WO2001029929A1 - Solder ball terminal - Google Patents
Solder ball terminal Download PDFInfo
- Publication number
- WO2001029929A1 WO2001029929A1 PCT/US2000/040937 US0040937W WO0129929A1 WO 2001029929 A1 WO2001029929 A1 WO 2001029929A1 US 0040937 W US0040937 W US 0040937W WO 0129929 A1 WO0129929 A1 WO 0129929A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder ball
- terminal
- socket
- body portion
- connection socket
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention generally relates to electrical connectors and more particularly to a solder ball terminal which facilitates the connection of electrical leads to surface mount ball grid array devices, land grid array devices and board to board connections .
- 5,030,144 to Seidler discloses a solder-bearing lead including a rectangular bar having a pair of prongs for receiving a solder mass therebetween.
- the bar is bent at a 90° angle so that the portion holding the solder mass is parallel to the mounting surface, and the opposite portion extends perpendicularly from the mounting surface.
- this device may be effective in connecting terminals to the mounting surface, it has several drawbacks. For instance, due to the offset design, the alignment of the connector is complicated and, once the connections are made, the offset connector can be difficult to design around.
- a more precise method of connecting terminals to mounting pads involves a technology in which the mounting pads are arranged as a grid and a number of solder balls are used to connect the terminals to the mounting pads.
- solder balls are configured to enable a more precise alignment of the terminal with the mounting pad because the initial contact point on the mounting pad is a round point on the surface of the solder ball, rather than a wider or irregularly-shaped portion of the solder mass described above.
- This more precise alignment capability enables the spacing between the terminals to be greatly minimized as compared to the device described above with respect to the '144 patent.
- Conventional solder ball terminals are formed by elevating the temperature of a solder ball to just below the liquid state to cause the solder ball 524 to adhere to the end 522 of a metal terminal 510 (Fig. 8, prior art) . Although generally effective, there are several disadvantages to conventional solder ball terminals.
- the terminal can lack good mechanical security (and hence electrical continuity) since the solder ball can be prone to breaking off from the smooth, flat surface of the terminal.
- the shape (i.e. roundness) of the solder ball can be affected during the attachment of the ball to the terminal which, in turn, can adversely affect attachment to the mounting pad.
- Proper alignment of the solder ball to the terminal can likewise be compromised during the attachment procedure.
- the solder ball is attached to the end of the terminal, the distance between the terminal and the mounting pad prior to the application of heat to the solder ball is greater than the diameter of the solder ball, thus increasing the risk of the terminal becoming misaligned with the mounting pad while the solder ball is being liquefied.
- the present invention provides a solder ball terminal in which the solder ball is physically retained in a counterbored socket at a connection end of the terminal .
- a solder ball terminal which includes a body portion, a connection socket disposed at one end of the body portion, the socket including an interior wall terminating in an annular lip, wherein the annular lip defines an opening into the socket.
- the solder ball is disposed within the socket such that a portion of the solder ball which is less than half of the diameter of the solder ball, extends beyond the annular lip.
- the socket has a spherical shape, and a longitudinal axis of the terminal's body portion extends through a center point of the solder ball.
- a solder ball terminal for particular application in surface mount circuit board connections is disclosed.
- the terminal includes a body portion at a first end thereof and a head at a second end thereof, the head including a socket having an opening for receiving a solder ball such that a portion of the solder ball extends outwardly from the socket, beyond the opening.
- the body portion may also preferably include a male adaptor for connection to a second solder ball terminal.
- Fig. 1 is a partial cut-away view of the solder ball terminal of the present invention, the cut-away portion showing the configuration of the solder ball within the connection socket of the terminal;
- Fig. 2 is an end view of the solder ball terminal, as seen from line 2-2 in Fig. 1;
- Fig. 3 is a partial view of the solder ball terminal of the Fig. 1, showing the placement of the solder ball on a mounting pad before and after the application of heat to the solder ball;
- Fig. 4 is a partial view of the solder ball terminal of Fig.
- Fig. 5 is a partial cut-away view of an alternate embodiment of the solder ball terminal of Fig. 1, including a male adaptor at one end for connection to a socket
- Fig. 6 is a partial cut-away view of an alternate embodiment of the solder ball terminal of Fig. 1, including a closed end and a knurl
- Fig. 7 is a partial cut-away view of an alternate embodiment of the solder ball terminal of Fig. 1, including a pair of solder balls disposed within corresponding sockets at either end of the terminal
- Fig. 8 is a schematic view of a solder ball terminal of the prior art .
- solder ball terminal 10 includes a body portion 12 having a female socket 14 disposed at one end thereof and a head portion 16 disposed at an opposite end thereof.
- the body 12, socket 14, and head 16 are formed from a unitary piece of metal.
- Head 16 further includes a connection socket 18 which is defined internally by a wall 20, and which includes an annular lip 22 located at the distal end of the head 16.
- the socket 18 may preferably be spherical so that a solder ball 24 can be easily fitted or swedged into the socket 18.
- the solder ball 24 is formed from typical solder materials, such as tin and lead, and the diameter of the solder ball 24 is approximately 0.020" -0.030" in the present embodiment. It should be understood that any size solder ball may be used in conjunction with the present invention, provided that the spherical socket 18 is appropriately sized, as described below. As seen in Fig. 2, the reduced-diameter opening defined by the outermost tip 22a of the annular lip 22, shown by dotted dashed line 28, is smaller than a first diameter "D" of the solder ball 24. This configuration allows the solder ball to be securely retained within the socket 18 by the annular lip so that the solder ball does not disengage from the socket.
- Body 12 may also include a barb portion 17 for anchoring the terminal in an insulating mount, as is known in the art.
- connection socket 14 is preferably sized to receive an adapter or interposer from a second terminal for connection to both a circuit board and a microprocessor chip or for connection to electrical leads to the microprocessor.
- an adapter 129 is shown in Fig. 5 which represents an alternate embodiment of body portion 12, as described in greater detail below.
- solder ball terminal 10 with connection socket 14 in combination with terminal 110 and adapter 129 allows a simultaneous connection to be made between a microprocessor chip and a printed circuit board which reduces cost and the risk of damage to the system.
- Fig. 3 the method of attaching the solder ball terminal 10 to a substrate, or a mounting pad of a circuit board will be described.
- connection end or distal end 40 of the solder ball terminal 10 is shown in Fig. 3, including the head 16, socket 18, and the solder ball 24.
- the solder ball 24 is preferably brought into contact with a mounting pad 30 of the substrate, or circuit board 32.
- the distance d between the tip 22a of the annular lip 22 and the mounting pad is approximately 0.008" -0.013 " , depending on the terminal and solder ball size, which may vary, as would be known to one of skill in the art.
- solder paste having a thickness of approximately 0.006" may also be utilized on the substrate. In such a case, the terminal even closer to the solder paste than the substrate alone .
- the head of the terminal is typically soldered to the top of the solder ball to adhere the solder ball to the terminal (see Fig. 1A) .
- a distance (d 2 ) between the end of the terminal head 522 and the mounting pad 530 is equal to approximately the diameter of the solder ball, or 0.030", in the case of the solder ball as described herein.
- the reduction of this distance by more than 50% by mounting the solder ball within socket 18 enables the terminal 10 to be connected with more precision and less chance of misalignment, since the solder ball terminal can be brought more than 50% closer to the mounting pad (with or without solder paste), for a more direct contact.
- the terminal is twice as close to the mounting pad as prior art terminals, if the solder ball is not in direct contact with the pad, upon melting the solder will follow the flow of gravity toward the mounting pad, instead of toward the heat source (i.e.
- Fig. 3 Shown on the right side of Fig. 3 is the distal end 40 of the solder ball terminal 10 upon the application of heat to the solder ball 24. Once heat is applied, the solder ball melts, causing the terminal to move closer to the mounting pad 30. Since the original distance d is greatly reduced from the prior art, as discussed above, the terminal does not travel as far as prior art terminals before coming to rest on the solder mass 34, which is formed from the melted solder ball 24. As is known in the art, the amount of time that the solder is allowed to flow is precisely controlled so that the solder mass 34 does not run off of the mounting pad 30 into contact with adjacent mounting pads.
- the solder ball terminal 10 may also be utilized with a solder ball 124 having an inner core 126 and an outer coating 128 (Fig. 4), such solder balls being known in the art.
- the outer core 128 is preferably formed from a typical solder material having a low melting temperature
- the inner core 126 is preferably formed from a solder material having a much higher melting point than the outer coating 128.
- the formation of the head 16 of the terminal, including the annular lip 22 and the tip 22a, is identical to the terminal 10 shown in Fig. 1.
- Shown on the right side of Fig. 4 is distal end 40 of the terminal 10 which has been attached to mounting pad 30 of the substrate or circuit board 32.
- the outer coating 128 melts to form a solder mass 134, while the inner core 126 remains intact. Once the solder mass 134 is cooled, the terminal and the inner core 126 are electrically connected to the circuit board through the mounting pad 30.
- Figs. 5-7 alternate embodiments of the solder ball terminal 10 are shown. In the embodiments of Figs.
- the embodiment of the terminal 110 shown in Fig. 5 includes a head 116 having a socket 118 defined by a wall 120, and including an annular lip 122 having a tip 122a, as described above with respect to terminal 10 shown in Fig. 1.
- the body 112 of terminal 110 includes a male adapter 129 for connection to a socket, such as the socket 14 of terminal 10, or for connection to a through-hole on a printed circuit board (not shown) .
- solder ball terminal 10 with connection socket 14 in combination solder ball terminal 110 and adapter 129 allows a simultaneous connection to be made between a microprocessor chip and a printed circuit board, which reduces cost and the risk of damage to the system.
- Such terminals have particular application in surface mount circuit board connections.
- the body 112 may also include a barb portion 117 for anchoring the terminal in an insulating mount, as described above.
- the embodiment of terminal 210 as shown in Fig. 6, likewise includes a head 216 having a socket 218 defined by a wall 220, and including an annular lip 222 having a tip 222a, as described above with respect to terminal 10 shown in Fig. 1. This embodiment does not, however, include a female socket at an end opposite the head 216.
- terminal 210 has a closed end 219 and preferably includes a knurl 221 circumscribing a portion of the body 212.
- the embodiment of terminal 310 includes a first or distal end 340 having a head 316 with a socket 318 defined by a wall 320, and including an annular lip 322 having a tip 322a, as described above with respect to terminal 10 shown in Fig. 1.
- the second or proximal end 350 is preferably identical to the distal end 340 and likewise includes a head 316b with a socket 318b defined by a wall 320b, and including an annular lip 322b having a tip 322c.
- the proximal end may be connected to the distal end by a stepped body portion 312.
- the terminal may be attached for electrical connection at both ends, in the manner described above with reference to Figs. 3 and 4.
- one end, i.e. the head, of the terminal according to the present invention includes a socket defined by a wall and including an annular lip having a outermost tip
- the opposite end, i.e. body may take any number of forms.
- the body portion in all embodiments may include a barb, a knurl or other geometries, either alone or in combination, as would be known to those of skill in the art.
- the dimensions provided herein are not to be construed as limiting, but only as examples, and may be readily modified by one of skill in the art. Therefore, the above description should not be construed as limiting, but merely as exemplifications of an illustrative embodiment.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00974127A EP1226627A1 (en) | 1999-10-20 | 2000-09-19 | Solder ball terminal |
CA002388520A CA2388520C (en) | 1999-10-20 | 2000-09-19 | Solder ball terminal |
AU12540/01A AU1254001A (en) | 1999-10-20 | 2000-09-19 | Solder ball terminal |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/420,711 | 1999-10-20 | ||
US09/420,711 US6352437B1 (en) | 1999-10-20 | 1999-10-20 | Solder ball terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001029929A1 true WO2001029929A1 (en) | 2001-04-26 |
Family
ID=23667546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/040937 WO2001029929A1 (en) | 1999-10-20 | 2000-09-19 | Solder ball terminal |
Country Status (5)
Country | Link |
---|---|
US (1) | US6352437B1 (en) |
EP (1) | EP1226627A1 (en) |
AU (1) | AU1254001A (en) |
CA (1) | CA2388520C (en) |
WO (1) | WO2001029929A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101321006A (en) * | 2001-12-14 | 2008-12-10 | 诺基亚公司 | Method of controlling transmission in a radio system |
CN107925176A (en) * | 2015-08-06 | 2018-04-17 | 瑞典爱立信有限公司 | Surface mount contact part, electronic device assembly and test probe tool |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US6758702B2 (en) * | 2000-02-24 | 2004-07-06 | Fci Americas Technology, Inc. | Electrical connector with compression contacts |
US6331836B1 (en) * | 2000-08-24 | 2001-12-18 | Fast Location.Net, Llc | Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path |
US6644985B2 (en) * | 2001-02-16 | 2003-11-11 | Fci Americas Technology, Inc. | Ball attached zero insertion force socket |
US6501665B1 (en) * | 2001-08-10 | 2002-12-31 | Lotes Co., Ltd. | Structure of a ball grid array IC mounting seat |
US6530788B1 (en) * | 2001-10-09 | 2003-03-11 | Lotes Co., Ltd. | Structure of a ball grid array IC socket connection with solder ball |
US6702594B2 (en) * | 2001-12-14 | 2004-03-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical contact for retaining solder preform |
US6533590B1 (en) * | 2001-12-17 | 2003-03-18 | Hon Hai Precision Ind. Co., Ltd. | Ball grid array connector having improved contact configuration |
WO2003076957A1 (en) * | 2002-03-05 | 2003-09-18 | Rika Denshi America, Inc. | Apparatus for interfacing electronic packages and test equipment |
US6861862B1 (en) | 2003-03-17 | 2005-03-01 | John O. Tate | Test socket |
US7042702B2 (en) * | 2003-12-15 | 2006-05-09 | Intel Corporation | Wound capacitor |
US7029292B2 (en) * | 2003-12-16 | 2006-04-18 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector and contact |
US20050196979A1 (en) * | 2004-03-02 | 2005-09-08 | Ironwood Electronics, Inc. | Adapter apparatus with conductive elements mounted using curable material and methods regarding same |
US6979238B1 (en) * | 2004-06-28 | 2005-12-27 | Samtec, Inc. | Connector having improved contacts with fusible members |
US7114996B2 (en) | 2004-09-08 | 2006-10-03 | Advanced Interconnections Corporation | Double-pogo converter socket terminal |
US7179108B2 (en) * | 2004-09-08 | 2007-02-20 | Advanced Interconnections Corporation | Hermaphroditic socket/adapter |
US7220134B2 (en) * | 2005-02-24 | 2007-05-22 | Advanced Interconnections Corporation | Low profile LGA socket assembly |
US7690925B2 (en) * | 2005-02-24 | 2010-04-06 | Advanced Interconnections Corp. | Terminal assembly with pin-retaining socket |
US7435102B2 (en) * | 2005-02-24 | 2008-10-14 | Advanced Interconnections Corporation | Interconnecting electrical devices |
US20070117268A1 (en) * | 2005-11-23 | 2007-05-24 | Baker Hughes, Inc. | Ball grid attachment |
US20070167038A1 (en) * | 2006-01-18 | 2007-07-19 | Glenn Goodman | Hermaphroditic socket/adapter |
US7695287B2 (en) * | 2006-07-06 | 2010-04-13 | Harris Corporation | Ball grid array (BGA) connection system and related method and ball socket |
US7874880B2 (en) * | 2009-02-26 | 2011-01-25 | Ironwood Electronics, Inc. | Adapter apparatus with sleeve spring contacts |
US8969734B2 (en) * | 2009-04-01 | 2015-03-03 | Advanced Interconnections Corp. | Terminal assembly with regions of differing solderability |
JPWO2012137714A1 (en) | 2011-04-04 | 2014-07-28 | ローム株式会社 | Semiconductor device and manufacturing method of semiconductor device |
US8371871B1 (en) | 2011-08-11 | 2013-02-12 | Advanced Interconnections Corp. | Terminal with compliant barb |
CN107565234B (en) * | 2017-07-24 | 2019-08-30 | 番禺得意精密电子工业有限公司 | Electric connector |
US10122139B1 (en) | 2017-12-07 | 2018-11-06 | Ironwood Electronics, Inc. | Adapter apparatus with conductive elements mounted using laminate layer and methods regarding same |
US10431920B1 (en) | 2018-04-17 | 2019-10-01 | John O. Tate | One-piece parallel multi-finger contact |
Citations (4)
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EP0753990A1 (en) * | 1995-07-13 | 1997-01-15 | Thomson-Csf | Connection device and process |
JPH10255882A (en) * | 1997-03-07 | 1998-09-25 | Japan Aviation Electron Ind Ltd | Connector and manufacture therefor |
GB2325354A (en) * | 1997-03-26 | 1998-11-18 | Whitaker Corp | Electrical connector or connection with concave ball-receiving site |
US5877554A (en) * | 1997-11-03 | 1999-03-02 | Advanced Interconnections Corp. | Converter socket terminal |
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US3780433A (en) | 1972-05-01 | 1973-12-25 | Amp Inc | A method of making an electrical connection using a coined post with solder stripe |
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US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
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US6079986A (en) * | 1998-02-07 | 2000-06-27 | Berg Technology, Inc. | Stacking coaxial connector for three printed circuit boards |
US5989049A (en) * | 1998-12-21 | 1999-11-23 | Hon Hai Precision Ind. Co., Ltd. | Contact of a ZIF PGA socket and the socket using the same |
US6054978A (en) * | 1999-04-12 | 2000-04-25 | Perry; Robert C. | Computer mouse with improved ball lock |
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1999
- 1999-10-20 US US09/420,711 patent/US6352437B1/en not_active Expired - Lifetime
-
2000
- 2000-09-19 CA CA002388520A patent/CA2388520C/en not_active Expired - Lifetime
- 2000-09-19 WO PCT/US2000/040937 patent/WO2001029929A1/en not_active Application Discontinuation
- 2000-09-19 EP EP00974127A patent/EP1226627A1/en not_active Withdrawn
- 2000-09-19 AU AU12540/01A patent/AU1254001A/en not_active Abandoned
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EP0753990A1 (en) * | 1995-07-13 | 1997-01-15 | Thomson-Csf | Connection device and process |
JPH10255882A (en) * | 1997-03-07 | 1998-09-25 | Japan Aviation Electron Ind Ltd | Connector and manufacture therefor |
GB2325354A (en) * | 1997-03-26 | 1998-11-18 | Whitaker Corp | Electrical connector or connection with concave ball-receiving site |
US5877554A (en) * | 1997-11-03 | 1999-03-02 | Advanced Interconnections Corp. | Converter socket terminal |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101321006A (en) * | 2001-12-14 | 2008-12-10 | 诺基亚公司 | Method of controlling transmission in a radio system |
CN107925176A (en) * | 2015-08-06 | 2018-04-17 | 瑞典爱立信有限公司 | Surface mount contact part, electronic device assembly and test probe tool |
EP3332452A4 (en) * | 2015-08-06 | 2018-10-31 | Telefonaktiebolaget LM Ericsson (PUBL) | Surface mount contact, electronic device assembly, and test probe pin tool |
US10333238B2 (en) | 2015-08-06 | 2019-06-25 | Telefonaktiebolaget Lm Ericsson (Publ) | Surface mount contact, electronic device assembly, and test probe pin tool |
Also Published As
Publication number | Publication date |
---|---|
CA2388520A1 (en) | 2001-04-26 |
US6352437B1 (en) | 2002-03-05 |
EP1226627A1 (en) | 2002-07-31 |
CA2388520C (en) | 2007-11-20 |
AU1254001A (en) | 2001-04-30 |
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