WO2001045901A1 - Apparatus for performing chemical-mechanical planarization - Google Patents
Apparatus for performing chemical-mechanical planarization Download PDFInfo
- Publication number
- WO2001045901A1 WO2001045901A1 PCT/US2000/040895 US0040895W WO0145901A1 WO 2001045901 A1 WO2001045901 A1 WO 2001045901A1 US 0040895 W US0040895 W US 0040895W WO 0145901 A1 WO0145901 A1 WO 0145901A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- polishing pad
- spindle
- cmp
- recited
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00981001A EP1156903B1 (en) | 1999-12-22 | 2000-09-13 | Apparatus for performing chemical-mechanical planarization |
JP2001546432A JP2003517936A (en) | 1999-12-22 | 2000-09-13 | Equipment for chemical mechanical planarization |
DE60030601T DE60030601T2 (en) | 1999-12-22 | 2000-09-13 | Device for chemical-mechanical planarization |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/470,296 US6413152B1 (en) | 1999-12-22 | 1999-12-22 | Apparatus for performing chemical-mechanical planarization with improved process window, process flexibility and cost |
US09/470,296 | 1999-12-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001045901A1 true WO2001045901A1 (en) | 2001-06-28 |
Family
ID=23867025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/040895 WO2001045901A1 (en) | 1999-12-22 | 2000-09-13 | Apparatus for performing chemical-mechanical planarization |
Country Status (6)
Country | Link |
---|---|
US (1) | US6413152B1 (en) |
EP (1) | EP1156903B1 (en) |
JP (1) | JP2003517936A (en) |
KR (1) | KR100701357B1 (en) |
DE (1) | DE60030601T2 (en) |
WO (1) | WO2001045901A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6575818B2 (en) * | 2001-06-27 | 2003-06-10 | Oriol Inc. | Apparatus and method for polishing multiple semiconductor wafers in parallel |
US20030230323A1 (en) * | 2002-06-14 | 2003-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for improving scrubber cleaning |
US6875086B2 (en) * | 2003-01-10 | 2005-04-05 | Intel Corporation | Surface planarization |
US20110300776A1 (en) * | 2010-06-03 | 2011-12-08 | Applied Materials, Inc. | Tuning of polishing process in multi-carrier head per platen polishing station |
CN103302563B (en) * | 2012-03-14 | 2015-11-25 | 富泰华工业(深圳)有限公司 | Sanding apparatus and use the manipulator of this sanding apparatus |
US20140024299A1 (en) * | 2012-07-19 | 2014-01-23 | Wen-Chiang Tu | Polishing Pad and Multi-Head Polishing System |
CN105619243B (en) * | 2016-01-05 | 2017-08-29 | 京东方科技集团股份有限公司 | Grind cutter head and lapping device |
CN109500666A (en) * | 2018-11-12 | 2019-03-22 | 上海交通大学 | The rotatable accurate dise knife numerically control grinder of grinding carriage and method for grinding |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5549502A (en) * | 1992-12-04 | 1996-08-27 | Fujikoshi Machinery Corp. | Polishing apparatus |
US5649854A (en) * | 1994-05-04 | 1997-07-22 | Gill, Jr.; Gerald L. | Polishing apparatus with indexing wafer processing stations |
DE29709755U1 (en) * | 1997-05-07 | 1997-09-04 | Wolters Peter Werkzeugmasch | Device for the chemical-mechanical polishing of a surface of an object, in particular a semiconductor wafer |
US5679059A (en) * | 1994-11-29 | 1997-10-21 | Ebara Corporation | Polishing aparatus and method |
US5938884A (en) * | 1995-05-18 | 1999-08-17 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09174430A (en) * | 1995-12-27 | 1997-07-08 | Komatsu Electron Metals Co Ltd | Polishing device for semiconductor wafer |
JPH09254024A (en) * | 1996-03-18 | 1997-09-30 | Nittetsu Semiconductor Kk | Device and method chemically mechanical polishing semiconductor wafer |
JPH1034514A (en) * | 1996-07-24 | 1998-02-10 | Sanshin:Kk | Surface polishing method and device therefor |
JPH10166262A (en) * | 1996-12-10 | 1998-06-23 | Nikon Corp | Polishing device |
US5975994A (en) * | 1997-06-11 | 1999-11-02 | Micron Technology, Inc. | Method and apparatus for selectively conditioning a polished pad used in planarizng substrates |
US5997384A (en) * | 1997-12-22 | 1999-12-07 | Micron Technology, Inc. | Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates |
US6015499A (en) * | 1998-04-17 | 2000-01-18 | Parker-Hannifin Corporation | Membrane-like filter element for chemical mechanical polishing slurries |
US6193588B1 (en) * | 1998-09-02 | 2001-02-27 | Micron Technology, Inc. | Method and apparatus for planarizing and cleaning microelectronic substrates |
US6227956B1 (en) * | 1999-10-28 | 2001-05-08 | Strasbaugh | Pad quick release device for chemical mechanical polishing |
-
1999
- 1999-12-22 US US09/470,296 patent/US6413152B1/en not_active Expired - Lifetime
-
2000
- 2000-09-13 KR KR1020017010642A patent/KR100701357B1/en not_active IP Right Cessation
- 2000-09-13 JP JP2001546432A patent/JP2003517936A/en not_active Withdrawn
- 2000-09-13 DE DE60030601T patent/DE60030601T2/en not_active Expired - Lifetime
- 2000-09-13 WO PCT/US2000/040895 patent/WO2001045901A1/en active IP Right Grant
- 2000-09-13 EP EP00981001A patent/EP1156903B1/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5549502A (en) * | 1992-12-04 | 1996-08-27 | Fujikoshi Machinery Corp. | Polishing apparatus |
US5649854A (en) * | 1994-05-04 | 1997-07-22 | Gill, Jr.; Gerald L. | Polishing apparatus with indexing wafer processing stations |
US5679059A (en) * | 1994-11-29 | 1997-10-21 | Ebara Corporation | Polishing aparatus and method |
US5938884A (en) * | 1995-05-18 | 1999-08-17 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
DE29709755U1 (en) * | 1997-05-07 | 1997-09-04 | Wolters Peter Werkzeugmasch | Device for the chemical-mechanical polishing of a surface of an object, in particular a semiconductor wafer |
Also Published As
Publication number | Publication date |
---|---|
DE60030601D1 (en) | 2006-10-19 |
KR100701357B1 (en) | 2007-03-28 |
KR20020001741A (en) | 2002-01-09 |
DE60030601T2 (en) | 2006-12-14 |
EP1156903B1 (en) | 2005-12-07 |
JP2003517936A (en) | 2003-06-03 |
US6413152B1 (en) | 2002-07-02 |
EP1156903A1 (en) | 2001-11-28 |
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