WO2001067116A3 - Temperature compensated vertical pin probing device - Google Patents

Temperature compensated vertical pin probing device Download PDF

Info

Publication number
WO2001067116A3
WO2001067116A3 PCT/US2001/006437 US0106437W WO0167116A3 WO 2001067116 A3 WO2001067116 A3 WO 2001067116A3 US 0106437 W US0106437 W US 0106437W WO 0167116 A3 WO0167116 A3 WO 0167116A3
Authority
WO
WIPO (PCT)
Prior art keywords
probing device
silicon nitride
vertical pin
temperature compensated
invar
Prior art date
Application number
PCT/US2001/006437
Other languages
French (fr)
Other versions
WO2001067116A2 (en
Inventor
Stephen Evans
Quade Francis T Mc
Original Assignee
Wentworth Lab Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wentworth Lab Inc filed Critical Wentworth Lab Inc
Priority to JP2001566038A priority Critical patent/JP4837866B2/en
Priority to EP01914572A priority patent/EP1194784B1/en
Priority to DE60135288T priority patent/DE60135288D1/en
Publication of WO2001067116A2 publication Critical patent/WO2001067116A2/en
Publication of WO2001067116A3 publication Critical patent/WO2001067116A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Abstract

An improved vertical pin probing device is constructed with a housing with spaced upper (48) and lower (50) spacers of Invar®, each having a thin sheet of silicon nitride ceramic material (56, 58) held in a window in the spacer by adhesive. The sheets of silicon nitride have laser-drilled matching patterns of holes (60) supporting probe pins (64) and insulating the probe pins from the housing. The Invar spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.
PCT/US2001/006437 2000-03-06 2001-02-28 Temperature compensated vertical pin probing device WO2001067116A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001566038A JP4837866B2 (en) 2000-03-06 2001-02-28 Temperature compensated vertical pin probe probe
EP01914572A EP1194784B1 (en) 2000-03-06 2001-02-28 Temperature compensated vertical pin probing device
DE60135288T DE60135288D1 (en) 2000-03-06 2001-02-28 TEMPERATURE-COMPENSATED PROBE WITH VERTICALLY ORIENTED PINS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/519,363 2000-03-06
US09/519,363 US6633175B1 (en) 2000-03-06 2000-03-06 Temperature compensated vertical pin probing device

Publications (2)

Publication Number Publication Date
WO2001067116A2 WO2001067116A2 (en) 2001-09-13
WO2001067116A3 true WO2001067116A3 (en) 2002-02-07

Family

ID=24067979

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/006437 WO2001067116A2 (en) 2000-03-06 2001-02-28 Temperature compensated vertical pin probing device

Country Status (6)

Country Link
US (1) US6633175B1 (en)
EP (1) EP1194784B1 (en)
JP (1) JP4837866B2 (en)
AT (1) ATE404871T1 (en)
DE (1) DE60135288D1 (en)
WO (1) WO2001067116A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1356307B1 (en) * 2001-01-31 2006-11-22 Wentworth Laboratories, Inc. Nickel alloy probe card frame laminate
US6906540B2 (en) 2001-09-20 2005-06-14 Wentworth Laboratories, Inc. Method for chemically etching photo-defined micro electrical contacts
US6977515B2 (en) 2001-09-20 2005-12-20 Wentworth Laboratories, Inc. Method for forming photo-defined micro electrical contacts
US6782331B2 (en) * 2001-10-24 2004-08-24 Infineon Technologies Ag Graphical user interface for testing integrated circuits
US6924653B2 (en) 2002-08-26 2005-08-02 Micron Technology, Inc. Selectively configurable microelectronic probes
US6773938B2 (en) 2002-08-29 2004-08-10 Micron Technology, Inc. Probe card, e.g., for testing microelectronic components, and methods for making same
WO2005050706A2 (en) * 2003-11-14 2005-06-02 Wentworth Laboratories, Inc. Die design with integrated assembly aid
EP1737075B1 (en) * 2005-06-23 2017-03-08 Feinmetall GmbH Contacting device
US8264248B2 (en) * 2007-03-30 2012-09-11 Dsl Labs, Inc. Micro probe assembly
US20080238452A1 (en) * 2007-03-30 2008-10-02 Dsl Labs, Incorporated Vertical micro probes
US7554348B2 (en) * 2007-06-29 2009-06-30 Wentworth Laboratories, Inc. Multi-offset die head
KR101476683B1 (en) 2013-05-08 2014-12-26 (주) 루켄테크놀러지스 Vertical film type probe card
US9435855B2 (en) 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
TWI521212B (en) * 2014-03-10 2016-02-11 A method and a method of assembling a vertical probe device, and a vertical probe device
US9594114B2 (en) 2014-06-26 2017-03-14 Teradyne, Inc. Structure for transmitting signals in an application space between a device under test and test electronics
KR102282192B1 (en) * 2015-07-23 2021-07-27 삼성전자 주식회사 Semiconductor device with mismatch detection and recovery circuit
US9977052B2 (en) 2016-10-04 2018-05-22 Teradyne, Inc. Test fixture
US10677815B2 (en) 2018-06-08 2020-06-09 Teradyne, Inc. Test system having distributed resources
US11363746B2 (en) 2019-09-06 2022-06-14 Teradyne, Inc. EMI shielding for a signal trace
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670889A (en) * 1994-10-17 1997-09-23 Nihon Denshizairyo Kabushiki Kaisha Probe card for maintaining the position of a probe in high temperature application
US5691651A (en) * 1991-01-23 1997-11-25 Ehlermann; Eckhard Device for testing integrated circuits
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
US6005401A (en) * 1993-12-16 1999-12-21 Matsushita Electric Industrial Co., Ltd. Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930809A (en) 1973-08-21 1976-01-06 Wentworth Laboratories, Inc. Assembly fixture for fixed point probe card
US4382228A (en) 1974-07-15 1983-05-03 Wentworth Laboratories Inc. Probes for fixed point probe cards
US4719417A (en) 1983-05-03 1988-01-12 Wentworth Laboratories, Inc. Multi-level test probe assembly for IC chips
US4599559A (en) 1983-05-03 1986-07-08 Wentworth Laboratories, Inc. Test probe assembly for IC chips
US4975638A (en) 1989-12-18 1990-12-04 Wentworth Laboratories Test probe assembly for testing integrated circuit devices
JPH03209738A (en) * 1990-01-11 1991-09-12 Tokyo Electron Ltd Probe card
US5323105A (en) 1991-08-08 1994-06-21 International Business Machines Corporation Test template for monitoring the pins of a multi-pin chip cirucit package
JPH06124985A (en) * 1992-10-13 1994-05-06 Tokyo Electron Yamanashi Kk Probe equipment and probing method
US5355079A (en) 1993-01-07 1994-10-11 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuit devices
US5442299A (en) 1994-01-06 1995-08-15 International Business Machines Corporation Printed circuit board test fixture and method
US5416429A (en) 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
JPH10505162A (en) 1994-09-09 1998-05-19 マイクロモジュール・システムズ Circuit membrane probe
EP0788729A4 (en) 1994-10-28 1998-06-03 Micromodule Systems Inc Programmable high density electronic testing device
US5854558A (en) 1994-11-18 1998-12-29 Fujitsu Limited Test board for testing a semiconductor device and method of testing the semiconductor device
US5959461A (en) 1997-07-14 1999-09-28 Wentworth Laboratories, Inc. Probe station adapter for backside emission inspection
WO1999004273A1 (en) 1997-07-15 1999-01-28 Wentworth Laboratories, Inc. Probe station with multiple adjustable probe supports
US5955888A (en) 1997-09-10 1999-09-21 Xilinx, Inc. Apparatus and method for testing ball grid array packaged integrated circuits
US5952843A (en) 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
JPH11295342A (en) * 1998-04-06 1999-10-29 Japan Electronic Materials Corp Probe card and its manufacture
JPH11344509A (en) * 1998-05-29 1999-12-14 Hiroshi Katagawa Probe card and probe pin
US6124723A (en) 1998-08-31 2000-09-26 Wentworth Laboratories, Inc. Probe holder for low voltage, low current measurements in a water probe station
US6160412A (en) 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6297657B1 (en) 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6163162A (en) * 1999-01-11 2000-12-19 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6255602B1 (en) 1999-03-15 2001-07-03 Wentworth Laboratories, Inc. Multiple layer electrical interface

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5691651A (en) * 1991-01-23 1997-11-25 Ehlermann; Eckhard Device for testing integrated circuits
US6005401A (en) * 1993-12-16 1999-12-21 Matsushita Electric Industrial Co., Ltd. Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
US5670889A (en) * 1994-10-17 1997-09-23 Nihon Denshizairyo Kabushiki Kaisha Probe card for maintaining the position of a probe in high temperature application
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same

Also Published As

Publication number Publication date
EP1194784A2 (en) 2002-04-10
JP2003526790A (en) 2003-09-09
ATE404871T1 (en) 2008-08-15
JP4837866B2 (en) 2011-12-14
DE60135288D1 (en) 2008-09-25
WO2001067116A2 (en) 2001-09-13
US6633175B1 (en) 2003-10-14
EP1194784B1 (en) 2008-08-13

Similar Documents

Publication Publication Date Title
WO2001067116A3 (en) Temperature compensated vertical pin probing device
WO2002019400A1 (en) Ceramic heater for semiconductor manufacturing and inspecting equipment
US6927586B2 (en) Temperature compensated vertical pin probing device
US6566898B2 (en) Temperature compensated vertical pin probing device
CN101762623B (en) Semiconductor-type gas sensor with A1N heat isolation panel double-side micro structure and manufacturing method thereof
WO2003036767A3 (en) Parallel, individually addressable probes for nanolithography
ATE480003T1 (en) COMPENSATION OF THE VARIATION OF CRITICAL DIMENSIONS ON A WAVE SURFACE USING LOCAL TEMPERATURE CONTROL
JP2004205487A (en) Probe card fixing mechanism
WO2001001460A3 (en) Temperature controlled wafer chuck
US9523716B2 (en) Probe guide plate and method for manufacturing the same
KR940016978A (en) Probe card assembly and manufacturing method
WO2001097260A3 (en) Holder for a substrate cassette and device provided with such a holder
CN101663591A (en) Connecting board, probe card and electronic component testing apparatus provided with the probe card
EP0995996A4 (en) Conductive contact
WO2005001408A3 (en) Pressure transducer with structural temperature and misalignment compensation
ITMI20012128A1 (en) MICROMECHANICAL BUILDING ELEMENT AND MANUFACTURING PROCEDURE
WO2009034454A3 (en) Semiconductor device
JP4006081B2 (en) Manufacturing method of semiconductor device
KR100368585B1 (en) A method for fabricating semiconductor equipment and jig thereof
US7584536B2 (en) Process for precise alignment of packaging caps on a substrate
US20080095211A1 (en) Apparatus For Testing Reliability Of Semi-Conductor Sample
KR100691164B1 (en) Probe card assembly
WO2004008492A3 (en) Mosaic decal probe
KR100549551B1 (en) Assembly structure of probe card
JP3603059B2 (en) Semiconductor manufacturing equipment

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): IL JP SG

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2001 566038

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 2001914572

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): IL JP SG

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

WWP Wipo information: published in national office

Ref document number: 2001914572

Country of ref document: EP