WO2000067546A1 - Verfahren und vorrichtung zum bestücken von substraten mit bauelementen und substrat - Google Patents
Verfahren und vorrichtung zum bestücken von substraten mit bauelementen und substrat Download PDFInfo
- Publication number
- WO2000067546A1 WO2000067546A1 PCT/DE2000/001350 DE0001350W WO0067546A1 WO 2000067546 A1 WO2000067546 A1 WO 2000067546A1 DE 0001350 W DE0001350 W DE 0001350W WO 0067546 A1 WO0067546 A1 WO 0067546A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- components
- data
- substrates
- data storage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
Definitions
- the invention relates to a method for Bestucken of S ubstraten with devices according to the preamble of Pa ⁇ tent shes 1, according to an apparatus for Bestucken of Substra ⁇ th components with the preamble of patent claim 9 and a substrate.
- a device for producing electrical assemblies (a placement machine) is known, in which components are removed from supply units by means of a placement head, are transported to a predetermined position on a substrate and are placed there on the substrate.
- the extent to which a substrate is in proper condition is generally recognized by marking with so-called ink dots on the substrates.
- ink dots on the substrates.
- several placement machines arranged in a line and mounting a substrate with different components can recognize that a substrate has been marked as defective in the course of the mounting process. In the line of subsequent placement machines, these will no longer be placed on substrates that have already been marked as defective, thus saving on components. At the moment, no further information about the placement process can be obtained from the printed substrates.
- transponders are known as general storage units, for example from WO 92/22827. These transponders are able to receive information without storing their own energy supply, to store this information and to transmit it again to a readout unit. The information is transferred to the storage unit and the information is read out wirelessly, generally by radio.
- the use of transponders for the assembly of Substra ⁇ th with components is not known.
- the object is achieved by a method of the type mentioned at the outset with the characterizing features of claim 1, a device of the type mentioned at the beginning with the characterizing features of claim 9 and a substrate having the features of claim 12 and claim 13, respectively.
- contactless data storage units are arranged in or on the substrates to be populated, into which data about the placement process are written by communication units, which data are assigned to the control device of the placement machine.
- the data transmitted and stored can be supplemented, deleted or read out at any time during the placement process or afterwards.
- Information can be stored, for example, about the manufacturers of the assembled components, about components still missing on the substrate, or the results of inspections already carried out in the automatic placement machine about the goodness of the placement process.
- the read-out unit reads the data out of the data storage unit again and is then used, for example, for further placement processes or for error analyzes (“retraceability”).
- the method according to claim 2 is particularly advantageous if the data storage unit is loaded onto the substrate in the automatic placement machine. This means that easily be used ren all conventional substrates for the procedural ⁇ , need to be developed position proceed without the costly new Substrather-.
- the data of the individual processes which are respectively running in the different placement machines are stored in succession in the data storage unit. This makes it easy to understand later, on which automatic placement machines, for example, incorrect placement accumulate. This placement machine can then be easily repaired or replaced.
- the data already stored in the data storage unit are read out by the placement machines following the line and taken into account in the placement of these following placement machines. In this way, contrary to the prescribed procedure, missing components can still be added, or substrates that are recognized as defective are no longer fitted with - sometimes expensive - components.
- inspection results are stored, which has the advantage that in the event of errors which have been detected, for example by a sensor of the placement machine preceding in the line, the further placement of this defective substrate is dispensed with, or an attempt is made to eliminate the error .
- the communication unit is attached to the placement head. This makes it easy to move to different positions on the substrate and to write to data storage units located there if the range of the data transmission is quite small.
- the communication unit comprises a separate read-out and a separate write unit.
- the data storage units can be read out from substrates entering the placement machines via a transport device at the beginning of the transport route, the data can be used for the placement process, and at the end of the transport route the new data are stored again in the data storage unit.
- FIG. 1 shows a schematic side view of an automatic placement machine with a communication unit arranged on the placement head
- Figure 2 ⁇ units is a schematic plan view of two arranged in a line Bestuckautomaten each at the beginning and at the end of the transport path arranged write and Ausleseem
- Figure 3 is a schematic plan view of em m multiple sub ⁇ strat capablee divided substrate, wherein each Substratge ⁇ Bidding a Data storage unit is assigned.
- FIG. 1 shows a schematic side view of automatic placement machine 1 in which substrates 2 with components 3 are stuck.
- the components 3 are removed from feed units 4 and placed on the substrate 2 in predetermined positions by means of a placement head 5, which is equipped with holding devices 6, for example suction pipettes.
- the placement head is controlled by a control device 7, which controls both a transport device 8 for transporting the substrates 2 along a transport path through the placement machine and the movement of the placement head 5 on a positioning device 11 arranged on a frame 10.
- the positioning device is formed, for example, by a system consisting of slides movable in one direction parallel to the substrate and arms arranged thereon. Automatic placement machines with several placement heads are also known, for which the invention can also be used.
- the control unit 7 communicates with a communication unit 12 arranged on the mounting head, which transmits data to a contactless data storage unit (transponder) 13 arranged on the substrate 2 or reads it out.
- the data which are transmitted from the control device 7 to the data storage unit 13 are, for example, identifications of the manufacturers of the components 3 which are equipped with this automatic placement machine 1 on the substrate 2.
- the substrate 2 thus contains information about the origin of the components 3 thereon what is of interest for later liability issues in the event of an error.
- the data storage units 13 can already be present on the as yet unpopulated substrates 2, or they are removed from a magazine 14 in the automatic placement machine 1 and placed on the substrate 2 with the aid of the placement head 5 and, in the same way as the components 3, are held by an adhesive. Also, before the substrate already Bestuckpro- process ms material 2 introduced ⁇ data storage units 13 are usable.
- FIG. 2 which shows two essentially the same automatic placement machines 1 as in FIG. 1 in a top view
- the placement machines 1 are arranged in a line.
- the automatic placement machines 1 At the beginning and at the end of the respective transport route, the automatic placement machines 1 have a readout unit 15 and a writing unit 16, which are parts of the communication unit 12. Due to the communication of the layout unit 15 of the right automatic placement machine 1 following the left one with the associated control device 7, the data storage unit 13 is read out from the first left automatic placement machine 1 m and used for the placement process.
- data about components 3 that are still missing can be communicated in this way, so that in the case of components 3 missing in the first automatic placement machine, the entire line does not stand, but instead, these components 3 are populated by subsequent automatic placement machines if there is a suitable supply.
- errors already recognized in the first automatic placement machine during inspections can be transferred to the subsequent automatic placement machines, which can then start suitable measures, such as correcting the errors or even missing the defective substrate, in order to save expensive components.
- the data storage units 13 can also only be read out after they have run through the entire line, if, for example, no direct adaptation of the placement process is provided, but only a check is to be made to determine whether all the desired configurations have been made at the end.
- it is suitable to divide the substrate 2 into a plurality of substrate regions 17, as is shown schematically in plan view in FIG. 3.
- Each substrate area 17 is assigned its own data storage unit 13, in which data relating to the respective substrate area 17 are stored, which can be read out separately by a readout unit 12.
- This readout unit 12 is also designed, for example, as an independent unit in order to receive information about the assembly process independently of the placement machine - for example, already after the installation of a printed circuit board as a substrate in an electrical device.
- the invention thus opens up the possibility of assigning precise data about the placement sequence to the individual substrates, which simplifies both the error detection and the placement sequence in the case of line placement machines.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00940160A EP1175816B1 (de) | 1999-04-30 | 2000-04-28 | Verfahren und vorrichtung zum bestücken von substraten mit bauelementen |
DE50007134T DE50007134D1 (de) | 1999-04-30 | 2000-04-28 | Verfahren und vorrichtung zum bestücken von substraten mit bauelementen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19919915.9 | 1999-04-30 | ||
DE19919915 | 1999-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000067546A1 true WO2000067546A1 (de) | 2000-11-09 |
Family
ID=7906553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/001350 WO2000067546A1 (de) | 1999-04-30 | 2000-04-28 | Verfahren und vorrichtung zum bestücken von substraten mit bauelementen und substrat |
Country Status (4)
Country | Link |
---|---|
US (1) | US6718629B1 (de) |
EP (1) | EP1175816B1 (de) |
DE (1) | DE50007134D1 (de) |
WO (1) | WO2000067546A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002087302A1 (de) * | 2001-04-19 | 2002-10-31 | Siemens Aktiengesellschaft | Einrichtung zum kennzeichnen von bauelementenmagazinen und verfahren zur verwendung der einrichtung |
WO2005034044A1 (en) * | 2003-10-01 | 2005-04-14 | Matsushita Electric Industrial Co., Ltd. | Identification method of apparatus to be recalled and heating method |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7290701B2 (en) * | 2004-08-13 | 2007-11-06 | Accu-Assembly Incorporated | Gathering data relating to electrical components picked from stacked trays |
JP5750235B2 (ja) | 2010-04-29 | 2015-07-15 | 富士機械製造株式会社 | 製造作業機 |
CN102860150B (zh) * | 2010-04-29 | 2015-05-13 | 富士机械制造株式会社 | 制造作业机 |
JP5675013B2 (ja) * | 2010-06-10 | 2015-02-25 | 富士機械製造株式会社 | 電子回路組立方法および電子回路組立システム |
JP6043993B2 (ja) * | 2011-10-31 | 2016-12-14 | Jukiオートメーションシステムズ株式会社 | 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法 |
JP6402882B2 (ja) * | 2013-09-19 | 2018-10-10 | パナソニックIpマネジメント株式会社 | 部品実装システムおよび部品実装方法 |
DE102016102135B3 (de) * | 2016-02-08 | 2017-08-03 | Asm Assembly Systems Gmbh & Co. Kg | Leiterplatten - Transportsystem und Fertigungssystem |
US11520319B2 (en) | 2017-07-10 | 2022-12-06 | Fuji Corporation | Base board production line, information management device, and information management proxy device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4787143A (en) * | 1985-12-04 | 1988-11-29 | Tdk Corporation | Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor |
WO1992022827A1 (en) * | 1991-06-05 | 1992-12-23 | Trovan Limited | An improved miniature transponder device |
EP0844645A1 (de) * | 1996-11-25 | 1998-05-27 | Schlumberger Technologies, Inc. | System, Verfahren und Vorrichtung zur Informationsspeicherung während eines Halbleiterherstellungsverfahren |
WO1998037744A1 (de) * | 1997-02-24 | 1998-08-27 | Siemens Aktiengesellschaft | Vorrichtung zum herstellen von elektrischen baugruppen |
Family Cites Families (11)
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US4512707A (en) * | 1983-05-18 | 1985-04-23 | At&T Technologies, Inc. | System for loading and dispensing articles from a magazine |
US4570058A (en) * | 1983-10-03 | 1986-02-11 | At&T Technologies, Inc. | Method and apparatus for automatically handling and identifying semiconductor wafers |
IN163064B (de) * | 1984-03-22 | 1988-08-06 | Siemens Ag | |
US5166884A (en) * | 1984-12-24 | 1992-11-24 | Asyst Technologies, Inc. | Intelligent system for processing and storing articles |
JPH0616282B2 (ja) * | 1985-05-27 | 1994-03-02 | ソニー株式会社 | 生産方法 |
JPS62130596A (ja) * | 1985-12-02 | 1987-06-12 | 三菱電機株式会社 | 電子部品自動組立装置 |
JPS62282848A (ja) * | 1986-05-30 | 1987-12-08 | Tokyo Keiki Co Ltd | Faシステムのデ−タ処理装置 |
US4827110A (en) * | 1987-06-11 | 1989-05-02 | Fluoroware, Inc. | Method and apparatus for monitoring the location of wafer disks |
US4941795A (en) * | 1988-11-21 | 1990-07-17 | At&T Bell Laboratories | Component insertion machine apparatus |
JPH066084A (ja) * | 1992-06-19 | 1994-01-14 | Olympus Optical Co Ltd | 電子部品自動実装機 |
KR0147403B1 (ko) * | 1994-06-24 | 1998-11-02 | 문정환 | 칩자동 로딩장치 |
-
2000
- 2000-04-26 US US09/558,779 patent/US6718629B1/en not_active Expired - Lifetime
- 2000-04-28 EP EP00940160A patent/EP1175816B1/de not_active Expired - Lifetime
- 2000-04-28 WO PCT/DE2000/001350 patent/WO2000067546A1/de active IP Right Grant
- 2000-04-28 DE DE50007134T patent/DE50007134D1/de not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4787143A (en) * | 1985-12-04 | 1988-11-29 | Tdk Corporation | Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor |
WO1992022827A1 (en) * | 1991-06-05 | 1992-12-23 | Trovan Limited | An improved miniature transponder device |
EP0844645A1 (de) * | 1996-11-25 | 1998-05-27 | Schlumberger Technologies, Inc. | System, Verfahren und Vorrichtung zur Informationsspeicherung während eines Halbleiterherstellungsverfahren |
WO1998037744A1 (de) * | 1997-02-24 | 1998-08-27 | Siemens Aktiengesellschaft | Vorrichtung zum herstellen von elektrischen baugruppen |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002087302A1 (de) * | 2001-04-19 | 2002-10-31 | Siemens Aktiengesellschaft | Einrichtung zum kennzeichnen von bauelementenmagazinen und verfahren zur verwendung der einrichtung |
DE10119232C1 (de) * | 2001-04-19 | 2002-12-05 | Siemens Production & Logistics | Einrichtung zum Kennzeichnen von mit einer Mehrzahl zu bestückender elektrischer Bauelemente versehenen Bauelemententrägern und Verfahren zur Verwendung der Einrichtung |
US6901311B2 (en) | 2001-04-19 | 2005-05-31 | Siemens Aktiengesellschaft | Device for characterizing component stores and method for using said device |
WO2005034044A1 (en) * | 2003-10-01 | 2005-04-14 | Matsushita Electric Industrial Co., Ltd. | Identification method of apparatus to be recalled and heating method |
Also Published As
Publication number | Publication date |
---|---|
US6718629B1 (en) | 2004-04-13 |
EP1175816B1 (de) | 2004-07-21 |
EP1175816A1 (de) | 2002-01-30 |
DE50007134D1 (de) | 2004-08-26 |
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