WO2000068979A3 - An apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool - Google Patents
An apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool Download PDFInfo
- Publication number
- WO2000068979A3 WO2000068979A3 PCT/US2000/008657 US0008657W WO0068979A3 WO 2000068979 A3 WO2000068979 A3 WO 2000068979A3 US 0008657 W US0008657 W US 0008657W WO 0068979 A3 WO0068979 A3 WO 0068979A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- cable
- flat
- filaments
- cables
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000617482A JP4814429B2 (en) | 1999-05-10 | 2000-03-30 | Device for detecting temperature on integrated circuit manufacturing tool substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/307,667 | 1999-05-10 | ||
US09/307,667 US6190040B1 (en) | 1999-05-10 | 1999-05-10 | Apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2000068979A2 WO2000068979A2 (en) | 2000-11-16 |
WO2000068979A3 true WO2000068979A3 (en) | 2001-03-08 |
WO2000068979A9 WO2000068979A9 (en) | 2002-06-27 |
Family
ID=23190706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/008657 WO2000068979A2 (en) | 1999-05-10 | 2000-03-30 | An apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool |
Country Status (3)
Country | Link |
---|---|
US (1) | US6190040B1 (en) |
JP (2) | JP4814429B2 (en) |
WO (1) | WO2000068979A2 (en) |
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US20050011611A1 (en) * | 2002-07-12 | 2005-01-20 | Mahoney Leonard J. | Wafer probe for measuring plasma and surface characteristics in plasma processing environments |
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US7135852B2 (en) * | 2002-12-03 | 2006-11-14 | Sensarray Corporation | Integrated process condition sensing wafer and data analysis system |
US7403834B2 (en) * | 2003-05-08 | 2008-07-22 | Regents Of The University Of California | Methods of and apparatuses for controlling process profiles |
US7415312B2 (en) * | 2004-05-25 | 2008-08-19 | Barnett Jr James R | Process module tuning |
US20050284570A1 (en) * | 2004-06-24 | 2005-12-29 | Doran Daniel B | Diagnostic plasma measurement device having patterned sensors and features |
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US20060020415A1 (en) * | 2004-07-23 | 2006-01-26 | Hardwicke Canan U | Sensor and method for making same |
US20060043063A1 (en) * | 2004-09-02 | 2006-03-02 | Mahoney Leonard J | Electrically floating diagnostic plasma probe with ion property sensors |
US20060171848A1 (en) * | 2005-01-31 | 2006-08-03 | Advanced Energy Industries, Inc. | Diagnostic plasma sensors for endpoint and end-of-life detection |
US8604361B2 (en) * | 2005-12-13 | 2013-12-10 | Kla-Tencor Corporation | Component package for maintaining safe operating temperature of components |
JP2007171107A (en) * | 2005-12-26 | 2007-07-05 | Fujitsu Ltd | Inner furnace temperature measurement method |
US7367712B2 (en) * | 2006-02-06 | 2008-05-06 | National Instruments Corporation | RTD measurement unit including detection mechanism for automatic selection of 3-wire or 4-wire RTD measurement mode |
US7510323B2 (en) * | 2006-03-14 | 2009-03-31 | International Business Machines Corporation | Multi-layered thermal sensor for integrated circuits and other layered structures |
US7555948B2 (en) * | 2006-05-01 | 2009-07-07 | Lynn Karl Wiese | Process condition measuring device with shielding |
US7540188B2 (en) * | 2006-05-01 | 2009-06-02 | Lynn Karl Wiese | Process condition measuring device with shielding |
CN101460817B (en) * | 2006-06-03 | 2012-07-04 | 精密线性系统股份有限公司 | Temperature-sensing and transmitting assemblies, programmable temperature sensor units, and methods of making and using them |
US8104951B2 (en) * | 2006-07-31 | 2012-01-31 | Applied Materials, Inc. | Temperature uniformity measurements during rapid thermal processing |
US7638798B2 (en) * | 2006-08-24 | 2009-12-29 | Coherent, Inc. | Laminated wafer sensor system for UV dose measurement |
US7924408B2 (en) * | 2007-02-23 | 2011-04-12 | Kla-Tencor Technologies Corporation | Temperature effects on overlay accuracy |
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US8079758B2 (en) * | 2007-10-25 | 2011-12-20 | Sebacs Co., Ltd. | Temperature computing instrument and method for calibrating temperature of sensor part used therefor |
DE102007061777B4 (en) * | 2007-12-19 | 2010-12-16 | Von Ardenne Anlagentechnik Gmbh | Process for vacuum coating of substrates to be coated and vacuum coating equipment |
US7902625B2 (en) * | 2008-04-21 | 2011-03-08 | International Business Machines Corporation | Metal-gate thermocouple |
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US20110292963A1 (en) * | 2010-01-28 | 2011-12-01 | Conductive Compounds, Inc. | Laser position detection system |
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US20120181265A1 (en) * | 2010-07-15 | 2012-07-19 | Despatch Industries Limited Partnership | Firing furnace configuration for thermal processing system |
US8681493B2 (en) | 2011-05-10 | 2014-03-25 | Kla-Tencor Corporation | Heat shield module for substrate-like metrology device |
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US9972762B2 (en) | 2012-08-31 | 2018-05-15 | Te Wire & Cable Llc | Thermocouple ribbon and assembly |
WO2014194077A2 (en) | 2013-05-30 | 2014-12-04 | Kla-Tencor Corporation | Method and system for measuring heat flux |
US9420639B2 (en) * | 2013-11-11 | 2016-08-16 | Applied Materials, Inc. | Smart device fabrication via precision patterning |
US11158526B2 (en) * | 2014-02-07 | 2021-10-26 | Applied Materials, Inc. | Temperature controlled substrate support assembly |
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WO2017004242A1 (en) * | 2015-06-29 | 2017-01-05 | Component Re-Engineering Company, Inc. | Temperature sensing device and method for making same |
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JP6694503B2 (en) * | 2016-04-19 | 2020-05-13 | 東京エレクトロン株式会社 | Substrate for temperature measurement and temperature measurement system |
US10393594B2 (en) * | 2016-08-12 | 2019-08-27 | Qualcomm Incorporated | Thermopile mesh |
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JP7066557B2 (en) * | 2018-07-12 | 2022-05-13 | 東京エレクトロン株式会社 | Temperature measurement sensor, temperature measurement system, and temperature measurement method |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0310130A (en) * | 1989-06-07 | 1991-01-17 | Casio Comput Co Ltd | Manufacture of temperature sensor |
US5436494A (en) * | 1994-01-12 | 1995-07-25 | Texas Instruments Incorporated | Temperature sensor calibration wafer structure and method of fabrication |
US5775808A (en) * | 1996-06-19 | 1998-07-07 | Applied Materials, Inc. | Apparatus for real-time, in situ measurement of temperature and a method of fabricating and using same |
US5969639A (en) * | 1997-07-28 | 1999-10-19 | Lockheed Martin Energy Research Corporation | Temperature measuring device |
WO2000003216A1 (en) * | 1998-07-10 | 2000-01-20 | Sensarray Corporation | Integrated wafer temperature sensors |
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-
1999
- 1999-05-10 US US09/307,667 patent/US6190040B1/en not_active Expired - Lifetime
-
2000
- 2000-03-30 JP JP2000617482A patent/JP4814429B2/en not_active Expired - Lifetime
- 2000-03-30 WO PCT/US2000/008657 patent/WO2000068979A2/en active Application Filing
-
2010
- 2010-11-26 JP JP2010263158A patent/JP5289419B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0310130A (en) * | 1989-06-07 | 1991-01-17 | Casio Comput Co Ltd | Manufacture of temperature sensor |
US5436494A (en) * | 1994-01-12 | 1995-07-25 | Texas Instruments Incorporated | Temperature sensor calibration wafer structure and method of fabrication |
US5775808A (en) * | 1996-06-19 | 1998-07-07 | Applied Materials, Inc. | Apparatus for real-time, in situ measurement of temperature and a method of fabricating and using same |
US5969639A (en) * | 1997-07-28 | 1999-10-19 | Lockheed Martin Energy Research Corporation | Temperature measuring device |
WO2000003216A1 (en) * | 1998-07-10 | 2000-01-20 | Sensarray Corporation | Integrated wafer temperature sensors |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 015, no. 122 (P - 1184) 26 March 1991 (1991-03-26) * |
Also Published As
Publication number | Publication date |
---|---|
JP4814429B2 (en) | 2011-11-16 |
WO2000068979A2 (en) | 2000-11-16 |
US6190040B1 (en) | 2001-02-20 |
JP2002544502A (en) | 2002-12-24 |
JP2011059132A (en) | 2011-03-24 |
JP5289419B2 (en) | 2013-09-11 |
WO2000068979A9 (en) | 2002-06-27 |
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