WO2001001460A3 - Temperature controlled wafer chuck - Google Patents

Temperature controlled wafer chuck Download PDF

Info

Publication number
WO2001001460A3
WO2001001460A3 PCT/US2000/002236 US0002236W WO0101460A3 WO 2001001460 A3 WO2001001460 A3 WO 2001001460A3 US 0002236 W US0002236 W US 0002236W WO 0101460 A3 WO0101460 A3 WO 0101460A3
Authority
WO
WIPO (PCT)
Prior art keywords
chuck
top surface
temperature controlled
wafer chuck
temperature
Prior art date
Application number
PCT/US2000/002236
Other languages
French (fr)
Other versions
WO2001001460A9 (en
WO2001001460A2 (en
Inventor
Simon Costello
Tuyen Paul Pham
Original Assignee
Trio Tech Internat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trio Tech Internat filed Critical Trio Tech Internat
Priority to AU27433/00A priority Critical patent/AU2743300A/en
Publication of WO2001001460A2 publication Critical patent/WO2001001460A2/en
Publication of WO2001001460A3 publication Critical patent/WO2001001460A3/en
Publication of WO2001001460A9 publication Critical patent/WO2001001460A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Abstract

A temperature-controlled semiconductor wafer chuck system, the chuck being configured for mounting on a prober stage of a wafer probe test station. The chuck having a top surface and a bottom surface including a heat sink configuration for removal of thermal energy from the chuck. A primary heater configured to add heat to the chuck is adjacent the top surface of the chuck. A secondary heater is adjacent to the bottom of the chuck, whereby the temperature of the top surface of the chuck and the bottom of the chuck can be independently controlled.
PCT/US2000/002236 1999-01-26 2000-01-26 Temperature controlled wafer chuck WO2001001460A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU27433/00A AU2743300A (en) 1999-01-26 2000-01-27 A temperature controlled wafer chuck system with low thermal resistance

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/238,009 1999-01-26
US09/238,009 US6583638B2 (en) 1999-01-26 1999-01-26 Temperature-controlled semiconductor wafer chuck system

Publications (3)

Publication Number Publication Date
WO2001001460A2 WO2001001460A2 (en) 2001-01-04
WO2001001460A3 true WO2001001460A3 (en) 2001-05-03
WO2001001460A9 WO2001001460A9 (en) 2002-09-06

Family

ID=22896111

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/002236 WO2001001460A2 (en) 1999-01-26 2000-01-26 Temperature controlled wafer chuck

Country Status (3)

Country Link
US (2) US6583638B2 (en)
AU (1) AU2743300A (en)
WO (1) WO2001001460A2 (en)

Families Citing this family (149)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6340895B1 (en) * 1999-07-14 2002-01-22 Aehr Test Systems, Inc. Wafer-level burn-in and test cartridge
JP4256031B2 (en) * 1999-07-27 2009-04-22 東京エレクトロン株式会社 Processing apparatus and temperature control method thereof
US8076216B2 (en) 2008-11-11 2011-12-13 Advanced Inquiry Systems, Inc. Methods and apparatus for thinning, testing and singulating a semiconductor wafer
EP1356499A2 (en) 2000-07-10 2003-10-29 Temptronic Corporation Wafer chuck with interleaved heating and cooling elements
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6967177B1 (en) * 2000-09-27 2005-11-22 Lsi Logic Corporation Temperature control system
DE20114544U1 (en) 2000-12-04 2002-02-21 Cascade Microtech Inc wafer probe
US20030016727A1 (en) * 2001-06-29 2003-01-23 Tokyo Electron Limited Method of and apparatus for measuring and controlling substrate holder temperature using ultrasonic tomography
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
WO2003020467A1 (en) * 2001-08-31 2003-03-13 Cascade Microtech, Inc. Optical testing device
US7163587B2 (en) * 2002-02-08 2007-01-16 Axcelis Technologies, Inc. Reactor assembly and processing method
DE10216786C5 (en) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Method and apparatus for conditioning semiconductor wafers and / or hybrids
US6745575B2 (en) 2002-07-11 2004-06-08 Temptronic Corporation Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules
TWI260725B (en) 2002-07-11 2006-08-21 Temptronic Corp Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules and method for supporting a workpiece with the workpiece chuck
US6819131B2 (en) * 2002-07-11 2004-11-16 Motorola, Inc. Passive, grease-free cooled device fixtures
JP4659328B2 (en) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 Probe device for controlling the temperature of an object to be inspected
US20040124865A1 (en) * 2002-12-26 2004-07-01 Chuang Kun Fu Method and structure for wafer-level reliability electromigration and stress migration test by isothermal heater
US7079760B2 (en) * 2003-03-17 2006-07-18 Tokyo Electron Limited Processing system and method for thermally treating a substrate
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
CN1301534C (en) * 2003-07-15 2007-02-21 旺宏电子股份有限公司 Method and apparatus for preventing abnormal event of temperature and gas flow of semiconductor boiler tube
KR100875527B1 (en) * 2003-08-18 2008-12-23 가부시키가이샤 아드반테스트 Temperature control device and temperature control method
US7310230B2 (en) * 2003-08-21 2007-12-18 Delta Design, Inc. Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure
KR100536610B1 (en) * 2003-08-29 2005-12-14 삼성전자주식회사 Apparatus For Calibrating Probe Station
US20050067146A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Two phase cooling system method for burn-in testing
US7129731B2 (en) * 2003-09-02 2006-10-31 Thermal Corp. Heat pipe with chilled liquid condenser system for burn-in testing
US7013956B2 (en) * 2003-09-02 2006-03-21 Thermal Corp. Heat pipe evaporator with porous valve
US20050067147A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Loop thermosyphon for cooling semiconductors during burn-in testing
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US6976782B1 (en) 2003-11-24 2005-12-20 Lam Research Corporation Methods and apparatus for in situ substrate temperature monitoring
US20070248515A1 (en) * 2003-12-01 2007-10-25 Tompa Gary S System and Method for Forming Multi-Component Films
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
JP2007517231A (en) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド Active wafer probe
KR100662907B1 (en) * 2004-09-11 2007-01-02 삼성전자주식회사 Troidal line filter and method for winding coil of troidal line filter
DE202005021435U1 (en) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Double-sided test setups
US7061264B2 (en) * 2004-09-29 2006-06-13 Agere Systems, Inc. Test semiconductor device and method for determining Joule heating effects in such a device
US7091737B2 (en) 2004-10-01 2006-08-15 Intel Corporation Apparatus and methods for self-heating burn-in processes
CN100353516C (en) * 2004-10-20 2007-12-05 力晶半导体股份有限公司 Semiconductor machine
US7304490B2 (en) * 2004-11-05 2007-12-04 Solid State Measurements, Inc. In-situ wafer and probe desorption using closed loop heating
WO2006060134A2 (en) * 2004-11-15 2006-06-08 Cree, Inc. Restricted radiated heating assembly for high temperature processing
US7731798B2 (en) * 2004-12-01 2010-06-08 Ultratech, Inc. Heated chuck for laser thermal processing
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
DE102005001163B3 (en) * 2005-01-10 2006-05-18 Erich Reitinger Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device
US7218129B2 (en) * 2005-01-12 2007-05-15 International Business Machines Corporation System, apparatus and method for controlling temperature of an integrated circuit under test
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
TWI288240B (en) * 2005-06-14 2007-10-11 Siliconware Precision Industries Co Ltd Electronic component test system including temperature measurement by light
JP4356661B2 (en) * 2005-07-25 2009-11-04 住友電気工業株式会社 Wafer holder and wafer prober equipped with the same
JP4950688B2 (en) * 2006-03-13 2012-06-13 東京エレクトロン株式会社 Mounting device
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7453277B2 (en) * 2006-06-06 2008-11-18 Advanced Inquiry Systems, Inc. Apparatus for full-wafer test and burn-in mechanism
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US8222511B2 (en) * 2006-08-03 2012-07-17 Gentherm Thermoelectric device
US20080088301A1 (en) * 2006-09-29 2008-04-17 Yie Wei Tan Testing device handler
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
KR20080053768A (en) * 2006-12-11 2008-06-16 삼성전자주식회사 Wafer chuck and apparatus having the same and method for testing the electrical characteristic of wafer
DE102008013978B4 (en) 2007-03-16 2021-08-12 Cascade Microtech, Inc. Chuck with triaxial structure
DE102008021242A1 (en) * 2007-04-30 2008-11-13 Suss Microtec Test Systems Gmbh Device and method for controlling a movement device
US20080286344A1 (en) * 2007-05-16 2008-11-20 Olivia Darmuzey Solid form
KR100891384B1 (en) * 2007-06-14 2009-04-02 삼성모바일디스플레이주식회사 Flexible substrate bonding apparatus and debonding apparatus
US9105809B2 (en) 2007-07-23 2015-08-11 Gentherm Incorporated Segmented thermoelectric device
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7877827B2 (en) 2007-09-10 2011-02-01 Amerigon Incorporated Operational control schemes for ventilated seat or bed assemblies
JP5074878B2 (en) * 2007-10-15 2012-11-14 東京エレクトロン株式会社 Inspection device
CN105291920B (en) 2008-02-01 2018-12-25 金瑟姆股份公司 Condensation and humidity sensor for thermoelectric device
WO2010009422A1 (en) 2008-07-18 2010-01-21 Amerigon Incorporated Climate controlled bed assembly
US7863890B2 (en) * 2008-08-19 2011-01-04 Kia Silverbrook Apparatus for testing integrated circuitry
US7804292B2 (en) * 2008-08-19 2010-09-28 Silverbrook Research Pty Ltd Method for testing integrated circuits mounted on a carrier
US7786723B2 (en) * 2008-08-19 2010-08-31 Silverbrook Research Pty Ltd Test stage for a carrier having printhead integrated circuitry thereon
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
KR101015600B1 (en) * 2008-12-19 2011-02-17 세크론 주식회사 Stage unit for a probe station and apparatus for testing a wafer including the same
DE102009018434B4 (en) * 2009-04-22 2023-11-30 Ev Group Gmbh Receiving device for holding semiconductor substrates
NL2004980A (en) * 2009-07-13 2011-01-17 Asml Netherlands Bv Heat transfers assembly, lithographic apparatus and manufacturing method.
JP5407749B2 (en) * 2009-10-26 2014-02-05 日本電気株式会社 In-circuit test fixture cooling structure
US8519729B2 (en) * 2010-02-10 2013-08-27 Sunpower Corporation Chucks for supporting solar cell in hot spot testing
SG184008A1 (en) * 2010-03-12 2012-10-30 Cascade Microtech Inc System for testing semiconductors
JP5620574B2 (en) 2010-06-07 2014-11-05 カスケード マイクロテックインコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ High voltage chuck for probe station
US9719169B2 (en) * 2010-12-20 2017-08-01 Novellus Systems, Inc. System and apparatus for flowable deposition in semiconductor fabrication
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
US8618513B2 (en) 2011-05-23 2013-12-31 Kla-Tencor Corporation Apparatus and methods for forming an electrical conduction path through an insulating layer
SG188036A1 (en) 2011-08-18 2013-03-28 Asml Netherlands Bv Lithographic apparatus, support table for a lithographic apparatus and device manufacturing method
US9689935B2 (en) * 2011-09-30 2017-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Hall-effect measurement apparatus
US9685599B2 (en) 2011-10-07 2017-06-20 Gentherm Incorporated Method and system for controlling an operation of a thermoelectric device
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US9891541B2 (en) * 2012-05-17 2018-02-13 Asml Netherlands B.V. Thermal conditioning unit, lithographic apparatus and device manufacturing method
US9984866B2 (en) * 2012-06-12 2018-05-29 Component Re-Engineering Company, Inc. Multiple zone heater
US9224626B2 (en) 2012-07-03 2015-12-29 Watlow Electric Manufacturing Company Composite substrate for layered heaters
US9673077B2 (en) 2012-07-03 2017-06-06 Watlow Electric Manufacturing Company Pedestal construction with low coefficient of thermal expansion top
KR101434425B1 (en) 2013-01-31 2014-09-02 (주) 예스티 Heater having rapid cooling function
US20140251214A1 (en) * 2013-03-06 2014-09-11 Applied Materials, Inc. Heated substrate support with flatness control
JP6382295B2 (en) * 2013-03-15 2018-08-29 コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド Multi-zone heater
KR101794744B1 (en) 2013-08-14 2017-12-01 에프이아이 컴파니 Circuit probe for charged particle beam system
US9847222B2 (en) 2013-10-25 2017-12-19 Lam Research Corporation Treatment for flowable dielectric deposition on substrate surfaces
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
US20150162169A1 (en) * 2013-12-05 2015-06-11 Taiwan Semiconductor Manufacturing Co., Ltd. Etching apparatus and method
SG11201606361QA (en) * 2014-02-14 2016-09-29 Applied Materials Inc Gas cooled substrate support for stabilized high temperature deposition
JP6652493B2 (en) 2014-02-14 2020-02-26 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ Conductive and convective temperature control sheet
US9678148B2 (en) * 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US9995767B2 (en) * 2014-06-06 2018-06-12 Advantest Corporation Universal container for device under test
US9638749B2 (en) 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
US9618574B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
US9618570B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
CN105374657B (en) * 2014-07-18 2017-07-25 中微半导体设备(上海)有限公司 Plasma processing apparatus and its temprature control method
US10049921B2 (en) 2014-08-20 2018-08-14 Lam Research Corporation Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor
CN107251247B (en) 2014-11-14 2021-06-01 查尔斯·J·柯西 Heating and cooling techniques
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US9714914B2 (en) 2015-01-20 2017-07-25 Taiwan Semiconductor Manufacturing Co., Ltd. CMOS compatible biofet
US9968927B2 (en) 2015-05-22 2018-05-15 Taiwan Semiconductor Manufacturing Co., Ltd. Optical biosensor device
US9916977B2 (en) 2015-11-16 2018-03-13 Lam Research Corporation Low k dielectric deposition via UV driven photopolymerization
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
US10499461B2 (en) * 2015-12-21 2019-12-03 Intel Corporation Thermal head with a thermal barrier for integrated circuit die processing
SE539700C2 (en) * 2016-05-09 2017-11-07 Blb Ind Ab A table system for an additive manufacturing machinery for plastic components
US10522400B2 (en) * 2016-05-27 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Embedded temperature control system for a biosensor
KR102609312B1 (en) 2016-09-13 2023-12-01 삼성전자주식회사 Apparatus and Method for improving wafer warpage
TWI661207B (en) * 2016-09-26 2019-06-01 旺矽科技股份有限公司 Chip probing equipment
US10101295B2 (en) 2016-12-15 2018-10-16 Taiwan Semiconductor Manufacturing Co., Ltd. On-chip reference electrode for biologically sensitive field effect transistor
US10509425B2 (en) * 2017-01-20 2019-12-17 Lam Research Corporation Virtual metrology method for ESC temperature estimation using thermal control elements
KR101877667B1 (en) * 2017-02-28 2018-07-11 세메스 주식회사 Method of testing semiconductor packages
US10677842B2 (en) 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
JP6827385B2 (en) * 2017-08-03 2021-02-10 東京エレクトロン株式会社 Inspection system
WO2019180785A1 (en) * 2018-03-19 2019-09-26 日新電機株式会社 Substrate heating system and substrate processing device
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
JP2020047860A (en) * 2018-09-20 2020-03-26 東京エレクトロン株式会社 Inspection device and inspection method
JP7213080B2 (en) * 2018-12-19 2023-01-26 東京エレクトロン株式会社 Mounting table
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
DE102019005093A1 (en) * 2019-07-22 2021-01-28 Att Advanced Temperature Test Systems Gmbh METHOD FOR TEMPERATURE CONTROL AND - REGULATION OF A CHUCK FOR A WAFER, A TEMPERATURE CONTROL DEVICE FOR TEMPERATURE CONTROLLING OF A CHUCK AND A WAFER TEST SYSTEM FOR TESTING A WAFER
JP6845286B2 (en) * 2019-08-05 2021-03-17 日本発條株式会社 A stage, a film forming apparatus or film processing apparatus provided with a stage, and a temperature control method for a substrate
CN111949001A (en) * 2019-09-23 2020-11-17 宁波鲍斯能源装备股份有限公司 Test system and test method of controller for air compressor
DE102019128942A1 (en) * 2019-10-28 2021-04-29 Infineon Technologies Ag Prober with cooling mechanism for direct cooling of a device under test
US20220413015A1 (en) 2019-11-27 2022-12-29 Kyocera Corporation Circuit board, probe card substrate, and probe card
US11378619B2 (en) 2019-12-18 2022-07-05 Formfactor, Inc. Double-sided probe systems with thermal control systems and related methods
US20230085111A1 (en) * 2020-01-30 2023-03-16 Kyocera Corporation Heater substrate, probe card substrate, and probe card
JP7449799B2 (en) * 2020-07-09 2024-03-14 東京エレクトロン株式会社 Temperature adjustment method and inspection device for mounting table
JP2022071468A (en) * 2020-10-28 2022-05-16 東京エレクトロン株式会社 Mounting table, inspection device, and inspection method
CN113124807A (en) * 2021-03-05 2021-07-16 深圳市福浪电子有限公司 Crystal oscillator box for crystal oscillator probe
US20230058964A1 (en) * 2021-08-18 2023-02-23 Mpi Corporation Optical detection system and alignment method for a predetermined target object
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11828795B1 (en) 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01216550A (en) * 1988-02-25 1989-08-30 Nec Corp Temperature control stage for semiconductor wafer prober
US5584971A (en) * 1993-07-02 1996-12-17 Tokyo Electron Limited Treatment apparatus control method
JPH1041375A (en) * 1996-07-25 1998-02-13 Sony Corp Hot chuck temp. control apparatus
JPH1083960A (en) * 1996-09-05 1998-03-31 Nec Corp Sputtering device
JPH10135315A (en) * 1996-10-29 1998-05-22 Tokyo Electron Ltd Sample holder temp. controller and testing apparatus
US6091060A (en) * 1997-12-31 2000-07-18 Temptronic Corporation Power and control system for a workpiece chuck

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791364A (en) * 1985-08-20 1988-12-13 Thermonics Incorporated Thermal fixture for testing integrated circuits
US4872835A (en) 1986-07-24 1989-10-10 Hewlett-Packard Company Hot chuck assembly for integrated circuit wafers
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
FR2631165B1 (en) * 1988-05-05 1992-02-21 Moulene Daniel TEMPERATURE CONDITIONING MEDIUM FOR SMALL OBJECTS SUCH AS SEMICONDUCTOR COMPONENTS AND THERMAL REGULATION METHOD USING THE SAME
DE3943478C2 (en) * 1989-05-08 1995-11-16 Philips Electronics Nv Workpiece carrier for a disc-shaped workpiece, as well as a vacuum treatment system
US5001423A (en) 1990-01-24 1991-03-19 International Business Machines Corporation Dry interface thermal chuck temperature control system for semiconductor wafer testing
US5578532A (en) * 1990-07-16 1996-11-26 Novellus Systems, Inc. Wafer surface protection in a gas deposition process
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5435379A (en) * 1992-08-14 1995-07-25 Texas Instruments Incorporated Method and apparatus for low-temperature semiconductor processing
US5550482A (en) * 1993-07-20 1996-08-27 Tokyo Electron Kabushiki Kaisha Probe device
US5595241A (en) * 1994-10-07 1997-01-21 Sony Corporation Wafer heating chuck with dual zone backplane heating and segmented clamping member
US5610529A (en) 1995-04-28 1997-03-11 Cascade Microtech, Inc. Probe station having conductive coating added to thermal chuck insulator
US6104203A (en) 1995-05-16 2000-08-15 Trio-Tech International Test apparatus for electronic components
US5834946A (en) * 1995-10-19 1998-11-10 Mosaid Technologies Incorporated Integrated circuit test head
JP3639887B2 (en) * 1997-01-30 2005-04-20 東京エレクトロン株式会社 Inspection method and inspection apparatus
EP0915499B1 (en) * 1997-11-05 2011-03-23 Tokyo Electron Limited Semiconductor wafer holding apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01216550A (en) * 1988-02-25 1989-08-30 Nec Corp Temperature control stage for semiconductor wafer prober
US5584971A (en) * 1993-07-02 1996-12-17 Tokyo Electron Limited Treatment apparatus control method
JPH1041375A (en) * 1996-07-25 1998-02-13 Sony Corp Hot chuck temp. control apparatus
JPH1083960A (en) * 1996-09-05 1998-03-31 Nec Corp Sputtering device
JPH10135315A (en) * 1996-10-29 1998-05-22 Tokyo Electron Ltd Sample holder temp. controller and testing apparatus
US6032724A (en) * 1996-10-29 2000-03-07 Tokyo Electron Limited Temperature control apparatus for sample susceptor
US6091060A (en) * 1997-12-31 2000-07-18 Temptronic Corporation Power and control system for a workpiece chuck

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 531 (E - 851) 28 November 1989 (1989-11-28) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 06 30 April 1998 (1998-04-30) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 08 30 June 1998 (1998-06-30) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 10 31 August 1998 (1998-08-31) *

Also Published As

Publication number Publication date
WO2001001460A9 (en) 2002-09-06
US20020017916A1 (en) 2002-02-14
US6583638B2 (en) 2003-06-24
US6605955B1 (en) 2003-08-12
WO2001001460A2 (en) 2001-01-04
AU2743300A (en) 2001-01-31

Similar Documents

Publication Publication Date Title
WO2001001460A3 (en) Temperature controlled wafer chuck
WO1999034412A3 (en) Workpiece chuck
ES2163263T3 (en) SUSCEPTOR DESIGNS FOR SLIM SILICON CARBIDE FILMS.
DE69739660D1 (en) ADJUSTABLE, HIGH-TEMPERATURE HOLDER FOR PLASMA CVD OF A HIGH DENSITY
TW200741936A (en) Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober
DE60045384D1 (en) MORE ZONE HEATING RESISTANCE
TW200721363A (en) Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit
ATE388482T1 (en) LOCAL HEATING AND COOLING OF SUBSTRATES
EP1235257A4 (en) Semiconductor-manufacturing apparatus
WO1999023691A3 (en) Improved low mass wafer support system
EP0798773A3 (en) Method of evaluating and method and apparatus for thermally processing semiconductor wafer
WO2002019400A1 (en) Ceramic heater for semiconductor manufacturing and inspecting equipment
EP0762495A3 (en) Thermal interface for a heat sink of a plurality of integrated circuits mounted on a substrate
DE602004028910D1 (en) NEN ON A WAVER SURFACE WITH THE HELP OF LOCAL TEMPERATURE CONTROL
WO1999060609A3 (en) Multi-function chamber for a substrate processing system
TW200616139A (en) Method and apparatus for controlling temperature of a substrate
EP1356510A4 (en) Wafer scale molding of protective caps
GB9901810D0 (en) Process for wet etching of semiconductor wafers
DE60034862D1 (en) High temperature electrostatic holder
EP1075015A3 (en) A method and apparatus for thermal control of a semiconductor substrate
FR2779867B1 (en) MOUNTING STRUCTURE AND METHOD FOR MOUNTING A SEMICONDUCTOR DEVICE
WO2000019775B1 (en) Wafer level burn-in and test thermal chuck and method
TW373251B (en) Arrangement for processing a substrate wafer and operating method thereof
WO2001067505A3 (en) Substrate thermal management system
WO2003014753A3 (en) Methods and apparatus for testing a semiconductor with temperature desoak

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

COP Corrected version of pamphlet

Free format text: PAGES 1/16-16/16, DRAWINGS, REPLACED BY NEW PAGES 1/16-16/16; DUE TO LATE TRANSMITTAL BY THE RECEIVING OFFICE

122 Ep: pct application non-entry in european phase