WO2001065315A3 - Method and apparatus for mixed-mode optical proximity correction - Google Patents

Method and apparatus for mixed-mode optical proximity correction Download PDF

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Publication number
WO2001065315A3
WO2001065315A3 PCT/US2001/006144 US0106144W WO0165315A3 WO 2001065315 A3 WO2001065315 A3 WO 2001065315A3 US 0106144 W US0106144 W US 0106144W WO 0165315 A3 WO0165315 A3 WO 0165315A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical proximity
proximity correction
based optical
correction system
rule
Prior art date
Application number
PCT/US2001/006144
Other languages
French (fr)
Other versions
WO2001065315A2 (en
Inventor
Christophe Pierrat
You-Ping Zhang
Fang-Cheng Chang
Ho Yong Park
Yao-Ting Wang
Original Assignee
Numerical Tech Inc
Christophe Pierrat
Zhang You Ping
Chang Fang Cheng
Ho Yong Park
Wang Yao Ting
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Numerical Tech Inc, Christophe Pierrat, Zhang You Ping, Chang Fang Cheng, Ho Yong Park, Wang Yao Ting filed Critical Numerical Tech Inc
Priority to AU2001243289A priority Critical patent/AU2001243289A1/en
Priority to EP01916242.9A priority patent/EP1264213B1/en
Priority to JP2001563954A priority patent/JP4947533B2/en
Publication of WO2001065315A2 publication Critical patent/WO2001065315A2/en
Publication of WO2001065315A3 publication Critical patent/WO2001065315A3/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level

Abstract

A semiconductor layout testing and correction system is disclosed. The system combines both rule-based optical proximity correction and model-based optical proximity correction in order to test and correct semiconductor layouts. In a first embodiment, a semiconductor layout is first processed by a rule-based optical proximity correction system and then subsequently processed by a model-based optical proximity correction system. In another embodiment, the system first processes a semiconductor layout with a rule-based optical proximity correction system and then selectively processes difficult features using a model-based optical proximity correction system. In yet another embodiment, the system selectively processes the various features of a semiconductor layout using a rule-based optical proximity correction system or a model-based optical proximity correction system.
PCT/US2001/006144 2000-02-28 2001-02-26 Method and apparatus for mixed-mode optical proximity correction WO2001065315A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001243289A AU2001243289A1 (en) 2000-02-28 2001-02-26 Method and apparatus for mixed-mode optical proximity correction
EP01916242.9A EP1264213B1 (en) 2000-02-28 2001-02-26 Method and apparatus for mixed-mode optical proximity correction
JP2001563954A JP4947533B2 (en) 2000-02-28 2001-02-26 Method and apparatus for mixed-mode optical proximity effect correction

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/514,551 2000-02-28
US09/514,551 US6584609B1 (en) 2000-02-28 2000-02-28 Method and apparatus for mixed-mode optical proximity correction

Publications (2)

Publication Number Publication Date
WO2001065315A2 WO2001065315A2 (en) 2001-09-07
WO2001065315A3 true WO2001065315A3 (en) 2002-04-04

Family

ID=24047688

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/006144 WO2001065315A2 (en) 2000-02-28 2001-02-26 Method and apparatus for mixed-mode optical proximity correction

Country Status (5)

Country Link
US (2) US6584609B1 (en)
EP (1) EP1264213B1 (en)
JP (1) JP4947533B2 (en)
AU (1) AU2001243289A1 (en)
WO (1) WO2001065315A2 (en)

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Publication number Priority date Publication date Assignee Title
US9361424B2 (en) 2004-05-07 2016-06-07 Mentor Graphics Corporation Integrated circuit layout design methodology with process variation bands

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