or chemical-mechanical planarization processes. In one aspect of the invention, a bi-modal slurry is fabricated by removing a first type of selected abrasive particles (216a) from a first abrasive particle solution (212) to form a treated flow of the first solution. The treated flow of the first solution is then combined with a flow of a second solution (222) having a plurality of second abrasive particles (226). The abrasive particles of the first type (216a) are accordingly removed from the first solution (212) separately from the second solution (222) such that the second abrasive particles (226) in the second solution (222) do not affect the removal of the abrasive particles of the first type (216a) from the first solution (212). In another aspect of the invention, a second type of selected abrasive particles are removed from the second solution prior to mixing with the first solution. Thus, by combining the treated flow of the first solution with either the treated or untreated flow of the second solution, a single flow of an abrasive slurry is produced having a first distribution (280) of the first abrasive particles about a first mode (282) and a second distribution (290) of the second abrasive particles about a second mode (292).
PCT/US2000/009156 1999-04-09 2000-04-06 Bi-modal abrasive slurries for planarization WO2000060917A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU43321/00A AU4332100A (en) 1999-04-09 2000-04-06 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/289,790 1999-04-09
US09/289,790 US6407000B1 (en) 1999-04-09 1999-04-09 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies

Publications (2)

Publication Number Publication Date
WO2000060917A2 WO2000060917A2 (en) 2000-10-19
WO2000060917A3 true WO2000060917A3 (en) 2001-01-11

Family

ID=23113112

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/009156 WO2000060917A2 (en) 1999-04-09 2000-04-06 Bi-modal abrasive slurries for planarization

Country Status (3)

Country Link
US (5) US6407000B1 (en)
AU (1) AU4332100A (en)
WO (1) WO2000060917A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599836B1 (en) * 1999-04-09 2003-07-29 Micron Technology, Inc. Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6407000B1 (en) * 1999-04-09 2002-06-18 Micron Technology, Inc. Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
US6273796B1 (en) * 1999-09-01 2001-08-14 Micron Technology, Inc. Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface
US6387289B1 (en) * 2000-05-04 2002-05-14 Micron Technology, Inc. Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
KR100481651B1 (en) * 2000-08-21 2005-04-08 가부시끼가이샤 도시바 Slurry for chemical mechanical polishing and method for manufacturing semiconductor device
JP2002100593A (en) * 2000-09-21 2002-04-05 Nikon Corp Grinding device, method for producing semiconductor device while using the same and semiconductor device produced thereby
US6811467B1 (en) * 2002-09-09 2004-11-02 Seagate Technology Llc Methods and apparatus for polishing glass substrates
JP2004247688A (en) * 2003-02-17 2004-09-02 Canon Inc Refrigerant supplying device
US6929532B1 (en) * 2003-05-08 2005-08-16 Lsi Logic Corporation Method and apparatus for filtering a chemical polishing slurry of a wafer fabrication process
JP2005007520A (en) * 2003-06-19 2005-01-13 Nihon Micro Coating Co Ltd Abrasive pad, manufacturing method thereof, and grinding method thereof
US6939211B2 (en) * 2003-10-09 2005-09-06 Micron Technology, Inc. Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
US7470295B2 (en) * 2004-03-12 2008-12-30 K.C. Tech Co., Ltd. Polishing slurry, method of producing same, and method of polishing substrate
TWI283008B (en) * 2004-05-11 2007-06-21 K C Tech Co Ltd Slurry for CMP and method of producing the same
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
FR2888146A1 (en) * 2005-07-06 2007-01-12 St Microelectronics Crolles 2 Polishing product supplying method for mechano-chemical polishing machine, involves directing polishing product towards plate and passing product through filter, where filter retains abrasive particles of product
WO2007146680A1 (en) * 2006-06-06 2007-12-21 Florida State University Research Foundation , Inc. Stabilized silica colloid
US7754612B2 (en) * 2007-03-14 2010-07-13 Micron Technology, Inc. Methods and apparatuses for removing polysilicon from semiconductor workpieces
US7960313B2 (en) * 2007-06-14 2011-06-14 Intermolecular, Inc. Combinatorial processing including stirring
US7785172B2 (en) * 2007-08-14 2010-08-31 Intermolecular, Inc. Combinatorial processing including rotation and movement within a region
US9202709B2 (en) * 2008-03-19 2015-12-01 Fujifilm Corporation Polishing liquid for metal and polishing method using the same
US20120264303A1 (en) * 2011-04-15 2012-10-18 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing slurry, system and method
US8696404B2 (en) * 2011-12-21 2014-04-15 WD Media, LLC Systems for recycling slurry materials during polishing processes
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
CN108161585B (en) * 2018-01-25 2020-03-10 南京航空航天大学 Research method for researching initial grinding surface through single abrasive particle three-time grinding
US10468767B1 (en) 2019-02-20 2019-11-05 Pivotal Commware, Inc. Switchable patch antenna

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5863838A (en) * 1996-07-22 1999-01-26 Motorola, Inc. Method for chemically-mechanically polishing a metal layer
US5904159A (en) * 1995-11-10 1999-05-18 Tokuyama Corporation Polishing slurries and a process for the production thereof
US5932486A (en) * 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US6077437A (en) * 1996-10-18 2000-06-20 Nec Corporation Device and method for recovering and reusing a polishing agent

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US198195A (en) * 1877-12-18 Improvement in opera-glasses
US4959113C1 (en) 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces
US5264101A (en) * 1989-11-06 1993-11-23 Applied Biosystems, Inc. Capillary electrophoresis molecular weight separation of biomolecules using a polymer-containing solution
US5264010A (en) * 1992-04-27 1993-11-23 Rodel, Inc. Compositions and methods for polishing and planarizing surfaces
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
JP2606156B2 (en) 1994-10-14 1997-04-30 栗田工業株式会社 Method for collecting abrasive particles
JP3344615B2 (en) * 1995-12-12 2002-11-11 ソニー株式会社 Method for manufacturing semiconductor device
US5658190A (en) 1995-12-15 1997-08-19 Micron Technology, Inc. Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5893754A (en) 1996-05-21 1999-04-13 Micron Technology, Inc. Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
JP3076244B2 (en) * 1996-06-04 2000-08-14 日本電気株式会社 Polishing method of multilayer wiring
US5725417A (en) 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
US5868896A (en) 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
US5954997A (en) 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
JPH1110540A (en) * 1997-06-23 1999-01-19 Speedfam Co Ltd Slurry recycling system of cmp device and its method
US6093649A (en) * 1998-08-07 2000-07-25 Rodel Holdings, Inc. Polishing slurry compositions capable of providing multi-modal particle packing and methods relating thereto
JPH11277434A (en) * 1998-03-30 1999-10-12 Speedfam Co Ltd Slurry recycle system for cmp device and method therefor
TW369947U (en) * 1998-04-24 1999-09-11 United Microelectronics Corp A filter set
US6124207A (en) 1998-08-31 2000-09-26 Micron Technology, Inc. Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries
US6046111A (en) 1998-09-02 2000-04-04 Micron Technology, Inc. Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates
JP2000198062A (en) * 1998-11-04 2000-07-18 Canon Inc Polishing device and its method
US6165048A (en) * 1998-11-10 2000-12-26 Vlsi Technology, Inc. Chemical-mechanical-polishing system with continuous filtration
US6083840A (en) 1998-11-25 2000-07-04 Arch Specialty Chemicals, Inc. Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys
US6599836B1 (en) 1999-04-09 2003-07-29 Micron Technology, Inc. Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6407000B1 (en) 1999-04-09 2002-06-18 Micron Technology, Inc. Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904159A (en) * 1995-11-10 1999-05-18 Tokuyama Corporation Polishing slurries and a process for the production thereof
US5863838A (en) * 1996-07-22 1999-01-26 Motorola, Inc. Method for chemically-mechanically polishing a metal layer
US5932486A (en) * 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US6077437A (en) * 1996-10-18 2000-06-20 Nec Corporation Device and method for recovering and reusing a polishing agent

Also Published As

Publication number Publication date
US20040198194A1 (en) 2004-10-07
US7122475B2 (en) 2006-10-17
US20040198195A1 (en) 2004-10-07
US6794289B2 (en) 2004-09-21
WO2000060917A2 (en) 2000-10-19
AU4332100A (en) 2000-11-14
US6407000B1 (en) 2002-06-18
US20020146907A1 (en) 2002-10-10
US20040229551A1 (en) 2004-11-18

Similar Documents

Publication Publication Date Title
WO2000060917A3 (en) Bi-modal abrasive slurries for planarization
US6805615B1 (en) Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
AU5148198A (en) Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
US6124207A (en) Slurries for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods and apparatuses for making and using such slurries
WO2003034804A3 (en) Preparation of high performance silica slurry using a centrifuge
HK1050377A1 (en) Composition and method for planarizing surfaces.
TW428225B (en) A method of polishing a surface of a substrate, a method of manufacturing semiconductor device, and an apparatus of manufacturing the same
EP1148538A4 (en) Cmp abrasive, liquid additive for cmp abrasive and method for polishing substrate
WO2002044293A3 (en) Method and composition for the removal of residual materials during substrate planarization
SG142143A1 (en) Abrading plate and polishing method using the same
EP1103346A3 (en) Method and apparatus for electrochemical-mechanical planarization
AU7814398A (en) Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization
AU4661997A (en) Polishing pad and method for making polishing pad with elongated microcolumns
MY125250A (en) Improved ceria powder
KR19990088389A (en) A method of eliminating agglomerate particles in a polishing slurry
WO2004009289A8 (en) Rising after chemical-mechanical planarization process applied on a wafer
WO2001095382A3 (en) Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow
AU4202799A (en) Method and apparatus for recovery of water and slurry abrasives used for chemical and mechanical planarization
US20020022441A1 (en) Slurry supply apparatus and method
US6585570B2 (en) Method and apparatus for supplying chemical-mechanical polishing slurries
WO2004053456A3 (en) Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials
WO1996002319A3 (en) Chemical slurry mixing apparatus and method
EP1036632A3 (en) Method and system of manufacturing slurry for polishing, and method and system of manufacturing semiconductor devices
US5935869A (en) Method of planarizing semiconductor wafers
MX9504956A (en) Milling process and interior coating for a mill cylinder.

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP