WO2001065899A3 - Kühlkörpermodul und anordnung von kühlkörpermodulen - Google Patents
Kühlkörpermodul und anordnung von kühlkörpermodulen Download PDFInfo
- Publication number
- WO2001065899A3 WO2001065899A3 PCT/DE2001/000557 DE0100557W WO0165899A3 WO 2001065899 A3 WO2001065899 A3 WO 2001065899A3 DE 0100557 W DE0100557 W DE 0100557W WO 0165899 A3 WO0165899 A3 WO 0165899A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- module
- modules
- arrangement
- sink modules
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/220,172 US6708757B2 (en) | 2000-02-28 | 2001-02-14 | Heat sink module and an arrangment of heat sink modules |
EP01913633A EP1260124A2 (de) | 2000-02-28 | 2001-02-14 | Kühlkörpermodul und anordnung von kühlkörpermodulen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10009398A DE10009398C2 (de) | 2000-02-28 | 2000-02-28 | Kühlkörpermodul und Anordnung von Kühlkörpermodulen |
DE10009398.1 | 2000-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001065899A2 WO2001065899A2 (de) | 2001-09-07 |
WO2001065899A3 true WO2001065899A3 (de) | 2001-12-06 |
Family
ID=7632739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/000557 WO2001065899A2 (de) | 2000-02-28 | 2001-02-14 | Kühlkörpermodul und anordnung von kühlkörpermodulen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6708757B2 (de) |
EP (1) | EP1260124A2 (de) |
DE (1) | DE10009398C2 (de) |
WO (1) | WO2001065899A2 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10153513A1 (de) * | 2001-10-30 | 2002-11-28 | Siemens Ag | Kondensatorkühlvorrichtung |
FI118781B (fi) * | 2003-06-04 | 2008-03-14 | Vacon Oyj | Kondensaattorin kiinnitys- ja suojajärjestely |
US20050250011A1 (en) * | 2004-04-02 | 2005-11-10 | Maxwell Technologies, Inc. | Particle packaging systems and methods |
US7295423B1 (en) * | 2003-07-09 | 2007-11-13 | Maxwell Technologies, Inc. | Dry particle based adhesive electrode and methods of making same |
US7352558B2 (en) * | 2003-07-09 | 2008-04-01 | Maxwell Technologies, Inc. | Dry particle based capacitor and methods of making same |
US7791860B2 (en) | 2003-07-09 | 2010-09-07 | Maxwell Technologies, Inc. | Particle based electrodes and methods of making same |
US20060147712A1 (en) * | 2003-07-09 | 2006-07-06 | Maxwell Technologies, Inc. | Dry particle based adhesive electrode and methods of making same |
US7342770B2 (en) * | 2003-07-09 | 2008-03-11 | Maxwell Technologies, Inc. | Recyclable dry particle based adhesive electrode and methods of making same |
US7920371B2 (en) | 2003-09-12 | 2011-04-05 | Maxwell Technologies, Inc. | Electrical energy storage devices with separator between electrodes and methods for fabricating the devices |
US7495349B2 (en) | 2003-10-20 | 2009-02-24 | Maxwell Technologies, Inc. | Self aligning electrode |
DE502004003799D1 (de) * | 2003-10-31 | 2007-06-21 | Siemens Ag | Gehäusebecher für ein elektronisches bauteil mit integriertem kühlkörper |
US7203056B2 (en) * | 2003-11-07 | 2007-04-10 | Maxwell Technologies, Inc. | Thermal interconnection for capacitor systems |
US7180726B2 (en) * | 2003-11-07 | 2007-02-20 | Maxwell Technologies, Inc. | Self-supporting capacitor structure |
US7027290B1 (en) | 2003-11-07 | 2006-04-11 | Maxwell Technologies, Inc. | Capacitor heat reduction apparatus and method |
US7016177B1 (en) | 2003-11-07 | 2006-03-21 | Maxwell Technologies, Inc. | Capacitor heat protection |
US7384433B2 (en) | 2004-02-19 | 2008-06-10 | Maxwell Technologies, Inc. | Densification of compressible layers during electrode lamination |
US7090946B2 (en) | 2004-02-19 | 2006-08-15 | Maxwell Technologies, Inc. | Composite electrode and method for fabricating same |
US7180277B2 (en) | 2004-04-09 | 2007-02-20 | Maxwell Technologies, Inc. | Capacitor start-up apparatus and method with fail safe short circuit protection |
US20050269988A1 (en) * | 2004-06-04 | 2005-12-08 | Maxwell Technologies, Inc. | Voltage balancing circuit for multi-cell modules |
DE102004063986A1 (de) * | 2004-11-05 | 2006-07-27 | Siemens Ag | Schienenfahrzeug mit einem Energiespeicher aus Doppelschichtkondensatoren |
US7440258B2 (en) | 2005-03-14 | 2008-10-21 | Maxwell Technologies, Inc. | Thermal interconnects for coupling energy storage devices |
DE102006041377B3 (de) * | 2006-08-29 | 2007-12-27 | Siemens Ag | Armatur |
US8518573B2 (en) * | 2006-09-29 | 2013-08-27 | Maxwell Technologies, Inc. | Low-inductive impedance, thermally decoupled, radii-modulated electrode core |
US7589971B2 (en) * | 2006-10-10 | 2009-09-15 | Deere & Company | Reconfigurable heat sink assembly |
US20080204973A1 (en) * | 2007-02-28 | 2008-08-28 | Maxwell Technologies, Inc. | Ultracapacitor electrode with controlled iron content |
US20080201925A1 (en) | 2007-02-28 | 2008-08-28 | Maxwell Technologies, Inc. | Ultracapacitor electrode with controlled sulfur content |
US8291965B2 (en) * | 2007-03-27 | 2012-10-23 | Adc Telecommunications, Inc. | Heat sink with angled fins |
TWI337837B (en) * | 2007-06-08 | 2011-02-21 | Ama Precision Inc | Heat sink and modular heat sink |
US20090080126A1 (en) * | 2007-09-25 | 2009-03-26 | Ise Corporation | Energy Storage Device Coupler and Method |
US20100157527A1 (en) * | 2008-12-23 | 2010-06-24 | Ise Corporation | High-Power Ultracapacitor Energy Storage Pack and Method of Use |
CN101909415A (zh) * | 2009-06-02 | 2010-12-08 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及其固定支架 |
US20120050944A1 (en) * | 2010-08-27 | 2012-03-01 | Samsung Electro-Mechanics Co., Ltd. | Capacitor unit cell and energy storage module with the same |
DE102011081283A1 (de) * | 2011-08-19 | 2013-02-21 | Robert Bosch Gmbh | Kondensator mit einem Kühlkörper |
CN103096688A (zh) * | 2011-11-08 | 2013-05-08 | 富准精密工业(深圳)有限公司 | 散热装置 |
US9899120B2 (en) | 2012-11-02 | 2018-02-20 | Nanotek Instruments, Inc. | Graphene oxide-coated graphitic foil and processes for producing same |
US10566482B2 (en) | 2013-01-31 | 2020-02-18 | Global Graphene Group, Inc. | Inorganic coating-protected unitary graphene material for concentrated photovoltaic applications |
US10087073B2 (en) | 2013-02-14 | 2018-10-02 | Nanotek Instruments, Inc. | Nano graphene platelet-reinforced composite heat sinks and process for producing same |
EP3076427B1 (de) * | 2015-03-30 | 2020-07-15 | General Electric Technology GmbH | Elektrische baugruppe |
DE102015111541B4 (de) * | 2015-07-16 | 2023-07-20 | Halla Visteon Climate Control Corporation | Verfahren zur Herstellung einer Verbindung zwischen mindestens einem zylindrischen Elektrolytkondensator und einem Kühlkörper |
US9847174B2 (en) | 2015-12-09 | 2017-12-19 | General Electric Company | Capacitor assembly and related method of forming |
DE102020115933A1 (de) | 2020-06-17 | 2021-12-23 | Phoenix Contact Gmbh & Co. Kg | Kühlkörpersystem |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3929701A1 (de) * | 1989-09-07 | 1991-03-14 | Standard Elektrik Lorenz Ag | Steckbare baugruppe |
JPH05275582A (ja) * | 1992-03-26 | 1993-10-22 | Hitachi Ltd | 放熱器の構造 |
JPH08290225A (ja) * | 1995-04-19 | 1996-11-05 | Atsushi Terada | 押し出し材同志の結合方法及び結合構造 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3081824A (en) * | 1960-09-19 | 1963-03-19 | Behlman Engineering Company | Mounting unit for electrical components |
US3220471A (en) * | 1963-01-15 | 1965-11-30 | Wakefield Engineering Co Inc | Heat transfer |
US3312277A (en) * | 1965-03-22 | 1967-04-04 | Astrodyne Inc | Heat sink |
DE1913546C3 (de) * | 1969-03-18 | 1975-08-28 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Baugruppe |
GB1502428A (en) * | 1974-06-08 | 1978-03-01 | Lucas Electrical Ltd | Full wave rectifier assembly |
US4022272A (en) * | 1975-11-14 | 1977-05-10 | Chester O. Houston, Jr. | Transmission fluid heat radiator |
US4190879A (en) * | 1978-08-21 | 1980-02-26 | Tissot Pierre L | Plastic chassis with magnetic holding means for electronic components |
DE8230004U1 (de) * | 1982-10-26 | 1983-03-17 | Inter Control Hermann Köhler Elektrik GmbH & Co KG, 8500 Nürnberg | Gehäuse für wärmeentwickelnde Bauelemente, insbesondere Elektronikteile, wie Moduln, Leiterplatten und ähnliches |
DE3415554A1 (de) * | 1983-04-30 | 1984-10-31 | Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid | Kuehlkoerper fuer leistungselektronische bauelemente |
US4734139A (en) * | 1986-01-21 | 1988-03-29 | Omnimax Energy Corp. | Thermoelectric generator |
GB8700844D0 (en) * | 1987-01-15 | 1987-02-18 | Marston Palmer Ltd | Heat sink assembly |
JP2536657B2 (ja) * | 1990-03-28 | 1996-09-18 | 三菱電機株式会社 | 電気装置及びその製造方法 |
US5168926A (en) * | 1991-09-25 | 1992-12-08 | Intel Corporation | Heat sink design integrating interface material |
US5419041A (en) * | 1992-08-04 | 1995-05-30 | Aqty Co., Ltd. | Process for manufacturing a pin type radiating fin |
GB2276763B (en) | 1993-03-30 | 1997-05-07 | Thermalloy Inc | Method and apparatus for dissipating thermal energy |
US5819407A (en) | 1995-04-19 | 1998-10-13 | Tousui, Ltd. | Method of joining together a pair of members each having a high thermal conductivity |
DE29716405U1 (de) * | 1997-09-12 | 1999-01-21 | Inter Mercador Gmbh & Co Kg Im | Wärmeübertragungskörper und -vorrichtung, insbesondere zum Kühlen von elektronischen Bauteilen |
-
2000
- 2000-02-28 DE DE10009398A patent/DE10009398C2/de not_active Expired - Fee Related
-
2001
- 2001-02-14 US US10/220,172 patent/US6708757B2/en not_active Expired - Fee Related
- 2001-02-14 EP EP01913633A patent/EP1260124A2/de not_active Withdrawn
- 2001-02-14 WO PCT/DE2001/000557 patent/WO2001065899A2/de not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3929701A1 (de) * | 1989-09-07 | 1991-03-14 | Standard Elektrik Lorenz Ag | Steckbare baugruppe |
JPH05275582A (ja) * | 1992-03-26 | 1993-10-22 | Hitachi Ltd | 放熱器の構造 |
JPH08290225A (ja) * | 1995-04-19 | 1996-11-05 | Atsushi Terada | 押し出し材同志の結合方法及び結合構造 |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 018, no. 049 (E - 1497) 26 January 1994 (1994-01-26) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31) * |
Also Published As
Publication number | Publication date |
---|---|
WO2001065899A2 (de) | 2001-09-07 |
EP1260124A2 (de) | 2002-11-27 |
DE10009398C2 (de) | 2002-03-14 |
US20030047302A1 (en) | 2003-03-13 |
US6708757B2 (en) | 2004-03-23 |
DE10009398A1 (de) | 2001-09-06 |
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