WO2001050104A2 - Method and apparatus for a direct bonded isolated pressure sensor - Google Patents
Method and apparatus for a direct bonded isolated pressure sensor Download PDFInfo
- Publication number
- WO2001050104A2 WO2001050104A2 PCT/US2000/034648 US0034648W WO0150104A2 WO 2001050104 A2 WO2001050104 A2 WO 2001050104A2 US 0034648 W US0034648 W US 0034648W WO 0150104 A2 WO0150104 A2 WO 0150104A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gap
- channel
- pressure
- pressure sensor
- stepped corner
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0075—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a ceramic diaphragm, e.g. alumina, fused quartz, glass
Definitions
- the present invention relates to pressure sensors.
- fluids can corrode metal sensing films.
- Metal sensing films are thus preferably placed inside a pressure sensor body and connecting leads are preferably fed through the body in such a way that corrosive process fluids do not come in contact with the sensing films and connecting leads.
- Corrosive process fluids can include gasses in an aerospace or stationary turbine engine, acids, caustics, oils, petrochemicals, and the like.
- Alumina is a preferred material for sensor bodies because it has excellent mechanical properties and corrosion resistance. It is, however, difficult to bore vias in alumina for connecting leads between a sensing film and an external electronic circuit.
- Alumina sensors are preferably assembled by direct bonding. With direct bonding, mating surfaces of alumina layers are optically flat, clean and fully in contact with one another, and no bonding substance is used between layers. Any irregularity, such as a metal film feedthrough at the mating surfaces, would hold the mating surfaces apart by a microscopic amount and interfere with the direct bonding. For demanding industrial, aerospace and turbine applications, an easily manufactured feedthrough seal is needed that does not' degrade the high performance of a direct bonded alumina pressure sensor.
- a feedthrough seal is formed by passing leads through a gap at a stepped corner between direct bonded layers of alumina and then filling at least a portion of the stepped corner with a seal that fills the gap.
- FIG. 1 shows a typical industrial environment
- FIG. 2 shows an embodiment of a transmitter
- FIG. 3 shows a perspective view of an embodiment of a direct bonded alumina pressure sensor
- FIG. 4 shows an exploded view of an embodiment of a direct bonded alumina pressure sensor
- FIG 5 shows cross-sectional view of a direct bonded alumina sensor
- FIG. 6 shows a view of a first layer of a direct bonded alumina pressure sensor
- FIG. 7 shows a view, of a second layer of a direct bonded alumina pressure sensor
- FIG. 8 shows sectional views of a pressure sensor during a process of manufacturing a direct bonded aluminum pressure sensor
- FIG. 9 shows an embodiment of a sensing module with a direct bonded alumina pressure sensor
- FIG. 10 shows an embodiment of an isolator module with a direct bonded alumina pressure sensor.
- FIGS. 11, 12, 13 show an embodiment of a direct bonded alumina pressure sensor similar to that shown in FIGS. 3, 4, 5 but including one flat layer;
- FIG. 14 shows an embodiment of a direct bonded alumina pressure sensor for a turbine engine.
- FIG. 1 a typical environment for an industrial pressure sensor is illustrated at 20.
- Process variable transmitters such as flow meter 22 in process fluid line 23, level transmitters 24, 26, 36 near tank 28 and integral orifice flow meter 30 in process line 31 are shown electrically connected to control system 32.
- Control system 32 controls current to pressure transducer 38 which controls control valve
- Process variable transmitters can be configured to monitor one or more process variables associated with fluids in a process plant such as slurries, liquids, vapors and gasses in chemical, pulp, petroleum, gas, pharmaceutical, food and other fluid processing plants.
- the monitored process variables can be pressure, temperature, flow, level, pH, conductivity, turbidity, density, concentration, chemical composition or other properties of fluids.
- a process variable transmitter includes one or more sensors that can be either internal tp the transmitter or external to the transmitter, depending on the installation needs of the process plant.
- the sensor module 54 couples to a housing 55 having electronics 56.
- Transmitter 50 is bolted to flange adapter 58.
- Flange adapter 58 connects to impulse pipes connected to flange adapter unions 60 or other connection hardware.
- Each absolute pressure sensor in sensor module 54 includes an integral beam exposed to process fluid and isolated sensor leads that pass through a sealed gap in the beam and connect to transmitter electronics 56.
- a seal 115 is applied over gap 108 to fill the gap 108 around the leads 110.
- the seal fills a portion of the stepped corner.
- the placement of the seal in the stepped corner or concave region shelters the seal from damage during handling and provides a high reliability closure for the channel in the sensor.
- the seal is in a hollow or concave region where it does not protrude outwardly and is unlikely to be struck during handling.
- the placement of the gap 108 at the base of the stepped corner ensures a large bonding area around the gap, increasing reliability.
- Beam 102 is formed by directly bonding alumina layers 114 and 116 together. After direct bonding, there is no joint at 118 and the beam 102 along with its blind end 104 are a single integrated part with a continuous crystal structure across broken line 118.
- direct bonding means that optically flat clean surfaces are brought in contact with each other so that they join without any intermediate sealing materials and without the application of an electrical potential or voltage and without melting or fusing or sintering together of bonding surfaces. Extreme chemical and physical, cleanliness and precise alignment of the surfaces are desired to achieve a direct bond. Single crystal sapphire is preferred.
- FIG. 5 a cross-sectional view of the pressure sensor 100 in FIGS. 3 and 4 is shown.
- First mesa 130 is aligned with second mesa 132 upon assembly, and the mesas 130, 132 are integrally bonded together to form an integral support.
- the integral support is aligned with the joining surfaces of the measurement cup to provide additional support.
- Third and fourth mesas 134 and 136 are disposed away from the blind end and nearer the isolated end. Upon assembly, mesas 134, 136 do not contact one another. Mesas 134 and 136 have metallic contact material on their facing surfaces.
- the sensor 100 is heated to cause the metallic contact material on mesas 134 and 136 to grow and complete an electrical connection between the two mesas 134 and 136. This electrical connection is completed after direct bonding so that it does not interfere with the close contact required between layers 114 and 116 for direct bonding.
- the growable material can be tantalum or platinum.
- Sensing film 112 includes a first capacitor plate 140 with an electrical lead or connection 142 extending from the channel 124 out the gap 108 to an electrical contact pad 146. Sensing film 112 also includes an electrostatic shield lead 148 which shields capacitor plate 140 from stray coupling. Electrostatic shield lead 148 also extends from the channel 124 and out the gap 108 to a contact pad 150. Mesa 136 includes a lead 152 for connection. A temperature sensing element 154 is also included on layer 116. Temperature sensing element 154 connects to electrical contact pads 156.
- the capacitor plate 140 deflects toward a facing capacitor plate on layer 114, and an electrical parameter, capacitance between the plates, varies as a function of pressure. Tungsten is preferred for the capacitor plates and the leads.
- the sensor is then placed in a high vacuum chamber to provide a high vacuum between 10 ⁇ 6 and 10 ⁇ 7 Torr.
- the water vapor and other gasses in the channel flow out through the porous seal 178.
- the gap covered by the glass frit has a width that is narrow enough to prevent the glass frit from being drawn into the channel, but wide enough to allow moisture and other gasses to flow out the porous seal in a practical length of time, and wide enough to ensure that electrical leads on one substrate do not contact the facing substrate during bonding of the substrates. It is found that a width of about 0.5 micron works in one embodiment, however this width can be varied as needed depending on the geometry of the channel, the porosity characteristics of the frit, and the temperature of the sensor during evacuation to achieve a practical time period for evacuation.
- a pressure sensing module 180 is shown which corresponds to flange 52 shown in FIG. 2.
- Assembly 180 includes two sensors 182, 184 as shown in FIGS. 3-7.
- an isolation cup 198 has an opening 200 sealed to an outer surface of the beam between the blind end and the opposite, isolated end.
- a sensing module 210 that includes an isolator diaphragm 212 with a rim 214 sealed to an isolator cup 216.
- Isolator diaphragm 212 separates process fluid 218 from isolator fluid 220 that is sealed in the space enclosed by the isolator cup 216 and the isolator diaphragm.
- Sensor 222 is constructed as shown in FIGS. 4-8 and is sealed to an opening 224 in the isolator cup 216.
- the isolator diaphragm 212 and isolator fluid 220 couple pressure to the sensor 222 while isolating the sensor from the process fluid 218.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU24432/01A AU2443201A (en) | 2000-01-06 | 2000-12-20 | Method and apparatus for a direct bonded isolated pressure sensor |
JP2001550004A JP2003519377A (en) | 2000-01-06 | 2000-12-20 | Method and apparatus for manufacturing a direct junction isolation pressure sensor |
EP00988200A EP1244899B1 (en) | 2000-01-06 | 2000-12-20 | Method and apparatus for a direct bonded isolated pressure sensor |
DE60018611T DE60018611T2 (en) | 2000-01-06 | 2000-12-20 | METHOD AND DEVICE FOR A DIRECTLY BONDED INSULATED PRESSURE SENSOR |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/478,383 US6520020B1 (en) | 2000-01-06 | 2000-01-06 | Method and apparatus for a direct bonded isolated pressure sensor |
US09/478,383 | 2000-01-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001050104A2 true WO2001050104A2 (en) | 2001-07-12 |
WO2001050104A3 WO2001050104A3 (en) | 2002-05-02 |
Family
ID=23899711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/034648 WO2001050104A2 (en) | 2000-01-06 | 2000-12-20 | Method and apparatus for a direct bonded isolated pressure sensor |
Country Status (6)
Country | Link |
---|---|
US (1) | US6520020B1 (en) |
EP (1) | EP1244899B1 (en) |
JP (1) | JP2003519377A (en) |
AU (1) | AU2443201A (en) |
DE (1) | DE60018611T2 (en) |
WO (1) | WO2001050104A2 (en) |
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US20150090040A1 (en) * | 2013-09-27 | 2015-04-02 | Rosemount Inc. | Pressure sensor with mineral insulated cable |
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WO2003034018A1 (en) * | 2001-10-15 | 2003-04-24 | Rosemount Inc. | Sensor with fluid isolation barrier |
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US20150090040A1 (en) * | 2013-09-27 | 2015-04-02 | Rosemount Inc. | Pressure sensor with mineral insulated cable |
WO2015047586A1 (en) * | 2013-09-27 | 2015-04-02 | Rosemount Inc. | Pressure sensor with mineral insulated cable |
CN104515637A (en) * | 2013-09-27 | 2015-04-15 | 罗斯蒙特公司 | Pressure sensor with mineral insulated cable |
RU2636272C2 (en) * | 2013-09-27 | 2017-11-21 | Роузмаунт Инк. | Pressure sensor with mineral-insulated cable |
US10260980B2 (en) | 2013-09-27 | 2019-04-16 | Rosemount Inc. | Pressure sensor with mineral insulated cable |
Also Published As
Publication number | Publication date |
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JP2003519377A (en) | 2003-06-17 |
DE60018611T2 (en) | 2006-01-19 |
AU2443201A (en) | 2001-07-16 |
EP1244899B1 (en) | 2005-03-09 |
DE60018611D1 (en) | 2005-04-14 |
WO2001050104A3 (en) | 2002-05-02 |
EP1244899A2 (en) | 2002-10-02 |
US6520020B1 (en) | 2003-02-18 |
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