WO2000079074A1 - Holzfussboden - Google Patents
Holzfussboden Download PDFInfo
- Publication number
- WO2000079074A1 WO2000079074A1 PCT/EP2000/005488 EP0005488W WO0079074A1 WO 2000079074 A1 WO2000079074 A1 WO 2000079074A1 EP 0005488 W EP0005488 W EP 0005488W WO 0079074 A1 WO0079074 A1 WO 0079074A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- floor
- wood
- adhesives
- covering elements
- Prior art date
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/022—Flooring consisting of parquetry tiles on a non-rollable sub-layer of other material, e.g. board, concrete, cork
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/0215—Flooring or floor layers composed of a number of similar elements specially adapted for being adhesively fixed to an underlayer; Fastening means therefor; Fixing by means of plastics materials hardening after application
- E04F15/02155—Adhesive means specially adapted therefor, e.g. adhesive foils or strips
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
Definitions
- the invention relates to a floor consisting of a curable adhesive spread on a sub-floor in a continuous layer and of covering elements made of wood or a wood-based material that are fully connected to the adhesive on their surface to be bonded.
- Adhesives which are composed of binders based on natural and / or synthetic resins with suitable solvents and additives are usually used to bond the covering elements, which are designed, for example, as parquet strips.
- the parquet adhesives according to the applicable DIN 281 have a shear strength of at least 3 to 3.5 N / mm 2 , which leads to a hard and brittle connection of the covering elements to the sub-floor.
- the adhesive is applied with a notched trowel.
- When laying parquet it must also be taken into account that the parquet wood expands when it absorbs moisture or shrinks when it dries back. When laying, the parquet wood usually contains 9% water.
- the moisture can change due to water absorption in the fresh building via the sub-floor or the surroundings or due to variable air humidity at the turn of the year.
- the resulting expansion and contraction must be absorbed or absorbed by the parquet adhesive.
- the parquet rods shrink when they are re-dried. Since the hard parquet adhesives large joints between the parquet bars often result.
- the object of the invention is to develop a floor which is able to transmit the shear forces from wood covering elements which occur during moisture absorption and re-drying to the sub-floor without tearing open the adhesive connection and bulging the floor covering.
- the solution according to the invention is based on the idea that the forces occurring when the covering elements expand and shrink can only be transferred to the sub-floor without an inadmissible local increase in force if they are evenly reduced over the entire adhesive surface within the adhesive layer.
- the adhesive layer has a thickness of 0.5 to 5 mm and that the adhesive has a tensile shear strength in the hardened state, which is smaller than that of the sub-floor.
- the average shear strength of cement screed is approximately 1.2 N / mm 2 . Accordingly, an adhesive is selected whose shear strength is less than 1.2 N / mm 2 , preferably 0.6 to 1.0 N / mm 2 .
- a reaction adhesive is advantageously chosen which cures with a Shore hardness (A) of 20 to 35. With these measures it is achieved that in the event of expansion or shrinkage, the forces acting on the adhesive layer are distributed uniformly over the entire adhesive surface. There are no force or pressure peaks that could lead to detachment or breakage of the adhesive connection. The distribution of forces ensures that the floor covering can deform less even when over-humidified or when it dries back. The covering elements are supported and held over a large area without partial breaks in the adhesive. This prevents the plywood from bulging out. Conversely, the joint formation is also reduced in the case of re-drying. Investigations have shown that the covering elements are somewhat compressed at their contact joints in the event of over-moistening.
- the adhesive consists of a reaction adhesive, preferably of polyurethane or polyurethane hybrid that cures with the absorption of water.
- the adhesive can consist of MS polymers (Modified Silicons).
- the invention further relates to the use of elastic adhesives with a high elongation at break, which cure with a tensile shear strength of less than 1.2 N / mm 2 , preferably from 0.6 to 1.0 N / mm 2 , for bonding Wooden floors on a sub-floor, preferably made of screed or concrete.
- the adhesive according to the invention is advantageously used Apply a layer thickness of 0.5 to 5 mm on the sub-floor using a notched trowel.
- FIG. 1 shows a section through a wooden floor.
- Fig. 2 is a shear stress-strain diagram for DIN parquet adhesives and adhesives according to the invention.
- the parquet floor shown in FIG. 1 in a sectional view consists of an adhesive 12 spread from a subfloor 10 made of screed in a continuous layer and of parquet bars 16 connected to the surface 12 to be bonded over its entire surface.
- the adhesive expediently consists of one-component polyurethane that cures with water absorption, which in the cured state has a shear strength ⁇ of less than 1.2 N / mm 2 .
- the shear strength ⁇ is the quotient of the maximum force F max and the adhesive area A of the parquet adhesive connection:
- the stress-strain curve ⁇ f ( ⁇ ) of various adhesives 1 and 2 is shown in the stress-strain diagram according to FIG. 2.
- the end of the respective curve defines the tensile shear strength of the adhesive used, which is approximately 3.5 N / mm 2 for DIN adhesives 1 and approximately 0.7 N / mm 2 for the adhesives 2 according to the invention.
- the average tensile shear strength of cement screed is also shown in the diagram in dashed line 3 as a reference value.
- the adhesive 2 according to the invention belongs to the elastic adhesives, while the parquet adhesives 1 according to DIN 281 are inelastic.
- the elastic parquet bonding does not allow any movement of the wood due to the even distribution of tension.
- the bond is shear resistant.
- a material-appropriate connection from the parquet to the screed is guaranteed:
- the tensile shear strength of the proposed elastic adhesives 2 of 0.7 N / mm 2 is significantly lower than the surface strength of the screed (1, 2 N / mm 2 ).
- the hardness of the cured adhesive 2 is approximately 20 to 30 Shore (A). There is therefore no screed damage. For this reason, a primer is not required to consolidate the screed surface.
- the rigid DIN adhesives with 3.5 N / mm 2 are significantly above the tensile shear strength of the screed.
- tension peaks occur at the edges of the covering elements.
- the forces generated by the movement of the wood are not reduced across the surface.
- Even an increase in the adhesive area does not lead to an improvement.
- elastic bonding on the other hand, the force is distributed over the entire adhesive surface: there are no tension peaks. As a result, significantly higher forces can be transmitted with less tensile stress on the subsurface.
- elastic bonding there is hardly any shifting between the parquet elements. In addition, an unraveling of the parquet elements is avoided.
- parquet adhesives The general properties of the parquet adhesives used are as follows:
- the invention relates to a wooden floor, consisting of a curable adhesive 12 spread on a sub-floor 10 in a continuous layer and covering surface 16 of wood or a wood-based material that is completely bonded to the adhesive on its surface 14.
- the adhesive layer 12 has a thickness of 0.5 to 5 mm and that the adhesive 12 in the hardened state has a tensile shear strength which is smaller than that of the subfloor 10 and is at most 1.2 N / mm 2 .
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00935209A EP1187960A1 (de) | 1999-06-18 | 2000-06-15 | Holzfussboden |
US10/009,959 US7210276B1 (en) | 1999-06-18 | 2000-06-15 | Wooden floor |
JP2001505407A JP2003502537A (ja) | 1999-06-18 | 2000-06-15 | 木製の床 |
CA002377588A CA2377588A1 (en) | 1999-06-18 | 2000-06-15 | Wooden floor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19928030A DE19928030A1 (de) | 1999-06-18 | 1999-06-18 | Holzfußboden |
DE19928030.3 | 1999-06-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000079074A1 true WO2000079074A1 (de) | 2000-12-28 |
WO2000079074A8 WO2000079074A8 (de) | 2001-04-12 |
Family
ID=7911784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2000/005488 WO2000079074A1 (de) | 1999-06-18 | 2000-06-15 | Holzfussboden |
Country Status (6)
Country | Link |
---|---|
US (1) | US7210276B1 (de) |
EP (1) | EP1187960A1 (de) |
JP (1) | JP2003502537A (de) |
CA (1) | CA2377588A1 (de) |
DE (1) | DE19928030A1 (de) |
WO (1) | WO2000079074A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1462588A2 (de) * | 2003-03-29 | 2004-09-29 | Parkett Herter GmbH & Co. KG | Zwei-Schicht-Fertigparkett |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1681405A1 (de) * | 2005-01-13 | 2006-07-19 | Berry Finance Nv | Fussbodenpaneel |
EP1852482B1 (de) * | 2006-05-05 | 2009-01-28 | Wakol GmbH | Parkettklebstoff und Verfahren zur Verhinderung oder Verminderung der Abgabe von organischen Lösungsmitteln aus Klebstoffen |
JP5430057B2 (ja) * | 2007-07-20 | 2014-02-26 | 大建工業株式会社 | 床材の施工構造、床材の除去方法及び床材の更新方法 |
US8166718B2 (en) * | 2008-10-10 | 2012-05-01 | Liu David C | Horizontally engineered hardwood floor and method of installation |
WO2011005511A2 (en) * | 2009-06-22 | 2011-01-13 | Sony Corporation | A method of compression of graphics images and videos |
DE102009034774A1 (de) | 2009-07-25 | 2011-01-27 | Bona Gmbh Deutschland | Auftragsdüse für viskose Klebstoffe |
BE1020576A3 (nl) * | 2012-03-21 | 2014-01-07 | Unilin Bvba | Vloerpaneel en werkwijze voor het vervaardigen van vloerpanelen. |
GB201403551D0 (en) * | 2014-02-28 | 2014-04-16 | Fujifilm Mfg Europe Bv | Membrane stacks |
EP3179562A1 (de) * | 2015-12-09 | 2017-06-14 | Teleste Oyj | Anordnung für einen koaxialkabelverbinder |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH331526A (de) * | 1953-06-24 | 1958-07-31 | Seylaz Marcel | Verfahren zum Aufleimen von Holzfussböden auf Betonunterlagen |
GB1558408A (en) * | 1975-07-07 | 1980-01-03 | Omholt Ray | Wood flooring system |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1223089B (de) | 1961-07-15 | 1966-08-18 | Rudolf K Siener | Verfahren zur Herstellung von mit loesungsmittel-freien Selbstklebern verschenen Fussbodenbelaegen |
US3365850A (en) * | 1965-03-03 | 1968-01-30 | Mari & Sons Flooring Co Inc | Dimensionally stable wood flooring |
US4233793A (en) * | 1975-07-07 | 1980-11-18 | Omholt Ray | Resiliently cushioned adhesive-applied wood flooring system and method of making the same |
US4360992A (en) * | 1978-11-22 | 1982-11-30 | Marino Vincent J | Dimensionally stable wood flooring |
US4543765A (en) * | 1980-06-18 | 1985-10-01 | Barrett Lawrence G | Unitized floor panel and method of laying the same |
US4416100A (en) * | 1981-09-04 | 1983-11-22 | Troendle, Inc. | Modular wooden floor units and method of manufacture thereof |
US5227409A (en) * | 1988-12-20 | 1993-07-13 | The Dow Chemical Company | Removable polyurethane adhesive |
US5255482A (en) * | 1989-11-08 | 1993-10-26 | Loretta A. Whitacre | Tile flooring structure |
US5137764A (en) * | 1990-12-06 | 1992-08-11 | Doyle Dennis J | Floor structure incorporating a vapor and gas barrier |
NL9301034A (nl) * | 1993-06-15 | 1995-01-02 | Osbe Parket B V | Werkwijze voor het leggen van een vloer. |
DE4327475C2 (de) * | 1993-08-16 | 1999-04-22 | Schott Glas | Verfahren zur Ausbildung einer dauerelastischen, im Demontagefall leicht lösbaren Klebeverbindung |
US5721302A (en) * | 1994-06-06 | 1998-02-24 | Wood; Benny R. | Water dispersible adhesive |
DE29702871U1 (de) * | 1997-02-19 | 1997-04-03 | Parkett Franz Gmbh | Diele für Parkettböden |
US6354058B1 (en) * | 1999-06-02 | 2002-03-12 | Christopher H. Lewis | Method and apparatus for laying tile |
-
1999
- 1999-06-18 DE DE19928030A patent/DE19928030A1/de not_active Ceased
-
2000
- 2000-06-15 CA CA002377588A patent/CA2377588A1/en not_active Abandoned
- 2000-06-15 US US10/009,959 patent/US7210276B1/en not_active Expired - Fee Related
- 2000-06-15 JP JP2001505407A patent/JP2003502537A/ja active Pending
- 2000-06-15 WO PCT/EP2000/005488 patent/WO2000079074A1/de not_active Application Discontinuation
- 2000-06-15 EP EP00935209A patent/EP1187960A1/de not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH331526A (de) * | 1953-06-24 | 1958-07-31 | Seylaz Marcel | Verfahren zum Aufleimen von Holzfussböden auf Betonunterlagen |
GB1558408A (en) * | 1975-07-07 | 1980-01-03 | Omholt Ray | Wood flooring system |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1462588A2 (de) * | 2003-03-29 | 2004-09-29 | Parkett Herter GmbH & Co. KG | Zwei-Schicht-Fertigparkett |
EP1462588A3 (de) * | 2003-03-29 | 2004-10-06 | Parkett Herter GmbH & Co. KG | Zwei-Schicht-Fertigparkett |
Also Published As
Publication number | Publication date |
---|---|
EP1187960A1 (de) | 2002-03-20 |
DE19928030A1 (de) | 2000-12-21 |
WO2000079074A8 (de) | 2001-04-12 |
US7210276B1 (en) | 2007-05-01 |
CA2377588A1 (en) | 2000-12-28 |
JP2003502537A (ja) | 2003-01-21 |
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