WO2000075068A3 - Method and apparatus for stress pulsed release and actuation of micromechanical structures - Google Patents

Method and apparatus for stress pulsed release and actuation of micromechanical structures Download PDF

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Publication number
WO2000075068A3
WO2000075068A3 PCT/US2000/014940 US0014940W WO0075068A3 WO 2000075068 A3 WO2000075068 A3 WO 2000075068A3 US 0014940 W US0014940 W US 0014940W WO 0075068 A3 WO0075068 A3 WO 0075068A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
stress wave
microparts
stiction
bonded
Prior art date
Application number
PCT/US2000/014940
Other languages
French (fr)
Other versions
WO2000075068A2 (en
Inventor
Amit Lal
Ville Kaajakari
Original Assignee
Wisconsin Alumni Res Found
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wisconsin Alumni Res Found filed Critical Wisconsin Alumni Res Found
Priority to AU53074/00A priority Critical patent/AU5307400A/en
Publication of WO2000075068A2 publication Critical patent/WO2000075068A2/en
Publication of WO2000075068A3 publication Critical patent/WO2000075068A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/3578—Piezoelectric force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • B81C1/00968—Methods for breaking the stiction bond
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/028—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors along multiple or arbitrary translation directions, e.g. XYZ stages
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
    • G02B6/3544—2D constellations, i.e. with switching elements and switched beams located in a plane
    • G02B6/3546—NxM switch, i.e. a regular array of switches elements of matrix type constellation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/357—Electrostatic force
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3586—Control or adjustment details, e.g. calibrating
    • G02B6/359—Control or adjustment details, e.g. calibrating of the position of the moving element itself during switching, i.e. without monitoring the switched beams

Abstract

Micromechanical parts are freed from a surface of a substrate to which the parts are stiction bonded by applying a pulse stress wave to the substrate that propagates through the substrate and is reflected at the surface to which the micropart is stiction bonded, breaking the bond between the micropart and the substrate surface by a spalling action at the surface. A piezoelectric transducer may be secured to the bottom surface of the substrate such that a voltage pulse supplied to the piezoelectric transducer deforms the piezoelectric element and the substrate to which it is secured to provide a pulse stress wave that propagates through the substrate to the top surface. For microparts that are in contact with but not stiction bonded to the substrate top surface, a pulse stress wave can be applied to the substrate to drive the microparts away from the surface by the rapid displacement of that surface as the pulse stress wave is reflected at the surface. Microparts that are attached to the surface in a way to permit rotation or a translation of movement may be activated by applying a pulse stress wave to the substrate to drive such parts away from contact with the surface into their erected positions.
PCT/US2000/014940 1999-06-04 2000-06-01 Method and apparatus for stress pulsed release and actuation of micromechanical structures WO2000075068A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU53074/00A AU5307400A (en) 1999-06-04 2000-06-01 Method and apparatus for stress pulsed release and actuation of micromechanical structures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13765299P 1999-06-04 1999-06-04
US60/137,652 1999-06-04

Publications (2)

Publication Number Publication Date
WO2000075068A2 WO2000075068A2 (en) 2000-12-14
WO2000075068A3 true WO2000075068A3 (en) 2001-07-12

Family

ID=22478455

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/014940 WO2000075068A2 (en) 1999-06-04 2000-06-01 Method and apparatus for stress pulsed release and actuation of micromechanical structures

Country Status (3)

Country Link
US (1) US6433463B1 (en)
AU (1) AU5307400A (en)
WO (1) WO2000075068A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4288777B2 (en) 1999-08-11 2009-07-01 ソニー株式会社 Multi-carrier signal transmitter and multi-carrier signal receiver
US6538796B1 (en) * 2000-03-31 2003-03-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration MEMS device for spacecraft thermal control applications
US6556739B1 (en) 2001-02-13 2003-04-29 Omm, Inc. Electronic damping of MEMS devices using a look-up table
US6571029B1 (en) 2001-02-13 2003-05-27 Omm, Inc. Method for determining and implementing electrical damping coefficients
ES2185478B1 (en) * 2001-02-14 2004-08-16 Universitat Politecnica De Catalunya MECHANICAL EXCITATION OF MICROMECHANIZED RESONATOR.
US6669454B2 (en) 2001-06-05 2003-12-30 Wisconsin Alumni Research Foundation Microfluidic actuation method and apparatus
US6595058B2 (en) * 2001-06-19 2003-07-22 Computed Ultrasound Global Inc. Method and apparatus for determining dynamic response of microstructure by using pulsed broad bandwidth ultrasonic transducer as BAW hammer
US6781208B2 (en) * 2001-08-17 2004-08-24 Nec Corporation Functional device, method of manufacturing therefor and driver circuit
US6856068B2 (en) * 2002-02-28 2005-02-15 Pts Corporation Systems and methods for overcoming stiction
JP4257570B2 (en) * 2002-07-17 2009-04-22 株式会社安川電機 Transfer robot teaching device and transfer robot teaching method
WO2005084394A2 (en) * 2004-03-05 2005-09-15 The Regents Of The University Of California Laser generated stress waves for stiction repair
US7596078B2 (en) * 2005-11-10 2009-09-29 Acellent Technologies, Inc. Method and apparatus for reducing crosstalk in a structural health monitoring system
US20080051996A1 (en) * 2006-08-23 2008-02-28 Dunning Katherine A Apparatus and method for vehicular display of information
US8250928B2 (en) * 2008-07-09 2012-08-28 The Boeing Company Measurement of strain in an adhesively bonded joint including magnetostrictive material
US9040432B2 (en) 2013-02-22 2015-05-26 International Business Machines Corporation Method for facilitating crack initiation during controlled substrate spalling
CN114061810B (en) * 2021-11-03 2023-07-25 重庆大学 Three-dimensional stress wave propagation monitoring device and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006749A (en) * 1989-10-03 1991-04-09 Regents Of The University Of California Method and apparatus for using ultrasonic energy for moving microminiature elements
JPH0727999A (en) * 1993-07-08 1995-01-31 Japan Aviation Electron Ind Ltd Laser type pointer
US5619089A (en) * 1994-10-31 1997-04-08 Seiko Instruments Inc. Ultrasonic motor and electronic apparatus provided with an ultrasonic motor
US5735026A (en) * 1993-07-21 1998-04-07 Daewoo Electronics Co., Ltd. Method for the manufacture of an electrodisplacive actuator array
US5766369A (en) * 1995-10-05 1998-06-16 Texas Instruments Incorporated Method to reduce particulates in device manufacture

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5610468A (en) * 1990-10-22 1997-03-11 Seiko Epson Corporation Ultrasonic step motor
JP3501860B2 (en) * 1994-12-21 2004-03-02 日本碍子株式会社 Piezoelectric / electrostrictive film type element and manufacturing method thereof
JPH11221493A (en) * 1998-02-04 1999-08-17 Erudekku:Kk Electric dust collecting apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006749A (en) * 1989-10-03 1991-04-09 Regents Of The University Of California Method and apparatus for using ultrasonic energy for moving microminiature elements
JPH0727999A (en) * 1993-07-08 1995-01-31 Japan Aviation Electron Ind Ltd Laser type pointer
US5735026A (en) * 1993-07-21 1998-04-07 Daewoo Electronics Co., Ltd. Method for the manufacture of an electrodisplacive actuator array
US5619089A (en) * 1994-10-31 1997-04-08 Seiko Instruments Inc. Ultrasonic motor and electronic apparatus provided with an ultrasonic motor
US5766369A (en) * 1995-10-05 1998-06-16 Texas Instruments Incorporated Method to reduce particulates in device manufacture

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"STICTION RELEASE", RESEARCH DISCLOSURE,GB,INDUSTRIAL OPPORTUNITIES LTD. HAVANT, no. 299, 1 March 1989 (1989-03-01), XP000049572, ISSN: 0374-4353 *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 04 31 May 1995 (1995-05-31) *

Also Published As

Publication number Publication date
WO2000075068A2 (en) 2000-12-14
US6433463B1 (en) 2002-08-13
AU5307400A (en) 2000-12-28

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